Datasheet W27C520W-90, W27C520W-70, W27C520S-90, W27C520S-70 Datasheet (Winbond Electronics)

Page 1
Preliminary W27C520
OE
64K × 8 ELECTRICALLY ERASABLE EPROM
GENERAL DESCRIPTION
FEATURES
• High speed access time: 70/90 nS (max.)
• Read operating current: 8/20 mA (max.)
• Erase/Programming operating current
30 mA (max.)
• Standby current: 20/100 µA (max.)
• Unregulated battery power supply range,
3.0V to 3.6V and 4.5V to 5.5V
• +13V erase and programming voltage
• High Reliability CMOS Technology
− 2K V ESD Protection
− 200 mA Latchup Immunity
• Fully static operation
• All inputs and outputs directly LVTTL/CMOS
compatible
• Three-state outputs
• Available packages: 20-pin TSSOP and 20-pin
SOP
PIN CONFIGURATIONS
1
A10
2
A12
3
A14
4
ALE
5
V
OE/VPP
A15 A13 A11
A9
OE/VPP
A15
A13
A11
A9
AD0
AD2 AD4 AD6
GND
DD
6 7 8 9 10
1 2 3 4 5 6 7 8 9 10
TSSOP
Top View
SOP
Top View
BLOCK DIAGRAM
20
A8 AD1
19
AD3
18
AD5
17
AD7
16
GND
15 14
AD6
13
AD4
12
AD2 AD0
11
VDD
20
ALE
19
A14
18
A12
17
A10
16
A8
15
AD1
14 13
AD3 AD5
12
AD7
11
PIN DESCRIPTION
SYMBOL DESCRIPTION
AD0−AD7
A8−A15
ALE Address Latch Enable
VDD Power Supply
GND Ground
OE / V
AD7 - AD0
A15 - A8
/VPP
ALE
V
GND
CONTROL
PP
L A T C H E S
DECODER
DD
OUTPUT BUFFER
MEMORY
ARRAY
Address/Data Inputs/Outputs Address Inputs
Output Enable, Program/Erase Supply Voltage
Publication Release Date: October 2000
- 1 - Revision A1
Page 2
Preliminary W27C520
OE
OE
FUNCTIONAL DESCRIPTION
Read Mode
Unlike conventional UVEPROMs, which has CE and OE two control functions, the W27C520 has one OE/VPP and one ALE (address_latch_enable) control functions. The ALE makes lower
address A[7:0] to be latched in the chip when it goes from high to low, so that the same bus can be used to output data during read mode. i.e. lower address A[7:0] and data bus DQ[7:0] are multiplexed.
/VPP controls the output buffer to gate data to the output pins. When addresses are stable, the
address access time (TACC) is equal to the delay from ALE to output (TCE), and data are available at the outputs TOE after the falling edge of OE/VPP, if TACC and TCE timings are met.
Erase Mode
The erase operation is the only way to change data from "0" to "1." Unlike conventional UVEPROMs, which use ultraviolet light to erase the contents of the entire chip (a procedure that requires up to half an hour), the W27C520 uses electrical erasure. Generally, the chip can be erased within 100 mS by using an EPROM writer with a special erase algorithm.
There are two ways to enter Erase mode. One is to raise OE/VPP to VPE (13V), VDD = VDE (6.5V), A9 = VHH (13V), A10 = high A8&A11 = low, and all other address pins include AD[7:0] keep at fixed low or high. Pulsing ALE high starts the erase operation. The other way is somewhat like flash, by programming two consecutive commands into the device and then enter Erase mode. The two commands are loading Data = AA(hex) to Addr. = 5555(hex) and Data = 10(hex) to Addr. = 2AAA(hex). Be careful to note that the ALE pulse widths of these two commands are different: One is 50 µS, while the other is 100 mS. Please refer to the Smart Erase Algorithm 1 & 2.
Erase Verify Mode
The device will enter the Erase Verify Mode automatically after Erase Mode. Only power down the device can force the device enter Normal Read Mode again.
