The mPD784021 is a product of the mPD784026 sub-series in the 78K/IV series. It contains various peripheral
hardware such as RAM, I/O ports, 8-bit resolution A/D and D/A converters, timers, serial interface, and interrupt
functions, as well as a high-speed, high-performance CPU.
m
PD784021 is a ROM-less product of the mPD784025 or mPD784026.
The
m
PD784020 differs from the mPD784021 only in its RAM size: 512 bytes are allocated for the mPD784020,
The
while 2048 bytes are allocated for the
For specific functions and other detailed information, consult the following user’s manual.
P00-P07: Port 0A8-A19: Address bus
P10-P17: Port 1RD: Read strobe
P20-P27: Port 2WR: Write strobe
P30-P37: Port 3WAIT: Wait
P60-P63, P66, P67 : Port 6HLDRQ: Hold request
P70-P77: Port 7HLDAK: Hold acknowledge
TO0-TO3: Timer outputASTB: Address strobe
CI: Clock inputREFRQ: Refresh request
RxD, RxD2: Receive dataRESET: Reset
TxD, TxD2: Transmit dataX1, X2: Crystal
SCK0-SCK2: Serial clockANI0-ANI7: Analog input
ASCK, ASCK2: Asynchronous serial clockANO0, ANO1 : Analog output
SI0-SI2: Serial inputAV
SO0-SO2: Serial outputAV
SB0: Serial busAV
PWM0, PWM1: Pulse width modulation outputV
NMI: Non-maskable interruptV
INTP0-INTP5: Interrupt from peripheralsTEST: Test
AD0-AD7: Address/data bus
REF1-AVREF3 : Reference voltage
DD: Analog power supply
SS: Analog ground
DD: Power supply
SS: Ground
9
Page 10
4. SYSTEM CONFIGURATION EXAMPLE (PPC)
µ
PD784021
mm
m
PD784020, 784021
mm
Serial
communication
µ
PD27C1001A
O0-O7
A0-A7
Sensing paper transport
Temperature of the
fusing heater
Brightness of the lamp
Lever for adjusting
the tone of the copy
Lever for compensating
the tone of the copy
µ
PD74HC573
Reset
circuit
Latch
RxD
TxD
RDOE
A17CE
A8-A16A8-A16
AD0-AD7
ASTB
INTP0
ANI0
ANI1
ANI2
ANI3
RESET
P11
P15
P16
P17
SCK1
SI1
SO1
P04
P06
P07
P66
PWM0
P00-P03
P33
P34
P35
P36
P37
Sensing paper
Sensing paper feed
Sensing paper ejection
Sensing the position of the scanner station
Operator
panel
High-voltage
control circuit
Fusing heater
control circuit
Lamp regulator
Driver
Drum, toner, and charge for
transfer
Fusing roller
Lamp for lighting the original
Lamp for discharging
(DC stepping motor)
Solenoid
Main motor
M
Clutch for stopping
SL
the scanner station
Clutch for forwarding
SL
the scanner station
Clutch for the resist
SL
shutter
Clutch for manual
SL
feeding
Clutch for cassette
SL
feeding
10
Page 11
5. BLOCK DIAGRAM
mm
m
PD784020, 784021
mm
NMI
INTP0-INTP5
INTP3
TO0
TO1
INTP0
INTP1
INTP2/CI
TO2
TO3
P00-P03
P04-P07
PWM0
PWM1
Programmable
interrupt controller
Timer/counter 0
(16 bits)
Timer/counter 1
(16 bits)
Timer/counter 2
(16 bits)
Timer 3
(16 bits)
Real-time output
port
PWM
78K/IV
CPU core
RAM
UART/IOE2
Baud-rate
generator
UART/IOE1
Baud-rate
generator
Clocked serial
interface
Bus interface
Port 0
Port 1
Port 2
RxD/SI1
TxD/SO1
ASCK/SCK1
RxD2/SI2
TxD2/SO2
ASCK2/SCK2
SCK0
SO0/SB0
SI0
ASTB
AD0-AD7
A8-A15
A16-A19
RD
WR
WAIT/HLDRQ
REFRQ/HLDAK
P00-P07
P10-P17
P20-P27
ANO0
ANO1
AV
REF2
AV
REF3
ANI0-ANI7
AV
DD
AV
REF1
AV
INTP5
SS
D/A converter
A/D converter
Watchdog timer
Remark The internal ROM or RAM capacity differs for each product.
Ý 8-bit I/O port
Ý Functions as a real-time output port (4 bits ¥ 2).
Ý Inputs and outputs can be specified bit by bit.
Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Ý Can drive a transistor.
Port 1 (P1):
Ý 8-bit I/O port
Ý Inputs and outputs can be specified bit by bit.
Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Ý Can drive LED.
Port 2 (P2):
Ý 8-bit input-only port
Ý P20 does not function as a general-purpose port (nonmaskable inter-
rupt). However, the input level can be checked by an interrupt service
routine.
Ý The use of the pull-up resistors can be specified by software for pins
P22 to P27 (in units of 6 bits).
Ý The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 output pin by
CSIM1.
Port 3 (P3):
Ý 8-bit I/O port
Ý Inputs and outputs can be specified bit by bit.
Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Port 6 (P6):
Ý P60 to P63 are an output-only port.
Ý Inputs and outputs can be specified bit by bit for pins P66 and P67.
Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Port 7 (P7):
Ý 8-bit I/O port
Ý Inputs and outputs can be specified bit by bit.
12
Page 13
mm
m
PD784020, 784021
mm
6.2 NON-PORT PINS (1/2)
PinI/ODual-functionFunction
TO0-TO3OutputP34-P37Timer output
CIInputP23/INTP2Input of a count clock for timer/counter 2
RXDInputP30/SI1Serial data input (UART0)
RXD2P13/SI2Serial data input (UART2)
TXDOutputP31/SO1Serial data output (UART0)
TXD2P14/SO2Serial data output (UART2)
ASCKInputP25/INTP4/SCK1Baud rate clock input (UART0)
ASCK2P12/SCK2Baud rate clock input (UART2)
SB0I/OP33/SO0Serial data I/O (SBI)
SI0InputP27Serial data input (3-wire serial I/O0)
SI1P30/RXDSerial data input (3-wire serial I/O1)
SI2P13/RXD2Serial data input (3-wire serial I/O2)
SO0OutputP33/SB0Serial data output (3-wire serial I/O0)
SO1P31/TXDSerial data output (3-wire serial I/O1)
SO2P14/TXD2Serial data output (3-wire serial I/O2)
SCK0I/OP32Serial clock I/O (3-wire serial I/O0, SBI)
SCK1P25/INTP4/ASCKSerial clock I/O (3-wire serial I/O1)
SCK2P12/ASCK2Serial clock I/O (3-wire serial I/O2)
NMIInputP20
INTP0P21Ý Input of a count clock for timer/counter 1
INTP1P22Ý Input of a count clock for timer/counter 2
INTP2P23/CIÝ Input of a count clock for timer/counter 2
INTP3P24Ý Input of a count clock for timer/counter 0
INTP4P25/ASCK/SCK1—
INTP5P26
AD0-AD7I/O—Time multiplexing address/data bus (for connecting external memory)
A8-A15Output—High-order address bus (for connecting external memory)
A16-A19OutputP60-P63
RDOutput—Strobe signal output for reading the contents of external memory
WROutput—Strobe signal output for writing on external memory
WAITInputP66/HLDRQWait signal insertion
REFRQOutputP67/HLDAKRefresh pulse output to external pseudo static memory
HLDRQInputP66/WAITInput of bus hold request
HLDAKOutputP67/REFRQOutput of bus hold response
ASTBOutput—Latch timing output of time multiplexing address (A0-A7) (for
External interrupt request
Ý Capture/trigger signal for CR11 or CR12
Ý Capture/trigger signal for CR22
Ý Capture/trigger signal for CR21
Ý Capture/trigger signal for CR02
Input of a conversion start trigger for A/D converter
High-order address bus during address expansion (for connecting external memory)
connecting external memory)
—
13
Page 14
mm
m
PD784020, 784021
mm
6.2 NON-PORT PINS (2/2)
PinI/ODual-functionFunction
RESETInput—Chip reset
X1Input—Crystal input for system clock oscillation (A clock pulse can also be
X2—
ANI0-ANI7InputP70-P77Analog voltage inputs for the A/D converter
ANO0, ANO1Output—Analog voltage inputs for the D/A converter
AVREF1——Application of A/D converter reference voltage
AVREF2, AVREF3
AVDDPositive power supply for the A/D converter
AVSSGround for the A/D converter
VDDPositive power supply
VSSGround
TESTDirectly connect to VSS. (The TEST pin is for the IC test.)
input to the X1 pin.)
