• Halogen-free according to IEC 61249-2-21
definition
• 175 °C T
• Center tap TO-220 package
• High frequency operation
• High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
• Guard ring for enhanced ruggedness and long term
reliability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
• Compliant to RoHS Directive 2002/95/EC
operation
J
Vishay Semiconductors
PRODUCT SUMMARY
PackageTO-262AA, TO-263AB (D2PAK)
I
F(AV)
V
R
V
at I
F
F
I
RM
T
max.175 °C
J
Diode variationCommon cathode
E
AS
15 mA at 125 °C
2 x 20 A
150 V
0.71 V
1 mJ
DESCRIPTION
The VS-40CTQ... center tap Schottky rectifier has been
optimized for very low forward voltage drop, with moderate
leakage. The proprietary barrier technology allows for
reliable operation up to 175 °C junction temperature. Typical
applications are in switching power supplies, converters,
freewheeling diodes, and reverse battery protection.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOLCHARACTERISTICS VALUESUNITS
I
F(AV)
V
I
FSM
V
T
RRM
F
J
Rectangular waveform40A
150V
tp = 5 μs sine1500A
20 Apk, TJ = 125 °C (per leg)0.71V
- 55 to 175°C
VOLTAGE RATINGS
PARAMETER SYMBOL
Maximum DC reverse voltageV
Maximum working peak reverse voltageV
R
RWM
VS-40CTQ150SPbF
VS-40CTQ150-1PbF
150V
UNITS
Document Number: 94215For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 04-Jan-11DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com1
Page 2
VS-40CTQ150SPbF, VS-40CTQ150-1PbF
Vishay Semiconductors
Schottky Rectifier, 2 x 20 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOLTEST CONDITIONSVALUES UNITS
Maximum average
per leg
forward current
See fig. 5
per device40
Maximum peak one cycle non-repetitive
surge current per leg
See fig. 7
Non-repetitive avalanche energy per legE
Repetitive avalanche current per legI
I
F(AV)
I
FSM
AR
50 % duty cycle at TC = 140 °C, rectangular waveform
5 μs sine or 3 μs rect. pulse
Following any rated load
condition and with rated
10 ms sine or 6 ms rect. pulse250
TJ = 25 °C, IAS = 1.5 A, L = 0.9 mH1.0mJ
AS
V
RRM
applied
Current decaying linearly to zero in 1 μs
Frequency limited by T
maximum VA = 1.5 x VR typical
J
20
1500
1.5A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONSVALUES UNITS
20 A
Maximum forward voltage drop per leg
See fig. 1
V
FM
40 A1.16
(1)
20 A
40 A0.85
Maximum reverse leakage current per leg
See fig. 2
I
RM
Maximum junction capacitance per legC
Typical series inductance per legL
TJ = 25 °C
(1)
T
J
VR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C450pF
T
Measured lead to lead 5 mm from package body8.0nH
S
Maximum voltage rate of changedV/dtRated V
Note
(1)
Pulse width < 300 μs, duty cycle < 2 %
T
= 25 °C
J
= 125 °C
T
J
V
= Rated V
= 125 °C15mA
R
R
R
0.93
0.71
50μA
10 000V/μs
A
V
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case per leg
Maximum thermal resistance,
junction to case per package
Typical thermal resistance,
case to heatsink
Approximate weight
Mounting torque
minimum
maximum12 (10)
Marking device
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Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
10
1
0.1
- Thermal Impedance (°C/W)
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Revision: 04-Jan-11DiodesAmericas@vishay.com
thJC
Z
0.01
0.000010.00010.0010.010.1 1
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
D = 0.75
Single pulse
(thermal resistance)
D = 0.50
D = 0.33
D = 0.25
D = 0.20
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
