• Multiple center power and ground pins for
improved noise immunity
• Individual byte controls for both Read and
Write cycles
• Available in 44 pin TSOPII / 48-fpBGA / 48-µBGA
Logic Block Diagram
Functional Description
The V62C1162048L is a Low Power CMOS Static
RAM organized as 131,072 words by 16 bits. Easy
Memory expansion is provided by an active LOW (CE)
and (OE) pin.
This device has an automatic power-down mode feature
when deselected. Separate Byte Enable controls (BLE
and BHE) allow individual bytes to be accessed. BLE
controls the lower bits I/O1 - I/O8. BHE controls the
upper bits I/O9 - I/O16.
Writing to these devices is performed by taking Chip
Enable (CE
(BLE
) with Write Enable (WE) and Byte Enable
/BHE) LOW.
Reading from the device is performed by taking Chip
Enable (CE
(BLE
Voltage on Any Pin Relative to GndVt-0.5+4.0V
Power DissipationPT−1.0W
Storage Temperature (Plastic)Tstg-55+150
Temperature Under BiasTbias-40+85
* Note: Stresses greater than those listed above Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and function operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
* VIL min = -2.0V for pulse width less than tRC/2.
** For Industrial Temperature
REV. 1.2May 2001 V62C1162048L(L)
= 0oC to +70oC / -40oC to 85oC**)
A
V
CC
1.82.02.2V
Gnd0.00.00.0V
V
IH
V
IL
1.6-VCC + 0.2V
-0.5*-0.4V
3
Page 4
DC Operating Characteristics (V
V62C1162048L(L)
=1.8 to 2.2V, Gnd = 0V, TA = 00C to +700C / -400C to 850C)
cc
Parameter Sym Test Conditions
Input Leakage Current
Output Leakage
Current
Operating Power
Supply Current
Average Operating
Current
Standby Power Supply
Current (TTL Level)
Standby Power Supply
Current (CMOS Level)
Vcc = Max,
IILII
IILOI
I
CC
I
CC1
= Gnd to V
V
in
cc
CE = VIH or Vcc=Max,
V
=Gnd to V
OUT
CE = VIL , VIN = V
I
=0
OUT
I
=0mA,
OUT
cc
orV
IH
,
IL
Min Cycle, 100% Duty
CE < 0.2V
I
CC2
I
SB
I
SB1
=0mA,
I
OUT
Cycle Time=1µs, Duty=100%
CE = VIH -0.5-0.5-0.5-0.5mA
CE > Vcc - 0.2V
V
< 0.2V or
IN
V
> Vcc- 0.2V L
IN
-70 -100
Min Max Min Max Min Max Min Max
-85
-120
Unit
-1-1-1-1µA
-1-1-1-1µA
-5-5-5-5
-35-35-30-30mA
-3-3-3-3mA
-
10
-
-
10
2
-
-
10
-
102µA
2
-
2
-
mA
µA
Output Low VoltageV
Output High VoltageV
Capacitance(f = 1MHz, T
IOL = 2 mA-0.4-0.4-0.4-0.4V
OL
IOH = -1 mA1.6-1.6-1.6-1.6-V
OH
= 250C)
A
Parameter*SymbolTest ConditionMaxUnit
Input Capacitance
I/O Capacitance
* This parameter is guaranteed by device characterization and is not production tested.
