The UT54ACS109 and the UT54ACTS109 are dual J-K positive triggered flip-flops. A low level at the preset or clear inputs
sets or resets the outputs regardless of the other input levels.
When preset and clear are inactive (high), data at the J and K
input meeting the setup time requirements are transferred to the
outputs on the positive-going edge of the clock pulse. Following
the hold time interval, data at the J and K input can be changed
without affecting the levels at the outputs. The flip-flops can
perform as toggle flip-flops by grounding K and tying J high.
They also can perform as D flip-flops if J and K are tied together.
The devices are characterized over full military temperature
range of -55 C to +125 C.
1. The output levels in this configuration are not guaranteed to meet the minimum levels for VOH if the lows at preset and clear are near V
addition, this configuration is nonstable; that is, it will not persist when either
preset or clear returns to its inactive (high) level.
1
H
maximum. In
IL
H
LOGIC SYMBOL
1
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and
IEC Publication 617-12.
PRE1
J1
CLK1
K1
CLR1
PRE2
J2
CLK2
K2
CLR2
(5)
(2)
(4)
(3)
(1)
(11)
(14)
(12)
(13)
(15)
S
J1
K1
R
C1
(6)
(7)
(10)
(9)
Q1
Q1
Q2
Q2
61 RadHard MSI Logic
Page 2
LOGIC DIAGRAM
UT54ACS109/UT54ACTS109
PRE
CLK
J
K
CLR
RADIATION HARDNESS SPECIFICATIONS
1
PARAMETERLIMITUNITS
Total Dose1.0E6rads(Si)
SEU Threshold
2
80
SEL Threshold 120
Neutron Fluence1.0E14
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
Q
Q
MeV-cm2/mg
MeV-cm2/mg
n/cm
2
SYMBOLPARAMETERLIMITUNITS
V
DD
V
I/O
T
STG
T
J
T
LS
JC
I
I
P
D
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Maximum junction temperature+175C
Lead temperature (soldering 5 seconds)+300C
Thermal resistance junction to case20C/W
Supply voltage-0.3 to 7.0V
Voltage any pin-.3 to VDD +.3V
Storage Temperature range-65 to +150C
DC input current10mA
Maximum power dissipation1W
RadHard MSI Logic 62
Page 3
UT54ACS109/UT54ACTS109
RECOMMENDED OPERATING CONDITIONS
SYMBOLPARAMETERLIMITUNITS
V
DD
V
IN
T
C
Supply voltage4.5 to 5.5V
Input voltage any pin0 to V
DD
Temperature range-55 to + 125C
V
63 RadHard MSI Logic
Page 4
UT54ACS109/UT54ACTS109
DC ELECTRICAL CHARACTERISTICS
7
(VDD = 5.0V 10%; VSS = 0V 6, -55 C < TC < +125 C)
SYMBOLPARAMETERCONDITIONMINMAXUNIT
V
IL
Low-level input voltage
ACTS
ACS
V
IH
High-level input voltage
ACTS
ACS
I
IN
Input leakage current
ACTS/ACSVIN = V
V
OL
Low-level output voltage
ACTS
ACS
V
OH
High-level output voltage
ACTS
ACS
I
OS
Short-circuit output current
ACTS/ACS
1
0.8
.3V
DD
1
.5V
DD
.7V
DD
or V
DD
3
I
= 8.0mA
OL
I
= 100 A
OL
3
I
= -8.0mA
OH
I
= -100 A
OH
2 ,4
VO = VDD and V
SS
SS
-1
.7V
DD
VDD - 0.25
-200200mA
1A
0.40
0.25
V
V
V
V
I
OLOutput current
(Sink)
I
OH
Output current
(Source)
P
total
I
DDQ
I
DDQ
Power dissipation
Quiescent Supply CurrentVDD = 5.5V10A
Quiescent Supply Current Delta
ACTS
C
INInput capacitance
C
OUTOutput capacitance
10
VIN = VDD or V
SS
8mA
VOL = 0.4V
10
VIN = VDD or V
SS
-8mA
VOH = VDD - 0.4V
2, 8 ,9
CL = 50pF2.0mW/
MHz
For input under test
1.6mA
VIN = VDD - 2.1V
For all other inputs
VIN = VDD or V
V
= 5.5V
DD
5
5
= 1MHz @ 0V15pF
= 1MHz @ 0V15pF
SS
RadHard MSI Logic 64
Page 5
UT54ACS109/UT54ACTS109
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%,
- 50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but
are guaranteed to VIH(min) and VIL(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density 5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed
3,765 pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS
at frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose 1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
65 RadHard MSI Logic
Page 6
UT54ACS109/UT54ACTS109
AC ELECTRICAL CHARACTERISTICS
(VDD = 5.0V 10%; VSS = 0V 1, -55 C < TC < +125 C)
2
SYMBOLPARAMETER MINIMUMMAXIMUMUNIT
t
PHL
t
PLH
t
PLH
t
PHL
t
PHL
t
PLH
f
MAX
t
SU1
CLK to Q, Q527ns
CLK to Q, Q423ns
PRE to Q116ns
PRE to Q119ns
CLR to Q219ns
CLR to Q216ns
Maximum clock frequency62MHz
PRE or CLR inactive
5ns
Setup time before CLK
t
SU2
t
H
t
W
Data setup time before CLK5ns
3
Data hold time after CLK 3ns
Minimum pulse width
8ns
PRE or CLR low
CLK high
CLK low
Notes:
1. Maximum allowable relative shift equals 50mV.
2. All specifications valid for radiation dose 1E6 rads(Si).
3. Based on characterization, hold time (tH) of 0ns can be assumed if data setup time (t
) is >10ns. This is guaranteed, but not tested.
SU2
RadHard MSI Logic 66
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