Datasheet V0603MHS12WH, V0603MHS12NH, V0603MHS12H, V0603MHS03WH, V0603MHS03H Datasheet (LITTELFUSE)
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Surface Mount Varistors
1
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
The Multilayer High-Speed MHS Series is a very-low capacitance
extension to the Littelfuse ML family of Transient Voltage Surge
Suppression devices available in an 0402 and 0603-size surface
mount chip.
The MHS series provides protection from ESD and EFT in high-speed
data-line and other high frequency applications. The low capacitance of
the MHS Series permits usage in analog or digital circuits where it will
not attenuate or distort the desired signal or data.
Their small size is ideal for high-density printed circuit boards, being
typically applied to protect intergrated circuits and other sensitive
components. They are particularly well suited to suppress ESD events
including those specified in IEC 61000-4-2 or other standards used for
ElectroMagnetic Compliance (EMC) testing.
The MHS series is manufactured from semiconducting ceramics and is
supplied in a leadless, surface mount package. The MHS Series is also
compatible with modern reflow and wave soldering processes.
Littelfuse Inc. manufactures other Multilayer Varistor Series products,
see the ML, MLE, MLN and AUML series data sheets.
Features
• 3pF & 12pF Capacitance Versions Suitable for High Speed
Data-Rate Lines
• ESD Rated to IEC 61000-4-2 (Level 4)
• EFT/B Rated to IEC 61000-4-4 (Level 4)
• Low Leakage Currents
• -55
o
C to +125oC Operating Temperature Range
• Inherently Bi-directional
Applications
• Data, Diagnostic I/O Ports
• Universal Serial Bus (USB)
• Video & Audio Ports
• Portable/Hand-Held Products
• Mobile Communications
• Computer/DSP Products
• Industrial Instruments Including Medical
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table.
Continuous:
Steady State Applied Voltage: DC Voltage Range (V
M(DC)
):V0402/0603MHS03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 42 V
V0402/0603MHS12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 18 V
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
O
C
Storage Temperature Range (T
STG
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
O
C
MHS SERIES UNITS
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Surface Mount Varistors
2
Device Ratings and Specifications
Temperature De-rating
For applications exceeding 125oC ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
PAR T
NUMBER
MAX RATINGS
(125°C)
PERFORMANCE SPECIFICATIONS (25°C)
MAXIMUM
ESD CLAMP
VO LTAGE
(NOTE 1)
W
TM Clamp
(Note 2)
8kV
CONTACT
NOTES:
1.
2.
Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
3.
Direct discharge to device terminals (IEC preferred test method).
4.
Corona discharge through air (represents actual ESD event).
Capacitance may be customized, contact your Littelfuse Sales Representative.
3.5V
V0402MHS12 0.025 125 160 0.1
V0402MHS03 0.010 300 400 0.1
MAXIMUM NON-
REPETITIVE
SURGE ENERGY
(10/1000µS)
Clamp
(Note 3)
15kV
AIR
MAXIMUM LEAKAGE CURRENT AT
SPECIFIED DC VOLTAGE
5.5V 9V
15V
I
L
(J) (V) (V) (µA)
(µA) (µA)
(µA)
TYPICAL
CAPACITANCE
AT 1MHz
(1V p-p)
(NOTE 4)
C
(pF)
TYPICAL
INDUCTANCE
(from Impedance
Analysis)
L
(nH)
0.15
0.15
1.00
0.25
5.00
0.50
12
3
<1.0
<1.0
MAXIMUM
CLAMPING
VO LTAGE
AT 1A (8X20µs)
(Vc)
55
110
P I
L
I
L
V0603MHS12 0.025 125 160 0.1
V0603MHS03 0.010 300 400 0.1
0.15
0.15
1.00
0.25
5.00
0.50
12
3
<1.0
<1.0
55
110
100
80
60
40
20
0
-55 50 60 70 80 90 100 110 120 130 140 150
PERCENT OF RATED VALUE
AMBIENT TEMPERATURE (oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
60
10
1
CURRENT (A)
NOMINAL VOLTAGE AT 1mADC
10
100
1000
10000
20
30
40
50
V0402MHS03
V0402MHS12
V0603MHS03
V0603MHS12
0.0001
0.001
CURRENT (mA)
0
0.01 0.1 1
5
10
20
25
30
15
25
85
125
VARISTOR VOLTAGE (V)
o
o
o
FIGURE 2: STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
-30
FREQUENCY (MHz)
INSERTION LOSS (dB)
10
100
1000
10000
-20
-10
0
V0402MHS12
V0402MHS03
V0603MHS12
V0603MHS03
MHS Varistor Series
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
3
Soldering Recommendations
The principal techniques used for the soldering of components in
surface mount technology are infared (IR) re-flow, vapour phase re-flow
and wave soldering. Typical profiles are shown in Figures 5, 6 and 7.
