Datasheet UT6164CLC-15, UT6164CLC-12, UT6164CLC-10, UT6164CJC-15, UT6164CJC-10 Datasheet (UTRON)

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Page 1
UTRON
UT6164C
Rev. 1.0
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
1
FEATURES
Fast access time : 10/12/15 ns (max.)
Low operating power consumption :
80 mA (typical)
Single 5V power supply
All inputs and outputs TTL compatible
Fully static operation
Three state outputs
Package : 28-pin 300 mil SOJ
28-pin 8mm×13.4mm STSOP
FUNCTIONAL BLOCK DIAGRAM
MEMORY ARRAY
128 ROWS X 512 COLUMNS
COLUMN I/O
COLUMN DECODER
ROW
DECODER
I/O
CONTROL
LOGIC
CONTROL
A4
I/O1
V
V
WE
OE
1CE
I/O8
.
.
.
.
. .
. .
.
A5
A6 A7 A
8
A11
A12
A
9 A3 A2 A1 A0
A
10
.
.
.
.
.
.
CE2
PIN DESCRIPTION
SYMBOL DESCRIPTION
A0 - A12 Address Inputs
I/O1 - I/O8 Data Inputs/Outputs
1CE
CE2
Chip Enable Input
WE
Write Enable Input
OE
Output Enable Input
VCC Power Supply
VSS Ground
GENERAL DESCRIPTION
The UT6164C is a 65,536-bit high-speed CMOS static random access memory organized as 8,192 words by 8 bits. It is fabricated using high performance, high reliability CMOS technology.
The UT6164C is designed for high-speed system applications. It is particularly suited for use in high-density high-speed system applications.
The UT6164C operates from a single 5V power supply and all inputs and outputs are fully TTL compatible.
PIN CONFIGURATION
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
Vcc
A8
A9
A11
A10
I/O8
I/O7
I/O6
I/O5
I/O4
I/O3
Vss
UT6164C
SOJ
28
14
13
12
11
10
9
8
7
6
5
4
3
2
1
17
16
15
20
19
18
22
23
24
25
26
27
21
WE
OE
CE2
NC
CE1
I/O4
A11
A9
A8
CE2
I/O3
A10
NC
A12
A7
A6
A5
Vcc
I/O8
I/O7
I/O6
I/O5
Vss
I/O2
I/O1
A0
A1
A2
A4
A3
UT6164C
STSOP
28
14
13
12
11
10
9
8
7
6
5
4
3
2
1
17
16
15
20
19
18
22
23
24
25
26
27
21
WE
OE
CE1
Page 2
UTRON
UT6164C
Rev. 1.0
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
2
ABSOLUTE MAXIMUM RATINGS
*
PARAMETER SYMBOL RATING UNIT
Terminal Voltage with Respect to Vss V
TERM
-0.5 to +6.5 V
Operating Temperature TA 0 to +70
Storage Temperature T
STG
-65 to +150
℃ Power Dissipation PD 1 W DC Output Current I
OUT
50 mA
Soldering Temperature (under 10 sec) Tsolder 260
*Stress greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability.
TRUTH TABLE
MODE
1
CE
CE2
OE
WE
I/O OPERATION SUPPLY CURRENT
Standby H X X X High - Z
I
SB
,
I
SB1
Standby X L X X High - Z
I
SB
,
I
SB1
Output Disable L H H H High - Z I
CC
Read L H L H D
OUT
I
CC
Write L H X L D
IN
I
CC
Note: H = VIH, L=VIL, X = Don't care.
DC ELECTRICAL CHARACTERISTICS
(VCC = 5V±10%, TA = 0℃ to 70℃)
PARAMETER SYMBOL TEST CONDITION MIN. MAX. UNIT
Input High Voltage
V
IH
2.2 VCC+0.5 V
Input Low Voltage
V
IL
- 0.5 0.8 V
Input Leakage Current
I
LI
V
SS
V
IN
VCC
- 1 1
µ
A
Output Leakage Current I
LO
V
SS
V
I/O
V
CC
1CE
=V
IH
or CE2=VIL or
OE
=V
IH
or
WE
=VIL
- 1 1
µ
A
Output High Voltage
V
OH
I
OH
= - 4mA 2.4 - V
Output Low Voltage
V
OL
I
OL
= 8mA - 0.4 V
- 10 - 180 mA
- 12 - 160 mA
Operating Power Supply Current
I
CC
Cycle time=Min.
