Datasheet W24257AQ-20, W24257AQ-12, W24257AQ-15, W24257AQ-10, W24257AK-20 Datasheet (Winbond Electronics)

W24257A

CS

WE

OE

32K × 8 HIGH SPEED CMOS STATIC RAM

GENERAL DESCRIPTION

The W24257A is a high speed, low power CMOS static RAM organized as 32768 × 8 bits that
operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.

FEATURES

• High speed access time: 10/12/15/20 nS (max.)

• Low power consumption:

− Active: 400 mW (typ.)

• Single +5V power supply

• Fully static operation

PIN CONFIGURATIONS

A14
A12

I/O1
I/O2
I/O3
V

1
2

A7

3

A6

4

A5

5

A4

6

A3

7

A2

A1

A0

SS

28-pin

8
9
10
11
12
13
14

DIP

28

V

DD

27

WE

26

A13
A8

25
24

A9
A11

23

OE

22

A10

21
20

CS

19

I/O8

18

I/O7

17

I/O6

16

I/O5
I/O4

15

• All inputs and outputs directly TTL compatible

• Three-state outputs

• Available packages: 28-pin 300 mil SOJ, 330

mil SOP, skinny DIP and standard type one
TSOP (8 mm × 13.4 mm)

BLOCK DIAGRAM

VDD
VSS

A0

.

DECODER

.

A14

CS
OE
WE

CONTROL

CORE

ARRAY

DATA I/O

I/O1

.
.

I/O8

A11

A13
V

A14
A12

WE

PIN DESCRIPTION

1

OE

2
3

A9

4

A8

5
6
7

DD

8
9
10

A7

11

A6

12

A5

13

A4

14

A3

28-pin
TSOP

A10

28

CS

27

I/O8

26

I/O7

25

I/O6

24

I/O5

23

I/O4

22

V

21

SS

I/O3

20

I/O2

19

I/O1

18
17

A0
A1

16

A2

15

- 1 - Revision A14

SYMBOL DESCRIPTION

A0−A14

I/O1−I/O8

Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input

VDD Power Supply
VSS Ground

Publication Release Date: May 1997

W24257A

Operating Power

CS

Supply Current

CS

CS

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER RATING UNIT
Supply Voltage to VSS Potential -0.5 to +7.0 V
Input/Output to VSS Potential -0.5 to VDD +0.5 V
Allowable Power Dissipation 1.0 W
Storage Temperature -65 to +150
Operating Temperature 0 to +70

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.

°C
°C

TRUTH TABLE

CS OE WE MODE

H X X Not Selected High Z ISB, ISB1

L H H Output Disable High Z IDD
L L H Read Data Out IDD
L X L Write Data In IDD

I/O1−I/O8

VDD CURRENT

OPERATING CHARACTERISTICS

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT
Input Low Voltage VIL - -0.5 - +0.8 V
Input High Voltage VIH - +2.2 - VDD +0.5 V
Input Leakage Current ILI VIN = VSS to VDD -10 - +10
Output Leakage

Current
Output Low Voltage VOL IOL = +8.0 mA - - 0.4 V

Output High Voltage VOH IOH = -4.0 mA 2.4 - - V

Standby Power
Supply Current

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

ILO

IDD

ISB

ISB1

VI/O = VSS to VDD, CS = VIH
or OE = VIH or WE = VIL

= VIL, I/O = 0 mA
Cycle = MIN 12 - - 160 mA
Duty = 100% 15 150 mA

= VIH
Cycle = MIN, Duty = 100%

≥ VDD -0.2V

10 - - 170 mA

20 - - 140 mA

-10 - +10

- - 30 mA

- - 10 mA

µA
µA

- 2 -

W24257A

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER SYM. CONDITIONS MAX. UNIT

Input Capacitance CIN VIN = 0V 8 pF
Input/Output Capacitance CI/O VOUT = 0V 10 pF

Note: These parameters are sampled but not 100% tested.

THERMAL RESISTANCE

PARAMETER SYM

.

Junction to Case Thermal Resistance
Junction to Ambient Thermal

Resistance

Note: These parameters are only applied to "TSOP" and "SOJ" package types.

θJC
θJA

A. F. R. = 1m/sec, TA = 25° C
A. F. R. = 1m/sec, TA = 25° C

CONDITIONS MAX. UNIT

AC TEST CONDITIONS

PARAMETER CONDITIONS

Input Pulse Levels 0V to 3V
Input Rise and Fall Times 5 nS
Input and Output Timing Reference Level 1.5V
Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA

20
60

°C/W
°C/W

Publication Release Date: May 1997

- 3 - Revision A14

AC TEST LOADS AND WAVEFORM

W24257A

5V

OUTPUT

R1 480 ohm

30 pF

Including
Jig and
Scope

R2
255 ohm

3.0V

0V

5 nS

90% 90%

10%

10%

OUTPUT

(For TCLZ

5 nS

5V

,

R1 480 ohm

5 pF

Including
Jig and
Scope

TOLZ TCHZ T

, ,

,

OHZTWHZ

R2
255 ohm

,

OW

)

T

- 4 -

W24257A

AC CHARACTERISTICS

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER SYM. W24257A-10 W24257A-12 W24257A-15 W24257A-20 UNIT

MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.

