The VSC837 is a monolithic 68x68 asynchronous crosspoint switc h, designed to carry broadband data
streams. The non-blocking switch core is programmed through a triple-mode port interface that allows random
access programming of each input/output port. A high degree of signal integr ity is maintained thr oughout the
chip via fully differential signal paths.
The crosspoint function is based on a multiplexer array architecture. Each data output is driven by a 68:1
multiplexer th at can be prog rammed to one and onl y o ne of its 68 inp uts. The s ignal path is u nregis tered and
fully asynchronous, so there are no restrictions on the phase, frequency, or signal pattern at each input.
Each high-speed output is a fully differential switched current driver with switchable on-die terminations
for maximum signal integrity. Data inputs are terminated on die through 100
plement inputs (see Input Termination section for further detail).
A triple-mode programming interface is provided that allows programming commands to be sent as serial
data or one of two forms of para llel da ta. The input -ref erred mode (b urst mode) allows an input por t to be rout ed
to all outputs in only 4 program cycles. Core program ming can be random for each port addre ss, or multiple
program assignments can be queued and issued simultaneously. The programming may be initialized to a
“straight-through” configuration (A0 to Y0, A1 to Y1, etc.) using the INITB pin.
An activity monitor is provided to allow in-system diagnostics. The activity monitor can observe any highspeed input via an internal 69th multiplexe r.
Unused channels may be powered down to allow efficient use of the switch in appl ications that requi re only
a subset of the channels. Power-down can be accomplished in har dware, via ded icated power pins for pairs of
input and output channels, or in software by programming individual unused outputs with a disable code.
All input data must be differential and should be nominally biased to +2.0V or AC-coupled. Other levels
are allowed as described under the Input Termination section. On-chip terminations are provided, with a nomi-
nal impedance of 100
coupling.
For direct interconnection of multiple VSC837 devices, a CML termination mode is provided by tying the
ITC pin to V
CC
loads for an open-drain or open-collector differential output.
Data outputs are provided through differential current switches with on-chip back-termination. The output
circuit is capable of dri ving ex ternal 5 0
electronically switchable to enable a power savings of 2W (max) by reducing the output driver current.
Ω differential. All input termination resistors float with an internal bias provided for AC-
, which ties the center point of the 100Ω te rminatio n to VCC, causing the terminat ions to act as
Ω far-end termination (recommended). The output back -terminatio ns are
In parallel mode (SERIAL=0, BURST=0), the binary word on INCHAN[6:0] is t he numerical identifie r of
the input that will be routed to the specified output. OUTCHAN[6:0] is the numerical identifier of the output
being programmed. A rising edge on the LOAD signal will transfer the programming data to the shadow register in the program me mor y. Raising CONFIG (asynchr onou sly) wi ll t ransf er th e pr og ramm ing data to th e ma in
latches in the program mem ory and cau se the int ernal select signa ls in the core to re-confi gure th e multip lexer.
Lowering CONFIG will latch the main latches. CONFIG may be tied HIGH to enable programming take effect
instantaneously.
This interface may be used with multiplexed address/data buses by using only INCHAN[6:0] without
OUTCHAN[6:0] and dropping ALE when the address of the output to be programmed is present on
INCHAN[6:0]. After the address is latched, the input address may be presented on INCHAN [6:0] and programming proceeds as above.
No read-back capability is provided in parallel mode. Read-back for diagnostic purposes is provided in
serial mode via the scan function.
Serial Mode
In serial mode (SERIAL=1, BURST=0), the INCHAN0 pin becomes the serial data input and the
INCHAN1 pin becomes the serial clock (rising edge triggered). A serial word of the form [Output][Input] is
shifted into the internal shift register, and the LOAD pin is asserted (HIGH) coincident with the last bit of the
data word to signal that the word is to be applied. This transfers the input ident ifier to the shado w register of t he
addressed output. CONFIG is then applied (asynchronously) to transfer one or more program commands to the
main latches of the program memories.
The SDOUT pin follows the data on the INCHAN0_SDIN pin 14 clock cycles later. This enables the user
to chain the serial ports of several crosspoints, shift program data for all switches through such a chain, and
assert LOAD on all switches simultaneously to program all of the connections simultaneously.
The output field is 7 bits long, representing the binary numerical identifier of the output to be programmed.
The input field is 7 bits long, representing the numerical identifier of the input that will be routed to the specified output.