1CE
= V
IL ,
CE2= VIH
I
I/O
=
0mA
- 15 - 140 mA
Standby Current (TTL) I
SB
1CE
= V
IH or
CE2= V
IL
- 30 mA
Standby Current (CMOS) I
SB1
1CE
V
CC
-0.2V or CE2
0.2V
- 5 mA
Page 3
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
3
CAPACITANCE
(TA=25℃, f=1.0MHz)
PARAMETER SYMBOL MIN. MAX. UNIT
Input Capacitance
C
IN
-
8 pF
Input/Output Capacitance
C
I/O
-
10 pF
Note : These parameters are guaranteed by device characterization, but not production tested.
AC TEST CONDITIONS
Input Pulse Levels 0V to 3.0V Input Rise and Fall Times 3ns Input and Output Timing Reference Levels 1.5V Output Load CL=30pF, IOH/IOL=-4mA/8mA
AC ELECTRICAL CHARACTERISTICS
(VCC = 5V±10% , TA = 0℃ to 70℃)
(1) READ CYCLE
UT6164C-10 UT6164C-12 UT6164C-15 UNIT
PARAMETER
SYMBOL
MIN. MAX. MIN. MAX. MIN. MAX.
Read Cycle Time
tRC
10
- 12 - 15 -
ns
Address Access Time
tAA
-
10 - 12 - 15
ns
Chip Enable Access Time
t
ACE
-
10 - 12 - 15
ns
Output Enable Access Time
tOE
-
5 - 6 - 7
ns
Chip Enable to Output in Low Z
t
CLZ*
2
- 3 - 4 -
ns
Output Enable to Output in Low Z
t
OLZ*
0
- 0 - 0 -
ns
Chip Disable to Output in High Z
t
CHZ*
-
5 - 6 - 7
ns
Output Disable to Output in High Z
t
OHZ*
-
5 - 6 - 7
ns
Output Hold from Address Change
tOH
3
- 3 - 3 -
ns
(2) WRITE CYCLE
UT6164C-10 UT6164C-12 UT6164C-15 UNIT
PARAMETER SYMBOL
MIN. MAX. MIN. MAX. MIN. MAX.
Write Cycle Time
tWC
10
- 12 - 15 - ns
Address Valid to End of Write
tAW
8
- 10 - 12 - ns
Chip Enable to End of Write
tCW
8
- 10 - 12 - ns
Address Set-up Time
tAS
0
- 0 - 0 - ns
Write Pulse Width
tWP
8
- 9 - 10 - ns
Write Recovery Time
tWR
0
- 0 - 0 - ns
Data to Write Time Overlap
tDW
6
- 7 - 8 - ns
Data Hold from End of Write Time
tDH
0
- 0 - 0 - ns
Output Active from End of Write
t
OW*
2
- 3 - 4 - ns
Write to Output in High Z
t
WHZ*
- 6 - 7 - 8
ns
*These parameters are guaranteed by device characterization, but not production tested.
Page 4
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
4
TIMING WAVEFORMS
READ CYCLE 1
(Address Controlled)
(1,2,4)
t
RC
Address
DOUT Data Valid
t
AA
t
OH
t
OH
READ CYCLE 2
(
1CE
CE2
and
OE
Controlled)
(1,3,5,6)
t
RC
t
AA
t
ACE1
t
ACE2
t
OE
t
CHZ1
t
CHZ2
t
OHZ
t
CLZ1
t
CLZ2
t
OH
t
OLZ
HIGH-Z
Data Valid
HIGH-Z
Address
CE1
CE2
OE
Dout
Notes :
1.
WE
is high for read cycle.
2. Device is continuously selected
1CE
=V
IL
and CE2=V
IH.
3. Address must be valid prior to or coincident with
1CE
and CE2 transition; otherwise t
AA
is the limiting parameter.
4.
OE
is low.
5. t
CLZ1
, t
CLZ2
, t
OLZ
, t
CHZ1
, t
CHZ2
and t
OHZ
are specified with CL=5pF. Transition is measured ±500mV from steady
state.
6. At any given temperature and voltage condition, t
CHZ1
is less than t
CLZ1
, t
CHZ2
is less than t
CLZ2
, t
OHZ
is less than
t
OLZ.
