The W25S243A is a high-speed, low-power, synchronous-burst pipelined, CMOS static RAM
organized as 65,536 × 64 bits that operates on a single 3.3-volt power supply. A built-in two-bit burst
address counter supports both Pentium burst mode and linear burst mode. The mode to be
executed is controlled by the
the FT pin. A snooze mode can reduces power dissipation.
This device supports 3-1-1-1-2-1-1-1 in a two-bank, back-to-back burst read cycle.
FEATURES
pin. Pipelining or non-pipelining of the data outputs is controlled by
Input, SynchronousByte write enable from cache controller
Input, Synchronous
Input, AsynchronousOutput enable input
Input, SynchronousInternal burst address counter advance
Input, SynchronousAddress status from Chip Set
Input, SynchronousAddress status from CPU
Input, StaticConnected to VSSQ: Device operates in flow-
Host bus byte enables used with
through (non-pipelined) mode.
Connected to VDDQ or unconnected: Device
operates in pipelined mode.
Input, StaticLower address burst order
Connected to VSSQ: Device is in linear mode.
Connected to VDDQ or unconnected: Device is in
non-linear mode.
VDDQI/O power supply
VSSQI/O ground
VDDPower supply
VSSGround
RSVReserved pin, don't use these pins
NCNo connection
Publication Release Date: November 1998
- 3 -Revision A1
Page 4
Preliminary W25S243A
LBO
ADSP
ADSC
ADV
LBO
LBO
BWE
GW
FUNCTIONAL DESCRIPTION
The W25S243A is a synchronous-burst pipelined SRAM designed for use in high-end personal
computers. It supports two burst address sequences for Intel systems (Interleaved mode) and linear
mode, which can be controlled by the
and the burst counter is incremented whenever
switched to non-pipelined mode if necessary.
BURST ADDRESS SEQUENCE
pin. The burst cycles are initiated by
is sampled low. The device can also be
or
INTEL SYSTEM (
= VDDQ)LINEAR MODE (
= VSSQ)
A[1:0]A[1:0]A[1:0]A[1:0]A[1:0]A[1:0]A[1:0]A[1:0]
External Start Address0001101100011011
Second Address0100111001101100
Third Address1011000110110001
Fourth Address1110010011000110
The device supports several types of write mode operations.
byte writes. The BE[7:0] signals can be directly connected to the SRAM BW[8:1]. The
and BW[8:1] support individual
signal is
used to override the byte enable signals and allows the cache controller to write all bytes to the
SRAM, no matter what the byte write enable signals are. The various write modes are indicated in the
Write Table below. Note that in pipelined mode, the byte write enable signals are not latched by the
SRAM with addresses but with data. In pipelined mode, the cache controller must ensure the SRAM
latches both data and valid byte enable signals from the processor.
Begin WriteCurrentXXX111XHi-ZWrite
Begin WriteCurrent1XXX11XHi-ZWrite
Begin WriteExternal01010XXHi-ZWrite
Continue WriteNextXXX110XHi-ZWrite
Continue WriteNext1XXX10XHi-ZWrite
Suspend WriteCurrentXXX111XHi-ZWrite
Suspend WriteCurrent1XXX11XHi-ZWrite
Notes:
1. For a detailed definition of read/write, see the Write Table below.
2. An "X" means don't care, "1" means logic high, and "0" means logic low.
3. The OE pin enables the data output but is not synchronous with the clock. All signals of the SRAM are sampled synchronous to
the bus clock except for the OE pin.
4. On a write cycle that follows a read cycle, OE must be inactive prior to the start of write cycle to allow write data to setup
the SRAM. OE must also disable the output buffer prior to the finish of a write cycle to ensure the SRAM data hold timings are
met.
Write all bytes1000000000
Write all bytes0xxxxxxxxx
GW
1011100000
1000000100
1000000011
1000000010
1000000001
BWE
BW8BW7BW6BW5BW4BW3BW2BW1
The ZZ state is a low-power state in which the device consumes less power than in the unselected
mode. Enabling the ZZ pin for a fixed period of time will force the SRAM into the ZZ state. Pulling the
ZZ pin low for a set period of time will wake up the SRAM again. While the SRAM is in ZZ mode, data
retention is guaranteed, but the chip will not monitor any input signal except for the ZZ pin. In the
unselected mode, on the other hand, all the input signals are monitored.
- 6 -
Page 7
Preliminary W25S243A
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETERRATINGUNIT
Core Supply Voltage to Vss-0.5 to 4.6V
I/O Supply Voltage to Vss-0.5 to 4.6V
Input/Output to VSSQ PotentialVSSQ -0.5 to VDDQ +0.5V
Allowable Power Dissipation1.0W
Storage Temperature-65 to 150
Operating Temperature0 to +70
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
(VDD/VDDQ = 3.15V to 3.6V, VSS/VSSQ = 0V, TA = 0 to 70° C)
PARAMETERSYM.TEST CONDITIONSMIN.TYP.MAX.UNIT
Input Low VoltageVIL--0.5-+0.8V
Input High VoltageVIH-+2.0-VDD
+0.3
Input Leakage CurrentILIVIN = VSSQ to VDDQ-10-+10
Output Leakage
Current
Output Low VoltageVOLIOL = +8.0 mA--0.4V
Output High VoltageVOHIOH = -4.0 mA2.4--V
Operating CurrentIDD
Standby CurrentISBUnselected mode defined in
ZZ Mode CurrentIZZ
Note: Typical characteristics are measured at VDD = 3.3V, TA = 25° C.
