Datasheet VS-30ETH06SPbF, VS-30ETH06-1PbF DataSheet (Vishay)

V

VS-30ETH06SPbF, VS-30ETH06-1PbF

Vishay High Power Products

S-30ETH06SPbF

Base

cathode

2

2

PAK

3

Anode

1
N/C

D

PRODUCT SUMMARY

trr (typical) 28 ns

I

F(AV)

V

R

Hyperfast Rectifier, 30 A FRED Pt

VS-30ETH06-1PbF

2

30 A

600 V

3

Anode

1
N/C

TO-262

FEATURES

• Hyperfast recovery time

• Low forward voltage drop

• Low leakage current

• 125 °C operating junction temperature

• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C

• Halogen-free according to IEC 61249-2-21 definition

• Compliant to RoHS directive 2002/95/EC

• AEC-Q101 qualified

DESCRIPTION/APPLICATIONS

State of the art hyperfast recovery rectifiers designed with
optimized performance of forward voltage drop, hyperfast
recovery time and soft recovery.
The planar structure and the platinum doped life time
control guarantee the best overall performance, ruggedness
and reliability characteristics.
These devices are intended for use in PFC boost stage in the
ac-to-dc section of SMPS, inverters or as freewheeling
diodes.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.

®

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS

Peak repetitive reverse voltage V

Average rectified forward current I

Non-repetitive peak surge current I

Operating junction and storage temperatures T

F(AV)

FSM

, T

J

RRM

TC = 103 °C 30

TJ = 25 °C 200

Stg

600 V

A

- 65 to 175 °C

ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Breakdown voltage,
blocking voltage

Forward voltage V

Reverse leakage current I

Junction capacitance C

Series inductance L

Document Number: 94020 For technical questions, contact: [e-mail]
Revision: 11-Mar-10 1

,

V

BR

V

R

IR = 100 μA 600 - -

R

IF = 30 A - 2.0 2.6

F

I

= 30 A, TJ = 150 °C - 1.34 1.75

F

VR = VR rated - 0.3 50

T

= 150 °C, VR = VR rated - 60 500

J

VR = 600 V - 33 - pF

T

Measured lead to lead 5 mm from package body - 8.0 - nH

S

V

μA

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VS-30ETH06SPbF, VS-30ETH06-1PbF

Vishay High Power Products

Hyperfast Rectifier,

30 A FRED Pt

®

DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V - 28 35

Reverse recovery time t

Peak recovery current I

Reverse recovery charge Q

rr

RRM

rr

= 25 °C

J

T

= 125 °C - 77 -

J

TJ = 25 °C - 3.5 -

T

= 125 °C - 7.7 -

J

= 30 A

I

F

dI

/dt = 200 A/μs

F

V

= 200 V

R

-31-

TJ = 25 °C - 65 -

T

= 125 °C - 345 -

J

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Maximum junction and storage
temperature range

Thermal resistance,
junction to case per leg

Thermal resistance,
junction to ambient per leg

Thermal resistance,
case to heatsink

Weight

Mounting torque

Marking device

T

, T

J

Stg

R

-0.71.1

thJC

R

R

thJA

thCS

Typical socket mount - - 70

Mounting surface, flat, smooth and greased - 0.2 -

- 65 - 175 °C

-2.0- g

-0.07- oz.

Case style D

6.0

(5.0)

2

PAK 30ETH06S

-

Case style TO-262 30ETH06-1

12

(10)

kgf · cm

(lbf · in)

nsT

A

nC

°C/W

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Document Number: 94020

2 Revision: 11-Mar-10

VS-30ETH06SPbF, VS-30ETH06-1PbF

1000

100

10

1

- Instantaneous Forward Current (A)

F

I

0 3.51.5

TJ = 175 °C

= 150 °C

T

J

= 25 °C

T

J

0.5 2 3

1

2.5

VF - Forward Voltage Drop (V)

Hyperfast Rectifier,

30 A FRED Pt

®

1000

100

10

0.1

0.01

- Reverse Current (µA)

R

I

0.001

0.0001

Vishay High Power Products

TJ = 175 °C

TJ = 150 °C

TJ = 125 °C

1

100

0 200 400

VR - Reverse Voltage (V)

TJ = 100 °C

TJ = 25 °C

300

Fig. 1 - Typical Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.