Page 5
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
5
WRITE CYCLE 1
(WEControlled)
(1,2,3,5)
t
WC
t
AW
t
CW1
t
AS
t
WP
t
WH
t
OW
t
DW
t
DH
t
CW2
t
WR
Address
CE1
CE2
WE
Dout
Din
Data Valid
High-Z
(4) (4)
WRITE CYCLE 2
(
1CE
CE2
Controlled)
(1,2,5)
t
WC
t
AW
t
CW1
t
AS
t
WR
t
CW2
t
WP
t
WHZ
t
DW
t
DH
Data Valid
Address
CE1
CE2
WE
Dout
Din
High-Z
Notes :
1.
WE
or
1CE
must be high or CE2 must be low during all address transitions.
2. A write occurs during the overlap of a low
1CE
, a high CE2 and a low
WE
.
3. During a
WE
controlled with write cycle with
OE
low, t
WP
must be greater than t
WHZ+tDW
to allow the I/O drivers
to turn off and data to be placed on the bus.
4. During this period, I/O pins are in the output state, and input singals must not be applied.
5. If the
1CE
low and CE2 high transition occurs simultaneously with or after
WE
low transition, the outputs remain in a high
impedance state.
6. t
OW
and t
WHZ
are specified with CL=5pF. Transition is measured ±500mV from steady state.
Page 6
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
6
PACKAGE OUTLINE DIMENSION
28 pin 300 mil SOJ Package Outline Dimension
1
28
14
15
A2
L
C
XX
X
Note:
1.
S/E/D DIM NOT INCLUDEING MOLD FLASH.
2.
THE END FLASH IN PACKAGE LENGTHWISE IS NOT MORE THAN 10 MILS EACH SIDE
UNIT
SYMBOL
INCH(BASE) MM(REF)
A 0.148 (MAX) 3.759 (MAX) A1 0.026(MIN) 0.660(MIN) A2
0.100±0.005 2.540±0.127
B 0.018 (TYP) 0.457(TYP) B1 0.028 (TYP) 0.711(TYP)
c 0.010 (TYP) 0.254 (TYP) D 0.710 (TYP) 18.034 (TYP) E 0.335(TYP) 8.509(TYP)
E1 0.3 (TYP) 7.620(TYP)
e 0.050 (TYP) 1.270 (TYP)
L
0.087±0.010 2.210±0.254 S 0.030 (TYP) 0.762 (TYP) Y 0.003(MAX) 0.076(MAX)
D
Page 7
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
7
28 pin 8x13.4mm STSOP PACKAGE OUTLINE DIMENSION
1
14 15
28
c
L
HD
D
"A"
b
E
e
12°(2x)12°(2x)
Seating Plane
y
28
15
14
1
c
A2A1
L
A
0.254
0
GAUGE PLANE
12°(2X)
12°(2X)
SEATING PLANE
"A" DATAIL VIEW
L1
Note: E dimension is not including end flash the total of both sides’ end flash is not above 0.3mm.
UNIT
SYMBOL
INCH(BASE) MM(REF)
A 0.047 (MAX) 1.20 (MAX)
A1
0.004±0.002 0.10±0.05
A2
0.039±0.002 1.00±0.05
b
0.008±0.001 0.200±0.025
c 0.005 (TYP) 0.127(TYP)
Db
0.465±0.004 11.80±0.10
E
0.315±0.004 8.00±0.10
e 0.022 (TYP) 0.55(TYP)
D
0.528±0.008 13.40±0.20
L
0.0236±0.004 0.50±0.10
L1
0.0315±0.004 0.80±0.10
y 0.003(MAX) 0.076(MAX)
Θ
0
o
5
o
0
o
5
o
H H C
H
F
C
Page 8
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
8
ORDERING INFORMATION
PART NO. ACCESS TIME (ns) PACKAGE
UT6164CJC-10 10 28 PIN SOJ UT6164CJC-12 12 28 PIN SOJ UT6164CJC-15 15 28 PIN SOJ UT6164CLS-10 10 28 PIN STSOP UT6164CLS-12 12 28 PIN STSOP UT6164CLS-15 15 28 PIN STSOP
Page 9
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
9
REVISION HISTORY
REVISION DESCRIPTION DATE
Rev. 1.0 Original Oct 15,2001
Page 10
UTRON
UT6164C
Rev. 1.0
8K X 8 BIT HIGH SPEED CMOS SRAM
UTRON TECHNOLOGY INC. P80074 1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C. TEL: 886-3-5777882 FAX: 886-3-5777919
10
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