Characteristics
thJC
, DiodesAsia@vishay.com, DiodesEurope@vishay.com3
P
DM
Notes:
1. Duty factor D = t
2. Peak TJ = PDM x Z
1/t2
t
1
thJC
t
2
+ T
C
100 10
Page 4
100
120
140
160
180
Allowable Case Temperature (°C)
I
F(AV)
- Average Forward Current (A)
1051520
3025
0
DC
Square wave (D = 0.50)
80 % V
R
applied
See note (1)
100
10 000
1000
I
FSM
- Non-Repetitive Surge Current (A)
tp - Square Wave Pulse Duration (µs)
1001000
10 000
10
At any rated load condition
and with rated V
RRM
applied
following surge
VS-40CTQ150SPbF, VS-40CTQ150-1PbF
Vishay Semiconductors
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Schottky Rectifier, 2 x 20 A
25
20
15
10
5
Average Power Loss (W)
0
0
Fig. 6 - Forward Power Loss Characteristics
RMS limit
1051520
I
- Average Forward Current (A)
F(AV)
DC
DC = 0.20
DC = 0.25
DC = 0.33
DC = 0.50
DC = 0.75
3025
Note
(1)
Formula used: TC = TJ - (Pd + Pd
Pd = Forward power loss = I
Pd
= Inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % VR applied
REV
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4DiodesAmericas@vishay.com
x VFM at (I
F(AV)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
TRL = Tape and reel (left oriented - for D2PAK only)
TRR = Tape and reel (right oriented - for D2PAK only)
-PbF = Lead (Pb)-free
9
1-Vishay Semiconductors product
Device code
513246789
VS-40CTQ150STRL PbF
-Circuit configuration:
C = Common cathode
3
VS-40CTQ150SPbF, VS-40CTQ150-1PbF
ORDERING INFORMATION TABLE
Schottky Rectifier, 2 x 20 A
Vishay Semiconductors
LINKS TO RELATED DOCUMENTS
Dimensionswww.vishay.com/doc?95014
Part marking informationwww.vishay.com/doc?95008
Packaging informationwww.vishay.com/doc?95032
SPICE modelwww.vishay.com/doc?95434
Document Number: 94215For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 04-Jan-11DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com5
Page 6
D2PAK, TO-262
DIMENSIONS FOR D2PAK in millimeters and inches
Outline Dimensions
Vishay High Power Products
Conforms to JEDEC outline D
(2)(3)
E
(3)
L1
D
L2
2 x
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
4
132
BB
e
2
H
2 x b2
2 x b
0.010
PAK (SMD-220)
A
Detail A
(2)
C
MM
A
Lead tip
B
A
c2
AA
A
c
M
± 0.004
B
0° to 8°
Gauge
plane
L3
B
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8:1
(E)
E1
View A - A
A1
(3)
(D1)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08)
Plating
Seating
plane
2.64 (0.103)
2.41 (0.096)
(3)
H
B
Pad layout
11.00
MIN.
(0.43)
MIN.
(4)
b1, b3
(c)
(b, b2)
Section B - B and C - C
Scale: None
9.65
(0.38)
3.81
(0.15)
c1
MIN.
MIN.
Base
Metal
(4)
SYMBOL
MILLIMETERSINCHES
MIN.MAX.MIN.MAX.MIN.MAX.MIN.MAX.
NOTESSYMBOL
MILLIMETERSINCHES
A4.064.830.1600.190D16.868.000.2700.3153
A10.000.2540.0000.010E9.6510.670.3800.4202, 3
b0.510.990.0200.039E17.908.800.3110.3463
b10.510.890.0200.0354e2.54 BSC0.100 BSC
b21.141.780.0450.070H14.6115.880.5750.625
b31.141.730.0450.0684L1.782.790.0700.110
c0.380.740.0150.029L1-1.65-0.0663
c10.380.580.0150.0234L21.271.780.0500.070
c21.141.650.0450.065L30.25 BSC0.010 BSC
D8.519.650.3350.3802L44.785.280.1880.208
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5 M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not
(7)
Outline conforms to JEDEC outline TO-263AB
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
Dimension b1 and c1 apply to base metal only
(5)
Controlling dimension: inches
(6)
Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.