The W78C58 is a derivative of the W78C52 microcontroller family that provides extended internal
ROM. The chip has 32K bytes of mask ROM and 256 bytes of RAM.
This device provides an enhanced architecture that makes it more powerful and suitable for a variety
of applications for general control systems. It provides on-chip 32KB mask ROM to accommodate
large program codes, 256-bytes of non-volatile on-chip RAM, four 8-bit I/O ports, one 4-bit I/O port,
three 16-bit timer/counters, eight sources with two-level interrupt structures, and on-chip oscillator
clock circuits.
FEATURES
• DC to 40 MHz extensive operating frequency
• 256-byte on-chip scratch pad RAM
• 32K-byte on-chip mask ROM
• 64K-byte address space for external Program Memory
• 64K-byte address space for external Data Memory
• Three 16-bit timer/counters
• Four 8-bit bit-addressable I/O ports
• One extra 4-bit bit-addressable I/O port, additonal
EAIEXTERNAL ACCESS ENABLE: This pin forces the processor to execute out
of external ROM. The ROM address and data will not be present on the bus if
the EA pin is high and the program counter is within the 32 KB area.
Otherwise they will be present on the bus.
PSENO H
ALEO HADDRESS LATCH ENABLE: ALE is used to enable the address latch that
RSTI LRESET: A high on this pin for two machine cycles while the oscillator is
XTAL1ICRYSTAL 1: This is the crystal oscillator input. This pin may be driven by an
XTAL2OCRYSTAL 2: This is the crystal oscillator output. It is the inversion of XTAL1.
VSSIGROUND: Ground potential.
VDDIPOWER SUPPLY: Supply voltage for operation.
P0.0−P0.7
P1.0−P1.7
P2.0−P2.7
P3.0−P3.7
I/O DPORT 0: Function is the same as that of the standard 8052.
I/O HPORT 1: Function is the same as that of the standard 8052.
I/O HPORT 2: Function is the same as that of the standard 8052.
I/O HPORT 3: Function is the same as that of the standard 8052.
PROGRAM STORE ENABLE: PSEN enables the external ROM data in the
Port 0 address/data bus.
When internal ROM access is performed, no PSEN strobe signal outputs
originate from this pin.
separates the address from the data on Port 0. ALE runs at 1/6th of the
oscillator frequency. An ALE pulse is omitted during external data memory
accesses.
running resets the device.
external clock.
P4.0−P4.3
INT2 (P4.3)I HExternal interrupt 2: An extra interrupt input source. It cascades to pin P4.3
INT3 (P4.2)I HExternal interrupt 3: An extra interrupt input source. It cascades to pin P4.2
* Note : TYPE I: input, O: output, I/O: bi-directional, H: pull-high, L: pull-low, D: open drain
I/O HPORT 4: A 4-bit bi-directional parallel port and bit-addressable with internal
pull-ups. Pin P4.3 and P4.2 have alternative function as external interrupt
(INT2/INT3) source input.
internally.
internally.
Publication Release Date: December 1997
- 3 -Revision A5
Page 4
BLOCK DIAGRAM
W78C58
P1.0
~
P1.7
P3.0
~
P3.7
P4.0
~
P4.3
INT2
INT3
Port
1
Port
3
Port
4
Port 1
Latch
Interrupt
Timer
Timer
Timer
UART
Port 3
Latch
Port 4
Latch
ACC
2
Oscillator
PSW
Instruction
Decoder
&
Sequencer
Bus & Clock
Controller
ALU
SFR RAM
RAM & SFR
Reset Block
0
1
T2T1
Address
256 bytes
B
Stack
Pointer
Power control
Port 0
Latch
DPTR
Temp Reg.
PC
Incrementor
Addr. Reg.
32KB
ROM
Port 2
Latch
Port
0
Port
2
P0.0
~
P0.7
P2.0
~
P2.7
XTAL1PSENALEGNDVCCRSTXTAL2
Figure 2. Architecture of the W78C58
- 4 -
Page 5
W78C58
FUNCTIONAL DESCRIPTION
The W78C58 is pin-to-pin compatible with the W78C52, except that the internal 8K mask ROM has
been replaced with 32K of internal mask ROM. The processor supports 111 different opcodes and
references both 64K program address space and 64 K data storage space.
