•New miniature package / thin, high reliability package
•Operation down to 3.5V
•CMOS for optimum stability, quality, and cost
Applications
•Solid state switch
•Limit switch
•Current limit
•Interrupter
Ordering Information
Part No. Temperature Suffix Package Temperature Range
US5781 E SO or UA -40°C to 85°C Extended
US5781 L SO or UA -40°C to 150°C Automotive
Preliminary
Functional Diagram
SO Package
Pin 1 - V
DD
Pin 2 - Output
Pin 3 - GND
Output
V
DD
Voltage
Regulator
Chopper
GND
UA Package
Pin 1 - V
DD
Pin 2 - GND
Pin 3 - Output
Note: This is a static-sensitive device; please observe ESD precautions. Reverse VDD protection is not included. For reverse voltage
protection, a 100Ω resistor in series with VDD is recommended.
Description
The US5781 is a unipolar Hall effect sensor IC fabricated from mixed signal CMOS technology. It incorporates advanced chopper stabilization techniques to provide accurate and stable magnetic
switch points. There are many applications for this
sensor in addition to those listed above. The design, specifications and performance have been
optimized for applications of solid state switches.
The output transistor will be switched on (BOP) in
the presence of a sufficiently strong South pole
magnetic field facing the marked side of the package. Similarly, the output will be switched off (BRP)
in the presence of a weaker South field and remain
off with “0” field. The SOT-23 device is reversed
from the UA package. The SOT-23 output transistor will be switched on (BOP) in the presence of a
sufficiently strong North pole magnetic field subjected to the marked face.
DC operating parameters: TA = -40 to 150oC, VDD = 12VDC (unless otherwise specified).
ParameterSymbolTest ConditionsMinTypMaxUnits
Supply Voltage VDD Operating 3.5 24 V
Supply Current IDD B<BRP 0.5 2.5 5.0 mA
Saturation Voltage V
Output Leakage I
Output Rise Time tr VDD = 12V, RL = 1.1KÙ, CL = 20pf 0.04 ì s
Output Fall Time tf VDD = 12V, RL = 1.1KÙ, CL = 20pf 0.18 ì s
I
DS(on)
B<BRP, V
OFF
OUT
= 20 mA, B>BOP 0.3 0.5 V
= 27V 0.01 5.0 ì A
OUT
US5781 Magnetic Specifications
Magnetic operating parameters: TA = -40 to 150oC, VDD =12 VDC (unless otherwise specified).
Parameter Symbol Test Conditions Min Typ Max Units
Operating Point BOP 7.0 12.0 15.0 mT
Release Point BRP 3.5 7.0 10.0 mT
Hysteresis B
Note: 1 mT = 10 Gauss.
2.0 5.0 7.0 mT
hys
Melexis Inc. reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Melexis does
not assume any liability arising from the use of any product or application of any product or circuit described herein.
The chopper stabilized amplifier uses switched
capacitor techniques to eliminate the amplifier offset voltage, which, in bipolar devices, is a major
source of temperature sensitive drift. CMOS
makes this advanced technique possible. The
CMOS chip is also much smaller than a bipolar
chip, allowing very sophisticated circuitry to be
placed in less space. The small chip size also
contributes to lower physical stress and less
power consumption.
Installation Comments
Consider temperature coefficients of Hall IC and
magnetics, as well as air gap life time variations.
Observe temperature limits during wave soldering.
Applications
If reverse supply protection is desired, use a resistor in series with the VDD pin. The resistor will
limit the supply current (Fault), IDD, to 50 mA. For
severe EMC conditions, use the application circuit
on this page.
CMOS High Sensitivity Switch
Preliminary Datasheet
Automotive and Severe
Environment Protection
Circuit
R1 100
Ω
D1
Supply
Voltage
Z1
C1
4.7nF
US5781
V
DD
R
L
1.2K
Hall IC
OUT
C2
4.7nF
V
SS
Two Wire Current Biasing Circuit
R
Iout
L
Hall
IC
Absolute Maximum Ratings
I
IN
V
DD
DD
I
R
b
Supply Voltage (Operating), VDD 3.5V to 24V
Supply Current (Fault), IDD 50mA
Output Voltage, V
Output Current (Fault), I
Power Dissipation, PD 100mW
Operating Temperature Range, TA -40 to 150°C
3.5V to 24V
OUT
50mA
OUT
The resistors Rb and RL can be used to bias the input
current, Iin. Refer to the part specification for limiting
values. This circuit will help in getting the precise ON
and OFF currents desired.
BRP = Ioff = (VDD / Rb + I
BOP = Ion = (Ioff + VDD / RL )
)
DD
Storage Temperature Range, TS -65 to 150°C
Maximum Junction Temp, TJ 175°C
ESD Sensitivity (All Pins) +/- 2KV
3.) Do not bend leads within 1mm
of lead to package
interface.
4.) Package dimensions exclude
molding flash
5.) Tolerance is 0.254mm unless
otherwise specified
2.57
2.51
0.41
0.35
5
Typical
o
Typical
0.38
Typical
(see note 3)
UA Hall Plate / Chip Location
2.13
1.87
1.53
1.27
o
45
Marked
Surface
All Dimensions in millimeters
* MARKING:
Line 1:
1st digit (U)= Supplier (Melexis)
15.5
14.5
2nd and 3rd digits (57) = Series (5780)
Line 2:
1st digit (1)= Year (2001)
2nd and 3rd digits(15) = Week of Year
PINOUT:
Pin 1V
Pin 2GND
Pin 3Output
DD
0.45
0.41
SOT-23 Hall Plate / Chip LocationSOT-23 Package Dimensions
3.00
2.60
0.50
0.35
57104
1.70
3.10
2.70
* MARKING:
1st & 2nd Digit (57) = Series (5780)
0.20
MIN
3rd Digit(1) = Year - 2001
Last Digits (04) = Week of Year
*
1.80
0.10
0.00
1.50
0.90
0.70
1.30
1.00
chip
0.66
0.56
NOTES:
1.) Controlling dimension: mm
2.) Lead thickness after solder plating will
be 0.254 mm maximum
0.25
3.) Package dimensions exclude molding
0.102.10
flash
4.) The end flash shall not exceed 0.127mm
on each side of package
5.) Tolerance is 0.254mm unless otherwise
specified
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