Datasheet W78E58M-40, W78E58M-24, W78E58M-16, W78E58F-40, W78E58F-24 Datasheet (Winbond Electronics)

W78E58

INT2

8-BIT MICROCONTROLLER

GENERAL DESCRIPTION

The W78E58 is an 8-bit microcontroller that is functionally compatible with the W78C58, except that the mask ROM is replaced by a flash EEPROM with a size of 32 KB. To facilitate programming and verification, the flash EEPROM inside the W78E58 allows the program memory to be programmed and read electronically. Once the code is confirmed, the user can protect the code for security.

The W78E58 microcontroller supplies a wider frequency range than most 8-bit microcontrollers on the market. It is functionally compatible with the industry-standard 80C52 microcontroller series, except

that one extra 4-bit bit-addressable I/O port(Port 4) and two additional external interrupts (

INT3 ).

The W78E58 contains four 8-bit bi-directional and bit-addressable I/O ports, three 16-bit timer/counters, and a serial port. These peripherals are supported by a eight-source, two-level interrupt capability. There are 256 bytes of RAM and an 32 KB flash EEPROM for application programs.

The W78E58 microcontroller has two power reduction modes, idle mode and power-down mode, both of which are software selectable. The idle mode turns off the processor clock but allows for continued peripheral operation. The power-down mode stops the crystal oscillator for minimum power consumption. The external clock can be stopped at any time and in any state without affecting the processor.

,

FEATURES

• 8-bit CMOS microcontroller

• Fully static design

• Low standby current at full supply voltage

• DC-40 MHz operation

• 256 bytes of on-chip scratchpad RAM

• 32 KB electrically erasable/programmable EPROM

• 64 KB program memory address space

• 64 KB data memory address space

• Four 8-bit bidirectional ports

• One extra 4-bit bit-addressable I/O port, additional

(available on 44-pin PLCC/QFP package)

• Three 16-bit timer/counters

• One full duplex serial port

• Boolean processor

• Eight-source, two-level interrupt capability

• Built-in power management

• Code protection mechanism

• Packages:

− DIP 40: W78E58-16/24/40

− PLCC 44: W78E58P-16/24/40

− QFP 44: W78E58F-16/24/40

− TQFP 44: W78E58M-16/24/40

/ INT3

Publication Release Date: November 1997

- 1 - Revision A2

PIN CONFIGURATIONS

40-Pin DIP (W78E58)

T2, P1.0

T2EX, P1.1

P1.2 P1.3 P1.4 P1.5 P1.6 P1.7

RST RXD, P3.0 TXD, P3.1

INT0, P3.2 INT1, P3.3

T0, P3.4 T1, P3.5

WR, P3.6

RD, P3.7

XTAL2 XTAL1

VSS

W78E58

VCC1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

40 39

P0.0, AD0

38

P0.1, AD1

37

P0.2, AD2

36

P0.3, AD3

P0.4, AD4

35 34

P0.5, AD5

33

P0.6, AD6

P0.7, AD7

32 31

EA

30

ALE

29

PSEN

28

P2.7, A15

27

P2.6, A14

26

P2.5, A13

25

P2.4, A12

24

P2.3, A11

23

P2.2, A10

P2.1, A9

22 21

P2.0, A8

44-Pin PLCC (W78E58P)

T 2

T

E

2

X

,

P

P1.5 P1.6 P1.7

RST

RXD, P3.0

INT2, P4.3

TXD, P3.1 INT0, P3.2 INT1, P3.3

T0, P3.4 T1, P3.5

P 1 . 4

6 5 4 3

7 8 9 10 11 12 13 14 15 16

17

P 3 . 6 , / W R

1 . 3

P 3 . 7 , / R D

1

1 .

.

1

2

X

T

A

L

1

2

1 . 0

2 1 44 43 42

V S S

44-Pin QFP/TQFP (W78E58F/W78E58M)

/

P 1 . 4

P 3 . 6 , / W R

P

1

.

2

3

43 42 41

X

P

T

3

A

.

L

7

2

, / R D

T

I

2

N

T

E

T

2

X

3

,

P

1

4

.

0

1

2

403938 37 36

X

V

P

T

S

4

A

S

.

L

0

1

A

D

3

2

1

0

,

P

0

V

0

.

C

.

3

1

C

2

0

34

3544

P

2

.

3

1

0

2

,

A

1

9

8

1

0

P0.4, AD4

33 32

P0.5, AD5

31

P0.6, AD6

30

P0.7, AD7

29

EA

28

P4.1

27

ALE

26

PSEN

25

P2.7, A15

24

P2.6, A14

23

P2.5, A13

22212019181716151413

P 2 . 4 , A 1 2

/ I N T 3 , P

V

4

C

.

C

2

P

2

4

.

0

, A 8

A

D

3

2

1

0

,

P

0

.

3

2

1

0

40

41

P

2

.