Reverse Voltage

1000

600500

100

- Junction Capacitance (pF)

T

C

10

0 200 400 500 600

TJ = 25 °C

300100

VR - Reverse Voltage (V)

Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage

10

1

0.1

0.01

- Thermal Impedance (°C/W)

thJC

Z

0.001

0.00001 0.0001 0.001 0.01 0.1 1

Single pulse

(thermal resistance)

D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01

Notes:

1. Duty factor D = t

2. Peak TJ = PDM x Z

t1 - Rectangular Pulse Duration (s)

Fig. 4 - Maximum Thermal Impedance Z

Characteristics

thJC

P

DM

t

1

t

2

.

1/t2

+ T

thJC

C

.

10

Document Number: 94020 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 11-Mar-10 3

VS-30ETH06SPbF, VS-30ETH06-1PbF

Vishay High Power Products

180

160

140

120

Square wave (D = 0.50)

applied

Rated V

R

100

Allowable Case Temperature (°C)

See note (1)

80

0 5 10 15 20 25

I

- Average Forward Current (A)

F(AV)

Fig. 5 - Maximum Allowable Case Temperature vs.

Average Forward Current

90

80

70

60

50

40

30

20

Average Power Loss (W)

10

0

0

0 1020304045

I

DC

5 152535

- Average Forward Current (A)

F(AV)

Fig. 6 - Forward Power Loss Characteristics

DC

30 35 40 45

RMS limit

D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50

Hyperfast Rectifier,

30 A FRED Pt

®

90

80

70

60

50

(ns)

rr

40

t

30

20

10

0

100 1000

Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt

1200

1000

800

600

(nC)

rr

Q

400

200

0

100 1000

IF = 30 A

= 15 A

I

F

VR = 200 V

= 125 °C

T

J

= 25 °C

T

J

dIF/dt (A/µs)

VR = 200 V

= 125 °C

T

J

= 25 °C

T

J

IF = 30 A

= 15 A

I

F

dIF/dt (A/µs)

Fig. 8 - Typical Stored Charge vs. dI

/dt

F

Note

(1)

Formula used: TC = TJ - (Pd + Pd
Pd = Forward power loss = I
Pd

= Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated V

REV

x VFM at (I

F(AV)

REV

) x R

;

thJC

/D) (see fig. 6);

F(AV)

R

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Document Number: 94020

4 Revision: 11-Mar-10

VS-30ETH06SPbF, VS-30ETH06-1PbF

Hyperfast Rectifier,

30 A FRED Pt

L = 70 μH

dIF/dt
adjust

Fig. 9 - Reverse Recovery Parameter Test Circuit

I

F

0

(1)

(1) dI

/dt - rate of change of current

F

through zero crossing

- peak reverse recovery current

(2) I

RRM

- reverse recovery time measured

(3) t

rr

from zero crossing point of negative
going I
through 0.75 I
extrapolated to zero current.

to point where a line passing

F

and 0.50 I

RRM

Fig. 10 - Reverse Recovery Waveform and Definitions

dIF/dt

RRM

G

®

Vishay High Power Products

= 200 V

V

R

0.01 Ω

D.U.T.

D

IRFP250

S

(3)

t

rr

t

a

(2)

I

RRM

t

b

(4)

Q

rr

0.5 I

RRM

dI

/dt

(rec)M

0.75 I

RRM

(4) Q

- area under curve dened by t

rr

and I

RRM

trr x I

(5) dI
current during t

=

Q

rr

/dt - peak rate of change of

(rec)M

portion of t

b

(5)

rr

RRM

2

rr

Document Number: 94020 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 11-Mar-10 5

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94020

6 Revision: 11-Mar-10

VS-30ETH06SPbF, VS-30ETH06-1PbF

Vishay High Power Products

Hyperfast Rectifier,

30 A FRED Pt

®

ORDERING INFORMATION TABLE

2

- Current rating (30 = 30 A)

3

- E = Single diode

4 - T = TO-220, D2PAK

5

- H = Hyperfast recovery

6

- Voltage rating (06 = 600 V)