Program Mode
Programming is the only way to change cell data from "1" to "0." The program mode is entered when
/VPP is raised to VPP (13V), VDD = VDP (6.5V), the address pins equal the desired addresses, and
the input pins equal the desired inputs. Pulsing ALE high starts the programming operation.
Program Verify Mode
The device will enter the Program Verify Mode automatically after Program Mode. Only power down the device can force the device enter Normal Read Mode again.
Erase/Program Inhibit
Erase or program inhibit mode allows parallel erasing or programming of multiple chips with different data. When ALE low, erasing or programming of non-target chips is inhibited, so that except for the
ALE and OE/VPP pins, the W27C520 may have common inputs.
Standby Mode
The standby mode significantly reduces VDD current. This mode is entered when ALE and OE/VPP keep high. In standby mode, all outputs are in a high impedance state.
- 2 -
Page 3
OE
Preliminary W27C520
System Considerations
An EPROM's power switching characteristics require careful device decoupling. System designers are interested in three supply current issues: standby current levels (ISB), active current levels (IDD), and transient current peaks produced by the falling and rising edges of ALE Transient current magnitudes depend on the device output's capacitive and inductive loading. Proper decoupling capacitor selection will suppress transient voltage peaks. Each device should have a
0.1 µF ceramic capacitor connected between its VDD and GND. This high frequency, low inherent­inductance capacitor should be placed as close as possible to the device. Additionally, for every eight devices, a 4.7 µF electrolytic capacitor should be placed at the array's power supply connection between VDD and GND. The bulk capacitor will overcome voltage slumps caused by PC board trace inductances.
TABLE OF OPERATING MODES
(VPP = 13V, VPE = 13V, VHH = 12V, VDP = 6.5V, VDE = 6.5V, VDD = 3.3V or 5.0V, VDI = 5.0V, X = VIH or VIL)
MODE PIN
Address Latch Enable VIH VIH AIN VDD A[7:0] Read VIL VIL AIN VDD DOUT Output Disable VIL/
Standby VIH VIH X VDD A[7:0] Program VIH VPP AIN VDP DIN Erase 1 VIH VPE A8&A11 = VIL, A9 = VPE,
Erase 2 VIH VPE First command:
Second command:
Product Identifier­manufacturer
Product Identifier-device VIL VIL A8 = VIH, A9 = VHH, Others = X VDI 1F(Hex)
ALE
VIH
VIL VIL A8 = VIL, A9 = VHH, Others = X VDI DA(Hex)
/VPP
VIH X VDD High Z
OTHER ADDRESS VDD AD[7:0]
VDE X
A10 = VIH, Others = X
VDE AA(hex)
Addr. = 5555 (hex)
VDE 10(hex)
Addr. = 2AAA (hex)
Publication Release Date: October 2000
- 3 - Revision A1
Page 4
Preliminary W27C520
OE
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER RATING UNIT
Ambient Temperature with Power Applied -55 to +125 Storage Temperature -65 to +150 Voltage on all Pins with Respect to Ground Except
/VPP, A9 and VDD Pins
Voltage on OE/VPP Pin with Respect to Ground Voltage on A9 Pin with Respect to Ground -2.0 to +7.0 V Voltage VDD Pin with Respect to Ground -2.0 to +14.0 V
Notes:
1. Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
2. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 nS. Maximum output pin voltage is VDD +0.75V DC which may overshoot to +7.0V for pulses of less than 20 nS.
-2.0 to +7.0 V
-2.0 to +7.0 V
DC Erase Characteristics
(TA = 25° C ±5° C, VDD = 6.5V ±0.25V)
°C °C
PARAMETER SYM.
Input Load Current ILI VIN = VIL or VIH -10 - 10 VDD Erase Current ICP
VPP Erase Current IPP
Input Low Voltage VIL - -0.3 - 0.8 V Input High Voltage VIH - 2.4 - VDD+0.3 Output Low Voltage
(Verify) Output High Voltage
(Verify) A9 SID Voltage
A9 Erase Voltage VPE - 12.75 13 13.25 V VPP Erase Voltage VPE - 12.75 13 13.25 V VDD Supply Voltage
(Erase & Erase Verify)
Note: VDD must be applied simultaneously or before VPP and removed simultaneously or after VPP.