Clock
The W78C58 is designed to be used with either a crystal oscillator or an external clock. Internally, the
clock is divided by two before it is used. This makes the W78C58 relatively insensitive to duty cycle
variations in the clock.
Crystal Oscillator
The W78C58 incorporates a built-in crystal oscillator. To make the oscillator work, a crystal is
connected across pins XTAL1 and XTAL2. In addition, a load capacitance of 30 pf (typically) must be
connected from each pin to ground. Resistor must also be connected from XTAL1 to XTAL2 to
provide a DC bias when the crystal frequency is above 24 MHz.
External Clock
An external clock should be connected to pin XTAL1. Pin XTAL2 should be left unconnected. The
XTAL1 input is a CMOS-type input, as required by the crystal oscillator. As a result, the external clock
signal should have an input one level greater than 3.5 volts.
Power Management
Idle Mode
The idle mode is entered by setting the IDLE bit in the PCON register. In the idle mode, the internal
clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The
processor will exit idle mode when either an interrupt or a reset occurs.
Power-down Mode
When the PD bit of the PCON register is set, the processor enters the power-down mode. In this
mode all of the clocks are stopped, including the oscillator. The only way to exit power-down mode is
by a reset.
Reset
The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two
machine cycles while the oscillator is running.
An internal trigger circuit in the reset line is used to deglitch the reset line when the W78C58 is used
with an external RC network. The reset logic also has a special glitch removal circuit that ignores
glitches on the reset line.
During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of
bit 4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.
New Defined Peripheral
In order to be more suitable for I/O, an extra 4-bit bit-addressable port P4 and two external interrupt
INT2, INT3 has been added to either the PLCC or QFP 44 pin package. And description follows:
Publication Release Date: December 1997
- 5 -Revision A5
Page 6
1. INT2 / INT3
INT2
W78C58
Two additional external interrupts,
interrupt 0 and 1 in the standard 80C52. The functions/status of these interrupts are
determined/shown by the bits in the XICON (External Interrupt Control) register. The XICON register
is bit-addressable but is not a standard register in the standard 80C52. Its address is at 0C0H. To
set/clear bits in the XICON register, one can use the "SETB (/CLR) bit" instruction. For example,
"SETB 0C2H" sets the EX2 bit of XICON.
Example:
P4REG0D8H
MOVP4, #0AH ; Output data "A" through P4.0−P4.3.
MOVA, P4; Read P4 status to Accumulator.
SETBP4.0; Set bit P4.0
CLRP4.1; Clear bit P4.1
2. PORT4
Another bit-address port P4 is also available and only 4 bits (P4<3:0>) can be used. This port address
is located at 0D8H with the same function as that of port P1,except the P4.3 and P4.2 are alternative
function pins. It can be used as general I/O pins or external interrupt input sources (INT2/INT3).
and INT3 , whose functions are similar to those of external
Reduce EMI Emission
Because of the large on-chip mask-ROM, when a program is running in internal ROM space, the ALE
will be unused. The transition of ALE will cause noise, so it can be turned off to reduce the EMI
emission if it is useless. Turning off the ALE signal transition only requires setting the bit 0 of the
AUXR SFR, which is located at 08Eh. When ALE is turned off, it will be reactivated when the program
accesses external ROM/RAM data or jumps to execute an external ROM code. The ALE signal will
turn off again after it has been completely accessed or the program returns to internal ROM code
space..
POF Flag
The Power-Off-Reset flag is set by on-chip circuitry when the VCC level rises from 0 to 5V. The POF
bit can be set/cleared by software allowing a user to determine if the reset is the result of a power-on
or a warm up by external reset. To avoid effect of POF flag, the power voltage must remain above
3V.
