Datasheet VS-VSKU91-16P Specification

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ADD-A-PAK
AAP Gen 7 (TO-240AA) Power Modules
PRIMARY CHARACTERISTICS
I
T(AV)
Type Modules - thyristor, standard
Package AAP Gen 7 (TO-240AA)
VS-VSKU91.., VS-VSKV91.. Series
Thyristor/Thyristor, 95 A
FEATURES
• High voltage
• Industrial standard package
• Low thermal resistance
• UL approved file E78996
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
BENEFITS
• Excellent thermal performances obtained by the usage of
95 A
exposed direct bonded copper substrate
• Up to 1600 V
• High surge capability
• Easy mounting on heatsink
Vishay Semiconductors
MECHANICAL DESCRIPTION
The AAP Gen 7 (TO-240AA), new generation of AAP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
ELECTRICAL DESCRIPTION
These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
I
T(AV)
I
T(RMS)
I
TSM
2
t
I
2
I
t 200 kA2s
V
RRM
T
Stg
T
J
85 °C 95
150
50 Hz 2000
60 Hz 2094
50 Hz 20
60 Hz 18.26
Range 400 to 1600 V
-40 to +125 °C
-40 to +125 °C
A
kA2s
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Document Number: 94655
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VS-VSKU91.., VS-VSKV91.. Series
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ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
V
, MAXIMUM
RSM
NON-REPETITIVE PEAK
REVERSE VOLTAGE
V
TYPE NUMBER
VS-VSK.91
V
, MAXIMUM
VOLTAGE
CODE
RRM
REPETITIVE PEAK
REVERSE VOLTAGE
V
04 400 500 400
08 800 900 800
12 1200 1300 1200
16 1600 1700 1600
ON-STATE CONDUCTION
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average on-state current I
Maximum continuous RMS on-state current I
Maximum peak, one-cycle non-repetitive on-state current
Maximum I
Maximum I
2
t for fusing I2t
2
t for fusing I2t
Maximum value of threshold voltage V
Maximum value of on-state slope resistance
Maximum on-state voltage drop V Maximum non-repetitive rate of rise of
turned on current
Maximum holding current I
Maximum latching current I
Notes
(1)I2
t for time tx = I2t x t
(2)
Average power = V
(3)
16.7 % x x IAV < I < x I
(4)
I > x I
AV
T(TO)
x
x I
T(AV)
AV
+ rt x (I
T(RMS)
T(AV)
T(RMS)
I
TSM
T(TO)
r
t
dI/dt
2
)
180° conduction, half sine wave, T
= 85 °C
C
DC 150
T
C
t = 10 ms
t = 8.3 ms 2094
t = 10 ms
t = 8.3 ms 1760
t = 10 ms
t = 8.3 ms 18.26
t = 10 ms
t = 8.3 ms 12.91 t = 0.1 ms to 10 ms, no voltage reapplied
(1)
T
= TJ maximum
J
Low level
(2)
High level
Low level
(2)
High level
ITM = x I
TM
= 25 °C, from 0.67 V
T
J
I
= x I
TM
TJ = 25 °C, anode supply = 6 V,
H
resistive load, gate open circuit
TJ = 25 °C, anode supply = 6 V, resistive load 400
L
No voltage reapplied
100 % V
RRM
reapplied
No voltage reapplied
100 % V
RRM
reapplied
(3)
TJ = TJ maximum
(4)
(3)
TJ = TJ maximum
(4)
T(AV)TJ
T(AV)
= 25 °C 1.73 V
,
DRM
, Ig = 500 mA, tr < 0.5 μs, tp > 6 μs
Vishay Semiconductors
V
, MAXIMUM REPETITIVE
DRM
PEAK OFF-STATE VOLTAGE,
GATE OPEN CIRCUIT
Sinusoidal half wave, initial T
Initial T
V
= TJ maximum
J
= TJ maximum
J
95
78 °C
2000
1682
20
14.14
200 kA
0.97
1.1
2.76
2.38
150 A/μs
250
I
RRM, IDRM
AT 125 °C
mA
15
A
A
kA2s
2
V
m
mA
s
Revision: 26-Jul-2018
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VS-VSKU91.., VS-VSKV91.. Series