- PbF = Lead (Pb)-free

7

-

S = D2PAK

-1 = TO-262

8

-

None = Tube (50 pieces)

TRL = Tape and reel (left oriented, for D

2

PAK package)

TRR = Tape and reel (right oriented, for D

2

PAK package)

9

Device code

51 3246789

VS- 30 E T H 06 S TRL PbF

1 - HPP product suffix

LINKS TO RELATED DOCUMENTS

Dimensions www.vishay.com/doc?95014

D2PAK

Part Marking Information

Vishay High Power Products

D2PAK, TO-262

TO-262

Assembly
lot code

Assembly
lot code

xxxxxxxx

V PYWWX

AC

xxxxxxx-x

V PYWWX

AC

Part number

Product version (optional):
P = Lead (Pb)-free
None = Standard
Date code:
Year 1 = 2001
Week 19
Line X

Part number

Product version (optional):
P = Lead (Pb)-free
None = Standard
Date code:
Year 1 = 2001
Week 19
Line X

Example: This is a xxxxxxxx with
assembly lot code AC,
assembled on WW 19, 2001
in the assembly line “X”

Example: This is a xxxxxxx-x with
assembly lot code AC,
assembled on WW 19, 2001
in the assembly line “X”

Document Number: 95008 For technical questions concerning discrete products, contact: [e-mail]
Revision: 30-Oct-08 For technical questions concerning module products, contact: [e-mail]

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1

D2PAK, TO-262

DIMENSIONS FOR D2PAK in millimeters and inches

Outline Dimensions

Vishay High Power Products

Conforms to JEDEC outline D

(2)(3)

E

(3)

L1

D

L2

2 x

Lead assignments

Diodes

1. - Anode (two die)/open (one die)

2., 4. - Cathode

3. - Anode

4

132

BB

e

2

H

2 x b2

2 x b

0.010

PAK (SMD-220)

A

Detail A

(2)

C

MM

A

Lead tip

B

A

c2

AA

A

c

M

± 0.004

B

Gauge

0° to 8°

plane

L3

B

L

L4

Detail “A”

Rotated 90 °CW

Scale: 8:1

(E)

E1

View A - A

A1

(3)

(D1)

17.90 (0.70)

15.00 (0.625)

2.32

(0.08)

Plating

Seating

plane

2.64 (0.103)

2.41 (0.096)

(3)

H

B

Pad layout

11.00
MIN.

(0.43)

MIN.

(4)

b1, b3

(c)

(b, b2)

Section B - B and C - C

Scale: None

9.65

(0.38)

3.81

(0.15)

c1

MIN.

MIN.

Base
Metal

(4)

SYMBOL

MILLIMETERS INCHES

MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.

NOTES SYMBOL

MILLIMETERS INCHES

A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3

A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3

b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3

b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC

b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625

b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110

c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3

c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070

c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC

D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208

Notes

(1)

Dimensioning and tolerancing per ASME Y14.5 M-1994

(2)

Dimension D and E do not include mold flash. Mold flash shall not

(7)

Outline conforms to JEDEC outline TO-263AB

exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body

(3)

Thermal pad contour optional within dimension E, L1, D1 and E1

(4)

Dimension b1 and c1 apply to base metal only

(5)

Datum A and B to be determined at datum plane H

(6)

Controlling dimension: inch

Document Number: 95014 For technical questions concerning discrete products, contact: [e-mail]
Revision: 31-Mar-09 For technical questions concerning module products, contact: [e-mail]

NOTES

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1

Outline Dimensions

Vishay High Power Products

D2PAK, TO-262

DIMENSIONS FOR TO-262 in millimeters and inches

Modified JEDEC outline TO-262

(Datum A)

(3)

L1

D

(2) (3)

E

1

L2

B

B

2 x e

MM

0.010 A B

Lead tip

A

2

3

C

C

(2)

L

3 x b2

3 x b

Lead assignments

Diodes

1. - Anode (two die)/open (one die)

2., 4. - Cathode

3. - Anode

c

A

A1

c2

B

A

Seating

plane

A

E

E1

Section A - A

Plating

(4)

b1, b3

c

(b, b2)

Section B - B and C - C

Scale: None

(3)

Base
metal

c1

(3)D1

(4)

SYMBOL

MILLIMETERS INCHES

MIN. MAX. MIN. MAX.