3.2Gb/s
Serial Read-Back
Read-back of the program memor y contents is acco mplished in serial m ode by s etting the ALE_SCN pin
HIGH. This will serially shift out the contents of the main latches in the program memories, slice 68 first and
slice 0 last, and MSB-first, LSB-last for each 7-bit word. One rising edge of INCHAN1_SCLK with
ALE_SCN=0 and SERIAL=1 must occur to load the entire 483-bit shift register prior to shifting out data. At a
clock rate of 66MHz, this operation takes 7.26
Burst mode programming (BURS T=1, SE RIAL=0) e nabl es an input to be broadcast to any group of 1 t o 17
outputs with a single command. In this mode, rising edges on the LOAD pin will trigger program operations.
The INCHAN[6:0] pins represent the input to be broadcast. The OUTCHAN[18:17] pins represent the page
(quarter) of the program memory to access, and each of the OUTCHA N[16:0] pins represent s 1 of the 17 outputs within that page. A ’1’ on any of those pins will cause that output to be programmed to connect to the input
named on INCHAN[6:0].
No read-back capability is provided in burst mode. See Serial Read-Back section above.
Activity Monitoring
The activity monito r observes the output of the internal 69 th output fro m the core. By p rogrammin g the
69th output to observe various inputs, the input signals can be scanned for activity or lack thereof. Each rising
edge of ACTCLK causes the monitor to read out the act ivity state from t he previous ACT CLK period and cl ears
the internal activity state until a data transition triggers it again. There must be a min imum of o ne ri si ng a nd o ne
falling edge on the observed input data pin during the ACTCLK period for activity to be detected. After poweron the output of ACTIVITY after the first ACTCLK rising edge is unknown.
Selective Power-Down
Unused input and output channels can be made to consume little or no power via one of two methods of
selective power-down.
Preliminary Data Sheet
VSC837
Software Power-Down
Using this feature, unused outputs may be disabled, saving approximately 170 mW per channel for maximum dissipation conditions. This is accomplished by programming each unused output to look at input 127 (7F
Hex), which represents a non-existent input channel. The channel may be subsequently activated by programming a valid input address. It is recommended, however, that any changes in power programming only be executed as part of an initialization sequence to guard against the effects of any switching transients that might
result from changing the power supply current sudden ly. Software mode does not affect the functioning or
power of unused input channels.
Hardware Power-Down
Using this feature, the power associated with given pairs of inp uts may be shut of f by ty ing the corresponding V
tion conditions. The power associated with give n pairs of outputs, including their c ontribution to the core
power, can be shut off by tying the corresponding V
output pair is saved under the maximum dissipation conditions.
ing inputs and outputs will always be on and consuming power. See Figure 6 and Table 10 for the location of
these pins.
pin to VCC (see Table 10). Approximately 160 mW per input pair is saved under t he max imum di ssipa-
EE
pin to VCC (see Table 10). Approximately 360 mW per
EE
Certain V
pins must always be active. In oth er words, t ied to t he most ne gative supp ly, so the correspond-
NOTES:(1) Tested on a sample basis only. (2) Br oadband (unfiltered) deterministic jitter added to a jitter-free input, 223-1 PRBS data pattern.
T a ble 2: Program Interface Timing
SymbolParameterMinTypMaxUnits
t
sWRB
t
hWRB
t
pwLW
t
sCSB
t
hCSB
t
pwCFG
t
sSDIN
t
hSDIN
t
perSCLK
t
sLOAD
t
hLOAD
t
sSERIAL
t
hSERIAL
t
sBURST
t
hBURST
t
dsDOUT
t
pwINITB
t
sSCAN
t
hSCAN
Maximum Data Rate——3.2Gb/s
Channel-to-channel delay skew—300—ps
Propagation Delay from an A input to a Y output—750—ps
High-speed input rise/fall times, 20% to 80%——150ps
F
High-speed outpu t rise/fall times, 20% to 80%——150ps
Setup time from INCHAN[6:0] or OUTCHAN[6:0] to rising edge of WRB3.35——ns
Hold time from rising edge of WRB to INCHAN[6:0] or OUTCHAN[6:0]1.45——ns
Pulse width (HIGH or LOW) on LOAD6.75——ns
Setup time from CSB to falling edge of LOAD or ALE_SCN in parallel or burst
mode, or rising edge of LOAD in serial mode.
Hold time of CSB rising edge after LOAD or ALE_SCN rising in parallel or
burst mode, or falling edge of LOAD in serial mode, or falling edge of CONFIG
in any mode.
Pulse width (HIGH or LOW) on CONFIG6.75——ns
Setup time from INCHAN0_SDIN to INCHAN1_SCLK rising1.65——ns
Hold time of INCHAN0_SDIN after INCHAN1_SCLK rising1.0—— ns
Minimum period of S CLK in serial mode15—— ns
Setup time from LOAD to INCHAN1_SCLK rising1.85——ns
Hold time of LOAD after INCHAN1_SCLK rising0.95——ns
Setup time from SERIAL rising to INCHAN1_SCLK rising when entering serial
mode or SERIAL falling to LOAD falling when entering parallel mode or
SERIAL falling to LOAD rising when entering burst mode.