3

2

1

,

A

1

9

1

0

P0.4, AD4

39 38

P0.5, AD5

37

P0.6, AD6

36

P0.7, AD7

35

EA

34

P4.1

33

ALE

32

PSEN

31

P2.7, A15

30

P2.6, A14

29

P2.5, A13

2827262524232221201918

P 2 . 4 , A 1 2

RXD, P3.0 INT2, P4.3

TXD, P3.1 INT0, P3.2 INT1, P3.3

T0, P3.4 T1, P3.5

P1.5 P1.6 P1.7

RST

1 2

3

4 5 6 7 8 9 10

11

12

- 2 -

W78E58

INT2

PIN DESCRIPTION

The W78E58 has two operating modes, normal and flash. In normal mode, the W78E58 corresponds to the W78C58. In flash mode, the user (the maker of the flash EEPROM writer) can access the flash EEPROM.

P0.7−P0.0 Port 0, Bits 7−0

MODE DESCRIPTION

Normal Port 0, Bits 0 through 7. Port 0 is a bidirectional I/O port. This port also provides a

multiplexed low order address/data bus during accesses to external memory.

Flash This port provides the data bus during access to the flash EEPROM.

P1.7−P1.0 Port 1, Bits 7−0

MODE DESCRIPTION

Normal Port 1, Bits 0 through 7. Port 1 is a bidirectional I/O port with internal pull-ups. Pins

P1.0 and P1.1 also serve as T2 (Timer 2 external input) and T2EX (Timer 2 capture/reload trigger), respectively.

Flash This port provides the low-order address bus during access to the flash EEPROM.

P2.7−P2.0 Port 2, Bits 7−0

MODE DESCRIPTION

Normal Port 2, Bits 0 through 7. Port 2 is a bidirectional I/O port with internal pull-ups. This port

also provides the upper address bits for accesses to external memory..

Flash This port provides the high-order address bus during access to the flash EEPROM.

P3.7−P3.0 Port 3, Bits 7−0

MODE DESCRIPTION

Normal Port 3, Bits 0 through 7. Port 3 is a bidirectional I/O port with internal pull-ups. All bits

have alternate functions.

Flash

P3.3−P3.0 and P3.7−P3.6 are the flash mode configuration pins, Input. P3.3−P3.0 and P3.7−P3.6 are configured to select or execute the flash operations. For

details, see Flash Operations.

P4.3−P4.0 Port 4, Bits 3−0 (available on 44-pin PLCC/QFP package)

MODE DESCRIPTION

Normal Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are alternative

function pins. It can be used as general I/O pins or external interrupt input sources (

/ INT3 ).

Publication Release Date: November 1997

- 3 - Revision A2

Flash No function in this mode.

EA

PSEN

This pin

PSEN

EA/VPP

MODE DESCRIPTION

W78E58

Normal

Flash VPP, Program Power supply pin, Input.

External Access, Input, active low.

,

This pin forces the processor to execute a program from the external ROM. When the internal flash EEPROM is accessed as in the W78C58, this pin should be kept high.

This pin accepts the high voltage (12V) needed for programming the flash EEPROM.

RST

MODE DESCRIPTION

Normal RST, Reset, Input, active high.

This pin resets the processor. It must be kept high for at least two machine cycles in order to be recognized by the processor.

Flash Flash mode configuration pin, Input, active high.

RST is used to configure the flash operations. For details, see Flash Operations.

ALE

MODE DESCRIPTION

Normal

Flash Flash mode configuration pin, Input, active low.

Address Latch Enable, Output, active high.

ALE, ALE is used to enable the address latch that separates the address from the data on

Port 0. ALE runs at 1/6th of the oscillator frequency. A single ALE pulse is skipped during external data memory accesses. ALE goes to a high impedance state with a weak pull-up during reset state.

ALE is used to configure the flash operations. For details, see Flash Operations.

PSEN

MODE DESCRIPTION

Normal

MOVC operations. reset state

Flash Flash mode configuration pin, Input, active high.

Program Store Enable, Output, active low.

,

enables the external ROM onto the Port 0 address/data bus during fetch and

goes to a high impedance state with a weak pull-up during

is used to configure the flash operations. For details, see Flash Operations.

XTAL1

MODE DESCRIPTION

- 4 -

W78E58

Normal Crystal 1. This is the crystal oscillator input. This pin may be driven by an external

clock.

Flash Connect to VSS.

XTAL2

MODE DESCRIPTION

Normal Crystal 2. This is the crystal oscillator output. It is the inversion of XTAL1.

Flash No function in this mode.

VSS, VCC

Power Supplies. These are the chip ground and positive supplies.

Publication Release Date: November 1997

- 5 - Revision A2

BLOCK DIAGRAM

P1.0

~

P1.7

Port

1

W78E58

Port 1 Latch

P3.0 ~ P3.7

P4.0 ~ P4.3

INT2

INT3

Port

T2

SFR RAM

Address

256 bytes

RAM & SFR

B

Stack

Pointer

Power Control

Port 0

Latch

DPTR

Temp Reg.