Application of D/A converter reference voltage
14
Page 15
mm
m
PD784020, 784021
mm
6.3 I/O CIRCUITS FOR PINS AND HANDLING OF UNUSED PINS
Table 6-1 describes the types of I/O circuits for pins and the handling of unused pins.
Fig. 6-1 shows the configuration of these various types of I/O circuits.
Table 6-1 Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)
PinI/O circuit typeI/ORecommended connection method for unused pins
P00-P075-AI/OInput state : To be connected to VDD
P10/PWM0Output state: To be left open
P11/PWM1
P12/ASCK2/SCK28-A
P13/RxD2/SI25-A
P14/TxD2/SO2
P15-P17
P20/NMI2InputTo be connected to VDD or VSS
P21/INTP0
P22/INTP12-ATo be connected to VDD
P23/INTP2/CI
P24/INTP3
P25/INTP4/ASCK/SCK18-AI/OInput state : To be connected to VDD
Output state: To be left open
P26/INTP52-AInputTo be connected to VDD
P27/SI0
P30/RxD/SI15-AI/OInput state : To be connected to VDD
P31/TxD/SO1Output state: To be left open
P32/SCK08-A
P33/SO0/SB010-A
P34/TO0-P37/TO35-A
AD0-AD7
A8-A15Output
P60/A16-P63/A19
RD
WR
Note
To be left open
P66/WAIT/HLDRQI/OInput state : To be connected to VDD
P67/REFRQ/HLDAKOutput state: To be left open
P70/ANI0-P77/ANI720Input state : To be connected to VDD or VSS
Output state: To be left open
ANO0, ANO112OutputTo be left open
ASTB4
Note These pins function as output-only pins depending on the internal circuit, though their I/O type is 5-A.
15
Page 16
mm
m
PD784020, 784021
mm
Table 6-1 Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)
PinI/O circuit typeI/ORecommended connection method for unused pins
RESET2Input—
TEST1To be connected to VSS directly
AVREF1-AVREF3—To be connected to VSS
AVSS
AVDDTo be connected to VDD
Caution When the I/O mode of an I/O dual-function pin is unpredictable, connect the pin to VDD through
a resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher
than that of the low level input at power-on or when I/O is switched by software).
Remark Since type numbers are consistent in the 78K series, those numbers are not always serial in each product.
(Some circuits are not included.)
16
Page 17
Fig. 6-1 I/O Circuits for Pins
mm
m
PD784020, 784021
mm
Type 1Type 2-A
IN
Type 2
IN
Schmitt trigger input with hysteresis characteristics
Type 4
Data
DD
V
P
N
Type 5-A
DD
V
P
OUT
Output
disable
N
Push-pull output which can output high impedance
(both the positive and negative channels are off.)
Type 8-A
VDD
Type 12
V
DD
P
IN
Schmitt trigger input with hysteresis characteristics
V
Pull-up
enable
Data
Output
disable
Input
enable
DD
V
P
N
Pull-up
enable
DD
P
IN/OUT
Pull-up
enable
Output
disable
Type 10-A
Pull-up
enable
Open
drain
Output
disable
Data
Data
VDD
P
P
IN/OUT
N
Type 20
V
DD
P
V
DD
P
IN/OUT
N
Input
enable
Analog output
voltage
Data
Output
disable
Comparator
(Threshold voltage)
P
OUT
N
V
DD
P
IN/OUT
N
+
–
V
REF
P
N
17
Page 18
mm
m
PD784020, 784021
mm
7. CPU ARCHITECTURE
7.1 MEMORY SPACE
A 1M-byte memory space can be accessed. By using a LOCATION instruction, the mode for mapping internal
data areas (special function registers and internal RAM) can be selected. A LOCATION instruction must always be
executed after a reset, and can be used only once.
(1) When the LOCATION 0 instruction is executed
m
Internal data areas are mapped to 0FD00H-0FFFFH for the
(2) When the LOCATION 0FH instruction is executed
Internal data areas are mapped to FFD00H-FFFFFH for the
PD784020 and 0F700H-0FFFFH for the mPD784021.
m
PD784020 and FF700H-FFFFFH for the mPD784021.
18
Page 19
mm
m
PD784020, 784021
mm
Note
(256 bytes)
Internal RAM
Special function registers (SFRs)
When the LOCATION 0FH
instruction is executed
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
HH
HH
H
FFEFFH
FFE80H
PD784020 Memory Map
mm
mm
m
Fig. 7-1
General-purpose
0FEFFH
0FE80H
(512 bytes)
FFD00H
FFCFFH
FFE7FH
FFE2FH
registers
(128 bytes)
FFE06H
Macro service control
0FE7FH
0FE2FH
0FE06H
FFD00H
Data area (512 bytes)
word area (42 bytes)
0FD00H
External memory
(1,047,808 bytes)
00FFFH
00FFFH
10000H
0FFFFH
00000H
00800H
007FFH
00080H
0007FH
CALLF entry area
(2K bytes)CALLT table area
00800H
007FFH
00080H
0007FH
(64 bytes)
Vector table area
(64 bytes)
00040H
0003FH
00000H
External memory
(960K bytes)
When the LOCATION 0
instruction is executed
FFFFFH
10000H
(256 bytes)
Internal RAM
(512 bytes)
Special function registers (SFRs)
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0FD00H
0FCFFH
00000H
Note
External memory
(64,768 bytes)
Note Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
19
Page 20
(256 bytes)
Internal RAM
(2,048 bytes)
Special function registers (SFRs)
When the LOCATION 0FH
instruction is executed
External memory
(1,046,272 bytes)
mm
m
PD784020, 784021
mm
Note
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF700H
FFEFFH
FFE80H
General-purpose
PD784021 Memory Map
mm
mm
m
Fig. 7-2
registers
0FEFFH
0FE80H
FF6FFH
FFE7FH
FFE2FH
(128 bytes)
0FE7FH
0FE2FH
FFE06H
Macro service control
0FE06H
FFD00H
FFCFFH
FF700H
Program/data area
(1,536 bytes)
Data area (512 bytes)
word area (42 bytes)
0FD00H
0FCFFH
0F700H
00FFFH
00FFFH
00800H
CALLF entry area
00800H
Note
10000H
0FFFFH
007FFH
00080H
0007FH
(2K bytes)CALLT table area
007FFH
00080H
0007FH
00000H
(64 bytes)
Vector table area
(64 bytes)
00040H
0003FH
00000H
20
External memory
(960K bytes)
When the LOCATION 0
instruction is executed
FFFFFH
(256 bytes)
Internal RAM
(2,048 bytes)
Special function registers (SFRs)
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0FD00H
0FCFFH
0F700H
0F6FFH
External memory
(63,232 bytes)
00000H
Note Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
Page 21
mm
m
PD784020, 784021
mm
7.2 CPU REGISTERS
7.2.1 General-Purpose Registers
A set of general-purpose registers consists of sixteen general-purpose 8-bit registers. Two 8-bit general-purpose
registers can be combined to form a 16-bit general-purpose register. Moreover, four 16-bit general-purpose registers,
when combined with an 8-bit register for address extension, can be used as 24-bit address specification registers.
Eight banks of this register set are provided. The user can switch between banks by software or the context
switching function.
General-purpose registers other than the V, U, T, and W registers used for address extension are mapped onto
internal RAM.
Fig. 7-3 General-Purpose Register Format
A (R1)X (R0)
AX (RP0)
B (R3)C (R2)
BC (RP1)
R5R4
RP2
R7R6
RP3
V
VVP (RG4)
U
UUP (RG5)
T
TDE (RG6)
WL (R14)
WHL (RG7)
The character strings enclosed in
parentheses represent absolute names.
R9R8
VP (RP4)
R11R10
UP (RP5)
D (R13)E (R12)
DE (RP6)
H (R15)
HL (RP7)
8 banks
Caution By setting the RSS bit of PSW to 1, R4, R5, R6, R7, RP2, and RP3 can be used as the X, A, C, B,
AX, and BC registers, respectively. However, this function must be used only when using
programs for the 78K/III series.