When wave soldering, the MHS suppressor is attached to the circuit
board by means of an adhesive. The assembly is then placed on a
conveyor and run through the soldering process to contact the wave.
With IR and vapour phase re-flow, the device is placed in a solder paste
on a substrate. As the solder paste is heated, it re-flows and solders the
unit to the board.
The recommended solder for the MHS suppressor is a 63/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402-size devices,
IR reflow is recommended.
When using a re-flow process, care should be taken to ensure that the
MHS chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating within 100 degrees of the solder’s peak
temperature is essentail to minimize thermal shock. Examples of the soldering conditions for the MHS suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
Recommended Pad Outline
6.
7.
5.
DIMENSION A
mm
1.70
0.020
0402
2.54
0.030
TABLE 1: PAD LAYOUT DIMENSIONS
0603
in
0.067
0.100
B
mm
0.510
0.760
in
0.610
0.890
C
mm
0.024
0.035
in
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Surface Mount Varistors
4
Ordering Information
V 0402
PACKING OPTIONS
H: 7in (178mm) Diameter Reel (Note)
DEVICE FAMILY
Littelfuse TVSS Device
H
DEVICE SIZE
i.e. 40Mil x 20Mil
(1.0mm x 0.5mm)
MHS 03 W
CAPACITANCE DESIGNATION
03 = 3PF
12 = 12PF
END TERMINATION OPTION
W: Ag/Pd
N: Nickel Barrier termination subject to availibility.
Please contact a Littelfuse sales representative
SERIES DESIGNATOR
Multilayer Hi-Speed
No Letter:
Ag/Pt (Standard)
D
E
W
L
Mechanical Dimensions
7 INCH REEL ("H" OPTION)
10,000
SIZE
2,500
0402
0603
13 IN REEL
"T" OPTION
––
10,000
Tape and Reel Specifications
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
SYMBOL DESCRIPTION DIMENSIONS IN MILLIMETERS
A
0
Width of Cavity Dependant on chip size to minimize rotation
B
0
Length of Cavity
K
0
Depth of Cavity
W Width of Tape 8 ±0.2
F Distance Between Drive Hole Centers and Cavity Centers 3.5 ±0.05
E Distance Between Drive Hole Centers and Tape Edge
P
1
Distance Between Cavity Center 2±0.05
P
2
Axial
Drive Distance Between Drive Hole Centers & Cavity Hole Centers
2 ±0.1
P
0
Axial Drive Distance Between Drive Hole Centers 4 ±0.1
D
0
Drive Hole Diameter 1.55 ±0.05
D
1
Nominal Paper Thickness 0.61
T
1
Top & Bottom Tape Thickness 0.10 Max
1
1.75±0.1
Dependant on chip size to minimize rotation
Dependant on chip size to minimize rotation
T
t
1
D
0
P
0
P
1
A
0
P
2
B
0
F
E
W
EMBOSSED PAPER CARRIER
TOP TAPE
8mm
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
DIA. REEL
DIMENSION
DEVICE DIMENSIONS
0402 SIZE
INCH MM
D Max. 0.024 0.60
E
0.10±0.006
0.25±0.15
L 0.039±0.004 1.00±0.10
W 0.020±0.004 0.50±0.10
0603 SIZE
INCH MM
0.035 0.9
0.015±0.008
0.4±0.2
0.063±0.006 1.6±1.5
0.032±0.006 0.8±1.5
Standard Shipping Quantities
Multilayer High Speed - MHS Series
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