PC

Incrementor

Addr. Reg.

Port 2

Latch

Port 0

Port 2

P0.0 ~ P0.7

P2.0 ~ P2.7

ACC

Interrupt

PSW

Instruction

Decoder

&

Sequencer

Bus & Clock

Controller

T1

ALU

Reset Block

Timer

2

Timer

0

Timer

1

UART

3

4

Port 3 Latch

Port 4 Latch

Oscillator

XTAL1

XTAL2

ALE

PSEN

RST

- 6 -

VssVcc

W78E58

FUNCTIONAL DESCRIPTION

The W78E58 architecture consists of a core controller surrounded by various registers, five general purpose I/O ports, 256 bytes of RAM, three timer/counters, and a serial port. The processor supports 111 different opcodes and references both a 64K program address space and a 64K data storage space.

Timers 0, 1, and 2

Timers 0, 1, and 2 each consist of two 8-bit data registers. These are called TL0 and TH0 for Timer 0, TL1 and TH1 for Timer 1, and TL2 and TH2 for Timer 2. The TCON and TMOD registers provide control functions for timers 0 and 1. The T2CON register provides control functions for Timer 2. RCAP2H and RCAP2L are used as reload/capture registers for Timer 2.

The operations of Timer 0 and Timer 1 are the same as in the W78C51. Timer 2 is a special feature of the W78E58: it is a 16-bit timer/counter that is configured and controlled by the T2CON register. Like Timers 0 and 1, Timer 2 can operate as either an external event counter or as an internal timer, depending on the setting of bit C/T2 in T2CON. Timer 2 has three operating modes: capture, autoreload, and baud rate generator. The clock speed at capture or auto-reload mode is the same as that of Timers 0 and 1.

Clock

The W78E58 is designed to be used with either a crystal oscillator or an external clock. Internally, the clock is divided by two before it is used. This makes the W78E58 relatively insensitive to duty cycle variations in the clock.

Crystal Oscillator

The W78E58 incorporates a built-in crystal oscillator. To make the oscillator work, a crystal must be connected across pins XTAL1 and XTAL2. In addition, a load capacitor must be connected from each pin to ground, and a resistor must also be connected from XTAL1 to XTAL2 to provide a DC bias when the crystal frequency is above 24 MHz.

External Clock

An external clock should be connected to pin XTAL1. Pin XTAL2 should be left unconnected. The XTAL1 input is a CMOS-type input, as required by the crystal oscillator. As a result, the external clock signal should have an input one level of greater than 3.5 volts.

Power Management

Idle Mode

The idle mode is entered by setting the IDL bit in the PCON register. In the idle mode, the internal clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The processor will exit idle mode when either an interrupt or a reset occurs.

Power-down Mode

When the PD bit of the PCON register is set, the processor enters the power-down mode. In this mode all of the clocks are stopped, including the oscillator. The only way to exit power-down mode is by a reset.

Publication Release Date: November 1997

- 7 - Revision A2

W78E58

INT2

Reset

The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two machine cycles while the oscillator is running.

An internal trigger circuit in the reset line is used to deglitch the reset line when the W78E58 is used with an external RC network. The reset logic also has a special glitch removal circuit that ignores glitches on the reset line.

During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of bit 4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.

Option Setting

Users write programs into the W78E58 by using the Winbond proprietary writer. The writer programs the data into an internal 32 KB region and reads the data back for verification. After confirming that the program is correct, the user can lock the data so that they can no longer be read.

Lock Bit

This bit is used to protect the customer data in the W78E58. It may be turned on after the programmer finishes the programming and verify sequence. Once this bit is set to logic 0, no flash data can be accessed again.

MOVC Execute

This bit is used to restrict the region accessible to the MOVC instruction. It can prevent the program from being downloaded using this instruction if the program needs to jump outside to get data. When this bit is set to logic 0, a MOVC instruction in external program memory space will be able to access code in the external memory, but it will not be able to access code in the internal memory. A MOVC instruction in internal program memory space will always be able to access code in both internal and external memory. If this bit is logic 1, there are no restrictions on the MOVC instruction.

New Defined Peripheral

In order to be more suitable for I/O, an extra 4-bit bit-addressable port P4 and two external interrupt

, INT3 has been added to either the PLCC or QFP 44 pin package. And description follows:

1. INT2/INT3 Two additional external interrupts,

interrupt 0 and 1 in the standard 80C52. The functions/status of these interrupts are determined/shown by the bits in the XICON (External Interrupt Control) register. The XICON register is bit-addressable but is not a standard register in the standard 80C52. Its address is at 0C0H. To set/clear bits in the XICON register, one can use the "SETB (/CLR) bit" instruction. For example, "SETB 0C2H" sets the EX2 bit of XICON.