Read Cycle Time TRC 10 - 12 - 15 - 20 - nS
Address Access Time TAA - 10 - 12 - 15 - 20 nS
Chip Select Access Time TACS - 10 - 12 - 15 - 20 nS
Output Enable to Output Valid TAOE - 5 - 6 - 7 - 10 nS
Chip Selection to Output in Low Z

Output Enable to Output in Low Z
Chip Deselection to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change TOH 3 - 3 - 3 - 3 - nS

TCLZ
TOLZ
TCHZ
TOHZ

∗ These parameters are sampled but not 100% tested.

3 - 3 - 3 - 3 - nS

∗

0 - 0 - 0 - 0 - nS

∗

- 5 - 6 - 7 - 10 nS

∗

- 5 - 6 - 7 - 10 nS

∗

Write Cycle

PARAMETER SYM. W24257A-10 W24257A-12 W24257A-15 W24257A-20 UNIT

MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.

Write Cycle Time TWC 10 - 12 - 15 - 20 - nS
Chip Selection to End of Write TCW 9 - 10 - 13 - 17 - nS
Address Valid to End of Write TAW 9 - 10 - 13 - 17 - nS
Address Setup Time TAS 0 - 0 - 0 - 0 - nS
Write Pulse Width TWP 9 - 10 - 10 - 12 - nS
Write Recovery Time

Data Valid to End of Write TDW 6 - 7 - 9 - 10 - nS
Data Hold from End of Write TDH 0 - 0 - 0 - 0 - nS
Write to Output in High Z

Output Disable to Output in High Z
Output Active from End of Write TOW 0 - 0 - 0 - 0 - nS

CS , WE

∗ These parameters are sampled but not 100% tested.

TWR 0 - 0 - 0 - 0 - nS

- 6 - 7 - 8 - 10 nS

∗

TWHZ

- 6 - 7 - 8 - 10 nS

∗

TOHZ

Publication Release Date: May 1997

- 5 - Revision A14

TIMING WAVEFORMS

AA

Read Cycle 1

(Address Controlled)

Address

DOUT

Read Cycle 2

(Chip Select Controlled)

CS

W24257A

T

RC

T

T

OH

T

OH

D

OUT

Read Cycle 3

(Output Enable Controlled)

Address

OE

CS

D

OUT

T

ACS

T

CLZ

RC

T

T

AA

AOE

T

T

OLZ

TACS

CLZT

T

CHZ

TOH

TOHZ

CHZ

T

- 6 -

Timing Waveforms, continued

Write Cycle 1

(OE Clock)

Address

OE

CS

WE

D

OUT

DIN

TAS

W24257A

WC

T

WR

T

CW

T

AW

T

WP

T

OHZ

T

(1, 4)

DW

T

DH

T

Write Cycle 2

(OE = VIL Fixed)

T

WC

Address

T

T

CW

CS

AWT

WE

D

OUT

DIN

T

AS

T

WP

T

WHZ

(1, 4)

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

WR

T

OH

T

OW

DW

TDH

T

(2) (3)

Publication Release Date: May 1997

- 7 - Revision A14

ORDERING INFORMATION

W24257A

PART NO. ACCESS

TIME

(nS)

W24257AK-10 10 170 10 300 mil skinny DIP
W24257AK-12 12 160 10 300 mil skinny DIP
W24257AK-15 15 150 10 300 mil skinny DIP
W24257AK-20 20 140 10 300 mil skinny DIP

W24257AJ-10 10 170 10 300 mil SOJ
W24257AJ-12 12 160 10 300 mil SOJ
W24257AJ-15 15 150 10 300 mil SOJ

W24257AJ-20 20 140 10 300 mil SOJ
W24257AS-10 10 170 10 330 mil SOP
W24257AS-12 12 160 10 330 mil SOP
W24257AS-15 15 150 10 330 mil SOP
W24257AS-20 20 140 10 330 mil SOP
W24257AQ-10 10 170 10 Standard type one TSOP
W24257AQ-12 12 160 10 Standard type one TSOP
W24257AQ-15 15 150 10 Standard type one TSOP
W24257AQ-20 20 140 10 Standard type one TSOP

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.

OPERATING

CURRENT

MAX. (mA)

STANDBY
CURRENT

MAX. (mA)

PACKAGE

- 8 -

PACKAGE DIMENSIONS

28-pin P-DIP Skinny

28

1E

1 14

S

A

A

2

L

D

B

B

e

1

W24257A

Dimension in Inches Dimension in mm

Symbol

Min. Nom. Max. Max.Nom.Min.

