Datasheet W24129A Datasheet (winbond)

CS

WE

OE

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W24129A

16K × 8 HIGH-SPEED CMOS STATIC RAM

GENERAL DESCRIPTION

The W24129A is a high-speed, low-power CMOS static RAM organized as 16384 × 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.

FEATURES

• High-speed access time: 12/15 nS (max.)

• Low-power consumption:

− Active: 400 mW (typ.)

• Single +5V power supply

• Fully static operation

PIN CONFIGURATION

V

DD

WE

A13

A8

A9

A11

OE

A10

A12

NC

1

2

3

A7

4

A6

A5

5

A4

6

A3

7

A2

8

28

27

26

25

24

23

22

21

• All inputs and outputs directly TTL compatible

• Three-state outputs

• Available packages: 28-pin 300 mil SOJ and

skinny DIP

BLOCK DIAGRAM

DD

V

SS

V

A0

.

DECODER

.

A13

CS OE WE

CONTROL

CORE ARRAY

ARRAY

DATA I/O

I/O1

. .

I/O8

I/O1

I/O2

I/O3

V

A1

A0

SS

9 20

10

11

12

13 16

14 15

CS

I/O8

19

I/O7

18

I/O6

17

I/O5

I/O4

PIN DESCRIPTION

SYMBOL DESCRIPTION

A0−A13

I/O1−I/O8

Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input

VDD Power Supply VSS Ground

Publication Release Date: July 1995

- 1 - Revision A2

W24129A

Operating Power

CS

Supply Current

CS

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER RATING UNIT Supply Voltage to VSS Potential -0.5 to +7.0 V Input/Output to VSS Potential -0.5 to VDD +0.5 V Allowable Power Dissipation 1.0 W Storage Temperature -65 to +150 Operating Temperature 0 to +70

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.

°C °C

TRUTH TABLE

CS OE WE MODE I/O1-I/O8 VDD CURRENT

H X X Not Selected High Z ISB,ISB1

L H H Output Disable High Z IDD L L H Read Data Out IDD L X L Write Data In IDD

OPERATING CHARACTERISTICS

(VDD = 5V ±5%, VSS = 0V, TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT Input Low Voltage VIL - -0.5 - +0.8 V Input High Voltage VIH - +2.2 - VDD +0.5 V Input Leakage Current ILI VIN = VSS to VDD -10 - +10 Output Leakage

Current Output Low Voltage VOL IOL = +8.0 mA - - 0.4 V

Output High Voltage VOH IOH = -4.0 mA 2.4 - - V

Standby Power Supply Current

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

ILO

IDD

ISB

ISB1

VI/O = VSS to VDD, CS = VIH or OE = VIH or WE = VIL

= VIL, I/O = 0 mA

Cycle = MIN 15 - - 150 mA

= VIH

Cycle = MIN, Duty = 100%

≥ VDD -0.2V

12 - - 160 mA

-10 - +10

- - 30 mA

- - 5 mA

µA µA

- 2 -

W24129A

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER SYM. CONDITIONS MAX. UNIT

Input Capacitance CIN VIN = 0V 8 pF Input/Output Capacitance CI/O VOUT = 0V 10 pF

Note: These parameters are sampled but not 100% tested.

AC TEST CONDITIONS

PARAMETER CONDITIONS

Input Pulse Levels 0V to 3V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA

AC TEST LOADS AND WAVEFORM

5V

OUTPUT

R1 480 ohm

30 pF

Including Jig and Scope

R2 255 ohm

3.0V

0V

5 nS

90% 90%

10%

OUTPUT

(For T

5 nS

5V

CLZ

T

OLZTCHZ

,

R1 480 ohm

5 pF

Including Jig and Scope

OHZ

, ,

T

,

T

WHZ

R2 255 ohm

,

)

TOW

Publication Release Date: July 1995

- 3 - Revision A2

W24129A

CS, WE

AC CHARACTERISTICS

(VDD = 5V ±5%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER SYM. W24129A-12 W24129A-15 UNIT

MIN. MAX. MIN. MAX.

Read Cycle Time TRC 12 - 15 - nS Address Access Time TAA - 12 - 15 nS Chip Select Access Time TACS - 12 - 15 nS Output Enable to Output Valid TAOE - 6 - 7 nS Chip Selection to Output in Low Z

Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change TOH 3 - 3 - nS

TCLZ TOLZ TCHZ TOHZ

∗ ∗

3 - 3 - nS 0 - 0 - nS

- 6 - 7 nS

∗ These parameters are sampled but not 100% tested.

Write Cycle

PARAMETER SYM. W24129A-12 W24129A-15 UNIT

MIN. MAX. MIN. MAX.