AC Test Conditions
Input Pulse Level0.4V to 1.6V
Input Rise and Fall Time 5ns
Input and Output Timing
Reference Level1.0V
Output Load Condition
70ns/85nsC
Load for 100ns/120nsC
= 30pf + 1TTL Load
L
= 100pf + 1TTL Load
L
C
in
C
I/O
V
Vin = 0V 7pF
= V
in
C
Figure A. * Including Scope and Jig Capacitance
= 0V 8pF
out
*
L
TTL
REV. 1.2May 2001 V62C1162048L(L)
4
Page 5
V62C1162048L(L)
Read Cycle
(9)
(V
= 1.8 to 2.2V, Gnd = 0V, TA = 00C to +700C / -400C to +850C)
cc
ParameterSym
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Access Time
OutputHold fromAddress Change
Chip Enable to Output in Low-Z
Chip Disable to Output in High-Z
Output Enable to Output in Low-Z
OutputDisable toOutput in High-Z
BLE
, BHE Enable to Output in Low-Z
BLE, BHE Disable to Output in High-Z
-70-85-100 -120
Unit
Min Max Min Max Min Max Min Max
t
RC
tAA -70-85-100-120ns
t
ACE
t
OE
t
OH
t
LZ
t
HZ
t
OLZ
t
OHZ
t
BLZ
t
BHZ
70-85-100-120-ns
-70-85-100-120ns
-40-40-50-60ns
10-10-10-10-ns
10-10-10-10-ns4,5
-30-35-40-45ns3,4,5
5-5-5-5-ns
-25-30-35-40ns
5-5-5-5-ns4,5
-25-30-35-40ns3,4,5
Note
BLE, BHE Access Time
Write Cycle
(11)
(V
= 1.8 to 2.2V, Gnd = 0V, TA = 00C to +700C / -400C to +850C)
cc
ParameterSymbol
Write Cycle Time
Chip Enable to Write End
Address Setup to Write End
Address Setup Time
Write Pulse Width
Write Recovery Time
Data Valid to Write End
Data Hold Time
Write Enable to Output in High-Z
Output Active from Write End
t
BA
-40-40-50-60ns
-70 -85-100 -120
Unit
Min Max Min Max Min Max Min Max
t
WC
tCW 60-70-80-90-ns
t
AW
t
AS
t
WP
t
WR
t
DW
t
DH
t
WHZ
t
OW
70-85-
60-70-80-90-ns
0-0-0-0-ns
50-60-70-80-ns
0-0-0-0-ns
30-35-40-45-ns
0-0-0-0-ns
-30-35-40-45ns
5-5-5-5-ns
100
-120-ns
Note
BLE, BHE Setup to Write End
REV. 1.2May 2001 V62C1162048L(L)
t
BW
60-70-80-90-ns
5
Page 6
V62C1162048L(L)
Timing Waveform of Read Cycle 1
(Address Controlled)
Address
t
OH
Data Out
Previous Data Valid
Timing Waveform of Read Cycle 2
Address
t
AA
t
ACE
CE
t
LZ(4,5)
t
BA
(BLE/BHE)
t
BLZ(4,5)
t
OE
OE
t
RC
t
AA
Data Valid
t
RC
t
HZ(3,4,5)
t
BHZ(3,4,5)
t
OHZ
Data Out
Notes (Read Cycle)
1. WE are high for read cycle.
2. All read cycle timing is referenced from the last valid address to the first transition address.
3.
t
and t
HZ
4. At any given temperature and voltage condition
device.
5. Transition is measured +
6. Device is continuously selected with CE
7. Address valid prior to coincident with CE
8. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write
cycle.
9. For test conditions, see AC Test Condition, Figure A.
REV. 1.2May 2001 V62C1162048L(L)
are defined as the time at which the outputs achieve the open circuit condition referenced to VOH or VOL levels.
OHZ
200mV from steady state voltage with load. This parameter is sampled and not 100% tested.
High-Z
t
OLZ
t
(max.) is less than tLZ (min.) both for a given device and from device to
HZ
= VIL.
transition Low.