ILOVI/O = VSSQ to VDDQ, and data
I/O pins in high-Z state defined
in truth table
TCYC ≥ min. , I/O = 0 mA
truth table, VIN, VIO = VIH (min.)
/VIL (max.) TCYC ≥ min.
Note: These parameters are sampled but not 100% tested.
Publication Release Date: November 1998
- 7 -Revision A1
Page 8
Preliminary W25S243A
AC CHARACTERISTICS
AC Test Conditions
PARAMETERCONDITIONS
Input Pulse Levels0V to 3V
Input Rise and Fall Times2 nS
Input and Output Timing Reference Level1.5V
Output LoadCL = 30 pF, IOH/IOL = -4 mA/8 mA
AC Test Loads and Waveform
R1 320 ohm
Including
Jig and
Scope
T
OHZ,TOLZ,
5 pF
measurement)
VL = 1.5V
OUTPUT
RL = 50 ohm
Zo = 50 ohm
3.0V
0V
30 pF
Including
Jig and
Scope
2 nS
90%
10%
(For T
10%
3.3V
OUTPUT
KHZ,
90%
2 nS
T
KLZ,
AC Timing Characteristics
(VDD/VDDQ = 3.15V to 3.6V, VSS/VSSQ = 0V, TA = 0 to 70° C, all timings measured in pipelined mode)
PARAMETERSYMBOLW25S243A-12UNITNOTES
MIN.MAX.
Add. Setup TimeTAS2.5-nS
Add. Hold TimeTAH0.5-nS
Write Data Setup TimeTDS2.5-nS
Write Data Hold TimeTDH0.5-nS
ADV Setup Time
ADV Hold Time
TADVS2.5-nS
TADVH0.5-nS
R2
350 ohm
- 8 -
Page 9
Preliminary W25S243A
AC Timing Characteristics, continued
PARAMETERSYMBOLW25S243A-12UNITNOTES
MIN.MAX.
ADSP Setup Time
ADSP Hold Time
ADSC Setup Time
ADSC Hold Time
CE1, CE2, CE3 Setup Time
CE1, CE2, CE3 Hold Time
GW , BWE X Setup Time
GW , BWE X Hold Time
Clock Cycle TimeTCYC15-nS
Clock High Pulse WidthTKO6-nS
Clock Low Pulse WidthTKL6-nS
Clock to Output ValidTKQ-12nS
Clock to Output High-ZTKHZ215nS1
Clock to Output Low-ZTKLZ0-nS1
Clock to Output InvalidTKX2-nS1
Output Enable to Output
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
OPERATING
CURRENT
MAX. (mA)
STANDBY
CURRENT
MAX. (mA)
PACKAGE
- 14 -
Page 15
PACKAGE DIMENSIONS
128-pin QFP
128
Preliminary W25S243A
H
D
D
103
1
38
39
Seating Plane
e
See Detail F
b
Symbol
A
A
1
2
A
b
c
D
E
e
D
H
E
H
L
1
L
y
θ
102
64
A
A
y
Dimension in inches
Nom.
Min.
0.004
0.101
0.006
0.004
0.547
0.783 0.787 0.791
0.669
0.905
0.023
0.055
Max.Max.
0.134
0.113
0.107
0.010
0.008
0.0060.15
0.010
0.555
0.551
0.020
0.685
0.677
0.921
0.913
0.039
0.031
0.071
0.063
0.004
E
H
E
65
A
2
1
Dimension in mm
Nom.
Min.
0.10
2.57
2.72
0.15
0.20
0.10
14.00
13.90
20.00
19.90
0.50
17.20
17.00
23.20 23.40
23.00
0.80
0.60
1.60
1.40
0120
c
L
3.40
2.87
0.25
0.25
14.10
20.10
17.40
1.00
1.80
0.10
12
θ
L
1
Detail F
Publication Release Date: November 1998
- 15 -Revision A1
Page 16
Package Dimensions, continued
128-pin TQFP
Preliminary W25S243A
H
D
D
103128
1
38
39
Seating Plane
e
See Detail F
b
Symbol
A
A
1
A
2
b
c
D
E
e
HD
H
E
L
1
L
y
θ
102
65
64
2
A
A
y
Dimension in inches
Nom.
Min.
0.002
0.053
0.006
0.004
0.547
0.783
0.626
0.862
0.018
Max.Max.
0.063
0.057
0.055
0.011
0.008
0.0060.15
0.010
0.555
0.551
0.791
0.787
0.020
0.634
0.630
0.870
0.866
0.030
0.024
0.039
0.004
E
HE
A
1
Min.
0.05
1.35
0.15
0.10
13.90
19.90
15.90
21.90
0.45
Dimension in mm
Nom.
1.40
0.20
14.00
14.10
20.00
20.10
0.50
16.10
16.00
22.00 22.10
0.60
1.00
0120
c
1.60
1.45
0.27
0.25
0.75
0.10
12
θ
L
L
1
Detail F
- 16 -
Page 17
Preliminary W25S243A
VERSION HISTORY
VERSIONDATEPAGEDESCRIPTION
A1Nov. 1998Initial Issued
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5796096
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Note: All data and specifications are subject to change without notice.
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Publication Release Date: November 1998
- 17 -Revision A1
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