V29C51002T/V29C51002B
2 MEGABIT (262,144 x 8 BIT)
5 VOLT CMOS FLASH MEMORY
Features
256Kx8-bit Organization
Address Access Time: 55, 90 ns
Single 5V ± 10% Power Supply
Sector Erase Mode Operation
16KB Boot Block (lockable)
512 bytes per Sector, 512 Sectors
– Sector-Erase Cycle Time: 10ms (Max)
– Byte-Write Cycle Time: 20µs (Max)
Minimum 10,000 Erase-Program Cycles
Low power dissipation
– Active Read Current: 20mA (Typ)
– Active Program Current: 30mA (Typ)
– Standby Current: 100µA (Max)
Hardware Data Protection
Low V
Self-timed write/erase operations with end-of-cycle detection
– DATA Polling
– Toggle Bit
CMOS and TTL Interface
Available in two versions
– V29C51002T (Top Boot Block)
– V29C51002B (Bottom Boot Block)
Packages:
– 32-pin Plastic DIP
– 32-pin TSOP-I
– 32-pin PLCC
Program Inhibit Below 3.5V
CC
PRELIMINARY
Description
The V29C51002T/V29C51002B is a high speed
262,144 x 8 bit CMOS flash memory. Writing or
erasing the device is done with a single 5 Volt
power supply. The device has separate chip enable
CE, write enable WE, and output enable OE
controls to eliminate bus contention.
The V29C51002T/V29C51002B offers a combination of: Boot Block with Sector Erase/Write
Mode. The end of write/erase cycle is detected by
Polling of I/O
DATA
The V29C51002T/V29C51002B features a
sector erase operation which allows each sector to
be erased and reprogrammed without affecting
data stored in other sectors. The device also
supports full chip erase.
Boot block architecture enables the device to
boot from a protected sector located either at the
top (V29C51002T) or the bottom (V29C51002B).
All inputs and outputs are CMOS and TTL
compatible.
The V29C51002T/V29C51002B is ideal for
applications that require updatable code and data
storage.
or by the Toggle Bit I/O
7
.
6
Device Usage Chart
Operating
Temperature
Range
C to 70°C••••• Blank
V29C51002T/V29C51002B Rev. 2.1 October 2000
Package OutlineAccess Time (ns)
Temperature
MarkPTJ5590
1
Page 2
MOSEL VITELIC
V 29C00251
OPERATING VOLTAGE
BOOT BLOCK LOCATION
Pin Configurations
N/C
A16
A15
A12
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
A7
1
2
3
4
5
6
32-Pin PDIP
7
Top View
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
51002-02
V
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
Input CapacitanceV
Output CapacitanceV
Control Pin CapacitanceV
= 5V ± 10%, f = 1 MHz.
CC
(1)
= 068pF
IN
= 0812pF
OUT
= 0810pF
IN
2,097,152 Bit
Memory Cell Array
Y-Decoder
I/O Buffer & Data Latches
–I/O
I/O
0
7
51002-07
Parameter Min.Max.Unit
Input Voltage with Respect to GND on A
Input Voltage with Respect to GND on I/O, address or control pins-1V
V
Current-100+100mA
CC
NOTE:
1.Includes all pins except V
. Test conditions: V
CC
, OE
9
= 5V, one pin at a time.
CC
-1+13V
+ 1V
CC
AC Test Load
+5.0 V
IN3064
Device Under
Test
CL = 100 pF
V29C51002T/V29C51002B Rev. 2.1 October 2000
or Equivalent
6.2 kΩ
3
2.7 kΩ
IN3064 or Equivalent
IN3064 or Equivalent
IN3064 or Equivalent
51002-08
Page 4
°
°
±1µ
±10µ
µ
MOSEL VITELIC
Absolute Maximum Ratings
(1)
V29C51002T/V29C51002B
SymbolParameterCommercialUnit
V
IN
V
IN
V
CC
T
STG
T
OPR
I
OUT
NOTE:
1.Stress greater than those listed unders “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2.No more than one output maybe shorted at a time and not exceeding one second long.
Input Voltage (input or I/O pins)-2 to +7V
Input Voltage (A
pin, OE
9
)-2 to +13V
Power Supply Voltage-0.5 to +5.5V
Storage Temerpature (Plastic)-65 to +125
Operating Temperature0 to +70
Short Circuit Current
Input LOW VoltageV
Input HIGH VoltageV
Input Leakage CurrentV
Output Leakage CurrentV
Output LOW VoltageV
Output HIGH VoltageV
Read CurrentCE
Address input = V
V
Write CurrentCE
TTL Standby CurrentCE
CMOS Standby CurrentCE
Device ID Voltage for A
Device ID Current for A
CE
9
CE = OE = VIL, WE = VIH, A9 = VH Max.—50µA
9
= V
CC
CC
IN
OUT
CC
CC
CC
Min.—0.8V
CC
= V
Max.2—V
CC
= GND to V
= GND to V
= V
CC
= V
CC
= OE = V
= V
CC
Min., I
Min, I
, WE
IL
Max.