t
OH
Data Valid
6
Page 7
V62C1162048L(L)
Timing Waveform of Write Cycle 1
Address
CE
BLE/BHE
WE
Data In
High-Z
Data Out
Timing Waveform of Write Cycle 2
Address
CE
t
AS (4)
BLE/BHE
t
AS (4)
(Address Controlled)
t
WC
t
AW
t
CW (3)
t
BW
t
WP (2)
t
OHZ (6)
High-Z (8)
(CE Controlled)
t
WC
t
AW
t
CW (3)
t
BW
t
WR (5)
t
DW
t
DH
t
OW
t
WR (5)
WE
Data In
High-Z
Data Out
Timing Waveform of Write Cycle 3
Address
CE
t
AS (4)
BLE/BHE
WE
Data In
Data Out
High-Z
High-Z
t
WP (2)
t
DW
t
t
LZ
WHZ (6)
t
DH
High-Z (8)High-Z
(BLE/BHE Controlled)
t
WC
t
AW
t
CW (3)
t
BW
t
WP (2)
t
DW
t
t
BLZ
WHZ (6)
High-Z (8)
t
WR (5)
t
DH
REV. 1.2May 2001 V62C1162048L(L)
7
Page 8
V62C1162048L(L)
Notes (Write Cycle)
1.All write timing is referenced from the last valid address to the first transition address.
2.A write occurs during the overlap of a low CE
low: A write ends at the earliest transition among CE
of write to the end of write.
3.
t
is measured from the later of CE going low to end of write.
CW
t
is measured from the address valid to the beginning of write.
4.
AS
5.
t
is measured from the end of write to the address change.
WR
6.If OE
Inputs of opposite phase of the output must not be applied because bus contention can occur.
7.For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and
, CE and WE are in the Read Mode during this period, the I/O pins are in the output Low-Z state.
write cycle.
8.If CE
9.D
10. When CE
goes low simultaneously with WE going low or after WE going low, the outputs remain high impedance state.
OUT is the read data of the new address.
is low: I/O pins are in the outputs state. The input signals in the opposite phase leading to the output should
not be applied.
11. For test conditions, see AC Test Condition, Figure A.
and WE. A write begins at the latest transition among CE and WE going
going high and WE going high. tWP is measured from the beginning
REV. 1.2May 2001 V62C1162048L(L)
8
Page 9
V62C1162048L(L)
Data Retention Characteristics
ParameterSymbolTest ConditionMinMaxUnit
VCC for Data Retention
Data Retention Current
Chip Deselect to Data Retention Time
Operation Recovery Time
Data Retention Waveform
V
CC
CE
(2)
(L Version Only) (TA = 00C to +700C / -400C to +850C)
Vcc_typ
t
CDR
V
(L Version Only)
V
DR
I
CCDR
t
CDR
t
R
Data Retention Mode
V
IH
(1)
CE > VCC - 0.2V 1.0
-1µA
-
VIN > VCC - 0.2V or 0-ns
VIN < 0.2V
> 1.0V
DR
V
DR
t
V
Vcc_typ
R
IH
t
RC
-ns
V
Notes (Write Cycle)
1.L-version includes this feature.
2.This Parameter is samples and not 100% tested.
3.For test conditions, see AC Test Condition, Figure A.
4.This parameter is tested with CL = 5pF as shown in Figure B. Transition is measured +
5.This parameter is guaranteed, but is not tested.
6.WE
7.CE
8.Address valid prior to or coincident with CE
is High for read cycle.
and OE are LOW for read cycle.
transition LOW.
9.All read cycle timings are referenced from the last valid address to the first transtion address.
10. CE
or WE must be HIGH during address transition.
11. All write cycle timings are referenced from the last valid address to the first transition address.
The information in this document is subject to change without
notice.
MOSEL VITELIC makes no commitment to update or keep current the information contained in this document. No part of this
document may be copied or reproduced in any form or by any
means without the prior written consent of MOSEL-VITELIC.
MOSEL VITELIC
3910 N. First Street, San Jose, CA 95134-1501 Ph: (408) 433-6000 Fax: (408) 433-0952 Tlx: 371-9461
5/01
Printed in U.S.A.
MOSEL VITELIC subjects its products to normal quality control
sampling techniques which are intended to provide an assurance
of high quality products suitable for usual commercial applications. MOSEL VITELIC does not do testing appropriate to provide
100% product quality assurance and does not assume any liability for consequential or incidental arising from any use of its products. If such products are to be used in applications in which
personal injury might occur from failure, purchaser must do its
own quality assurance testing appropriate to such applications.
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