Hold time from INCHAN1_SCLK rising to SERIAL falling when exiting serial
mode.
Setup time from BURST rising to LOAD rising when entering burst mode or
BURST falling to LOAD falling when entering parallel mode.
Hold time from LOAD rising to BURST falling when exiting burst mode.2.45—— ns
Delay from INCHAN1_SCLK rising to SDOUT, 20pF load.——6.20ns
Pulse width (HIGH or LOW) on INITB6.75——ns
Setup time from ALE_SCN to INCHAN1_SCLK rising when starting or
completing a serial read-back sequence.
Hold time of ALE_SCN after INCHAN1_SCLK rising when starting or
The high-speed inputs of the VSC837 are internally terminated by a 100Ω resistor between true and complement inputs. Termination resistors are isolated from each other on-chip. The termination will self-bias to
+2.0V (nominal) for AC-coupled applications. The ITC pin enables direct interconnection of multiple VSC837
devices. With ITC tied to V
minations to act as loads for an open-drain or open-collector differential output.
, the center point of the 10 0Ω te rmin ation resisto r is ti ed to VCC, causing the ter-
CC
3.2Gb/s
Table 7: Allowed Input Termination Schemes
TypeDescriptionComments
1AC-coupled input
2DC-coupled from open-drain CMLTie ITC HIGH, terminations acts as 50Ω load to V
3DC-coupled from back-terminated 2.5V CMLTie ITC HIGH, terminations act s as 50Ω load to V
4DC-coupled from back-terminated 2.5V CML
5DC-coupled from back-terminat ed 3.3V LV-PECLTie ITC LOW, 100Ω differential termination
Tie IT C LOW, 100Ω differential input termination,
input self-biased
Tie IT C LOW, 100Ω differential termination
(preferred over Type 3)
Some allowed termination schemes result in additional ICC current and power dissipation on-chip. See
Table 8.
Table 8: Additional Current and Power
SymbolDescriptionMinTypMaxUnitsConditions
I
CC-C
P
CC-C
Additional ICC current when receiving DC-Coupled
CML (ITC = HIGH)
Additional power dissipated on-chip for DC
terminating CML at inputs
The high-speed outputs of the VSC837 are internally back terminated by 50Ω to VCC when the
TERM_CTRL pin is HIGH. When this pin is LOW, the output driver functions as an open-drain CML driver.
Setting DRIVE_CTRL LOW (GND) saves 2W under maximum power dissipation conditions. See Table 9 for
allowable types of terminations and modes of operation.
Table 9: Allowed High-Speed Output Terminations and Modes of Operation
(1)
V
TypeDescription
1AC-Coupled to 50Ωtermination to any voltageVCC (HIGH)VCC (ON)5002.0
2AC-Coupled to
3DC-Coupled, terminated in 50Ωto VCC at far-end onlyGND (LOW)GND (OFF)5002.25
4DC-Coupled, terminated in
5DC-Coupled, source and far-end terminated in
6DC-Coupled, source and far-end terminated in 50Ωto V
7DC-Coupled,
8DC-Coupled,
NOTE: (1) Measured at output of VSC837, with VCC = 2.5V.
Power Supply Voltage (VCC) Potential to GND................................................................................-0.5V to +4.V
TTL Input Vo ltage Applied .....................................................................................................-0.5V to V
ECL Input Vo ltage Applied ....................................................................................................-0.5V to V
Output Current (I
Case Temperature Under Bias (T
Storage Temperature (T
NOTE: (1) Caution: Stresses listed under “Absolute Maximum Ratings” may be applied to devices one at a time without causing perma-
nent damage. Functionality at or exceeding the values listed is not implied. Exposure to these values for extended periods may
affect device reliability.