21
Page 22
mm
m
PD784020, 784021
mm
7.2.2 Control Registers
(1) Program counter (PC)
This register is a 20-bit program counter. The program counter is automatically updated by program execution.
Fig. 7-4 Format of Program Counter (PC)
190
PC
(2) Program Status Word (PSW)
This register holds the CPU state. The program status word is automatically updated by program execution.
Fig. 7-5 Format of Program Status Word (PSW)
15141312
PSWH
PSW
PSWL
Note This flag is used to maintain compatibility with the 78K/III series. This flag must be set to 0 when programs
for the 78K/III series are being used.
(3) Stack pointer (SP)
This register is a 24-bit pointer for holding the start address of the stack. The high-order 4 bits must be set
to 0.
PC0000
UFRBS2RBS1RBS0
76543210
Note
SZRSS
Fig. 7-6 Format of Stack Pointer (SP)
23200
ACIEP/V0CY
111098
22
Page 23
mm
m
PD784020, 784021
mm
7.2.3 Special Function Registers (SFRs)
The special function registers are registers with special functions such as mode registers and control registers
for built-in peripheral hardware. The special function registers are mapped onto the 256-byte space between 0FF00H
Note
and 0FFFFH
Note Applicable when the LOCATION 0 instruction is executed. FFF00H-FFFFFH when the LOCATION 0FH
Caution Never attempt to access addresses in this area where no SFR is allocated. Otherwise, the
Table 7-1 lists the special function registers (SFRs). The titles of the table columns are explained below.
.
instruction is executed.
mm
m
PD784021 may be placed in the deadlock state. The deadlock state can be cleared only by a
mm
reset.
• Abbreviation ................... Symbol used to represent a built-in SFR. The abbreviations listed in the table are
reserved words for the NEC assembler (RA78K4). The C compiler (CC78K4) allows
the abbreviations to be used as sfr variables of bit type with the #pragma sfr command.
R/W : Allows both read and write operations.
R: Allows read operations only.
W: Allows write operations only.
• Manipulatable bits .......... Indicates the maximum number of bits that can be manipulated whenever an SFR is
manipulated. An SFR that supports 16-bit manipulation can be described in the sf r
operand. For address specification, an even-numbered address must be specified.
An SFR that supports 1-bit manipulation can be described in a bit manipulation
instruction.
• When reset ..................... Indicates the state of each register when RESET is applied.
H
23
Page 24
Table 7-1 Special Function Registers (SFRs) (1/4)
mm
m
PD784020, 784021
mm
Note
Address
0FF00HPort 0P0R/Wll –Undefined
0FF01HPort 1P1ll –
0FF02HPort 2P2Rll –
0FF03HPort 3P3R/Wll –
0FF06HPort 6P6ll –00H
0FF07HPort 7P7ll –Undefined
0FF0EHPort 0 buffer register L P0Lll –
0FF0FHPort 0 buffer register HP0Hll –
0FF10HCompare register (timer/counter 0)CR00––l
0FF12HCapture/compare register (timer/counter 0)CR01––l
0FF14HCompare register L (timer/counter 1)CR10
0FF15HCompare register H (timer/counter 1) –––
0FF16HCapture/compare register L (timer/counter 1)CR11
0FF17HCapture/compare register H (timer/counter 1) –––
0FF18HCompare register L (timer/counter 2)CR20
0FF19HCompare register H (timer/counter 2) –––
0FF1AHCapture/compare register L (timer/counter 2)CR21
Special function register (SFR) nameAbbreviationR/W
CR10W
CR11W
CR20W
CR21W
Manipulatable bits
1 bit 8 bits 16 bits
–ll
–ll
–ll
–ll
When reset
0FF1BHCapture/compare register H (timer/counter 2) –––
0FF1CHCompare register L (timer 3)CR30
0FF1DHCompare register H (timer 3) –––
0FF20HPort 0 mode registerPM0ll –FFH
0FF21HPort 1 mode registerPM1ll –
0FF23HPort 3 mode registerPM3ll –
0FF26HPort 6 mode registerPM6ll –
0FF27HPort 7 mode registerPM7ll –
0FF2EHReal-time output port control registerRTPCll –00H
0FF30HCapture/compare control register 0CRC0–l–10H
0FF31HTimer output control registerTOCll –00H
0FF32HCapture/compare control register 1CRC1–l–
0FF33HCapture/compare control register 2CRC2–l–10H
CR30W
–ll
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
24
Page 25
mm
m
mm
Table 7-1 Special Function Registers (SFRs) (2/4)
PD784020, 784021
Address
0FF36HCapture register (timer/counter 0)CR02R––l0000H
0FF38HCapture register L (timer/counter 1)CR12
0FF39HCapture register H (timer/counter 1) –––
0FF3AHCapture register L (timer/counter 2)CR22
0FF3BHCapture register H (timer/counter 2) –––
0FF41HPort 1 mode control registerPMC1R/Wll –00H
0FF43HPort 3 mode control registerPMC3ll –
0FF4EHRegister for optional pull-up resistorPUOll –
0FF50HTimer register 0TM0R––l0000H
0FF51H––
0FF52HTimer register 1TM1TM1W–ll
0FF53H –––
0FF54HTimer register 2TM2TM2W–ll
0FF55H –––
0FF56HTimer register 3TM3TM3W–ll
0FF57H –––
Note
Special function register (SFR) nameAbbreviationR/W
CR12W
CR22W
Manipulatable bits
1 bit 8 bits 16 bits
–ll
–ll
When reset
0FF5CHPrescaler mode register 0PRM0R/W–l–11H
0FF5DHTimer control register 0TMC0ll –00H
0FF5EHPrescaler mode register 1PRM1–l–11H
0FF5FHTimer control register 1TMC1ll–00H
0FF60HD/A conversion value setting register 0DACS0–l–
0FF61HD/A conversion value setting register 1DACS1–l–
0FF62HD/A converter mode registerDAMll –03H
0FF68HA/D converter mode registerADMll –00H
0FF6AHA/D conversion result registerADCRR–l–Undefined
0FF70HPWM control registerPWMCR/Wll–05H
0FF71HPWM prescaler registerPWPR–l–00H
0FF72HPWM modulo register 0PWM0––lUndefined
0FF74HPWM modulo register 1PWM1––l
0FF7DHOne-shot pulse output control registerOSPCll–00H
0FF80HSerial bus interface control registerSBICll –
0FF82HSynchronous serial interface mode registerCSIMll –
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
25
Page 26
Table 7-1 Special Function Registers (SFRs) (3/4)
mm
m
PD784020, 784021
mm
Note 1
Address
0FF84HSynchronous serial interface mode register 1CSIM1R/Wll –00H
0FF85HSynchronous serial interface mode register 2CSIM2ll –
0FF86HSerial shift registerSIO–l–
0FF88HAsynchronous serial interface mode registerASIMll –
0FF89HAsynchronous serial interface mode register 2ASIM2ll –
0FF8AHAsynchronous serial interface status registerASISRll–
0FF8BHAsynchronous serial interface status register 2 ASIS2ll –
0FF8CHSerial receive buffer: UART0RXB–l–Undefined
Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
2. A write operation can be performed only with special instructions MOV STBC,#byte and MOV
WDM,#byte. Other instructions cannot perform a write operation.