A 4.06 4.83 0.160 0.190

A1 2.03 3.02 0.080 0.119

b 0.51 0.99 0.020 0.039

b1 0.51 0.89 0.020 0.035 4

b2 1.14 1.78 0.045 0.070

b3 1.14 1.73 0.045 0.068 4

c 0.38 0.74 0.015 0.029

c1 0.38 0.58 0.015 0.023 4

c2 1.14 1.65 0.045 0.065

D 8.51 9.65 0.335 0.380 2

D1 6.86 8.00 0.270 0.315 3

E 9.65 10.67 0.380 0.420 2, 3

E1 7.90 8.80 0.311 0.346 3

e 2.54 BSC 0.100 BSC

L 13.46 14.10 0.530 0.555

L1 - 1.65 - 0.065 3

L2 3.56 3.71 0.140 0.146

Notes

(1)

Dimensioning and tolerancing as per ASME Y14.5M-1994

(2)

Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body

(3)

Thermal pad contour optional within dimension E, L1, D1 and E1

(4)

Dimension b1 and c1 apply to base metal only

(5)

Controlling dimension: inches

(6)

Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline

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NOTES

Document Number: 95014

Revision: 31-Mar-09

D2PAK

CARRIER TAPE FOR TAPE AND REEL LEFT in millimeters

Carrier tape (130 meter long per reel)

C

7

Ø 1.55 ± 0.05

Ø 1.6 ± 0.1

R 0.3

typical

P

2

Y

2.0 ± 0.1

2.17 ± 0.1

P

0

4.0 ± 0.1

1.57 ± 0.1

Packaging Information

Vishay High Power Products

C

L

0.40 ± 0.05

B

2

± 0.1

C

6

1.75 ± 0.1

C

4

F ± 0.1

C

5

W ± 0.3

0.12 MAX.

B

C

0

2

± 0.1

Ø 72

Ø 560

1.20

Section Y - Y

K

0

Y

P1 ± 0.1 A0 ± 0.1

NUMBER PACKAGE A

2

93-0194-01 D

PAK 10.80 16.00 10.35 4.90 11.50 16.00 24.00 330 800

C

1

Reel

30

Single

winded

B

0

0

winded

B

2

Level

K

114

FP1W REEL DIAMETER QUANTITY PER REEL

0

Notes

MATERIAL

1. General

• : Statistical, C

ST

≥ 1.33

pk

• 10 sprocket hole pitch cumulative tolerance ± 0.02 mm

• Camber not to exceed 1 mm in 250 mm

• A

and B0 measured on a plane 0.3 mm above the bottom of

0

the pocket

• K

measured from a plane on the inside bottom of the pocket to

0

the top surface of the carrier

• Pocket position relative to sprocket hole measured as true

PACKAGING

1. General

• Each box must be identified with Vishay part number 93-0194-x

• Box should be free of foreign particles

• Product must be stored at room temperature and clean

environment

• Certificate of analysis is required per every lot number

2. Material

• Conductive black styrenic alloy

position of pocket, not pocket hole

• Measured from centerline of sprocket hole to centerline of

pocket

• Must also meet requirements of EIA standard #EIA-481A

taping of surface mount components for automatic placement

2. Specification

• Poliestyrene

• Surface resistivity of molded material must measure

6

≤ 10

Ω/SQ measured in accordance to procedure given in

ASTM D-257 and ASTM D-991

• Free of heat marks

• No sharp edges allowed

• No deformities allowed in wall cavity

• Holes, edges and cavities must be free of burrs ≤ 0.060 mm

(burrs shall not come off the tape)

Document Number: 95032 For technical questions concerning discrete products, contact: [e-mail]
Revision: 18-May-09 For technical questions concerning module products, contact: [e-mail]

± 0.1

C

3

www.vishay.com

1

Packaging Information

Vishay High Power Products

D2PA K

CARRIER TAPE FOR TAPE AND REEL RIGHT in millimeters

Carrier tape (130 meter long per reel)