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TRIGGERING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum peak gate power P
Maximum average gate power P
Maximum peak gate current I
Maximum peak negative gate voltage - V
GM
G(AV)
GM
GM
TJ = - 40 °C
Maximum gate voltage required to trigger V
GT
T
= 25 °C 2.5
J
T
= 125 °C 1.7
J
Anode supply = 6 V resistive load
TJ = - 40 °C
Maximum gate current required to trigger I
Maximum gate voltage that will not trigger V
Maximum gate current that will not trigger I
GD
GT
T
TJ = 125 °C, rated V
GD
TJ = 125 °C, rated V
= 25 °C 150
J
= 125 °C 80
J
Anode supply = 6 V resistive load
applied 0.25 V
DRM
applied 6 mA
DRM
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum peak reverse and off-state leakage current at V
RRM
, V
DRM
Maximum RMS insulation voltage V
Maximum critical rate of rise of off-state voltage dV/dt T
I
RRM,
I
DRM
TJ = 125 °C, gate open circuit 15 mA
50 Hz
INS
= 125 °C, linear to 0.67 V
J
DRM
Vishay Semiconductors
12
3.0
3.0 A
10
4.0
270
3000 (1 min)
3600 (1 s)
1000 V/μs
W
V
mAT
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Junction operating and storage temperature range
Maximum internal thermal resistance, junction to case per leg
Typical thermal resistance, case to heatsink per module
to heatsink
Mounting torque ± 10 %
busbar 3
Approximate weight
Case style JEDEC
, T
T
J
Stg
R
thJC
DC operation 0.22
-40 to +125 °C
°C/W
R
thCS
Mounting surface flat, smooth and greased 0.1
A mounting compound is recommended and the
4
torque should be rechecked after a period of
Nm
3 hours to allow for the spread of the compound.
75 g
2.7 oz.
®
AAP Gen 7 (TO-240AA)
R CONDUCTION PER JUNCTION
DEVICES
VSK.91.. 0.04 0.048 0.063 0.085 0.125 0.033 0.052 0.067 0.088 0.127 °C/W
Note
• Table shows the increment of thermal resistance R
SINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION
180° 120° 90° 60° 30° 180° 120° 90° 60° 30°
when devices operate at different conduction angles than DC
thJC
UNITS
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Average on-state current (A)
Maximum allowable case temperature (°C)
0 20406080100
70
80
90
100
110
120
130
180° 120°
90° 60° 30°
RthJC (DC) = 0.22°C/W
0 20406080100120140160
70
80
90
100
110
120
130
180° 120°
90° 60° 30°
DC
RthJC (DC) = 0.22°C/W
Average on-state current (A)
Maximum allowable case temperature (°C)
Average on-state current (A)
Maximum average on-state power loss (W)
0 20406080100
0
20
40
60
80
100
120
140
160
180° 120°
90° 60° 30°
RMS limit
Per leg, Tj = 125°C
Average on-state current (A)
Maximum average on-state power loss (W)
0 20406080100120140160
0
20
40
60
80
100
120
140
160
180
200
220
180° 120°
90° 60° 30°
RMS limit
DC
Per leg, Tj = 125°C
Peak half sine wave on-state current (A)
Number of equal amplitude half cycle current pulses (N)
110100
800
1000
1200
1400
1600
1800
At any rated load condition and with
rated Vrrm applied following surge
Initial Tj = Tj max
@ 60 Hz 0.0083 s
@ 50 Hz 0.0100s
Per leg
VS-VSKU91.., VS-VSKV91.. Series
Vishay Semiconductors
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
Fig. 4 - On-State Power Loss Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current
2000
1800
1600
Maximum Non-repetitive Surge Current
Versus Pulse Train Duration. Control
of conduction may not be maintained.