26
Page 27
mm
m
mm
Table 7-1 Special Function Registers (SFRs) (4/4)
PD784020, 784021
Address
0FFCCHRefresh mode registerRFMR/Wll –00H
0FFCDHRefresh area specification registerRFAll –
0FFCFHOscillation settling time specification registerOSTS–l–
0FFD0H-External SFR area –ll– –
0FFDFH
0FFE0HInterrupt control register (INTP0)PIC0ll –43H
0FFE1HInterrupt control register (INTP1)PIC1ll –
0FFE2HInterrupt control register (INTP2)PIC2ll –
0FFE3HInterrupt control register (INTP3)PIC3ll –
0FFE4HInterrupt control register (INTC00)CIC00ll–
0FFE5HInterrupt control register (INTC01)CIC01ll–
0FFE6HInterrupt control register (INTC10)CIC10ll–
0FFE7HInterrupt control register (INTC11)CIC11ll–
0FFE8HInterrupt control register (INTC20)CIC20ll–
0FFE9HInterrupt control register (INTC21)CIC21ll–
0FFEAHInterrupt control register (INTC30)CIC30ll –
0FFEBHInterrupt control register (INTP4)PIC4ll –
Note
Special function register (SFR) nameAbbreviationR/W
Manipulatable bits
1 bit 8 bits 16 bits
When reset
0FFECHInterrupt control register (INTP5)PIC5ll –
0FFEDHInterrupt control register (INTAD)ADICll–
0FFEEHInterrupt control register (INTSER)SERICll–
0FFEFHInterrupt control register (INTSR)SRICll –
Interrupt control register (INTCSI1)CSIIC1ll–
0FFF0HInterrupt control register (INTST)STICll –
0FFF1HInterrupt control register (INTCSI)CSIICll –
0FFF2HInterrupt control register (INTSER2)SERIC2ll–
0FFF3HInterrupt control register (INTSR2)SRIC2ll –
Interrupt control register (INTCSI2)CSIIC2ll–
0FFF4HInterrupt control register (INTST2)STIC2ll –
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
27
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mm
m
PD784020, 784021
mm
8. PERIPHERAL HARDWARE FUNCTIONS
8.1 PORTS
The ports shown in Fig. 8-1 are provided to enable the application of wide-ranging control. Table 8-1 lists the
functions of the ports. For the inputs to port 0 to port 6, a built-in pull-up resistor can be specified by software.
Fig. 8-1 Port Configuration
P00
Port 0
P07
P10
Port 1
P17
P30
P37
P60
P63
P66
P67
P70
P77
Port 2P20-P27
8
Port 3
Port 6
Port 7
28
Page 29
mm
m
PD784020, 784021
mm
Table 8-1 Port Functions
Port namePinFunctionPull-up specification by software
Port 0P00-P07• Bit-by-bit input/output setting supportedSpecified as a batch for all pins placed in
• Operable as 4-bit real-time outputsinput mode.
(P00-P03, P04-P07)
• Capable of driving transistors
Port 1P10-P17• Bit-by-bit input/output setting supportedSpecified as a batch for all pins placed in
• Capable of driving LEDsinput mode.
Port 2P20-P27• Input portSpecified for the 6 bits (P22-P27) as a batch.
Port 3P30-P37• Bit-by-bit input/output setting supportedSpecified as a batch for all pins placed in
Port 7P70-P77• Bit-by-bit input/output setting supported—
Specified as a batch for all pins placed in
input mode.
8.2 CLOCK GENERATOR
A circuit for generating the clock signal required for operation is provided. The clock generator includes a frequency
divider; low current consumption can be achieved by operating at a lower internal frequency when high-speed
operation is not necessary.
XX : Oscillator frequency or external clock input
CLK : Internal operating frequency
f
29
Page 30
Fig. 8-3 Examples of Using Oscillator
(1) Crystal/ceramic oscillation
µ
PD784021
V
SS
X1
X2
mm
m
PD784020, 784021
mm
H
•When EXTC bit of OSTS = 1•When EXTC bit of OSTS = 0
µ
PD784021
X1
PD74HC04, etc.
µ
Caution When using the clock generator, to avoid problems caused by influences such as stray
capacitance, run all wiring within the area indicated by the dotted lines according to the following
rules:
X2
(2) External clock
Open
X1
X2
PD784021
µ
• Minimize the wiring length.
• Wires must never cross other signal lines.
• Wires must never run near a line carrying a large varying current.
• The grounding point of the capacitor of the oscillator circuit must always be at the same
potential as V
SS. Never connect the capacitor to a ground pattern carrying a large current.
• Never extract a signal from the oscillator circuit.
30
Page 31
mm
m
PD784020, 784021
mm
8.3 REAL-TIME OUTPUT PORT
The real-time output port outputs data stored in the buffer, synchronized with a timer/counter 1 match interrupt
or external interrupt. Thus, pulse output that is free of jitter can be obtained.
Therefore, the real-time output port is best suited to applications (such as open-loop control over stepping motors)
where an arbitrary pattern is output at arbitrary intervals.
As shown in Fig. 8-4, the real-time output port is built around port 0 and the port 0 buffer register (P0H, P0L).
Three timer/counter units and one timer unit are incorporated.
Moreover, seven interrupt requests are supported, allowing these units to function as seven timer/counter units.
Table 8-2 Timer/Counter Operation
Name
Item
Count pulse width8 bits–lll
H
Operating modeInterval timer2ch2ch2ch1ch
FunctionTimer output2ch–2ch–
Note The one-shot pulse output function makes the level of a pulse output active by software, and makes the
level of a pulse output inactive by hardware (interrupt request signal).
Note that this function differs from the one-shot timer function of timer/counter 2.
16 bitsllll
External event counterlll–
One-shot timer––l–
Toggle outputl–l–
PWM/PPG outputl–l–
One-shot pulse output
Real-time output–l––
Pulse width measurement1 input1 input2 inputs–
Number of interrupt requests2221
Two channels of PWM (pulse width modulation) output circuitry with a resolution of 12 bits and a repetition
frequency of 48.8 kHz (fCLK = 12.5 MHz) are incorporated. Low or high active level can be selected for the PWM output
channels, independently of each other. This output is best suited to DC motor speed control.
Fig. 8-6 Block Diagram of PWM Output Unit
Internal bus
CLK
f
Prescaler
Remark n = 0, 1
PWM modulo register
150
PWMn
84
8-bit
down-counter
1/256
16
8 74 3
Pulse control
circuit
4-bit counter
8
PWM control register
(PWMC)
Reload
control
Output
control
PWMn (output pin)
34
Page 35
mm
m
PD784020, 784021
mm
8.6 A/D CONVERTER
An analog/digital (A/D) converter having 8 multiplexed analog inputs (ANI0-ANI7) is incorporated.
The successive approximation system is used for conversion. The result of conversion is held in the 8-bit A/D
conversion result register (ADCR). Thus, speedy high-precision conversion can be achieved. (The conversion time
is about 10 ms at fCLK = 12.5 MHz.)
A/D conversion can be started in any of the following modes:
• Hardware start: Conversion is started by means of trigger input (INTP5).
• Software start : Conversion is started by means of bit setting the A/D converter mode register (ADM).
After conversion has started, one of the following modes can be selected:
• Scan mode : Multiple analog inputs are selected sequentially to obtain conversion data from all pins.
• Select mode: A single analog input is selected at all times to enable conversion data to be obtained
continuously.
ADM is used to specify the above modes, as well as the termination of conversion.
When the result of conversion is transferred to ADCR, an interrupt request (INTAD) is generated. Using this feature,
the results of conversion can be continuously transferred to memory by the macro service.
ANI0
ANI1
ANI2
ANI3
ANI4
ANI5
ANI6
ANI7
INTP5
Input selector
Edge
detector
A/D converter mode
register (ADM)
Fig. 8-7 Block Diagram of A/D Converter
Sample-and-hold circuit
Voltage comparator
Successive conver-
sion register (SAR)
Conversion
trigger
Trigger enable
8
Control
circuit
8
A/D conversion
result register (ADCR)
8
INTAD
Series resistor string
R/2
R
Tap selector
R/2
AV
AV
REF1
SS
Internal bus
35
Page 36
mm
m
PD784020, 784021
mm
8.7 D/A CONVERTER
Two digital/analog (D/A) converter channels of voltage output type, having a resolution of 8 bits, are incorporated.
A resistor string system is used for conversion. By writing the value to be subject to D/A conversion in the 8-bit
D/A conversion value setting register (DACSn: n = 0, 1), the resulting analog value is output on ANOn
(n = 0, 1). The range of the output voltages is determined by the voltages applied to the AVREF2 and AVREF3 pins.
Because of its high output impedance, no current can be obtained from an output pin. When the load impedance
is low, insert a buffer amplifier between the load and the converter.
The impedance of the ANOn pin goes high while the RESET signal is low. DACSn is set to 0 after a reset
is released.
Fig. 8-8 Block Diagram of D/A Converter
AV
REF2
R
R
AV
REF3
ANOn
R
R
DACSn
8
Tap selector
RESET
DACEn
8
Internal bus
36
Remarkn = 0, 1
Page 37
mm
m
PD784020, 784021
mm
8.8 SERIAL INTERFACE
Three independent serial interface channels are incorporated.