CC
, V
CC
OL
OH
IL
= WE = VIL, OE = V
= OE = WE = V
= OE = WE = V
= OE = V
, WE = V
IL
= V
CC
, V
Max.—
CC
= V
CC
Max.—
CC
= 2.1mA—0.4V
= -400µA2.4—V
, all I/Os open,
= V
IH
/V
, at f = 1/t
IH
IH
, V
IH
CC
– 0.3V, V
CC
IH
Min.,
RC
, V
= V
CC
= V
Max.—50mA
CC
Max.—2mA
CC
= V
CC
Max.—100
CC
—40mA
11.512.5V
A
A
A
V29C51002T/V29C51002B Rev. 2.1 October 2000
4
Page 5
MOSEL VITELICV29C51002T/V29C51002B
AC Electrical Characteristics
(over all temperature ranges)
Read Cycle
Parameter
NameParameter
t
RC
t
AA
t
ACS
t
OE
t
CLZ
t
OLZ
t
DF
t
OH
Read Cycle Time55—90—ns
Address Access Time—55—90ns
Chip Enable Access Time—55—90ns
Output Enable Access Time—25—45ns
CE Low to Output Active0—0—ns
OE Low to Output Active0—0—ns
OE or CE High to Output in High Z030040ns
Output Hold from Address Change0—0—ns
Program (Erase/Program) Cycle
Parameter
NameParameter
t
WC
t
AS
t
AH
t
CS
t
CH
t
OES
t
OEH
t
WP
t
WPH
t
DS
t
DH
t
WHWH1
t
WHWH2
t
WHWH3
Write Cycle Time55——90——ns
Address Setup Time0—— 0——ns
Address Hold Time35——45——ns
CE Setup Time0—— 0——ns
CE Hold Time0—— 0——ns
OE Setup Time0—— 0——ns
OE High Hold Time0—— 0——ns
WE Pulse Width30——45——ns
WE Pulse Width High20——30——ns
Data Setup Time25——30——ns
Data Hold Time0—— 0——ns
Programming Cycle——20——20µs
Sector Erase Cycle——10——10ms
Chip Erase Cycle—2—— 2—sec
-55-90
UnitMin.Max.Min.Max.
-55-90
UnitMin. Typ. Max. Min. Typ. Max.
V29C51002T/V29C51002B Rev. 2.1 October 2000
5
Page 6
MOSEL VITELICV29C51002T/V29C51002B
Waveforms of Read Cycle
t
RC
ADDRESS
t
AA
t
CE
CE
t
OE
OE
t
OLZ
WE
t
CLZ
I/O
Waveforms of WE
HIGH-Z
Controlled-Program Cycle
VALID DATA OUTVALID DATA OUT
3rd bus cycle
ADDRESS
t
t
WC
CH
t
AS
PA5555H
t
AH
CE
OE
t
t
OES
t
WP
WHWH1
WE
t
I/O
t
CS
A0H
WPH
t
DS
t
DH
(3)
PD
NOTES:
1.I/O7: The output is the complement of the data written to the device.
2.PA: The address of the memory location to be programmed.
3.PD: The data at the byte address to be programmed.
I/O
t
DF
t
OH
HIGH-Z
t
AA
(2)
PA
t
RC
t
OE
(1)
D
OUT
7
51002-09
t
t
OH
51002-10
DF
V29C51002T/V29C51002B Rev. 2.1 October 2000
6
Page 7
MOSEL VITELICV29C51002T/V29C51002B
Waveforms of CE Controlled-Program Cycle
t
WC
ADDRESS
WE
OE
5555HPAPA
t
AS
t
AH
(1)
t
RC
t
WP
t
WHWH1
CE
t
A0H
WPH
t
DS
t
DH
(2)
PD
(1)
t
AS
t
AH
t
OES
I/O
Waveforms of Erase Cycle
t
WC
ADDRESS
5555H5555H5555H2AAAH2AAAHSA
CE
OE
t
WP
WE
I/O
t
CS
t
DS
t
WPH
t
DH
AAH55H80HAAH55H30H
NOTES:
1.PA: The address of the memory location to be programmed.