Timers 0, 1, and 2
Timers 0, 1, and 2 each consist of two 8-bit data registers. These are called TL0 and TH0 for Timer 0,
TL1 and TH1 for Timer 1, and TL2 and TH2 for Timer 2. The TCON and TMOD registers provide
control functions for timers 0, 1. The T2CON register provides control functions for Timer 2. RCAP2H
and RCAP2L are used as reload/capture registers for Timer 2.
The operations of Timer 0 and Timer 1 are the same as in the W78C51. Timer 2 is a special feature
of the W78C52C: it is a 16-bit timer/counter that is configured and controlled by the T2CON register.
Like Timers 0 and 1, Timer 2 can operate as either an external event counter or as an internal timer,
depending on the setting of bit C/T2 in T2CON. Timer 2 has three operating modes: capture, autoreload, and baud rate generator. The clock speed at capture or auto-reload mode is the same as that
of Timers 0 and 1.
- 6 -
Page 7
W78C58
DESCRIPTIONS OF THE SPECIAL FUNCTION REGISTERS (SFRS)
SYMBOLDEFINITIONADDR. MSB BIT ADDRESS, SYMBOL LSBRESET
SMOD: Double baud rate bit. When set to a 1, the baud rate is doubled when the serial port is
being used in either modes 1, 2, 3.
SMOD0: Enable FE bit in SCON. This bit is an alternative switch of SM0 and FE (Frame Error)
bit. When set to a 1, SCON.7 means a FE bit, otherwise a SM0 bit.
POF: Power off flag. Bit is set by hardware when power on reset. It can be cleared by software
to determine chip reset is a warm boot or cold boot.
GF1, GF0: These two bits are general-purpose flag bits for the user.
PD: Power down mode bit. Set it to enter power down mode.
IDL: Idle mode bit. Set it to enter idle mode.
GF1GF0PDIDL
The power-off flag is located at PCON.4. This bit is set when VDD has been applied to the part. It can
be used to determine if a reset is a warm boot or a cold boot if it is subsequently reset by software.
PT2: Timer 2 interrupt priority high if set
PS: Serial port priority high if set
PT1: Timer 1 interrupt priority high if set
PX1: External interrupt 1 priority high if set
PT0: Timer 0 interrupt priority high if set
PX0: External interrupt 0 priority high if set
W78C58
***XICON - External Interrupt Control (C0H)
PX3EX3IE3IT3PX2EX2IE2IT2
PX3: External interrupt 3 priority high if set
EX3: External interrupt 3 enable if set
IE3: If IT3 = 1, IE3 is set/cleared automatically by hardware when interrupt is detected/serviced
IT3: External interrupt 3 is falling-edge/low-level triggered when this bit is set/cleared by software
PX2: External interrupt 2 priority high if set
EX2: External interrupt 2 enable if set
IE2: If IT2 = 1, IE2 is set/cleared automatically by hardware when interrupt is detected/serviced
IT2: External interrupt 2 is falling-edge/low-level triggered when this bit is set/cleared by software
The W78C58 supports an eight-source and a four-priority-level interrupt architectures. Besides the
SFRs of IP and IE to control the six-source of the standard 8052 interrupt functions. There is an
another SFR (XICON) to control the extra two-source of the external interrrupt (INT2 and INT3). This
priority scheme is formed by combining IPH with IP to determine the priority of each interrupt. Except
the INT2 and INT3, they are not defined in IP SFR but in XICON.
Publication Release Date: December 1997
- 9 -Revision A5
Page 10
Following tables show the interrupt informations and priority definitions.
GATE: Gating control. When set, Timer/counter x is enabled only while INTx pin is high and TRx
control pin is set. When cleared, Timer x is enabled whenever the TRx conrol bit is set.
C//T: Timer or Counter Selector. Cleared for timer operation. Set for counter operation.
M1 M0: Operating Mode
0 0: 13-bit Timer/Counter.
0 1: 16-bit Timer/Counter.
1 0: 8-bit auto-reload Timer/Counter. THx holds a value which is to be reloaded into TLx
each time it overflows.