***XICON - external interrupt control (C0H)

PX3 EX3 IE3 IT3 PX2 EX2 IE2 IT2

and INT3 , whose functions are similar to those of external

PX3: External interrupt 3 priority high if set

- 8 -

W78E58

INT2

EX3: External interrupt 3 enable if set IE3: If IT3 = 1, IE3 is set/cleared automatically by hardware when interrupt is detected/serviced IT3: External interrupt 3 is falling-edge/low-level triggered when this bit is set/cleared by software PX2: External interrupt 2 priority high if set EX2: External interrupt 2 enable if set IE2: If IT2 = 1, IE2 is set/cleared automatically by hardware when interrupt is detected/serviced IT2: External interrupt 2 is falling-edge/low-level triggered when this bit is set/cleared by software

Eight-source interrupt informations:

INTERRUPT

SOURCE

External Interrupt 0 03H 0 (highest) IE.0 TCON.0 Timer/Counter 0 0BH 1 IE.1 External Interrupt 1 13H 2 IE.2 TCON.2 Timer/Counter 1 1BH 3 IE.3 Serial Port 23H 4 IE.4 Timer/Counter 2 2BH 5 IE.5 External Interrupt 2 33H 6 XICON.2 XICON.0 External Interrupt 3 3BH 7 (lowest) XICON.6 XICON.3

2. PORT4

Another bit-addressable port P4 is also available and only 4 bits (P4<3:0>) can be used. This port address is located at 0D8H with the same function as that of port P1, except the P4.3 and P4.2 are

alternative function pins. It can be used as general I/O pins or external interrupt input sources (

INT3 ).

Example:

P4 REG 0D8H

VECTOR

ADDRESS

POLLING

SEQUENCE WITHIN

PRIORITY LEVEL

ENABLE

REQUIRED

SETTINGS

INTERRUPT

TYPE

EDGE/LEVEL

/

MOV P4, #0AH ; Output data "A" through P4.0−P4.3.

MOV A, P4 ; Read P4 status to Accumulator. SETB P4.0 ; Set bit P4.0 CLR P4.1 ; Clear bit P4.1

3. Reduce EMI Emission

Because of the large on-chip flash EEPROM, when a program is running in internal ROM space, the ALE will be unused. The transition of ALE will cause noise, so it can be turned off to reduce the EMI

Publication Release Date: November 1997

- 9 - Revision A2

W78E58

PSEN

emission if it is useless. Turning off the ALE signal transition only requires setting the bit 0 of the AUXR SFR, which is located at 08Eh. When ALE is turned off, it will be reactivated when the program accesses external ROM/RAM data or jumps to execute an external ROM code. The ALE signal will turn off again after it has been completely accessed or the program returns to internal ROM code space..

The AO bit in the AUXR register, when set, disables the ALE output.

***AUXR - Auxiliary register (8EH)

- - - - - - - AO

AO: Turn off ALE output.

4. Power-off Flag

***PCON - Power control (87H)

SMOD - - POF GF1 GF0 PD IDL

SMOD: Double baud rate bit. When set to a 1, the baud rate is doubled when the serial port is

being used in either modes 1, 2, 3.

POF: Power off flag. Bit is set by hardware when power on reset. It can be cleared by software

to determine chip reset is a warm boot or cold boot. GF1, GF0: These two bits are general-purpose flag bits for the user. PD: Power down mode bit. Set it to enter power down mode. IDL: Idle mode bit. Set it to enter idle mode.

The power-off flag is located at PCON.4. This bit is set when VDD has been applied to the part. It can be used to determine if a reset is a warm boot or a cold boot if it is subsequently reset by software.

Flash Operations

In normal operation, the W78E58 is functionally compatible with the W78C58. In the flash operating mode, the flash EEPROM can be programmed and verified repeatedly. Once the code inside the flash EEPROM is confirmed, the code can be protected. The flash EEPROM and the operations on it are described below.

All of the operations are configured by the pins RST, ALE, A14CTRL (P3.2), OECTRL (P3.3), CE (P3.6), OE (P3.7), A0 (P1.0) and VPP (EA). In these

operations, A15 to A0 (P2.7 to P2.0, P1.7 to P1.0) and D7 to D0 (P0.7 to P0.0) serve as the address and data bus, respectively.

Read Operation

This operation enables customers to read their codes and the option bits. The data will not be valid if the lock bit is programmed to low.

- 10 -

, A9CTRL (P3.0), A13CTRL (P3.1),

W78E58

PSEN

Program Operation

This operation is used to program data to the flash EEPROM and the option bits. Programming is initiated when VPP reaches VCP (12.5V) level, CE is set to low, and OE is set to high.

Program Verify Operation

All data must be checked after programming. This operation should be performed after each byte is programmed, and it will ensure a substantial program margin.

