Datasheet UPG153TB-E3 Datasheet (NEC)

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Page 1

DATA SHEET

GaAs INTEGRATED CIRCUIT

µµµµ

PG153TB

L-BAND SPDT SWITCH

DESCRIPTION

The µPG153TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system.

FEATURES

• Low Insertion Loss : L

• High Linearity Switching: P

INS

= 0.7 dB TYP. @V

in (1 dB)

= +33.0 dBm TYP. @V

• Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)

CONT

= +3.0 V/0 V, f = 2 GHz

CONT

= +3.0 V/0 V, f = 2 GHz

APPLICATIONS

• L, S-band digital cellular or cordless telephone

• PCS, WLAN, and WLL applications

ORDERING INFORMATION

Part Number Marking Package Supplying Form

PG153TB-E3 G1J 6-pin super minimold Embossed tape 8 mm wide.

Pin 1, 2, 3 face to tape perf oration side. Qty 3 kp/reel.

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PG153TB)

ABSOLUTE MAXIMUM RATINGS (TA = +25°C)

Parameter Symbol Ratings Unit Control Voltage 1, 2 V Input Power P Total Power Dissipat i on P Operating Temperature T Storage Temperature T

Condition 2.5 ≤ | V

Note

CONT1

CONT1, 2

– V

tot

stg

CONT2

–6.0 to +6.0

–45 to +85 °C

–55 to +150 °C

| ≤ 6.0 V

Note

+33 dBm

0.15 W

Remarks 1.

Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, T Operation in excess of any one of these parameters may result in permanent damage.

Caution The IC must be handled with care to prevent static discharge because its circuit is composed of

GaAs MES FET.

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.

Document No. P13632EJ2V0DS00 (2nd edition) Date Published September 1999 N CP(K) Printed in Japan

The mark shows major revised points.

= +85°C

1998, 1999©

Page 2

µµµµ

PG153TB

PIN CONNECTIONS

Pin No. Connection Pin No. Connection

1OUT14V

CONT2

2GND5 IN 3OUT26V

CONT1

RECOMMENDED OPERATING CONDITIONS (TA = +25°C)

Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (Low) V Control Voltage (High) V

CONT

–0.2 0 +0.2 V +2.5 +3.0 +5.3 V

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, TA = +25°C, V

CONT1

Off chip DC blocking capacitors value; 51 pF)

Parameter S ymbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss L

INS

Isolation ISL

Input Return Loss RL Output Return Loss RL Input Power at 0.1 dB

Compression Point Input Power at 1 dB

Compression Point

Note 2

Switching Speed t Control Current I

in (0.1 dB)

in (1 dB)

CONT

f = 100 M to 1.0 GHz f = 2.0 GHz f = 2.5 GHz f = 100 M to 2.0 GHz 10 13 f = 1.0 GHz 15 18.5 f = 2.5 GHz

f = 100 M to 2.0 GHz 11 15

out

f = 100 M to 2.0 GHz 11 15 f = 2.0 GHz

f = 2.0 GHz 31 33

= 3 V, V

CONT

= 3 V/0 V

CONT2

= 0 V or V

(Top View) (Bottom View)

3 4

2 5

CONT1

G1J

= 0 V, V

1 6

−

CONT2

0.50 0.65

0.70 0.90

0.90

4 3

5 2

6 1

= 3 V, ZO = 50 Ω,

Note 1

−

Note 1

−

30 20 50

−

dB dB

dBm

Notes 1.

Characteristic for reference at f = 2.0 to 2.5 GHz

in (0.1 dB)

1 dB than that of linear range. All other characteristics are measured in linear range.

Cautions 1. When the

No. 3 (OUT2) and No. 5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF.

2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters.

in (1 dB)

or P

is measured the input power level when the insertion loss increases more 0.1 dB or

PG153TB is used, it is necessary to use DC blocking capacitors for No. 1 (OUT1),

µµµµ

Data Sheet P13632EJ2V0DS00

Page 3

TYPICAL CHARACTERISTICS (ON)

CONT

TEST CONDITIONS: V

= 3 V/0 V, Pin = 0 dBm, TA = +25 °C

µµµµ

PG153TB

IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY

CH1 S

(dB)

Input Return Loss RL

MARKER 1 1 GHz

–10 –20 –30 –40

START 0.300 000 000 GHz

10 dB/REF 0 dB

Frequency f (GHz)

OUT1 OUT2

50 Ω

STOP 3.300 000 000 GHz

1: –22.622 dB

1 GHz

2: –28.228 dB

1.5 GHz

3: –27.318 dB

2 GHz

4: –18.235 dB

2.5 GHz

IN-OUT1 ISOLATION vs. FREQUENCY

CH1 S12log MAGlog MAG 10 dB/REF 0 dB

MARKER 1 1 GHz

–10

Isolation ISL (dB)

–20 –30 –40

START 0.300 000 000 GHz

Frequency f (GHz)

1: –18.937 dB

1 GHz

2: –15.032 dB

1.5 GHz

3: –12.119 dB

2 GHz

4: –10.675 dB

2.5 GHz

STOP 3.300 000 000 GHz

IN-OUT1 INSERTION LOSS vs. FREQUENCY

CH1 S21log MAG 1 dB/REF 0 dB

1: –0.764 dB

1 GHz

2: –0.957 dB

1.5 GHz

3: –1.215 dB

2 GHz

4: –1.516 dB

2.5 GHz

(dB)

INS

Insertion Loss L

MARKER 1 1 GHz

–1 –2 –3 –4

START 0.300 000 000 GHz

STOP 3.300 000 000 GHz

Frequency f (GHz)

Caution This data is including loss of the test fixture.

IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY

CH1 S22log MAG 10 dB/REF 0 dB

1: –24.057 dB 2: –37.231 dB

(dB)

out

Output Return Loss RL

MARKER 1 1 GHz

–10 –20 –30 –40

START 0.300 000 000 GHz

STOP 3.300 000 000 GHz

Frequency f (GHz)

3: –25.963 dB 4: –19.332 dB

1 GHz

1.5 GHz 2 GHz

2.5 GHz

Data Sheet P13632EJ2V0DS00

Page 4

TYPICAL CHARACTERISTICS (OFF)

CONT

TEST CONDITIONS: V

= 3 V/3 V, Pin = 0 dBm, TA = +25 °C

µµµµ

PG153TB

IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY

CH1 S11log MAG 10 dB/REF 0 dB

(dB)

Input Return Loss RL

MARKER 1 1 GHz

–10 –20 –30 –40

START 0.300 000 000 GHz

Frequency f (GHz)

OUT1 OUT2

50 Ω

STOP 3.300 000 000 GHz

1: –10.653 dB

1 GHz

2: –11.354 dB

1.5 GHz

3: –11.745 dB

2 GHz

4: –11.111 dB

2.5 GHz

IN-OUT1 INSERTION LOSS vs. FREQUENCY

CH1 S21log MAG 10 dB/REF 0 dB

1: –4.066 dB

1 GHz

2: –4.072 dB

1.5 GHz

(dB)

INS

Insertion Loss L

MARKER 1 1 GHz

–10 –20 –30 –40

START 0.300 000 000 GHz

Frequency f (GHz)

STOP 3.300 000 000 GHz

3: –4.130 dB

2 GHz

4: –4.382 dB

2.5 GHz

Caution This data is including loss of the test fixture.

IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY

CH1 S22log MAG 10 dB/REF 0 dB

1: –12.642 dB 2: –12.038 dB

(dB)

out

Output Return Loss RL

MARKER 1 1 GHz

–10 –20 –30 –40

START 0.300 000 000 GHz

Frequency f (GHz)

3: –11.728 dB 4: –12.291 dB

STOP 3.300 000 000 GHz

1 GHz

1.5 GHz 2 GHz

2.5 GHz

Data Sheet P13632EJ2V0DS00

Page 5

TEST CIRCUIT

µµµµ

PG153TB

= +25°C, V

CONT1

= +3 V, V

CONT2

= 0 V or V

CONT1

= 0 V, V

CONT2

= +3 V, f = 2 GHz, ZO = 50

Ω

Off chip DC blocking capacitors value: C0 = 51 pF, C1 = 1 000 pF (Bypass), using NEC standard evaluation board

OUT1 OUT2

C0C0

321

G1J

456

CONT2INVCONT1

EVALUATION BOARD

OUT1

CONT1

OUT2

CONT2

Data Sheet P13632EJ2V0DS00

Page 6

TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE

CONT1

CONT1(H)

CONT(L)

µµµµ

PG153TB

CONT2

Note

CONT(H)

CONT(L)

In case of V

CONT1

= V

input signal of IN (Pin 5) is output from OUT1 (Pin 1) and OUT2 (Pin 3).

PACKAGE DIMENSIONS

6 PIN MINIMOLD (Unit: mm)

CONT2

0.2

= High or V

+0.1 –0

CONT1

OUT1

OUT2

= V

Note

OUT1

OUT2

OUT1

OUT2

CONT2

= Low, (that is same control voltage for both pins),

0.15

+0.1 –0

OUT1

OUT2

0.1 MIN.

Note

2.1 ±0.1

1.25 ±0.1

0.65 0.65

1.3

2.0 ±0.2

0 to 0.1

0.7

0.9 ±0.1

Data Sheet P13632EJ2V0DS00

Page 7

µµµµ

PG153TB

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering method and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Conditions Recommended Condition Symbol

Infrared Reflow Package peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C) Count: 3, Exposure limi t: None

VPS Package peak temperature: 215° C or bel ow

Time: 40 seconds or less (at 200°C) Count: 3, Exposure limi t: None

Wave Soldering Soldering bath temperature: 260°C or below

Time: 10 seconds or less Count: 1, Exposure limi t: None

Partial Heating Pin temperature: 300°C

Time: 3 seconds or less (per pi n row) Exposure limit: None

After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Note

Caution Do not use different soldering methods together (except for partial heating).

IR35-00-3

VP15-00-3

WS60-00-1

–

Data Sheet P13632EJ2V0DS00

Page 8

µµµµ

PG153TB

Caution

The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal.

• The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.

M7 98. 8