1 1: Timer 0: TL0 is an 8-bit timer/counter controlled by the standard Timer 0 control bits.
TH0 is an 8-bit timer only controlled by Timer 1 control bits.
Timer 1: Timer/counter 1 stopped.
- 10 -
Page 11
W78C58
***TCON - Timer 0, 1 Control (88H)
TF1TR1TF0TR0IE1IT1IE0IT0
TF1: Timer 1 overflow flag. Set by hardware on timer/counter overflow. cleared by hardware when
processor vectors to interrupt routine.
TR1: Timer 1 run control bit. Set/cleared by software to turn timer/counter on or off.
TF0: Timer 0 overflow flag. Set by hardware on timer/counter overflow. Cleared by hardware when
processor vectors to interrupt routine.
TR0: Timer 0 run control bit. Set/cleared by software to turn timer/counter on or off.
IE1: Interrupt 1 edge flag. Set by hardware when external interrupt edge detected. Cleared when
interrupt processed.
IT1: Interrupt 1 type control bit. Set/cleared by software to specify falling edge/low level triggered
external interrupt.
IE0: Interrupt 0 edge flag. Set by hardware when external interrupt edge detected. Cleared when
interrupt processed.
IT0: Interrupt 0 type control bit. Set/cleared by software to specify falling edge/low level triggered
external interrupt.
***T2CON - Timer 2 Control (C8H)
TF2EXF2RCLKTCLKEXEN2TR2C//TCP//RL2
TF2:Timer 2 overflow flag. Set by a Timer 2 overflow and must be cleared by software. TF2 will
not be set when RCLK = 1 or TCLK = 1.
EXF2: Timer2 external flag. Set when either a capture or reload is caused by a negative transition
on T2EX and EXEN2 = 1. When Timer 2 interrupt is enabled, EXF2 = 1 will cause the CPU
to vector to the Timer 2 interrupt routine. EXF2 must be cleared by software.
RCLK: Receive clock flag. RCLK = 1 causes the serial port to use Timer 2 overflow pulses for its
receive clock in mode 1 and 3. RCLK = 0 causes Timer 1 overflow to be used for the
receive clock.
TCLK: Transmit clock flag. TCLK = 1 causes the serial port to use Timer 2 overflow pulses for its
transmit clock in mode 1 and 3. TCLK = 0 causes Timer 1 overflow to be used for the
transmit clock.
EXEN2: Timer 2 external enable flag. EXEN2 = 1 allows a capture or reload to occur as a result of a
negative transition on T2EX if Timer 2 is not used to clock the serial port. EXEN2 = 0
causes Timer 2 to ignore events at T2EX.
TR2: TR2 = 1/0: turns on/off Timer 2.
C//T: Timer or Counter select. Set 1/0 for external event counter (falling edge triggered) /inter
timer.
CP//RL2:Capture/reload flag.
Publication Release Date: December 1997
- 11 -Revision A5
Page 12
W78C58
EA
*Reduced EMI Mode
The AO bit in the AUXR register, when set, disables the ALE output.
***AUXR - Auxiliary Register (8EH)
-------AO
AO: Turn off ALE output.
ABSOLUTE MAXIMUM RATINGS
PARAMETERSYMBOLMIN.MAX.UNIT
DC Power SupplyVCC−VSS-0.3+7.0V
Input VoltageVINVSS -0.3VCC +0.3V
Operating TemperatureTA070
Storage TemperatureTST-55+150
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
RST
Input High Voltage
XTAL1 [*4]
Output Low Voltage
P1, P2, P3, P4
Output Low Voltage
P0, ALE, PSEN [*3]
Sink Current
P1, P2, P3, P4
Sink Current
P0, ALE, PSEN
Output High Voltage
P1, P2, P3, P4
Output High Voltage
P0, ALE, PSEN [*3]
VIL200.8VVDD = 4.5V
VIL300.8VVDD = 4.5V
VIH12.4VDD +0.2VVDD = 5.5V
VIH23.5VDD +0.2VVDD = 5.5V
VIH33.5VDD +0.2VVDD = 5.5V
VOL1-0.45VVDD = 4.5V
IOL = +2 mA
VOL2-0.45VVDD = 4.5V
IOL = +4 mA
ISK148mAVDD = 4.5V
Vs = 0.45V
ISK21014mAVDD = 4.5V
Vs = 0.45V
VOH12.4-VVDD = 4.5V
IOH = -100 µA
VOH22.4-VVDD = 4.5V
IOH = -400 µA
Source Current
P1, P2, P3, P4
Source Current
P0, ALE, PSEN
Notes:
*1. RST pin is a Schmitt trigger input. RST has internal pull-low resistors of about 30 KΩ.