C

Ø 1.55 ± 0.05

Ø 1.6 ± 0.1

R 0.3

typical

6

P

2

Y

Y

2.0 ± 0.1

2.17 ± 0.1

P1 ± 0.1

30

A0 ± 0.1

P

0

4.0 ± 0.1

C

1.57 ± 0.1

1

Reel

114

C

7

1.75 ± 0.1

C

4

F ± 0.1

C

5

W ± 0.3

Ø 72

1.20

C

0.12 MAX.

K

± 0.1

0

L

0.40 ± 0.05

Section Y - Y

B

C

3

± 0.1

2

B

C

0

2

± 0.1

Single

winded

NUMBER PACKAGE A

2

93-0195-01 D

PAK 10.80 16.00 10.35 4.90 11.50 16.00 24.00 330 800

B

0

B

0

2

Notes

MATERIAL

1. General

• : Statistical, C

ST

≥ 1.33

pk

• 10 sprocket hole pitch cumulative tolerance ± 0.02 mm

• Camber not to exceed 1 mm in 250 mm

• A

and B0 measured on a plane 0.3 mm above the bottom of

0

the pocket

• K

measured from a plane on the inside bottom of the pocket to

0

the top surface of the carrier

• Pocket position relative to sprocket hole measured as true

position of pocket, not pocket hole

• Measured from centerline of sprocket hole to centerline of

pocket

• Must also meet requirements of EIA standard #EIA-481A

taping of surface mount components for automatic placement

2. Specification

• Poliestyrene

• Surface resistivity of molded material must measure

6

≤ 10

Ω/SQ measured in accordance to procedure given in

ASTM D-257 and ASTM D-991

• Free of heat marks

• No sharp edges allowed

• No deformities allowed in wall cavity

• Holes, edges and cavities must be free of burrs ≤ 0.060 mm

(burrs shall not come off the tape)

Level

winded

K

0

Ø 560

FP1W REEL DIAMETER QUANTITY PER REEL

PACKAGING

1. General

• Each box must be identified with Vishay part number 93-0195-x

• Box should be free of foreign particles

• Product must be stored at room temperature and clean

environment

• Certificate of analysis is required per every lot number

2. Material

• Conductive black styrenic alloy

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2 For technical questions concerning module products, contact: [e-mail]

Document Number: 95032

Revision: 18-May-09

Packaging Information

D2PA K

COVER TAPE FOR CARRIER TAPE in millimeters

Y

Y

X

X

Antistatic layer

Pet layer

Olefin layer

Vishay High Power Products

W

ST

Ø 76.5 ± 1.0

Section X - X

0.055 ± 0.005

ST

Sealant layer

Section Y - Y

VERSION NUMBER APPLICATION W CARRIER TAPE WIDTH MATERIAL

2

01 92-5210-14 D

Notes

MATERIAL

1. General

• : C

ST

2. Specification

≥ 1.33

pk

PAK 21.3 ± 0.1 24 Antistatic/treated/transparent/polyester

PACKAGING

1. General

• Each box must be identified with Vishay part number 92-5210-x

• Box should be free of foreign particles

• Thickness: 0.052 ± 0.005

• Length: 500 m

• Tensile strength: 6.00 kg/mm SQ

• Elongation: > 100 %

• Surface resistivity: 10E11 Ω/SQ max. both sides (antistatic)

• Peel strength conforms to IRMX specification P01-0074

• POS test range not to exceed 35 grf.

Data included on C of C of every lot

• Curl 4.5 mm max.

Sample length 200 mm
Frequency 5 times

• Inspection date < one year

• Luminous transmittance: 89.8 %

• Must also meet all requirements of EIA-standard #EIA-481C,

taping of surface mount components for automatic placement

• Free of heat marks

• No sharp edges allowed

• No burrs allowed

Document Number: 95032 For technical questions concerning discrete products, contact: [e-mail]
Revision: 18-May-09 For technical questions concerning module products, contact: [e-mail]

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3

Legal Disclaimer Notice

Vishay

Disclaimer

All product specifications and data are subject to change without notice.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.

Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.

Product names and markings noted herein may be trademarks of their respective owners.

Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1