The W83194AR-96 is a Clock Synthesizer for Intel Whitney chipset. W83194AR-96 provides all
clocks required for high-speed RISC or CISC microprocessor and also provides 32 different
frequencies of CPU, SDRAM, PCI, 3V66, IOAPIC clocks frequency setting. All clocks are externally
selectable with smooth transitions.
The W83194AR-96 provides I2C serial bus interface to program the registers to enable or disable
each clock outputs and provides 0.25% center and 0-0.5% down type spread spectrum to reduce EMI.
The W83194AR-96 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30
pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as
maintaining 50± 5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide
better than 0.5V /ns slew rate.
The Pin column lists the affected pin number and the @PowerUp column gives the state at true
power up. Registers are set to the values shown only on true power up. "Command Code" byte and
"Byte Count" byte must be sent following the acknowledge of the Address Byte. Although the data
(bits) in these two bytes are considered "don't care", they must be sent and will be acknowledge.
After that, the below described sequence (Register 0, Register 1, Register 2, ....) will be valid and
7 0 - SSEL3 (Frequency table selection by software via I2C )
6 0 - SSEL2 ( Frequency table selection by software via I2C)
5 0 - SSEL1 ( Frequency table selection by software via I2C)
4 0 - SSEL0 ( Frequency table selection by software via I2C)
3 0 - 0 = Selection by hardware
1 = Selection by software I2C - Bit (2, 7:4),
2 0 - SSEL4 (Frequency table selection by software via I2C )
1 0 - SSEL5 (Frequency table selection by software via I2C )
7 1 - SKEW2(SDRAM to CPU Skew programming bit)
6 0 - SKEW1(SDRAM to CPU Skew programming bit)
5 0 - SKEW0(SDRAM to CPU Skew programming bit)
4
3 0 - Reserve
2 0 - Reserve
1 0 - Reserve
0 0 - Reserve
1
- SDRAM_F
Publication Release Date: July 1999
- 7 - Revision 0.35
Page 8
5.7 Register 6: Winbond Chip ID Register (Read Only)
Bit @PowerUp Pin Description
7 1 - Winbond Chip ID
6 0 - Winbond Chip ID
5 0 - Winbond Chip ID
4 1 - Winbond Chip ID
3 1 - Winbond Chip ID
2 0 - Winbond Chip ID
1 0 - Winbond Chip ID
0 0 - Winbond Chip ID
5.8 Register 7: Winbond Chip ID Register (Read Only)
Bit @PowerUp Pin Description
7 0 - Winbond Chip ID
W83194AR-96
PRELIMINARY
6 0 - Winbond Chip ID
5 1 - Winbond Chip ID
4 0 - Winbond Chip ID
3 0 - Winbond Chip ID
2 0 - Winbond Version ID
1 0 - Winbond Version ID
0 1 - Winbond Version ID
Publication Release Date: July 1999
- 8 - Revision 0.35
Page 9
W83194AR-96
PRELIMINARY
6.0 SPECIFICATIONS
6.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Subjection to maximum conditions for extended periods may affect reliability.
Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol Parameter Rating
Vdd , VIN
T
STG
TB
TA
6.2 AC CHARACTERISTICS
Voltage on any pin with respect to GND - 0.5 V to + 7.0 V
Storage Temperature
Ambient Temperature
Operating Temperature
- 65°C to + 150°C
- 55°C to + 125°C
0°C to + 70°C
VddR=Vdd3=VddP=VddS=3.3V ± 5 %, VddC = VddA= 2.375V~2.9V , TA = 0°C to +70°C
Parameter Symbol Min Typ Max Units Test Conditions
Output Duty Cycle
CPU/SDRAM to PCI Offset
Skew (CPU-CPU), (PCIPCI), (SDRAM-SDRAM)
CPU/SDRAM
Cycle to Cycle Jitter
CPU/SDRAM
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
Overshoot/Undershoot
Beyond Power Rails
Ring Back Exclusion
45 50 55 % Measured at 1.5V
1 4 ns 15 pF Load Measured at 1.5V
t
OFF
250 ps 15 pF Load Measured at 1.5V
t
SKEW
t
CCJ
±250 ps
tJA
500 ps
J
BW
500 KHz
t
TLH
t
THL
over
V
V
RBE
0.4 1.6 ns 15 pF Load on CPU and PCI
outputs
0.7 1.5 V
22 Ω at source of 8 inch PCB
run to 15 pF load
0.7 2.1 V Ring Back must not enter this
range.
Publication Release Date: July 1999
- 9 - Revision 0.35
Page 10
6.3 DC CHARACTERISTICS
W83194AR-96
PRELIMINARY
VddR=Vdd3=VddP=VddS=3.3V ± 5 %, VddC = VddA= 2.375V~2.9V , TA = 0°C to +70°C
Parameter Symbol Min Typ Max Units Test Conditions
Input Low Voltage
Input High Voltage
Input Low Current
(no pull-up Resistors)
Input Low Current
(pull-up Resistors)
Input High Current
Operating Current
Power Down Current I
Input Frequency
V
IL
V
IH
I
IL
I
IL
IIH
IDD 60 100 mA @66M
DDPD
Fi
Vss-
0.3
2.0 Vdd
-5 2.0
-200 -100
-5 5
400 600
14.318 MHz Vdd=3.3V
0.8
+0.3
Vdc
Vdc
µA
µ
A
µ
A
µ
A
CL= 0pF
Pin Inductance Lpin 7 nH
Input Capacitance CIN 5 pF Logic Inputs
C
C
Transition Time T
6 pF Output pins capacitance
OUT
13.5 22.5 pF X1 & X2 pins
INX
3 mS
Tra
Disable/Enable Delay T 1 10 nS
Clock stabilization T
3 mS
STA
Publication Release Date: July 1999
- 10 - Revision 0.35
Page 11
7.0 ORDERING INFORMATION
Part Number Package Type Production Flow
W83194AR-96
48 PIN SSOP
8.0 HOW TO READ THE TOP MARKING
1st line: Winbond logo and the type number: W83194AR-96
2nd line: Tracking code 2 8051234
2
A: Internal use code
B
8051234
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; O means OSE, G means GR
W83194AR-96
28051234
814GAB
: wafers manufactured in Winbond FAB 2
: wafer production series lot number
: IC revision
W83194AR-96
PRELIMINARY
Commercial, 0°C to +70°C
All the trade marks of products and companies mentioned in this data sheet belong to their
respective owners
.
Publication Release Date: July 1999
- 11 - Revision 0.35
Page 12
9.0 PACKAGE DRAWING AND DIMENSIONS
W83194AR-96
PRELIMINARY
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the trade
marks of products and companies mentioned in this data sheet belong to their respective
owners
.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal injury.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sale.
Publication Release Date: July 1999
- 12 - Revision 0.35
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