*3. P0, ALE and /PSEN are tested in the external access mode.
*4. XTAL1 is a CMOS input.
*5. Pins of P1, P2, P3, P4 can source a transition current when they are being externally driven from 1 to 0. The transition
current reaches its maximum value when VIN approximates to 2V.
ISR1-120-180
µA
VDD = 4.5V
Vs = 2.4V
ISR2-8-14mAVDD = 4.5V
Vs = 2.4V
Publication Release Date: December 1997
- 13 -Revision A5
Page 14
W78C58
AC CHARACTERISTICS
The AC specifications are a function of the particular process used to manufacture the part, the
ratings of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the
specifications can be expressed in terms of multiple input clock periods (TCP), and actual parts will
usually experience less than a ±20 nS variation. The numbers below represent the performance
expected from a 0.8 micron CMOS process when using 2 and 4 mA output buffers.
2. It is recommended that an oscillator be used as external clock source when operating freq. is above 35MHz. Apply the
external clock signal to XTAL1, and leave XTAL2 float, as shown in Figure 10.
6.8 KΩ
4.3 KΩ
- 18 -
Page 19
Application Circuits, continued
Expanded External Data Memory and Oscillator
VCC
8.2K
VCC
10u
OSCILLATOR
35
EA
21
X1
20
X2
10
RESET
INT0
14
15
INT1
16
T0
17
T1
2
P1.0
3
P1.1
4
P1.2
5
P1.3
6
P1.4
7
P1.5
8
P1.6
9
P1.7
W78C58
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
WR
PSEN
ALE
TXD
RXD
43
AD0
42
AD1
41
AD2
40
AD3
39
AD4
38
AD5
37
AD6
36
AD7
24
A8
25
A9
26
A10
27
A11
28
A12
A13
29
30
A14
31
RD
19
18
32
33
13
11
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
GND
W78C58
3
D0Q0
4
D1Q1
7
D2Q2
8
D3Q3
13
D4Q4
14
D5Q5
17
D6Q6
18
D7
1
OC
G 11
74LS373
A0
2
A1
5
A2
6
9
A3
A4
12
A5
15
A6
16
A7
19
Q7
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
GND
10
A0
20256
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
CE
OE
WR
D0
D1
D2
D3
D4
D5
D6
D7
9
8
7
6
5
4
3
25
24
21
23
2
26
1
20
22
27
AD0
11
AD1
12
AD2
13
AD3
15
AD4
16
AD5
17
AD6
18
AD7
19
Figure B
Publication Release Date: December 1997
- 19 -Revision A5
Page 20
PACKAGE DIMENSIONS
40-pin DIP
40
1
E
S
A
2
A
L
D
B
B
1
W78C58
Dimension in inch Dimension in mm
Symbol
A
A
A
B
B
c
21
D
E
E
e
L
a
e
201
Base Plane
1
A
Seating Plane
e
1
E
e A
a
S
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
c
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
Nom.
Min.
0.010
1
0.155
0.150
2
0.016
0.018
0.0501.27
1
0.008
0.010
2.055 2.07052.20 52.58
0.6000.590
0.540
1
1
0.120
0.130
015
0.6500.63016.00 16.51
A
Min.
0.254
3.81
0.406
0.203
14.986
13.72
2.286 2.54 2.7940.090 0.100
3.048
Nom.