).............................................................................................-55oC to + 125oC
C
) ........................................................................................................-65oC to + 150oC
STG
CC
CC
+1.0V
+0.5V
Operating Conditions
Supply Voltage (VEE)..........................................................................................................................................0V
Supply Voltage (V
Supply Voltage (V
Case Temperature Operating Range (T).............................................................................................. 0
OUTCHAN14 C24 Output Channel, Bit 14 (burst mode only) TTL
OUTCHAN15 F29 Output Channel, Bit 15 (burst mode only) TTL
OUTCHAN16 F28 Output Channel, Bit 16 (burst mode only) TTL
OUTCHAN17 F25 Output Channel, Bit 17 (burst mode only) TTL
OUTCHAN18 F26 Output Channel, Bit 18 (burst mode only) TTL
SDOUT AG6 Serial Data Out for Serial Mode and Scan TTL
SERIAL AE6 SERIAL = 1 Sets Serial Mode TTL
TERM_CTRL AD5
Power Supplies
VEE C23 Common Negative Power Supply GND
VEE C7 Common Negative Power Supply GND
VEE R3 Common Negative Power Supply GND
VEE AG7 Common Negative Power Supply GND
VEE AG23Common Negative Power Supply GND
VEE R27 Common Negative Power Supply GND
VCC A1 Positive Power Supply 2.5V
VCC A2 Positive Power Supply 2.5V
VCC A3 Positive Power Supply 2.5V
VCC A4 Positive Power Supply 2.5V
VCC A5 Positive Power Supply 2.5V
VCC A25 Positive Power Supply 2.5V
VCC A26 Positive Power Supply 2.5V
VCC A27 Positive Power Supply 2.5V
VCC A28 Positive Power Supply 2.5V
VCC A29 Positive Power Supply 2.5V
VCC AE1 Positive Power Supply 2.5V
VCC AE2 Positive Power Supply 2.5V
VCC AE25Positive Power Supply 2.5V
VCC AE26Positive Power Supply 2.5V
VCC AE27Positive Power Supply 2.5V
VCC AE28Positive Power Supply 2.5V
VCC AE29Positive Power Supply 2.5V
VCC AE3 Positive Power Supply 2.5V
VCC AE4 Positive Power Supply 2.5V
VCC AE5 Positive Power Supply 2.5V
VCC AF1 Positive Power Supply 2.5V
VCC AF2 Positive Power Supply 2.5V
VCC AF25Positive Power Supply 2.5V
Output Back-Termination Control (LOW = no back termination;
VEEP_T2 C21 Negative Power Supply for Inputs A8/AN8+A10/AN10 GND
VEEP_T3 C20 Negative Power Supply for Inputs A12/AN12+A14/AN14 GND
VEEP_T4 C19 Negative Power Supply for Inputs A16/AN16+A18/AN18 GND
VEEP_T5 C18 Negative Power Supply for Inputs A20/AN20+A22/AN22 GND
VEEP_T6 C17 Negative Power Supply for Inputs A24/AN24+A26/AN26 GND
VEEP_T7 C16 Negative Power Supply for Inputs A28/AN28+A30/AN30 GND
VEEP_T8 C15 Negative Power Supply for Inputs A32/AN32+A34/AN34 GND
VEEP_T9 C14 Negative Power Supply for Inputs A36/AN36+A38/AN38 GND
VEEP_T10 C13 Negative Power Supply for Inputs A40/AN40 +A42/AN42 GND
VEEP_T11 C12 Negative Power Supply for Inputs A44/AN44+A46/AN46 GND
VEEP_T12 C11 Negative Power Supply for Inputs A48/AN48 +A50/AN50 GND
VEEP_T13 C10 Negative Power Supply for Inputs A52/AN52 +A54/AN54 GND
VEEP_T14 C9 Negative Power Supply for Inputs A56/AN56+A58/AN58 GND
VEEP_T15 C8 Negative Power Supply for Inputs A60/AN60+A62/AN62 GND
VEEP_B1 AG22Negative Power Supply for Inputs A5/AN5+A7/AN7 GND
VEEP_B2 AG21Negative Power Supply for Inputs A9/AN9+A11/AN11 GND
VEEP_B3 AG20Negative Power Supply for Inputs A13/AN13+A15/AN15 GND
VEEP_B4 AG19Negative Power Supply for Inputs A17/AN17+A19/AN19 GND
VEEP_B5 AG18Negative Power Supply for Inputs A21/AN21+A23/AN23 GND
VEEP_B6 AG17Negative Power Supply for Inputs A25/AN25+A27/AN27 GND
VEEP_B7 AG16Negative Power Supply for Inputs A29/AN29+A31/AN31 GND
VEEP_B8 AG15Negative Power Supply for Inputs A33/AN33+A35/AN35 GND
VEEP_B9 AG14Negative Power Supply for Inputs A37/AN37+A39/AN39 GND