OPERATION P3.0

(A9

CTRL)

Read VIL VIL VIL VIL VIL VIL VIH Program VIL VIL VIL VIL VIL VIH VCP Program Verify VIL VIL VIL VIL VIH VIL VCP

Notes:

1. During all of these operations, RST = VIH, ALE = VIL, and

2. VCP = 12V, VIH = VDD, VIL = Vss.

3. The program verify operation should follow the programming operaion.

P3.1

(A13

CTRL)

P3.2

(A14

CTRL)

P3.3

(OE

CTRL)

P3.6

( CE )

= VIH.

P3.7

( OE )

EA

(VPP)

P2, P1

(A15 TO A0)P0(D7 TO D0)

Address Data Out 1, 2 Address Data In 1, 2 Address Data Out 3

NOTES

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL MIN. MAX. UNIT

DC Power Supply

VDD−VSS Input Voltage VIN VSS -0.3 VDD +0.3 V Operating Temperature TA 0 70 Storage Temperature TST -55 +150

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.

+5V

V

A0 to A7

P1

V

IL

V

IL

V

IL

V

IL

V

IL

V

IH

P3.0 P3.1 P3.2 P3.3 P3.6 P3.7

X'tal1 X'tal2 Vss

DD

P0

EA/Vpp

ALE

RST

PSEN

P2

PGM DATA

V

CP

V

IL

V

IH

V

IH

A8 to A15

-0.3 +7.0 V

+5V

V

A0 to A7

P1

V

IL

V

IL

V

IL

V

IL

V

IH

V

IL

P3.0 P3.1 P3.2 P3.3 P3.6 P3.7

X'tal1 X'tal2 Vss

DD

P0

EA/Vpp

ALE

RST

PSEN

P2

PGM DATA

V

CP

V

IL

V

IH

V

IH

A8 to A15

°C °C

Programming Configuration

Programming Verification

Publication Release Date: November 1997

- 11 - Revision A2

DC CHARACTERISTICS

EA

(VDD-VSS = 5V ±10%, TA = 25°C, Fosc = 20 MHz, unless otherwise specified.)

PARAMETER SYM. SPECIFICATION UNIT TEST CONDITIONS

MIN. MAX.

Operating Voltage VDD 4.5 5.5 V Operating Current IDD - 20 mA No load

VDD = 5.5V

Idle Current IIDLE - 6 mA Idle mode

VDD = 5.5V

Power Down Current IPWDN - 50

Input Current P1, P2, P3, P4 Input Current RST Input Leakage Current

P0, Logic 1 to 0 Transition

Current P1, P2, P3, P4 Input Low Voltage

IIN1 -50 +10

IIN2 -10 +300

ILK -10 +10

ITL [*4] -500 -200

VIL1 0 0.8 V VDD = 4.5V

µA

Power-down mode VDD = 5.5V VDD = 5.5V VIN = 0V or VDD VDD = 5.5V 0 < VIN < VDD VDD = 5.5V 0V <VIN < VDD

VDD = 5.5V VIN =2.0V

W78E58

P0, P1, P2, P3, P4, Input Low Voltage RST Input Low Voltage XTAL1[*4] Input High Voltage

P0, P1, P2, P3, P4, Input High Voltage RST Input High Voltage XTAL1 [*4] Output Low Voltage P1, P2, P3, P4

VIL2 0 0.8 V VDD = 4.5V

VIL3 0 0.8 V VDD = 4.5V

VIH1 2.4 VDD +0.2 V VDD = 5.5V

VIH2 3.5 VDD +0.2 V VDD = 5.5V

VIH3 3.5 VDD +0.2 V VDD = 5.5V

VOL1 - 0.45 V VDD = 4.5V

IOL = +2 mA

- 12 -

DC Characteristics, continued

PARAMETER SYM. SPECIFICATION UNIT TEST CONDITIONS

Output Low Voltage P0, ALE, PSEN [*3]

W78E58

MIN. MAX.

VOL2 - 0.45 V VDD = 4.5V

IOL = +4mA

Sink Current P1, P2, P3, P4 Sink Current

P0, ALE, PSEN Output High Voltage

P1, P2, P3, P4 Output High Voltage

P0, ALE, PSEN [*3] Source Current

P1, P2, P3, P4 Source Current

P0, ALE, PSEN

Notes: *1. RST pin is a Schmitt trigger input. RST has internal pull-low resistors of about 30 KΩ. *3. P0, ALE and /PSEN are tested in the external access mode. *4. XTAL1 is a CMOS input. *5. Pins of P1, P2, P3, P4 can source a transition current when they are being externally driven from 1 to 0. The transition

current reaches its maximum value when VIN approximates to 2V.