VOL IOL = 2.1 mA - - 0.45 V
VOH
VHH
VDE - 6.25 6.5 6.75 V
CONDITIONS LIMITS UNIT
ALE = VIH, OE/VPP = VPE A8 & A11 = VIL, A9 = VPE, A10 = VIH, Others = X
ALE = VIH, OE/VPP = VPE A8 & A11 = VIL, A9 = VPE, A10 = VIH, Others = X
IOH = -0.4 mA 2.4 - - -
VDD = 5V ±10%
MIN. TYP. MAX.
- - 30 mA
- - 30 mA
11.5 12 12.5 V
µA
V
- 4 -
Page 5
Preliminary W27C520
Input
CAPACITANCE
(VDD = 3.0V to 3.6V or 4.5V to 5.5V, TA = 25° C, f = 1 MHz)
PARAMETER SYMBOL MAX. UNIT
Input Capacitance CIN VIN = 0V 6 pF Output Capacitance COUT VOUT = 0V 12 pF
AC CHARACTERISTICS
AC Test Conditions
PARAMETER CONDITIONS
Input Pulse Levels 0V/3V Input Rise and Fall Times 10 nS Input and Output Timing Reference Level 1.5V/1.5V Output Load CL = 100 pF, IOH/IOL = -0.4 mA/2.1 mA
AC Test Load and Waveforms
D
OUT
3V
0V
+1.3V
(IN914)
3.3K ohm
100 pF (Including Jig and Scope)
Output
Test Points Test Points
1.5V
1.5V
Publication Release Date: October 2000
- 5 - Revision A1
Page 6
READ OPERATION DC CHARACTERISTICS
0.3V,
OE
(VDD = 3.0V to 3.6V or 4.5V to 5.5V, TA = 0 to 70° C)
Preliminary W27C520
PARAMETER SYM.
CONDITIONS LIMITS UNIT
MIN. TYP. MAX.
Input Load Current ILI VIN = 0V to VDD -5 - 5 Output Leakage Current ILO VOUT = 0V to VDD -5 - 5
VDD = 3.0V to
3.6V VDD = 4.5V to
5.5V
VDD = 3.0V to
3.6V VDD = 4.5V to
5.5V
(CMOS input)
ISB
Input Low Voltage VIL - -0.6
ALE = VDD ±
/VPP = VDD ±0.3V All others inputs = GND/ VDD ±0.3V
ALE = VIL, IOUT = 0 mA f = 5 MHz
- - 20 Standby VDD Current
- 100
- - 8 VDD Operating Current IDD
- - 20
- 0.8 V
Input High Voltage VIH - 2.0 - VDD
Output Low Voltage VOL IOL = 2.1 mA - - 0.4 V Output High Voltage VOH IOH = -0.4 mA 2.4 - - V
READ OPERATION AC CHARACTERISTICS
µA µA µA
mA
V
+0.3
(VDD = 3.0V to 3.6V or 4.5V to 5.5V, TA = 0 to 70° C)
PARAMETER SYM. W27C520-70 W27C520-90 UNIT
MIN. MAX. MIN. MAX.
Address Latch Enable Access Time TCE - 70 - 90 nS Address Latch Enable Width TALE 45 - 45 - nS Address Access Time TACC - 70 - 90 nS Address Setup Time TAS 15 - 15 - nS Address Hold Time TAH 15 - 15 - nS Output Enable Access Time TOE - 35 - 35 nS
OE /VPP High to High-Z Output
TDF - 25 - 25 nS
Output Hold from Address Change TOH 0 - 0 - nS
Note: VDD must be applied simultaneously or before VPP and removed simultaneously or after VPP.