2.PD: The data at the byte address to be programmed.
3.SA: The sector address for Sector Erase.
I/O7
t
DF
t
OE
D
OUT
t
OH
51002-11
(5555H for Chip Erase)
2
t
WHWH
3
(10H for
Chip Erase)
51002-12
V29C51002T/V29C51002B Rev. 2.1 October 2000
7
Page 8
MOSEL VITELICV29C51002T/V29C51002B
Waveforms of DATA Polling Cycle
t
CH
CE
t
DF
OE
t
OEH
t
OE
WE
I/O
I/O0-I/O
7
6
I/O
7
I/O0-I/O
6
Waveforms of Toggle Bit Cycle
CE
t
OEH
WE
OE
t
CE
t
t
WHWH1 (2 or 3)
I/O
INVALID
7
OH
VALID DATA OUT
VALID DATA OUT
HIGH-Z
HIGH-Z
51002-13
I/O
6
V29C51002T/V29C51002B Rev. 2.1 October 2000
t
WHWH1 (2 or 3)
8
stop toggling
51002-14
Page 9
MOSEL VITELICV29C51002T/V29C51002B
Functional Description
The V29C51002T/V29C51002B consists of 512
equally-sized sectors of 512 bytes each. The 16 KB
lockable Boot Block is intended for storage of the
system BIOS boot code. The boot code is the first
piece of code executed each time the system is
powered on or rebooted.
The V29C51002 is available in two versions: the
V29C51002T with the Boot Block address starting
from 3C000H to 3FFFFH, and the V29C51002B
with the Boot Block address starting from 00000H
to 3FFFFH.
Read Cycle
A read cycle is performed by holding both CE
and OE signals LOW. Data Out becomes valid only
when these conditions are met. During a read cycle
WE must be HIGH prior to CE and OE going LOW.
WE must remain HIGH during the read operation
for the read to complete (see Table 1).
Output Disable
Returning OE or CE HIGH, whichever occurs first
will terminate the read operation and place the l/O
pins in the HIGH-Z state.
Standby
The device will enter standby mode when the CE
signal is HIGH. The l/O pins are placed in the
HIGH-Z, independent of the OE input state.
Command Sequence
The V29C51002T/V29C51002B does not
provide the “reset” feature to return the chip to its
normal state when an incomplete command
sequence or an interruption has happened. In this
case, normal operation (Read Mode) can be
restored by issuing a “non-existent” command
sequence, for example Address: 5555H, Data FFH.
V29C51002TV29C51002B
16KB Boot Block512 Byte
512 Byte
512 Byte
512 Byte
3FFFFH
3C000H
03FFFH
00000H
16KB Boot Block = 32 Sectors
00000H
16KB Boot Block
512 Byte
512 Byte
51002-15
Byte Write Cycle
The V29C51002T/V29C51002B is programmed
on a byte-by-byte basis. The byte write operation is
initiated by using a specific four-bus-cycle
sequence: two unlock program cycles, a program
setup command and program data program cycles
(see Table 2).
During the byte write cycle, addresses are
latched on the falling edge of either CE or WE,
whichever is last. Data is latched on the rising edge
of CE or WE, whichever is first. The byte write cycle
can be CE controlled or WE controlled.
Sector Erase Cycle
The V29C51002T/V29C51002B features a
sector erase operation which allows each sector to
be erased and reprogrammed without affecting
data stored in other sectors. Sector erase operation
is initiated by using a specific six-bus-cycle
sequence: Two unlock program cycles, a setup
command, two additional unlock program cycles,
Program
Chip Erase5555HAAH2AAAH55H5555H80H5555HAAH2AAAH55H5555H10H
Sector Erase 5555HAAH2AAAH55H5555H80H5555HAAH2AAAH55HSA(5)30H
NOTES:
1.RA: Read Address
2.RD: Read Data
3.PA: The address of the memory location to be programmed.
4.PD: The data at the byte address to be programmed.
5.SA(5): Sector Address
Program Cycle
Address Data Address Data Address Data Address DataAddress Data Address Data
5555HAAH2AAAH55H5555H90H
5555HAAH2AAAH55H5555HA0HPAPD(4)
and the sector erase command (see Table 2). A
sector must be first erased before it can be re-
Second Bus
Program Cycle
Third Bus
Program Cycle
Fourth Bus
Program Cycle
See table 3 for detail.
Fifth Bus
Program Cycle
Six Bus
Program Cycle
data, and the device is then ready for the next
cycle.
written. While in the internal erase mode, the
device ignores any program attempt into the
device. The internal erase completion can be
determined via DATA polling or toggle bit status.