ISK1 4 12 mA VDD = 4.5V

Vs = 0.45V

ISK2 10 20 mA VDD = 4.5V

Vs = 0.45V

VOH1 2.4 - V VDD = 4.5V

IOH = -100 µA

VOH2 2.4 - V VDD = 4.5V

IOH = -400 µA

ISR1 -120 -250

µA

VDD = 4.5V Vs = 2.4V

ISR2 -8 -14 mA VDD = 4.5V

Vs = 2.4V

AC CHARACTERISTICS

The AC specifications are a function of the particular process used to manufacture the part, the ratings of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the specifications can be expressed in terms of multiple input clock periods (TCP), and actual parts will usually experience less than a ±20 nS variation. The numbers below represent the performance expected from a 0.8 micron CMOS process when using 2 and 4 mA output buffers.

Clock Input Waveform

Publication Release Date: November 1997

- 13 - Revision A2

W78E58

PSEN

RD

XTAL1

T

CH

F

OP, TCP

T

CL

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES

Operating Speed FOP 0 - 40 MHz 1 Clock Period TCP 25 - - nS 2 Clock High TCH 10 - - nS 3 Clock Low TCL 10 - - nS 3

Notes:

1. The clock may be stopped indefinitely in either state.

2. The TCP specification is used as a reference in other specifications.

3. There are no duty cycle requirements on the XTAL1 input.

Program Fetch Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES

Address Valid to ALE Low TAAS Address Hold from ALE Low TAAH

ALE Low to

Low to Data Valid Data Hold after Data Float after

Low

High

TAPL TPDA - - 2 TCP nS 2 TPDH 0 - 1 TCP nS 3 TPDZ 0 - 1 TCP nS

ALE Pulse Width TALW

Pulse Width

TPSW

1 TCP -∆ 1 TCP -∆ 1 TCP -∆

2 TCP -∆ 3 TCP -∆

- - nS 4

- - nS 1, 4

- - nS 4

2 TCP - nS 4 3 TCP - nS 4

Notes:

1. P0.0−P0.7, P2.0−P2.7 remain stable throughout entire memory cycle.

2. Memory access time is 3 TCP.

3. Data have been latched internally prior to

4. "∆" (due to buffer driving delay and wire loading) is 20 nS.

going high.

Data Read Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

ALE Low to RD Low

Low to Data Valid

TDAR

TDDA - - 4 TCP nS 1

3 TCP -∆

- 14 -

S

-

3 TCP +∆

nS 1, 2

W78E58

RD

WR

CE

Data Hold from RD High Data Float from RD High

Pulse Width

Notes:

1. Data memory access time is 8 TCP.

2. "∆" (due to buffer driving delay and wire loading) is 20 nS.

TDDH 0 - 2 TCP nS

TDDZ 0 - 2 TCP nS

TDRD

6 TCP -∆

6 TCP - nS 2

Data Write Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

ALE Low to WR Low Data Valid to WR Low Data Hold from WR High

Pulse Width

Note: "∆" (due to buffer driving delay and wire loading) is 20 nS.

TDAW

TDAD TDWD TDWR

3 TCP -∆ 1 TCP -∆ 1 TCP -∆ 6 TCP -∆

-

3 TCP +∆

- - nS

6 TCP - nS

Port Access Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Port Input Setup to ALE Low TPDS 1 TCP - - nS Port Input Hold from ALE Low TPDH 0 - - nS Port Output to ALE TPDA 1 TCP - - nS

nS

Note: Ports are read during S5P2, and output data becomes available at the end of S6P2. The timing data are referenced to

ALE, since it provides a convenient reference.

Program Operation

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

VPP Setup Time TVPS 2.0 - Data Setup Time TDS 2.0 - Data Hold Time TDH 2.0 - Address Setup Time TAS 2.0 - Address Hold Time TAH 0 - -

Program Pulse Width for

TPWP 295 300 305

Program Operation

Program Pulse Width for

TOPWP 295 300 305

Program Operation OECTRL Setup Time OECTRL Hold Time

TOCS 2.0 - TOCH 2.0 - -

Publication Release Date: November 1997

- 15 - Revision A2

µS µS µS µS µS µS

µS

µS µS

W78E58

OE

PSEN

Setup Time High to Output Float

Data Valid from

Note: Flash data can be accessed only in flash mode. The RST pin must pull in VIH status, the ALE pin must pull in VIL status, and

the

pin must pull in VIH status.

TOES 2.0 - -

TDFP 0 - 130 nS

TOEV - - 150 nS

µS

- 16 -

TIMING WAVEFORMS

Program Fetch Cycle

XTAL1

ALE

PSEN

PORT 2

PORT 0

S1

S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6

T

ALW

T

APL

T

PSW

T

AAS

T

A0-A7

PDA

T

PDH,TPDZ

A0-A7

DataCode

Code

A0-A7

Data

T

AAH

W78E58

A0-A7

Data Read Cycle

XTAL1

ALE

PSEN

PORT 2

PORT 0

RD

A0-A7

TDAR

A8-A15

TDDA

S2 S3S5 S6 S1S2 S3 S4S5 S6 S1S4

DATA

T

DDH,TDDZ

T

DRD

Publication Release Date: November 1997

- 17 - Revision A2

Timing Waveforms, continued

Data Write Cycle

XTAL1

ALE

PSEN

W78E58

S2 S3S5 S6 S1S2 S3 S4S1S5 S6S4

PORT 2

PORT 0

WR

Port Access Cycle

XTAL1

ALE

PORT

T

A8-A15

A0-A7

T

DAW

S5 S6 S1

T

PDHPDS

DAD

DATA OUT

T

DWR

T

DWD

T

PDA

DATA OUT

INPUT

SAMPLE

- 18 -

Timing Waveforms, continued

Program Operation

W78E58

P2, P1

(A15... A0)