- 6 -
Page 7
Preliminary W27C520
DC PROGRAMMING CHARACTERISTICS
(VDD = 6.5V ±0.25V, TA = 25° C ±5° C)
PARAMETER SYM.
Input Load Current ILI VIN = VIL or VIH -10 - 10 VDD Program Current ICP ALE = VIH,
VPP Program Current IPP ALE = VIH,
Input Low Voltage VIL - -0.3 - 0.8 V Input High Voltage VIH - 2.4 - VDD +0.5 Output Low Voltage (Verify) VOL IOL = 2.1 mA - - 0.45 V Output High Voltage (Verify) VOH IOH = -0.4 mA 2.4 - - V A9 Silicon I.D. Voltage VHH VPP Program Voltage VPP - 12.75 13.0 VDD Supply Voltage (Program) VDP - 6.25 6.5 6.75 V
AC PROGRAMMING/ERASE CHARACTERISTICS
(VDD = 6.5V ±0.25V, TA = 25° C ±5° C)
PARAMETER SYM. LIMITS UNIT
OE /VPP Pulse Rise Time Address Latch Enable Width TALE 500 - - nS ALE Program Pulse Width TPPW 47.5 50 52.5
ALE Erase Pulse Width TEPW 95 100 105 mS ALE Erase Pulse Width 1 TEPW1 47.5 50 52.5 ALE Erase Pulse Width 2 TEPW2 95 100 105 mS Latched Address Setup Time TLAS 100 - - nS Latched Address Hold Time TLAH 100 - - nS Address Setup Time TAS 2.0 - ­Address Hold Time TAH 0 - -
OE /VPP Setup Time
OE /VPP Hold Time Data Setup Time TDS 2.0 - -
Data Hold Time TDH 2.0 - ­Data Valid from OE/VPP Low during Erase Verify
Data Valid from OE /VPP Low during Program Verify
OE /VPP High to Output High Z
OE /VPP High Voltage Delay After ALE Low
OE /VPP Recovery Time
Note: VDD must be applied simultaneously or before VPP and removed simultaneously or after VPP.
CONDITIONS LIMITS UNIT
MIN. TYP. MAX.
- - 30 mA
OE /VPP = VPP
- - 30 mA
/VPP = VPP
OE
VDD = 5V ±10%
TPRT 50 - - nS
TOES 2.0 - ­TOEH 2.0 - -
TEOE - - 150 nS TPOE - - 150 nS TDFP 0 - 130 nS
TVS 2.0 - ­TVR 2.0 - -
11.5 12.0
MIN. TYP. MAX.
12.5 V
13.25 V
µA
V
µS
µS
µS µS µS
µS µS µS
µS µS
Publication Release Date: October 2000
- 7 - Revision A1
Page 8
TIMING WAVEFORMS
AC Read Waveform
V
ALE
IH
V
IL
V
IH
V
IL
V
IH
V
IL
High Z
A8-A15
OE/Vpp
AD0-AD7
T
ALE
AS
T
Address
Preliminary W27C520
Address Valid
CE
T
TOE
AH
T
Data
ACC
T
DF
T
OH
T
High Z
Programming Waveform
V
A[15:8]
OE/Vpp
ALE
AD[7:0]
V
13V
V
V
V
V
V V
IH
IL
T
RPT
IH
IL
IH
IL
IH
IL
T
VS
ALE
T
T
LAS
Add
PROGRAM PROGRAM (VERIFY)
T
AS
T
Address Stable
T
OES
T
OEH
T
VR
T
T
PPW
T
T
T
LAH
DS
DH
Data in
ALE
Add
T
POE
T
DFP
Data out
AH
- 8 -
Page 9
Timing Waveforms, continued
Erase Waveform 1
Preliminary W27C520
V
IH
A[15:8]
V
IL
V
AD[7:0]
IH
V
IL
13.0V
V
ALE
IH
V
IL
V
IH
V
IL
OE/Vpp
Erase Waveform 2
Read Company SID
Others=V
A8=VIL
A[15:8]
OE/Vpp
V V
13.0V V
V