The V29C51002T/V29C51002B is shipped fully
erased (all bits = 1).
Toggle Bit (I/O6)
The V29C51002T/V29C51002B also features
another method for determining the end of a
program cycle. When the device is in the program
cycle, any attempt to read the device will result in
l/O6 toggling between 1 and 0. Once the program is
Chip Erase Cycle
The V29C51002T/V29C51002B features a chip-
erase operation. The chip erase operation is
completed, the toggling will stop. The device is then
ready for the next operation. Examining the toggle
bit may begin at any time during a program cycle.
initiated by using a specific six-bus-cycle
sequence: two unlock program cycles, a setup
command, two additional unlock program cycles,
and the chip erase command (see Table 2).
The automatic erase begins on the rising edge of
the last WE
or CE pulse in the command sequence
and terminates when the data on DQ7 is “1”.
Boot Block Protection Enabling/Disabling
The V29C51002T/V29C51002B features
hardware Boot Block Protection. The boot block
sector protection is enabled when high voltage
(12.5V) is applied to OE and A9 pins with CE pin
LOW and WE pin LOW. The sector protection is
disabled when high voltage is applied to OE, CE
Program Cycle Status Detection
There are two methods for determining the state
and A9 pins with WE pin LOW. Other pins can be
HIGH or LOW. This is shown in table 1.
of the V29C51002T/V29C51002B during a
program (erase/write) cycle: DATA Polling (I/O7)
and Toggle Bit (I/O6).
Autoselect Mode
The V29C51002T/V29C51002B features an
Autoselect mode to identify boot block locking
DATA Polling (I/O7)
The V29C51002T/V29C51002B features DATA
polling to indicate the end of a program cycle.
When the device is in the program cycle, any
attempt to read the device will received the
complement of the loaded data on I/O7. Once the
program cycle is completed, I/O7 will show true
status, device ID and manufacturer ID.
Entering Autoselect mode is accomplished by
applying a high voltage (VH) to the A9 Pin, or
through a sequence of commands (as shown in
table 2). Device will exit this mode once high
voltage on A9 is removed or another command is
loaded into the device.
V29C51002T/V29C51002B Rev. 2.1 October 2000
10
Page 11
MOSEL VITELICV29C51002T/V29C51002B
Boot Block Protection Status
In Autoselect mode, performing a read at
address location 3CXX2H (V29C51002T) or
0CXX2H (V29C51002B) will indicate boot block
protection status. If the data is 01H, the boot block
is protected. If the data is 00H, the boot block is
unprotected. This is also shown is table 3.
Device ID
In Autoselect mode, performing a read at
address XXX1H will determine whether the device
is a Top Boot Block device or a Bottom Boot Block
device. If the data is 02H, the device is a Top Boot
Block. If the data is A2H, the device is a Bottom
Boot Block device (see Table 3).
Table 3. Autoselect Decoding
Decoding ModeBoot Block
Boot Block ProtectionTopV
BottomV
Device IDTopV
BottomA2H
Manufacture IDV
NOTE:
1.X = Don’t Care, VIH = HIGH, VIL = LOW.
A
0
IL
IL
IH
IL
Manufacturer ID
In Autoselect mode, performing a read at
address XXXX0H will determine the manufacturer
ID. 40H is the manufacturer code for Mosel Vitelic
Flash.
Hardware Data Protection
VCC Detection: the program operation is inhibited
when VCC is less than 3.5V.
Noise Protection: a CE or WE pulse of less than
5ns will not initiate a program cycle.
Program Inhibit: holding any one of OE LOW, CE
HIGH or WE HIGH inhibits a program cycle.
The information in this document is subject to change without
notice.
MOSEL VITELIC subjects its products to normal quality control
sampling techniques which are intended to provide an assurance
10/00
Printed in U.S.A.
of high quality products suitable for usual commercial applicaMOSEL VITELIC makes no commitment to update or keep current the information contained in this document. No part of this
document may be copied or reproduced in any form or by any
means without the prior written consent of MOSEL-VITELIC.
tions. MOSEL VITELIC does not do testing appropriate to provide
100% product quality assurance and does not assume any liabil-
ity for consequential or incidental arising from any use of its prod-
ucts. If such products are to be used in applications in which
personal injury might occur from failure, purchaser must do its
own quality assurance testing appropriate to such applications.
MOSEL VITELIC 3910 N. First Street, San Jose, CA 95134-1501 Ph: (408) 433-6000 Fax: (408) 433-0952 Tlx: 371-9461
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