P3.6 (CE)

P3.3

(OECTRL)

P3.7 (OE)

P0

(A7... A0)

Vpp

V

IH

V

IL

V

IH

V

IL

V

IH

V

IL

V

IH

V

IL

V

IH

V

IL

Vcp V

IH

Program Program

Verify

Address Stable

T

AS

T

PWP

T

OCS

T

OCH

T

OES

T

DH

Data In Data Out

T

DS

T

VPS

AH

T

DFP

D

OUT

T

OEV

Read Verify

Address Valid

Publication Release Date: November 1997

- 19 - Revision A2

TYPICAL APPLICATION CIRCUITS

Expanded External Program Memory and Crystal

V

CC

V

8.2 K

CC

10 u

C1

CRYSTAL

C2

31

EA

19

XTAL1

R

18

XTAL2

9

RST

INT0

12 13

INT1

14

T0

15

T1

1

P1.0

2

P1.1

3

P1.2

4

P1.3

5 6 7 8

P1.4 P1.5 P1.6 P1.7

W78E58

PSEN

P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7

P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7

RD WR

ALE TXD RXD

38 37 36 35

21 22 23 24 25 26 27 28

39

34 33 32

17 16 29 30 11 10

AD0 AD1

AD2 AD3 AD4 AD5 AD6 AD7

A8 A9 A10 A11 A12

A13 A14 A15

AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7

GND

3 4 7 8 13 14 17 18

1

11

D0

Q0

D1

Q1

D2

Q2

D3

Q3

D4

Q4

D5

Q5

D6

Q6

D7

Q7

OC G

74LS373

2 5 6 9 12 15 16 19

A0 A1 A2 A3 A4 A5 A6 A7

A0 A1 A2 A3 A4 A5 A6 A7 A8

A9 A10 A11 A12 A13 A14 A15

GND

10

9 8 7 6 5 4

3 25 24 21 23 2 26 27

1

20 22

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15

CE OE

27512

W78E58

11 12 13 15 16 17 18 19

AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7

O0 O1 O2 O3 O4 O5 O6 O7

CRYSTAL C1 C2 R

16 MHz 30P 30P 24 MHz 15P 15P 33 MHz 10P 10P 6.8K 40 MHz 5P 5P 4.7K

Above table shows the reference values for crystal applications.

Note: C1, C2, R components refer to Figure A.

Figure A

- 20 -

Typical Application Circuits, continued

V

Expanded External Data Memory and Oscillator

CC

V

8.2 K

CC

OSCILLATOR

10 u

19

18

9

12 13 14 15

31

1 2 3 4 5 6 7 8

EA XTAL1

XTAL2

RST

INT0

INT1 T0 T1

P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7

W78E58

P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7

P2.0 21 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7

RD

WR

PSEN

ALE

TXD

RXD

39

AD0 AD1

38

37

AD2

36

AD3 AD4

35

AD5

34

33

AD6

32

AD7

A8

A9

22

23

A10

24

A11

25

A12

26

A13

27

A14

28 17

16 29 30 11 10

AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7

GND

18

3 4 7 8 13 14 17

11

1

D0 D1 D2 D3 D4 D5 D6 D7

OC G

74LS373

Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7

W78E58

A0 A1 A2

A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14

GND

10

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14

CE

OE

WR

D0 D1 D2 D3 D4 D5 D6 D7

9 8 7 6 5 4

3 25 24 21 23

2 26

1 20

22

27

A0

2

A1

5

A2

6

A3

9

A4

12

A5

15

A6

16

A7

19

20256

AD0

11

AD1

12

AD2

13

AD3

15

AD4

16

AD5

17

AD6

18

AD7

19

PACKAGE DIMENSIONS

40-pin DIP

40

1

E

1

S

2

A

L

D

B

1

B

Figure B

Dimension in inches Dimension in mm

Symbol

A A A B B 1 c

21

20

1

Base Plane

A

1e

Seating Plane

E

A

e

a

D E E e L

a

e S

Notes:

1. Dimension D Max. & S include mold flash or tie bar burrs.

c

2. Dimension E1 does not include interlead flash.

3. Dimension D & E1 include mold mismatch and

are determined at the mold parting line.

4. Dimension B1 does not include dambar protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on final visual inspection spec.

1

2

1 1

A

Min.