IH
IL
IH IL
DD
V =5.0V A9=12.0
V
IL
Read Company SID
V = 3.3 or 5.0V
DD
Read Device SID
Chip Erase Erase (Verify)
A9 = 12.0V A9 = 13.0V
IH
IH
1F
T
AST
PRT
T
OES
A[15:8] = 55
T
OES
Others = VILor V A8, A11 = V
A10 = V
Chip Erase
A8 = V
Read Device SID
or V
A8=V
Others = V
IL
DA
IH
IH
T
PRT
IL
or V
A8 = V
Command 1 Command 2
V =6.5V
DD
T
RPT
VS
T
DD
V = 6.5V
IL
IH
T
EPW
OEH
T
IH
T
OEH
V =6.5V
DD
A[15:8] = 2A
DD
V = 6.5V
Address Valid
Add
T
VR
D
OUT
T
EOE
Erase Verify
V =6.5V
DD
Address Valid
T
ALE
AD[7:0]
V
IH
V
IL
V
IH
V
IL
DA
T
OES
ALE
T
T
LAS
T
55 AA
1F D
LAH
EPW1
T
T
EPW2
T
T
DS
DH
AA
10
Add
EOE
OUT
Note: First command Address = 5555(hex) with Data = AA(hex) Second command Address = 2AAA(hex) with Data = 10(hex)
Publication Release Date: October 2000
- 9 - Revision A1
Page 10
SMART PROGRAMMING ALGORITHM 1
Start
Address = First Location
V = 6.5V
DD
OE/Vpp = 13V
Preliminary W27C520
Increment Address
Increment
Address
Last
Address ?
Power
Down
No
Yes
No
Pass
Program One 50 S Pulse
Address = First Location
Program One 50 S Pulse
V = 3.3 or 5.0V
DD
OE/Vpp = V
µ
Last
Address ?
Yes
X = 0
Verify
Byte
µ
IL
Fail
No
Increment X
X = 25 ?
Yes
Compare
All Bytes to
Original
Data
Pass
Device Passed
- 10 -
Fail
Device
Failed
Page 11
SMART PROGRAMMING ALGORITHM 2
Start
Address = First Location
V = 6.5V
DD
X = 0
Preliminary W27C520
Increment Address
Fail
Program One 50 S Pulse
OE/Vpp = 13V
µ
Increment X
X = 25?
No
Verify One Byte OE/Vpp = V
IL
Pass
No
Last Address ?
Yes
Power Down
V =3.3or5.0V
DD
Compare
All Bytes to
Original
Data
Yes
Verify One Byte
OE/Vpp = V
Fail
Fail
IL
Pass
Pass
Device Passed
Device Failed
Publication Release Date: October 2000
- 11 - Revision A1
Page 12
SMART ERASE ALGORITHM 1
OE/Vpp = 13V
Start
X = 0
V = 6.5V
DD
Preliminary W27C520
Increment
Address
A9 = 13V; A8&A11 = V A10 = V
Chip Erase 100 mS Pulse
Address = First Location
Increment X
V = 6.5VDD
OE/Vpp = V
No
Address?
IH
IL
Erase
Verify
Pass
Last
Yes
Power Down
IL
No
Fail
X = 20?
Yes
V = 3.3 or 5.0V
DD
OE/Vpp = V
Compare
All Bytes to
FFs (HEX)
Pass Device
IL
Pass
- 12 -
Fail
Fail Device
Page 13
SMART ERASE ALGORITHM 2
OE/Vpp = 13V
Start
X = 0
V = 6.5V
DD
Preliminary W27C520
Increment
Address
Program One 50 S Pulse
with Address = 5555(Hex) Data = AA(Hex)
Program One 100 mS Pulse
with Address = 2AAA(Hex) Data = 10(Hex)
OE/Vpp = V
No
V = 3.3 or 5.0V
DD
OE/Vpp = V
µ
Increment X
V = 6.5V
DD
Erase
Verify
Pass
Last
Address?