A

0.010

A

1

0.125

A

2

0.016

15

B
B1

0.008

c
D
E

1

E
e

1

0.120

L

a

0.330 8.38

A

e
S

Notes:

1. Dimensions D Max. & S include mold flash or

E

Base Plane

1A

1

Mounting Plane

e

A

a

c

tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.

4. Dimension B1 does not include dambar
protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on
final visual inspection spec.

0.175

0.130

0.135

0.018

0.022

0.060 1.52

0.0640.058

0.010

0.014

1.388 1.400

0.3100.300 0.320

0.293

0.2880.283

0.110

0.140

0.130

°

0

0.350

0.370

0.055

°

15

0.25

3.18

0.41

0.20

7.62

7.19

2.29 2.54 2.790.090 0.100

3.05

°

0

4.45

3.30

3.43

0.46

0.56

1.631.47

0.25

0.36

35.26 35.56

8.13

7.87

7.447.32

3.30

3.56

9.40

8.89

1.40

°

15

28-pin Small Outline J Band

1

D

s

Seating Plane

b

1b

e

Dimension in Inches

Symbol

Min. Nom. Max. Max.Nom.Min.

1528

EHE

14

2

A

A

L

£c

1

A

y

1e

c

A

0.027

1

A

0.095

A
b1
b
c
D
E

e
e
H
L
S
y

θ

Notes:

1. Dimensions D Max. & S include mold flash
or tie bar burrs.

2. Dimension b does not include dambar
protrusion/intrusion.

3. Dimensions D & E include mold mismatch
and are determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec. should be based
on final visual inspection spec.

0.100

2

0.026

0.016

0.018

0.010 0.25

0.008

0.710

0.295

0.050 0.056 1.12 1.27 1.42

0.044

0.2650.245 7.246.736.22

1

E

0.077

0.087

0

0.140

0.105

0.0320.028

0.022

0.014

0.730

0.3050.300

0.285

0.097 1.96

0.045

0.004
10

Dimension in mm

0.69

2.41

2.54

0.41

0.46

18.03

7.49

7.62

8.31 8.56 8.810.327 0.337 0.347

2.21

0

3.56

18.54

2.67

0.810.710.66

0.56

0.360.20

7.75

2.46

1.14

0.10
10

Publication Release Date: May 1997

- 9 - Revision A14

Package Dimensions, continued

28-pin SO Wide Body

W24257A

28 15

1

S

Seating Plane

D

e

14

b

y

28-pin Standard Type One TSOP

D

H

D

e

b

θ

L

1

L

Dimension in Inches

Symbol

A

e

1

E

H

E

θ

L

Detail F

e

1

2

A

A

1

A

See Detail F

c

L

E

c

E

A
A
b
c
D
E

HE
L
L
S
y

θ

Notes:

1. Dimensions D Max. & S include mold flash
or tie bar burrs.

2. Dimension b does not include dambar
protrusion/intrusion.

3. Dimensions D & E include mold mismatch
and are determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec should be based
on final visual inspection spec.

Dimension in Inches

Symbol

A

0.002

1

A

0.035

2

A

0.007 0.008 0.011

b

0.004

c

0.461

D

0.311 0.315 0.319

E

0.520 0.528 0.536

HD
e

0.020

L
L

1

0.000

Y

θ

1

A
A

Y

2

A

Note: Controlling dimension: Millimeters

Nom.

Min.

0.004

1

0.098

0.093

2

0.014

0.016

0.0100.008

0.713

e

0.059

0.067

E

0

Min.

Nom. Max. Min. Nom.

0.047

0.040

0.006

0.465 0.469

0.022

0.024

0.010

0 3 5

Dimension in mm

Max. Max.

Min.

0.112

0.10

0.103

2.36

0.36

0.020

0.014 0.36

0.733

8.28

0.3360.3310.326

1.12 1.27 1.420.044 0.050 0.056

0.4770.4650.453 12.1211.8111.51

0.044

0.71

0.075 1.50

0.004
10

0

.

Dimension in mm

0.05

0.006

0.041

0.17

0.10

0.008

11.70

11.80

7.90

13.40

13.20

0.50

0.028

0.00

0.004
0

Nom.

2.85

2.49

2.62

0.41

0.51

0.250.20

18.62

18.11

8.53

8.41

0.91 1.120.028 0.036

1.70

1.91

1.190.047

0.10
10

Max.

1.20

0.15

1.000.95

1.05

0.20 0.27

0.15 0.21

11.90

8.10

8.00

13.60

0.55

0.70

0.60

0.25

0.10

3

5

- 10 -

W24257A

Headquarters

No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]

Note: All data and specifications are subject to change without notice.

Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.

2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]

Publication Release Date: May 1997

- 11 - Revision A14