VEEP_B10 AG13Negative Power Supply for Inputs A41/AN41+A43/AN43 GND
VEEP_B11 AG12Negative Power Supply for Inputs A45/AN45+A47/AN47 GND
VEEP_B12 AG11Negative Power Supply for Inputs A49/AN49+A51/AN51 GND
VEEP_B13 AG10Negative Power Supply for Inputs A53/AN53+A55/AN55 GND
VEEP_B14 AG9 Negative Power Supply for Inputs A57/AN57+A59/AN59 GND
VEEP_B15 AG8 Negative Power Supply for Inputs A61/AN61+A63/AN63 GND
VEEP_L0 G3 Negative Power Supply for Outputs Y1/YN1+Y3/YN3 GND
VEEP_L1 H3 Negative Power Supply for Outputs Y5/YN5+Y7/YN7 GND
VEEP_L2 J3 Negative Power Supply for Outputs Y9/YN9+Y11/YN11 GND
VEEP_L3 K3 Negative Power Supply for Outputs Y13/YN13+Y15/YN15GND
VEEP_L4 L3 Negative Power Supply for Outputs Y17/YN17+Y19/YN19GND
VEEP_L5 M3 Negative Power Supply for Outputs Y21/YN21+Y23/YN23GND
VEEP_L6 N3 Negative Power Supply for Outputs Y25/YN25+Y27/YN27GND
VEEP_L7 P3 Negative Power Supply for Outputs Y29/YN29+Y31/YN31GND
VEEP_L9 T3 Negative Power S up ply for Ou tputs Y37/YN37+Y39/YN39GND
VEEP_L10 U3 Negative Power Supply for Outputs Y41/YN41+Y43/YN43GND
VEEP_L11 V3 Negative Power Supply for Outputs Y45/YN45+Y47/YN47GND
VEEP_L12 W3 Negative Power Supply for Outputs Y49/YN49+Y51/YN51GND
VEEP_L13 Y3 Negative Power Supply for Outputs Y53/YN53+Y55/YN55GND
VEEP_L14 AA3 Negative Power Supply for Outputs Y57/YN57+Y59/YN59GND
VEEP_L15 AB3 Negative Power Supply for Outputs Y61/YN61+Y6 3/YN63GND
VEEP_L16 AC3 Negative Power Supply for Outputs Y65/YN65+Y6 7/YN67GND
VEEP_R0 G27 Negative Power S upply for Outputs Y0/YN0+Y2/YN2 GND
VEEP_R1 H27 Negative Power S upply for Outputs Y4/YN4+Y6/YN6 GND
VEEP_R2 J27 Negative Power Supply for Outputs Y8/YN8+Y10/YN10 GND
VEEP_R3 K27 Negative Power Supply for Outputs Y12/YN12+Y14/YN14GND
VEEP_R4 L27 Negative Power Supply for Outputs Y16/YN16+Y18/YN18GND
VEEP_R5 M27 Negative Power Supply for Outputs Y20/YN20+Y22/YN22GND
VEEP_R6 N27 Negative Power Supply for Outputs Y24/YN24+Y26/YN26GND
VEEP_R7 P27 Negative Power Supply for Outputs Y28/YN28+Y30/YN30GND
VEEP_R9 T27 Negative Power Supply for Outputs Y36/YN36+Y38/YN38GND
VEEP_R10 U27 Negative Power Supply for Outputs Y40/YN40+Y42/YN42GND
VEEP_R11 V27 Negative Power Supply for Outputs Y44/YN44+Y46/YN46GND
VEEP_R12 W27 Negative Power Supply for Outputs Y48/YN48+Y50/YN50GND
VEEP_R13 Y27 Negative Power Supply for Outputs Y52/YN52+Y54/YN54GND
VEEP_R14 AA27Negative Power Supply for Outputs Y56/YN56+Y58/YN58GND
VEEP_R15 AB27Negative Power Supply for Outputs Y60/YN60+Y62/YN62GND
VEEP_R16 AC27Negative Power Supply for Outputs Y64/YN64+Y66/YN66GND
The order number for this product is formed by a combination of the device type and package type.
Device Type
3.2Gb/s 68x68 Crosspoint Switch
VSC837
Preliminary Data Sheet
VSC837
XX
Package Style
UG: 480 TBGA, 37.5mm Body
Notice
Vitesse Semiconductor Corporation (“Vitesse”) provides this document for informational purposes only. This document contains pre-production
information about Vitesse products in their con ce pt , development and/or testing p hase . All i nformation in this document, including descriptions of
features, functions, performan ce, technical specifications and availability, is subject to change wi th out notice at any ti me. Nothing contained in this
document shall be c ons trued as e xten ding an y w arran ty or pr omise , e xp ress or imp lied , th at a ny Vitesse produ ct wi ll b e av ail able as described or
will be suitable for or will accomp lis h any particular task.
Vitesse products are not intended for use in life support applia nc es, devices or systems. Use of a Vitesse product in such applications without written consent is prohibited.