• Asynchronous serial interface (UART)/three-wire serial I/O (IOE) ¥ 2
• Synchronous serial interface (CSI) ¥ 1
• Three-wire serial I/O (IOE)
• Serial bus interface (SBI)
So, communication with points external to the system and local communication within the system can be performed
at the same time. (See Fig. 8-9.)
Fig. 8-9 Example Serial Interfaces
(a) UART + SBI
PD784021 (master)
PD4711A
µ
RS-232-C
driver/
receiver
PD4711A
µ
RS-232-C
driver/
receiver
(UART)
(UART)
µ
RxD
TxD
Port
RxD2
TxD2
Port
SB0
SCK0
(SBI)
V
DD
µ
µ
PD75402A (slave)
SB0
SCK
PD75328 (slave)
SB0
SCK
LCD
PD4711A
µ
RS-232-C
driver/
receiver
(b) UART + Three-wire serial I/O
PD784021 (master)
µ
(UART)
RxD
TxD
Port
Note Handshake line
[Three-wire serial I/O]
SO0
SI0
SCK0
INTPm
Port
SO1
SI1
SCK1
INTPn
Port
Note
Note
PD75108 (slave)
µ
SI
SO
SCK
Port
INT
PD78014 (slave)
µ
SI
SO
SCK
Port
INT
37
Page 38
mm
m
PD784020, 784021
mm
8.8.1 Asynchronous Serial Interface/Three-Wire Serial I/O (UART/IOE)
Two serial interface channels are available; for each channel, asynchronous serial interface mode or three-wire
serial I/O mode can be selected.
(1) Asynchronous serial interface mode
In this mode, 1-byte data is transferred after a start bit.
A baud rate generator is incorporated to enable communication at a wide range of baud rates.
Moreover, the frequency of a clock signal applied to the ASCK pin can be divided to define a baud rate.
With the baud rate generator, the baud rate conforming to the MIDI standard (31.25 kbps) can be obtained.
Fig. 8-10 Block Diagram of Asynchronous Serial Interface Mode
Internal bus
RxD, RxD2
TxD, TxD2
Baud rate generator
XX
/2
f
ASCK, ASCK2
Selector
1/2
n+1
Receive buffer
Receive
shift register
Reception
control parity
check
1/2m
1/2m
RXB, RXB2
INTSR,
INTSR2
INTSER,
INTSER2
Transmission
shift register
Transmission
control parity
bit addition
TXS, TXS2
INTST, INTST2
38
Remark f
XX: Oscillator frequency or external clock input
n = 0 to 11
m = 16 to 30
Page 39
mm
m
PD784020, 784021
mm
(2) Three-wire serial I/O mode
In this mode, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK) and the two serial data lines (SI
and SO).
In general, a handshake line is required to check the state of communication.
Fig. 8-11 Block Diagram of Three-Wire Serial I/O Mode
Internal bus
Direction control
circuit
SIO1, SIO2
Shift register Output latch
SI1, SI2
SO1, SO2
SCK1, SCK2
Remark f
Serial clock counter
Serial clock
control circuit
XX: Oscillator frequency or external clock input
n = 0 to 11
m = 1, 16 to 30
Interrupt signal
generator
1/m1/2
Selector
INTCSI1,
INTCSI2
n+1
fXX/2
39
Page 40
mm
m
PD784020, 784021
mm
8.8.2 Synchronous Serial Interface (CSI)
With this interface, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
Fig. 8-12 Block Diagram of Synchronous Serial Interface
Internal bus
Direction
control circuit
Set
Clear
SI0
SO0/SB0
Shift register
Selector
N-ch open-drain
output enabled
(when SB0 or
SBI mode is used)
SIO
Output latch
Busy/
acknowledge
detection
circuit
Bus release/
command/
acknowledge
detection
circuit
Remark f
Serial clock
counter
Serial clock
control circuit
CLK: Internal system clock frequency (system clock frequency/2)
Interrupt signal
generation
circuit
INTCSISCK0
Selector
TM 3 output/2
CLK
/8
f
CLK
/32
f
40
Page 41
mm
m
PD784020, 784021
mm
(1) Three-wire serial I/O mode
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK0) and serial data lines (SI0 and SO0).
In general, a handshake line is required to check the state of communication.
(2) SBI mode
The SBI mode allows communication with more than one device via two lines: the serial clock (SCK0) and serial
bus (SB0). The SBI mode is the standard NEC serial interface.
A master device outputs an address through the SB0 pin to select a slave device with which communication is
to be performed. After a target device is selected, commands and data are transmitted between the master device
and slave device.
8.9 EDGE DETECTION FUNCTION
The interrupt input pins (NMI, INTP0-INTP5) are used to apply not only interrupt requests but also trigger signals
for the built-in circuits. As these pins are triggered by an edge (rising or falling) of an input signal, a function for edge
detection is incorporated. Moreover, a noise suppression function is provided to prevent erroneous edge detection
caused by noise.
PinDetectable edgeNoise suppression method
NMIRising edge or falling edgeAnalog delay
INTP0-INTP3Rising edge or falling edge, or both edgesClock sampling
INTP4, INTP5Analog delay
Note INTP0 is used for sampling clock selection.
Note
41
Page 42
mm
m
PD784020, 784021
mm
8.10 WATCHDOG TIMER
A watchdog timer is incorporated for CPU runaway detection. The watchdog timer, if not cleared by software within
a specified interval, generates a nonmaskable interrupt. Furthermore, once watchdog timer operation is enabled,
it cannot be disabled by software. The user can specify whether priority is placed on an interrupt based on the
watchdog timer or on an interrupt based on the NMI pin.
H
f
Fig. 8-13 Block Diagram of Watchdog Timer
CLK
Clear signal
Timer
f
f
CLK
f
CLK
f
CLK
CLK
21
/2
20
/2
19
/2
17
/2
Selector
INTWDT
42
Page 43
mm
m
PD784020, 784021
mm
9. INTERRUPT FUNCTION
Table 9-1 lists the interrupt request handling modes. These modes are selected by software.
Table 9-1 Interrupt Request Handling Modes
Handling modeHandled byHandlingPC and PSW contents
Vectored interruptSoftwareBranches to a handling routine for executionThe PC and PSW contents are pushed
(arbitrary handling).to and popped from the stack.
Context switchingAutomatically selects a register bank, andThe PC and PSW contents are saved to
branches to a handling routine for executionand read from a fixed area in the
(arbitrary handling).register bank.
Macro serviceFirmwarePerforms operations such as memory-to-I/O-Maintained
device data transfer (fixed handling).
9.1 INTERRUPT SOURCE
An interrupt can be issued from any one of the interrupt sources listed in Table 9-2: execution of a BRK instruction,
an operand error, or any of the 23 other interrupt sources.
Four levels of interrupt handling priority can be set. Priority levels can be set to nest control during interrupt handling
or to concurrently generate interrupt requests. Nested macro services, however, are performed without suspension.
When interrupt requests having the same priority level are generated, they are handled according to the default
priority (fixed). (See Table 9-2.)
43
Page 44
Table 9-2 Interrupt Sources
mm
m
PD784020, 784021
mm
Type
Software–BRK instructionInstruction execution ––
Nonmaskable–NMIDetection of edge input on the pinExternal–
H
Maskable0 (highest) INTP0Detection of edge input on the pin (TM1/TM1W capture trigger)ExternalEnabled
Default
priority
1INTP1Detection of edge input on the pin (TM2/TM2W capture trigger)
2INTP2
3INTP3Detection of edge input on the pin (TM0 capture trigger)
4INTC00TM0-CR00 match signal issuedInternalEnabled
5INTC01TM0-CR01 match signal issued
6INTC10TM1-CR10 match signal issued (in 8-bit operation mode)
7INTC11TM1-CR11 match signal issued (in 8-bit operation mode)
8INTC20TM2-CR20 match signal issued (in 8-bit operation mode)
9INTC21TM2-CR21 match signal issued (in 8-bit operation mode)
10INTC30TM3-CR30 match signal issued (in 8-bit operation mode)
11INTP4Detection of edge input on the pinExternalEnabled
12INTP5Detection of edge input on the pin
13INTADA/D converter processing completed (ADCR transfer)InternalEnabled
14INTSERASI0 reception error–
15INTSRASI0 reception completed or CSI1 transfer completedEnabled
16INTSTASI0 transmission completed
17INTCSICSI0 transfer completed
18INTSER2ASI2 reception error–
19INTSR2ASI2 reception completed or CSI2 transfer completedEnabled
20 (lowest) INTST2ASI2 transmission completed
NameTrigger
Operand errorWhen the MOV STBC,#byte or MOV WDM,#byte instruction is
executed, exclusive OR of the byte operand and byte does not
produce FFH.