3.937
0.457
0.254
15.24
13.84
3.302
5.334
4.064
0.559
1.3721.2190.0540.048
0.356
15.494
13.97
3.556
17.01
Max.Max.
0.210
0.160
0.022
0.014
0.610
0.5500.545
0.110
0.140
0.670
0.090
.
150
2.286
44-pin PLCC
7
17
L
θ
Seating Plane
61
e
H
D
D
4440
G
D
Dimension in inch Dimension in mm
Symbol
39
H
E
E
29
2818
A
2
A
b
b
1
A
1
y
G
E
c
A
A
A
b1
b
c
D
E
e
G
G
H
HE
L
y
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
Nom.
Min.
0.020
1
0.145
2
0.026
0.016
0.008
0.648
0.590
D
0.590
E
0.680
D
0.680
0.090
Max.Max.
0.185
0.150
0.155
0.028
0.032
0.022
0.018
0.010
0.014
0.653
0.658
0.6580.6530.648
0.050 BSC
0.610
0.630
0.6300.610
0.690
0.700
0.700
0.690
0.100
0.110
0.004
Min.
0.508
3.683
0.66
0.406
0.203
16.46
14.99
17.27
17.27
2.296
1.27
Nom.
3.81
0.711
0.457
0.254
16.59
15.49
15.4914.99
17.53
2.54
BSC
4.699
3.937
0.813
0.559
0.356
16.71
16.7116.5916.46
16.00
16.00
17.78
17.7817.53
2.794
0.10
- 20 -
Page 21
Package Dimensions, continued
1
2
44-pin QFP
H
D
D
44
1
11
12
e
Seating Plane
See Detail F
W78C58
Dimension in inch
34
33
Symbol
A
A
A
b
1
2
c
D
E
EH
E
e
D
H
E
H
L
1
L
22
b
c
A
A
2
A
1
y
θ
L
L 1
Detail F
y
θ
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
Nom.
Min.
--- ---
0.002
0.01 0.020.25
0.081
0.075
0.01
0.014
0.0060.152
0.394
0.390
0.390
0.025
0.031
0.51013.45
0.520
0.520
0.510
0.025
0.031
0.063
0.0510.075 1.295
0
Dimension in mm
Max.Max.
---
0.087
0.018
0.0100.004
0.398
0.3980.394
0.036
0.530
0.530
0.037
0.003
Nom.
Min.
--- ---
0.05
1.90
0.25
9.9
9.9
0.635
12.95
12.95
0.65
7
0
2.05
0.35
10.00
10.00
0.80
13.2
---
0.5
2.20
0.45
0.2540.101
10.1
10.1
0.952
13.4513.2
0.8
0.95
1.6
1.905
0.08
7
44-pin TQFP
44
1
11
12
Seating Plane
H
D
D
e
See Detail F
Dimension in inchDimension in mm
Symbol
34
33
E
EH
22
b
Notes:
c
A
A
A
1
y
θ
L
L
Detail F
Min. Nom. Max.Max.Nom.Min.
A
1
A
2
A
b
c
D
E
e
D
H
E
H
L
1
L
y
θ
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
--- ---
0.002
0.004 0.0060.10
0.037
0.039
0.0039
0.013
---
0.394
0.390
0.390
0.025
0.031
0.46812.10
0.472
0.472
0.468
0.018
0.024
0.039
---
0
0.047
0.041
0.015
0.0080.004
0.398
0.3980.394
0.036
0.476
0.476
0.030
0.003
---
7
--- ---
0.05
0.95
0.22
9.9
9.9
0.635
11.90
11.90
0.45
------
0
1.00
0.32
10.00
10.00
12.00
1.20
0.15
1.05
0.38
0.2000.090
---
10.1
10.1
0.952
0.80
12.1012.00
0.60
0.75
1.00
0.08
7
Publication Release Date: December 1997
- 21 -Revision A5
Page 22
W78C58
Note: All data and specifications are subject to change without notice.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792697
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
- 22 -
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
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