Yes
Power
Down
IL
IL
Fail
No
X = 20?
Yes
Compare All Bytes to FFs (HEX)
Pass
Pass
Device
Fail
Fail
Device
Publication Release Date: October 2000
- 13 - Revision A1
Page 14
ORDERING INFORMATION
Preliminary W27C520
PART NO. ACCESS
TIME
(nS)
W27C520W-70* 70 8/20 20/100 173mil TSSOP W27C520W-90* 90 8/20 20/100 173mil TSSOP W27C520S-70* 70 8/20 20/100 300mil SOP W27C520S-90* 90 8/20 20/100 300mil SOP
Notes:
1. The Part No is preliminary and might be changed after project is consoled.
2. Winbond reserves the right to make changes to its products without prior notice.
3. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
OPERATING
CURRENT
MAX. (mA)
STANDBY CURRENT
MAX. (µA)
PACKAGE
- 14 -
Page 15
PACKAGE DIMENSIONS
θ
θ
20-pin TSSOP
Preliminary W27C520
20-pin SOP
c
L
b
Dimension in Inches
Symbol
Min. Nom. Max.
A
0.002
1
A
E
1
E
L D
0.246
E
0.169 0.176
1
e
D
A
1
A
c
L
E
0.007
b
0.003 0.007
c e
0
θ
0.65 BSC
Dimension in mm
Min. Nom. Max.
0.043
0.05
0.006
0.50
6.40
0.256
6.25
4.30
0.18
0.012
0.09
0.256 BSC
8 0 8
1.10
0.15
0.700.0280.020
6.600.2600.252
6.50
4.48
0.30
0.18
b
Dimension in Inches
Symbol
Min. Nom. Max.
0.092 2.34
A
0.003
1
A
E
E
1
L D
0.393
E
0.291 0.299
1
e
D
A
1
A
E
0.013
b
0.009 0.013
c
e
0
θ
0.50 BSC
Dimension in mm
Min. Nom. Max.
0.105
0.076
0.012
0.381
12.6
0.420
9.98
7.39
0.330
0.020
0.229
1.27 BSC
8 0 8
2.67
0.305
0.8890.0350.015
13.00.5130.497
10.7
7.60
0.508
0.330
Publication Release Date: October 2000
- 15 - Revision A1
Page 16
VERSION HISTORY
Winbond Electronics North America Corp.
Winbond Electronics North America Corp.
Preliminary W27C520
VERSION
DATE PAGE DESCRIPTION
A1 Oct. 2000 - Initial Issued
Headquarters
Headquarters
No. 4, Creation Rd. III,
No. 4, Creation Rd. III, Science-Based Industrial Park,
Science-Based Industrial Park, Hsinchu, Taiwan
Hsinchu, Taiwan TEL: 886-3-5770066
TEL: 886-3-5770066 FAX: 886-3-5796096
FAX: 886-3-5796096 http://www.winbond.com.tw/
http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-27197006
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan
Taipei, Taiwan TEL: 886-2-27190505
TEL: 886-2-27190505 FAX: 886-2-27197502
FAX: 886-2-27197502
Note: All data and specifications are subject to change withou t notice.
Note: All data and specifications are subject to change withou t notice.
Winbond Electronics (H.K.) Ltd.
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd;
No. 378 Kwun Tong Rd; Kowloon, Hong Kong
Kowloon, Hong Kong TEL: 852-27513100
TEL: 852-27513100 FAX: 852-27552064
FAX: 852-27552064
- 16 -
Winbond Memory Lab.
Winbond Memory Lab. Winbond Microelectronics Corp.
Winbond Microelectronics Corp. Winbond Systems Lab.
Winbond Systems Lab.
2727 N. First Street, San Jose,
2727 N. First Street, San Jose, CA 95134, U.S.A.
CA 95134, U.S.A. TEL: 408-9436666
TEL: 408-9436666 FAX: 408-5441798
FAX: 408-5441798
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