WDTWatchdog timer overflowInternal
Detection of edge input on the pin (TM2/TM2W event counter input)
TM1W-CR10W match signal issued (in 16-bit operation mode)
TM1W-CR11W match signal issued (in 16-bit operation mode)
TM2W-CR20W match signal issued (in 16-bit operation mode)
TM2W-CR21W match signal issued (in 16-bit operation mode)
TM3W-CR30W match signal issued (in 16-bit operation mode)
INTCSI1
INTCSI2
Source
Internal/Macro
externalservice
Remark ASI: Asynchronous serial interface
CSI: Synchronous serial interface
44
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mm
m
PD784020, 784021
mm
9.2 VECTORED INTERRUPT
When a branch to an interrupt handling routine occurs, the vector table address corresponding to the interrupt
source is used as the branch address.
Interrupt handling by the CPU consists of the following operations :
• When a branch occurs : Push the CPU status (PC and PSW contents) to the stack.
• When control is returned: Pop the CPU status (PC and PSW contents) from the stack.
To return control from the handling routine to the main routine, use the RETI instruction. The branch destination
When an interrupt request is generated, or when the BRKCS instruction is executed, an appropriate register bank
is selected by the hardware. Then, a branch to a vector address stored in that register bank occurs. At the same
time, the contents of the current program counter (PC) and program status word (PSW) are stacked in the register
bank.
The branch address must be within the range of 0 to FFFFH.
Fig. 9-1 Context Switching Caused by an Interrupt Request
0000B
7
PC19-16
2
Save
(Bits 8 to 11 of
temporary register)
Temporary register
1
Save
Transfer
PC15-0
6
Exchange
5
Save
Register bank n (n = 0-7)
AX
BC
R5R4
R7
V
U
T
WL
DE
H
VP
UP
R6
Switching between register banks
3
RSS ← 0
4
IE ← 0
Register bank (0-7)
(RBS0-RBS2 ← n)
PSW
9.4 MACRO SERVICE
The macro service function enables data transfer between memory and special function registers (SFRs) without
requiring the intervention of the CPU. The macro service controller accesses both memory and SFRs within the same
transfer cycle to directly transfer data without having to perform data fetch.
Since the CPU status is neither saved nor restored, nor is data fetch performed, high-speed data transfer is
possible.
Fig. 9-2 Macro Service
CPUSFRMemory
Internal bus
Read
Write
Macro service
controller
Write
Read
46
Page 47
9.5 EXAMPLES OF MACRO SERVICE APPLICATIONS
(1) Serial interface transmission
mm
m
PD784020, 784021
mm
Transmission data storage buffer (memory)
TxD
Transmission control
Data n
Data n-1
Data 2
Data 1
Internal bus
Transmission
shift register
TXS (SFR)
INTST
Each time a macro service request (INTST) is generated, the next transmission data is transferred from memory
to TXS. When data n (last byte) has been transferred to TXS (that is, once the transmission data storage buffer
becomes empty), a vectored interrupt request (INTST) is generated.
(2) Serial interface reception
Reception data storage buffer (memory)
Data n
Data n-1
Data 2
Data 1
Internal bus
RxD
Reception buffer
Reception
shift register
Reception control
RXB (SFR)
INTSR
Each time a macro service request (INTSR) is generated, reception data is transferred from RXB to memory.
When data n (last byte) has been transferred to memory (that is, once the reception data storage buffer becomes
full), a vectored interrupt request (INTSR) is generated.
47
Page 48
mm
m
PD784020, 784021
mm
(3) Real-time output port
INTC10 and INTC11 function as the output triggers for the real-time output ports. For these triggers, the macro
service can simultaneously set the next output pattern and interval. Therefore, INTC10 and INTC11 can be used
to independently control two stepping motors. They can also be applied to PWM and DC motor control.
Each time a macro service request (INTC10) is generated, a pattern and timing data are transferred to the buffer
register (P0L) and compare register (CR10), respectively. When the contents of timer register 1 (TM1) and CR10
match, another INTC10 is generated, and the P0L contents are transferred to the output latch. When Tn (last
byte) is transferred to CR10, a vectored interrupt request (INTC10) is generated.
For INTC11, the same operation as that performed for INTC10 is performed.
48
Page 49
mm
m
PD784020, 784021
mm
10. LOCAL BUS INTERFACE
The local bus interface enables the connection of external memory and I/O devices (memory-mapped I/O). It
supports a 1M-byte memory space. (See Fig. 10-1.)
Fig. 10-1 Example of Local Bus Interface
PD784021
µ
A16-A19
Decoder
RD
WR
REFRQ
AD0-AD7
Pseudo SRAM
PROM
PD27C1001A
µ
Data bus
Data bus
Kanji character
generator
PD24C1000
µ
ASTB
A8-A15
Latch
Address bus
Gate array for I/O
expansion including
Centronics interface
circuit, etc.
10.1 MEMORY EXPANSION
By adding external memory, program memory or data memory can be expanded, 64K bytes at a time, to
approximately 1M byte (three steps).
49
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mm
m
PD784020, 784021
mm
10.2 MEMORY SPACE
The 1M-byte memory space is divided into eight spaces, each having a logical address. Each of these spaces
can be controlled using the programmable wait and pseudo-static RAM refresh functions.
Fig. 10-2 Memory Space
FFFFFH
512K bytes
80000H
7FFFFH
256K bytes
40000H
3FFFFH
20000H
1FFFFH
10000H
0FFFFH
0C000H
0BFFFH
08000H
07FFFH
04000H
03FFFH
00000H
128K bytes
64K bytes
16K bytes
16K bytes
16K bytes
16K bytes
50
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mm
m
PD784020, 784021
mm
10.3 PROGRAMMABLE WAIT
When the memory space is divided into eight spaces, a wait state can be separately inserted for each memory
space while the RD or WR signal is active. This prevents the overall system efficiency from being degraded even
when memory devices having different access times are connected.
In addition, an address wait function that extends the ASTB signal active period is provided to produce a longer
address decode time. (This function is set for the entire space.)
10.4 PSEUDO-STATIC RAM REFRESH FUNCTION
Refresh is performed as follows:
• Pulse refresh: A bus cycle is inserted where a refresh pulse is output on the REFRQ pin at regular
intervals. When the memory space is divided into eight, and a specified area
is being accessed, refresh pulses can also be output on the REFRQ pin as the
memory is being accessed. This can prevent the refresh cycle from suspending
normal memory access.
• Power-down self-refresh : In standby mode, a low-level signal is output on the REFRQ pin to maintain the
contents of pseudo-static RAM.
10.5 BUS HOLD FUNCTION
A bus hold function is provided to facilitate connection to devices such as a DMA controller. Suppose that a bus
hold request signal (HLDRQ) is received from an external bus master. In this case, upon the completion of the bus
cycle being performed, the address bus, address/data bus, ASTB, RD, and WR pins are placed in the high-impedance
state, and the bus hold acknowledge signal (HLDAK) is made active to release the bus for the external bus master.
While the bus hold function is being used, the external wait and pseudo-static RAM refresh functions are disabled.
51
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m
PD784020, 784021
mm
11. STANDBY FUNCTION
The standby function allows the power consumption of the chip to be reduced. The following standby modes are
supported:
• HALT mode : The CPU operation clock is stopped. By occassionally inserting the HALT mode during normal
operation, the overall average power consumption can be reduced.
• IDLE mode : The entire system is stopped, with the exception of the oscillator circuit. This mode consumes
only very little more power than STOP mode, but normal program operation can be restored in
almost as little time as that required to restore normal program operation from HALT mode.
• STOP mode : The oscillator is stopped. All operations in the chip stop, such that only leakage current flows.
These modes can be selected by software.
A macro service can be initiated in HALT mode.