0.010

0.150

0.016

0.008

0.540

0.120 0 15

Nom.

Max. Max.

Min.

0.210 5.334

0.160

0.022

0.0540.048

0.014

0.610

0.5500.545

0.110

0.140

0.670

.

0.090

0.254

3.81

0.406

0.203

14.986

13.72

2.286 2.54 2.7940.090 0.100

3.048

0.155

0.018

0.050 1.27

0.010

2.055 2.070

0.6000.590

0.130

0.6500.630 16.00 16.51

Nom.

3.937

0.457

0.254

52.20 52.58

15.24

15.494

13.84

3.302

4.064

0.559

1.3721.219

0.356

13.97

3.556

17.01

150

2.286

Publication Release Date: November 1997

- 21 - Revision A2

Package Dimensions, continued

1

44-pin PLCC

6 1

7

17

L

θ

Seating Plane

e

H

D

44 40

G

D

W78E58

Dimension in inches Dimension in mm

Symbol

39

H

E

29

2818

2A

A

b b

1

A

y

G

E

c

A A A b b c D E e G D G H D H

L y

Notes:

1. Dimension D & E do not include interlead flash.

2. Dimension b1 does not include dambar protrusion/intrusion.

3. Controlling dimension: Inches

4. General appearance spec. should be based on final visual inspection spec.

Nom.

Min.

0.020

1

0.145

2

0.026

1

0.016

0.008

0.648

0.590

E

0.680

E

0.090

Max. Max.

0.185

0.150

0.155

0.028

0.032

0.022

0.018

0.010

0.014

0.653

0.658

0.653

0.658

0.050 BSC

0.610

0.630

0.6300.610

0.700

0.690

0.7000.690

0.100

0.110

0.004

0.508

3.683

0.406

0.203

16.46

14.99

17.27

2.296

Min.

0.66

Nom.

4.699

3.81

3.937

0.813

0.711

0.559

0.457

0.254

0.356

16.59

16.71

16.7116.5916.46

1.27

BSC

15.49

16.00

16.0015.4914.99

17.53

17.78

17.7817.53

2.54

2.794

0.10

44-pin QFP

1

11

Seating Plane

H

D

44

12

e

34

33

E

EH

22

b

Notes:

c

A

See Detail F

2

1

A

y

θ

L

L 1

Detail F

Dimension in inch

Symbol

A

1

A

2

A b c D E e

HD

E

H L

1

L y

θ

1. Dimension D & E do not include interlead flash.

2. Dimension b does not include dambar protrusion/intrusion.

3. Controlling dimension: Millimeter

4. General appearance spec. should be based on final visual inspection spec.

Nom.

Min.

--- ---

0.002

0.01 0.02 0.25

0.081

0.075

0.01

0.014

0.006 0.152

0.394

0.390

0.025

0.031

0.510 13.45

0.520

0.510

0.025

0.031

0.063

0.051 0.075 1.295

0

Dimension in mm

Max. Max.

---

0.087

0.018

0.0100.004

0.398

0.3980.394

0.036

0.530

0.037

0.003

Nom.

Min.

--- ---

0.05

1.90

0.25

2.05

0.35

0.5

2.20

0.45

0.2540.101

10.00

9.9

0.635

12.95

0.65

10.00

0.80

13.2

10.1

0.952

13.4513.2

0.8

0.95

1.6

1.905

0.08

7

0

---

7

- 22 -

Timing Waveforms, continued

1

2

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5792697

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-27197006

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-27190505

FAX: 886-2-27197502

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: 408-9436666

FAX: 408-5441798

Note: All data and specifications are subject to change without notice.

44-pin TQFP

H

D

44

1

11

12

Seating Plane

D

e

See Detail F

W78E58

Dimension in inch Dimension in mm

Symbol

34

33

E

EH

22

b

Notes:

c

A

1

y

θ

L

Detail F

Min. Nom. Max. Max.Nom.Min.

A

1

A

2

A b c D E

e

D

H

E

H L

1

L

y

θ

1. Dimension D & E do not include interlead flash.

2. Dimension b does not include dambar protrusion/intrusion.

3. Controlling dimension: Millimeter

4. General appearance spec. should be based on final visual inspection spec.

--- ---

0.002

0.004

0.037

0.039

0.0039

0.013

---

0.394

0.390

0.025

0.031

0.468 12.10

0.472

0.468

0.018

0.024

0.039

---

0

0.047

0.006

0.041

0.015

0.0080.004

0.398

0.3980.394

0.036

0.476

0.030

0.003

---

7

--- ---

0.05

0.95

0.22

9.9

0.635

11.90

0.45

--- ---

0

0.10

1.00

0.32

10.00

12.00

1.20

0.15

1.05

0.38

0.2000.090

---

10.1

0.952

0.80

12.1012.00

0.60

0.75

1.00

0.08 7

Publication Release Date: November 1997

- 23 - Revision A2