Initial Tj = 125°C
No Voltage Reapplied
Rated Vrrm reapplied
1400
Fig. 3 - On-State Power Loss Characteristics
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1200
1000
Peak half sine wave on-state current (A)
800
Per leg
0.01 0.1 1
Pulse train duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
4
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Total output current (A)
Maximum allowable ambient temperature (°C)
Maximum total power loss (W)
0 20 40 60 80 100 120 140
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W 1 °C/W
0 100 200 300 400
0
100
200
300
400
500
600
700
800
900
60°
(rect)
3 x VSK.91 Series
6-pulse midpoint
connection bridge
Tj = 125°C
Instantaneous on-state voltage (V)
Instantaneous on-state current (A)
0.51.01.52.02.53.03.5
1
10
100
1000
Tj = 25°C
Tj = 125°C
Per leg
VS-VSKU91.., VS-VSKV91.. Series
Vishay Semiconductors
700
180°
600
500
400
(sine)
180°
(rect)
300
200
Maximum total power loss (W)
100
single phase bridge connected
0
0 50 100 150 200
Total output current (A)
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W 1 °C/W 2 °C/W
2 x VSK.91 Series
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Fig. 7 - On-State Power Loss Characteristics
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Fig. 8 - On-State Power Loss Characteristics
Fig. 9 - On-State Voltage Characteristics
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Square wave pulse duration (s)
Transient thermal impedance Z
thJC
(°C/W)
0.001 0.01 0.1 1 10
0.001
0.01
0.1
1
Steady state value
RthJC = 0.22 °C/W
(DC operation)
Per leg
0.1
1
10
100
0.001 0.01 0.1 1 10 100 1000
(b)
(a)
Rec tang ular ga te pulse
(4) (3) (2) (1)
TJ = -4 0 ° C
TJ = 25 ° C
TJ = 1 2 5 ° C
a)Recommended load line for
b)Recommended load line for
VGD
IGD
Fr e q u e n c y Lim i t e d b y PG ( A V )
(1) PGM = 200 W, t p = 300 µs (2) PGM = 60 W, tp = 1 ms (3) PGM = 30 W, tp = 2 ms (4) PGM = 12 W, tp = 5 ms
<= 30% ra te d di/ d t: 15 V, 40 o hm s tr = 1 µs, tp >= 6 µs
rated di/ dt: 20 V, 20 ohms tr = 0.5 µs, t p >= 6 µs
IRK.71../ .91.. Series
Instantaneous gate voltage (V)
Instantaneous gate current (A)
VSK.
VS-VSKU91.., VS-VSKV91.. Series
Vishay Semiconductors
Fig. 10 - Thermal Impedance Z
ORDERING INFORMATION TABLE
Device code
VS-VS
Characteristics
thJC
Fig. 11 - Gate Characteristics
KU91/16
21 43 5
1
- Vishay Semiconductors product
2
- Module type
3
- Circuit configuration (see Circuit Configuration table)
Note
• To order the optional hardware go to www.vishay.com/doc?95172
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- Current code (95 A)
- Voltage code (see Voltage Ratings table)
5
6
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CIRCUIT CONFIGURATION
CIRCUIT DESCRIPTION
VS-VSKU91.., VS-VSKV91.. Series
CIRCUIT
CONFIGURATION CODE
Vishay Semiconductors
CIRCUIT DRAWING
VSKU
1
(1)
+
G1 (4)
G1 (4)
K1 (5)
K1 (5)
(2)
(3)
(1)
(2)
(3)
-
-
-
+
+
Two SCRs common cathodes U
Two SCRs common anodes V
2
3
4 5 7 6
VSKV
1
2
3
4 5 7 6
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95368
K2 (7)G2(6)
K2 (7)G2(6)
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Document Number: 94655
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ADD-A-PAK Generation VII - Thyristor
35 REF.
30 ± 0.5
(1.18 ± 0.020)
29 ± 0.5
(1 ± 0.020)
Viti M5 x 0.8
Screws M5 x 0.8
18 (0.7) REF.
15.5 ± 0.5
(0.6 ± 0.020)
Fast-on tab 2.8 x 0.8 (0.110 x 0.03)
6.7 ± 0.3 (0.26 ± 0.012)
30 ± 1 (1.18 ± 0.039)
24 ± 0.5
(1 ± 0.020)
1
2
3
4 5 7 6
80 ± 0.3 (3.15 ± 0.012)
92 ± 0.75 (3.6 ± 0.030)
20 ± 0.5 (0.79 ± 0.020)
20 ± 0.5 (0.79 ± 0.020)
15 ± 0.5 (0.59 ± 0.020)
22.6 ± 0.2 (0.89 ± 0.008)
6.3 ± 0.2 (0.248 ± 0.008)
5.8 ± 0.25 (0.228 ± 0.010)
4 ± 0.2 (0.157 ± 0.008)
DIMENSIONS in millimeters (inches)
Outline Dimensions
Vishay Semiconductors
Document Number: 95368 For technical questions, contact: indmodules@vishay.com Revision: 11-Nov-08 1
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