Write Cycle Time TWC 12 - 15 - nS Chip Selection to End of Write TCW 10 - 13 - nS Address Valid to End of Write TAW 10 - 13 - nS Address Setup Time TAS 0 - 0 - nS Write Pulse Width TWP 10 - 10 - nS Write Recovery Time

Data Valid to End of Write TDW 7 - 9 - nS Data Hold from End of Write TDH 0 - 0 - nS Write to Output in High Z

Output Disable to Output in High Z Output Active from End of Write TOW 0 - 0 - nS

∗ These parameters are sampled but not 100% tested.

TWR 0 - 0 - nS

∗

TWHZ TOHZ

∗

- 7 - 8 nS

- 4 -

TIMING WAVEFORMS

AA

Read Cycle 1

(Address Controlled)

Address

DOUT

Read Cycle 2

(Chip Select Controlled)

CS

W24129A

T

RC

T

OH

T

OH

D

OUT

Read Cycle 3

(Output Enable Controlled)

Address

OE

CS

D

OUT

T

ACS

T

CLZ

RC

T

AA

AOE

T

TOLZ

TACS

CLZT

T

CHZ

TOH

TOHZ

CHZ

T

Publication Release Date: July 1995

- 5 - Revision A2

Timing Waveforms, continued

Write Cycle 1

(OE Clock)

Address

OE

CS

WE

DOUT

DIN

TAS

W24129A

WC

T

WR

T

CW

T

AW

T

WP

T

OHZ

T

(1,4)

DW

T

DH

T

Write Cycle 2

(OE = VIL Fixed)

T

WC

Address

T

CW

CS

AWT

WE

D

OUT

DIN

T

AS

T

WP

T

WHZ

(1,4)

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

WR

T

OH

T

OW

DW

TDH

T

(2) (3)

- 6 -

ORDERING INFORMATION

W24129A

PART NO. ACCESS

TIME (nS)

W24129AK-12 12 160 5 300 mil skinny DIP W24129AK-15 15 150 5 300 mil skinny DIP

W24129AJ-12 12 160 5 300 mil SOJ W24129AJ-15 15 150 5 300 mil SOJ

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.

OPERATING

CURRENT

MAX. (mA)

STANDBY CURRENT

MAX. (mA)

PACKAGE

Publication Release Date: July 1995

- 7 - Revision A2

PACKAGE DIMENSIONS

28-pin P-DIP Skinny

28

E

1

1 14

S

2

A

L

D

B

e

B

1

15

Base Plane

A

1

Mounting Plane

W24129A

Dimension in Inches Dimension in mm

Symbol

A A A B B c D E E

e L

a

e S

Notes:

1. Dimension D Max. & S include mold flash or tie bar burrs.

2. Dimension E1 does not include interlead flash.

E

e

a

c

A

3. Dimension D & E1 include mold mismatch and are determined at the mold parting line.

4. Dimension B1 does not include dambar protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on final visual inspection spec.

Min.

0.010

1

0.125

2

0.016

1

0.008

1 1

0.120

°

0

A

Nom.

Max. Max.

0.175

0.130

0.135

0.018

0.022

0.060 1.52

0.0640.058

0.010

0.014

1.388 1.400

0.3100.300 0.320

0.293

0.2880.283

0.110

0.130

0.140

0.370

0.3500.330 8.38 8.89

0.055

Nom.

Min.

0.25

3.18

3.30

0.41

0.46

0.20

0.25

35.26

7.62

2.29 2.54 2.790.090 0.100

3.05

3.30

°

15

0

4.45

3.43

0.56

1.631.47

0.36

35.56

8.13

7.87

7.447.327.19

3.56

°

15

9.40

1.40

28-pin Small Outline J Band

1

D

s

Seating Plane

b

1b

e

Dimension in Inches Dimension in mm

Symbol

Min. Nom. Max. Max.Nom.Min.

A

0.027

1

A

0.095

A

2

0.026

1

b

0.016

1528

EHE

14

b

0.008

c D

0.295

E

0.044

e

1

e

E

H

0.077

L S

y

θ

Notes:

1. Dimension D Max. & S include mold flash or tie bar burrs.

2. Dimension b does not include dambar

2

A

L

1

A

y

£c

c

1e

protrusion/intrusion.

3. Dimension D & E include mold mismatch and are determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec. should be based on final visual inspection spec.

0.140

0.100

0.105

0.0320.028

0.018

0.022

0.010 0.25

0.014

0.710

0.730

0.3050.300

0.050 0.056

0.285

0.2650.245 7.246.736.22

0.347

0.097 1.96

0.087

0.045

0.004 10

0

0.69

2.41

0.41

7.49

1.12

8.31 8.56 8.810.327 0.337

3.56

2.54

2.67

0.810.710.66

0.46

0.56

0.360.20

18.54

18.03

7.75

7.62

1.42

1.27

2.21

2.46

1.14

0.10

0

10

- 8 -

W24129A

Headquarters

No. 4, Creation Rd. III,

Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,

Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505

Note: All data and specifications are subject to change without notice.

Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.

CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668

Publication Release Date: July 1995

- 9 - Revision A2