Fig. 11-1 Standby Mode Status Transition
Macro service request
End of one operation
End of macro service
Interrupt request
RESET input
Set HALT
Note 2
Macro service request
End of one operation
HALT
(standby)
Macro
service
Note 1
NMI, INTP4, INTP5 input
STOP
(standby)
Wait for
oscillation
settling
Set STOP
RESET input
IDLE
(standby)
Oscillation settling
time elapses
Set IDLE
RESET input
NMI, INTP4, INTP5 input
Request for masked interrupt
Program
operation
Note 1
Notes 1. INTP4 and INTP5 are applied when not masked.
2. Only when the interrupt request is not masked
Remark NMI is enabled only by external input. The watchdog timer cannot be used to release one of the standby
modes (STOP or IDLE mode).
52
Page 53
mm
m
PD784020, 784021
mm
12. RESET FUNCTION
Applying a low-level signal to the RESET pin initializes the internal hardware (reset status).
When the RESET input makes a low-to-high transition, the following data is loaded into the program counter (PC):
• Eight low-order bits of the PC: Contents of location at address 0000H
• Intermediate eight bits of the PC : Contents of location at address 0001H
• Four high-order bits of the PC: 0
The PC contents are used as a branch destination address. Program execution starts from that address. Therefore,
a reset start can be performed from an arbitrary address.
The contents of each register can be set by software, as required.
The RESET input circuit contains a noise eliminator to prevent malfunctions caused by noise. This noise eliminator
is an analog delay sampling circuit.
Fig. 12-1 Accepting a Reset
Delay
RESET
(input)
Internal reset signal
For power-on reset, the RESET signal must be held active until the oscillation settling time (approximately 40 ms)
has elapsed.
Oscillation settling timeDelay
V
DD
RESET
(input)
Delay
Start reset
Fig. 12-2 Power-On Reset
Delay
End reset
Initialize PC
Initialize PC
Execute instruction
at reset start address
Execute instruction at
reset start address
Internal reset signal
End reset
53
Page 54
mm
m
PD784020, 784021
mm
13. INSTRUCTION SET
(1) 8-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT EI, DI, SWRS
58
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mm
m
PD784020, 784021
mm
14. ELECTRICAL CHARACTERISTICS
The electrical characteristics described in this chapter apply to the products which are improved versions of the
m
PD784020 and mPD784021 (other than K-rank products). For K-rank products yet to be improved (K-rank products),
please consult with our sales offices.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Supply voltage
Input voltage
Output voltage
Low-level output current
High-level output current
A/D converter reference input voltage
D/A converter reference input voltage
Operating ambient temperature
Storage temperature
Symbol
VDD
AVDD
AVSS
VI
VO
IOL
IOH
AVREF1
AVREF2
AVREF3
TA
Tstg
Each pin
Total of all output pins
Each pin
Total of all output pins
Conditions
Rating
–0.5 to +7.0
AVSS to VDD + 0.5
–0.5 to +0.5
–0.5 to VDD + 0.5
–0.5 to VDD + 0.5
15
150
–10
–100
–0.5 to VDD + 0.3
–0.5 to VDD + 0.3
–0.5 to VDD + 0.3
–40 to +85
–65 to +150
Unit
V
V
V
V
V
mA
mA
mA
mA
V
V
V
°C
°C
H
Caution Absolute maximum ratings are rated values beyond which some physical damages may be
caused to the product; if any of the parameters in the table above exceeds its rated value even
for a moment, the quality of the product may deteriorate. Be sure to use the product within the
rated values.
59
Page 60
OPERATING CONDITIONS
• Operating ambient temperature (TA): –40 to +85 °C
• Rising and falling time (tr, tf) (for pins not especially specified): 0 to 200
• Power supply voltage and clock cycle time: See Fig. 14-1.
Fig. 14-1 Relationship between Power Supply Voltage and Clock Cycle Time
OSCILLATOR CHARACTERISTICS (TA = –40 to +85 °C, VDD = 4.5 to 5.5 V, VSS = 0 V)
Resonator
Ceramic resonator
or crystal
External clock
Recommended circuitMin.
Oscillator frequency (fXX)
X1X2V
SS
C1C2
X1 input frequency (fX)
X1X2
HCMOS
Inverter
X1 input rising and falling times
(tXR, tXF)
X1 input high-level and lowlevel widths (tWXH, tWXL)
Parameter
4
4
0
10
Max.
25
25
10
125
Unit
MHz
MHz
ns
ns
Caution When using the system clock generator, run wires in the portion surrounded by dotted lines
according to the following rules to avoid effects such as stray capacitance:
• Minimize the wiring.
• Never cause the wires to cross other signal lines.
• Never cause the wires to run near a line carrying a large varying current.
• Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
SS. Never connect the capacitor to a ground pattern carrying a large current.
as V
• Never extract a signal from the oscillator.
61
Page 62
OSCILLATOR CHARACTERISTICS (TA = –40 to +85 °C, VDD = 2.7 to 5.5 V, VSS = 0 V)
mm
m
PD784020, 784021
mm
Resonator
Ceramic resonator
or crystal
External clock
Recommended circuitMin.
Oscillator frequency (fXX)
X1X2V
SS
C1C2
X1 input frequency (fX)
X1X2
HCMOS
Inverter
X1 input rising and falling times
(tXR, tXF)
X1 input high-level and lowlevel widths (tWXH, tWXL)
Parameter
4
4
0
10
Max.
16
16
10
125
Unit
MHz
MHz
ns
ns
Caution When using the system clock generator, run wires in the portion surrounded by dotted lines
according to the following rules to avoid effects such as stray capacitance:
• Minimize the wiring.
• Never cause the wires to cross other signal lines.
• Never cause the wires to run near a line carrying a large varying current.
• Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
SS. Never connect the capacitor to a ground pattern carrying a large current.
as V
• Never extract a signal from the oscillator.
62
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mm
m
PD784020, 784021
mm
DC CHARACTERISTICS (TA = –40 to +85 °C, VDD = AV DD = 2.7 to 5.5 V, VSS = AVSS = 0 V) (1/2)
Parameter
Low-level input voltage
High-level input voltage
Low-level output voltage
High-level output voltage
X1 low-level input current
X1 high-level input current
Symbol
VIL1
VIL2
VIL3
VIH1
VIH2
VIH3
VOL1
VOL2
VOH1
VOH2
IIL
IIH
Conditions
Pins other than those described in
Notes 1, 2, 3, and 4
Pins described in Notes 1, 2, 3, and 4
VDD = +5.0 V ±10 %
Pins described in Notes 2, 3, and 4
Pins other than those described in Note 1
Pins described in Note 1
VDD = +5.0 V ±10 %
Pins described in Notes 2, 3, and 4
IOL = 2 mA
VDD = +5.0 V ±10 %
IOL = 8 mA
Pins described in Notes 2 and 5
IOH = –2 mA
VDD = +5.0 V ±10 %
IOH = –5 mA
Pins described in Note 4
0 V £ VI£ VIL2
VIH2£ VI£ VDD
a: 1 when address wait is applied, 0 in other cases
n: number of wait cycles (n • 0)
(4) Refresh timing
Parameter
Random read/write cycle time
REFRQ low-level pulse width
ASTBØÆ REFRQ delay time
RD• Æ REFRQ delay time
WR• Æ REFRQ delay time
REFRQ• Æ ASTB delay time
REFRQ high-level pulse width
Symbol
tRC
tWRFQL
tDSTRFQ
tDRRFQ
tDWRFQ
tDRFQST
tWRFQH
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Remark T: TCYK (system clock cycle time)
Min.
3T
1.5T – 25
1.5T – 30
0.5T – 9
1.5T – 9
1.5T – 9
0.5T – 9
1.5T – 25
1.5T – 30
Max.Conditions
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
67
Page 68
SERIAL OPERATION (CSI)
mm
m
PD784020, 784021
mm
Parameter
Serial clock cycle time
(SCK0)
Serial clock low-level width
(SCK0)
Serial clock high-level width
(SCK0)
SI0, SB0 setup time
(referred to SCK0•)
SI0, SB0 hold time
(referred to SCK0•)
SO0, SB0 output delay time
(referred to SCK0Ø)
SO0, SB0 output hold time
(referred to SCK0•)
SB0 high hold time
(referred to SCK0•)
SB0 low setup time
(referred to SCK0Ø)
SB0 low-level width
SB0 high-level width
Symbol
tCYSK0
tWSKL0
tWSKH0
tSSSK0
tHSSK0
tDSBSK1
tDSBSK2
tHSBSK1
tHSBSK2
tSSBSK
tWSBL
tWSBH
Conditions
InputVDD = +5.0 V ±10 %
Output
InputVDD = +5.0 V ±10 %
Output
InputVDD = +5.0 V ±10 %
Output
CMOS push-pull output
(three-wire serial I/O mode)
Open-drain output
(SBI mode), RL = 1 kW
During data transfer
SBI mode
Min.
500
1000
T
210
460
0.5T – 40
210
460
0.5T – 40
80
80
0
0
0.5TCYSK0 – 40
4
4
4
4
Max.
150
400
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCYX
tCYX
tCYX
tCYX
Remarks 1. The values listed in the above table are obtained when f
CYX = 1/fXX
2. t
3. T: Serial clock frequency specified using software. The minimum value is 16/fXX.
68
XX = 25 MHz and CL = 100 pF.
Page 69
SERIAL OPERATION (IOE1, IOE2)
mm
m
PD784020, 784021
mm
Parameter
Serial clock cycle time
(SCK1, SCK2)
Serial clock low-level width
(SCK1, SCK2)
Serial clock high-level width
(SCK1, SCK2)
SI1, SI2 setup time
(referred to SCK1, SCK2•)
SI1, SI2 hold time
(referred to SCK1, SCK2•)
SO1, SO2 output delay time
(referred to SCK1, SCK2Ø)
SO1, SO2 output hold time
(referred to SCK1, SCK2•)
Symbol
tCYSK1
tWSKL1
tWSKH1
tSSSK1
tHSSK1
tDSOSK
tHSOSK
Conditions
InputVDD = +5.0 V ±10 %
OutputInternal clock divided by 16
InputVDD = +5.0 V ±10 %
OutputInternal clock divided by 16
InputVDD = +5.0 V ±10 %
OutputInternal clock divided by 16
During data transfer
Min.
250
500
T
85
210
0.5T – 40
85
210
0.5T – 40
40
40
0
0.5TCYSK1 – 40
Max.
50
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Remarks 1. The values listed in the above table are obtained when C
2. T: Serial clock frequency specified using software. The minimum value is 16/f
SERIAL OPERATION (UART, UART2)
Parameter
ASCK clock input cycle time
ASCK clock low-level width
ASCK clock high-level width
Symbol
tCYASK
tWASKL
tWASKH
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
L = 100 pF.
Min.
125
250
52.5
85
52.5
85
XX.
Max.Conditions
Unit
ns
ns
ns
ns
ns
ns
69
Page 70
OTHER OPERATIONS
mm
m
PD784020, 784021
mm
Parameter
NMI low-level width
NMI high-level width
INTP0 low-level width
INTP0 high-level width
INTP1-INTP3 and CI low-
Peak package’s surface temperature: 235 ½C
Reflow time: 30 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 ½C
Reflow time: 40 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 3
Solder temperature: 260 ½C or less
Flow time: 10 seconds or less
Number of flow process: 1
Preheating temperature: 120 ½C max. (measured on the package
surface)
Terminal temperature: 300 ½C or less
Flow time: 3 seconds or less (for each side of device)
Peak package’s surface temperature: 235 ½C
Reflow time: 30 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 2
Exposure limit
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Peak package’s surface temperature: 215 ½C
Reflow time: 40 seconds or less (at 200 ½C or more)
Maximum allowable number of reflow processes: 2
Exposure limit
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Terminal temperature: 300 ½C or less
Flow time: 3 seconds or less (for each side of device)
Note
Note
Soldering conditions
Soldering conditions
: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Symbol
IR35-107-2
VP15-107-2
–
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ½C and maximum relative humidity at 65 % or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
82
Page 83
mm
m
PD784020, 784021
mm
APPENDIX A DEVELOPMENT TOOLS
The following development tools are available for system development using the mPD784021.
Language Processing Software
RA78K4
CC78K4
CC78K4-L
Note 1
Note 1
Note 1
Assembler package for all 78K/IV series models
C compiler package for all 78K/IV series models
C compiler library source file for all 78K/IV series models
PROM Write Tools
PG-1500PROM programmer
PA-78P4026GCProgrammer adaptor, connects to PG-1500
PA-78P4038GK
PA-78P4026KK
PG-1500 controller
Note 2
Control program for PG-1500
Debugging Tools
IE-784000-RIn-circuit emulator for all mPD784026 sub-series models
IE-784000-R-BKBreak board for all 78K/IV series models
IE-784026-R-EM1Emulation board for evaluating mPD784026 sub-series models
IE-784000-R-EM
IE-70000-98-IF-BInterface adapter when the PC-9800 series computer (other than a notebook)
IE-70000-98N-IFInterface adapter and cable when a PC-9800 series notebook is used as the
IE-70000-PC-IF-BInterface adapter when the IBM PC/ATTM is used as the host machine
IE-78000-R-SV3Interface adapter and cable when the EWS is used as the host machine
is used as the host machine
host machine
EP-78230GC-REmulation probe for 80-pin plastic QFP (14 ¥ 14 mm) for all mPD784026
EP-78054GK-REmulation probe for 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm) for all
EV-9200GC-80Socket for mounting on target system board made for 80-pin plastic QFP
EV-9500GK-80Adapter for mounting on target system board made for 80-pin plastic TQFP
EV-9900Tool used to remove the mPD78P4026KK-T from the EV-9200GC-80
SM78K4
ID78K4
DF784026
Note 3
Note 3
Note 4
sub-series
m
PD784021
(14 ¥ 14 mm)
(fine pitch) (12 ¥ 12 mm)
System simulator for all 78K/IV series models
Integrated debugger for IE-784000-R
Device file for all mPD784026 sub-series models
Real-time OS
RX78K/IV
MX78K4
Note 4
Note 2
Real-time OS for 78K/IV series models
OS for all 78K/IV series models
Remark The RA78K4, CC78K4, SM78K4, and ID78K4 are used with the DF784026.
83
Page 84
Notes 1. • Based on PC-9800 series (MS-DOSTM)
• Based on IBM PC/AT and compatibles (PC DOS
• Based on HP9000 series 700
• Based on SPARCstation
• Based on NEWS
• Based on PC-9800 series (MS-DOS)
2.
TM
(NEWS-OSTM)
TM
TM
(SunOSTM)
(HP-UXTM)
• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
3.
• Based on PC-9800 series (MS-DOS + Windows)
• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
• Based on HP9000 series 700 (HP-UX)
• Based on SPARCstation (SunOS)
• Based on PC-9800 series (MS-DOS)
4.
• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
PD784026 Sub-Series Special Function RegistersU10593J—
m
PD784026 Sub-Series Application Note, Hardware BasicU10573J
78K/IV Series User's Manual, InstructionU10905JIEU-1386
78K/IV Series Instruction Summary SheetU10594J—
78K/IV Series Instruction SetU10595J—
78K/IV Series Application Note, Software BasicU10095J—
To be released soon
To be released soon
Document No.
JapaneseEnglish
IP-3230
IP3231
—
Documents Related to Development Tools (User’s Manual)
Document name
RA78K Series Assembler PackageOperationEEU-809EEU-1399
LanguageEEU-815EEU-1404
RA78K Series Structured Assembler PreprocessorEEU-817EEU-1402
CC78K Series C CompilerOperationEEU-656EEU-1280
LanguageEEU-655EEU-1284
CC78K Series Library Source FileEEU-777—
PG-1500 PROM ProgrammerEEU-651EEU-1335
PG-1500 Controller PC-9800 Series (MS-DOS) BaseEEU-704EEU-1291
PG-1500 Controller IBM PC Series (PC DOS) BaseEEU-5008U10540E
IE-784000-REEU-5004EEU-1534
IE-784026-R-EM1EEU-5017EEU-1528
EP-78230EEU-985EEU-1515
EP-78054GK-REEU-932EEU-1468
SM78K4 System Simulator Windows BaseReferenceU10093JU10093E
SM78K Series System Simulator
ID78K4 Integrated DebuggerReferenceU10440JU10440E
External Parts User Open
Interface Specifications
Document No.
JapaneseEnglish
U10092JU10092E
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
85
Page 86
mm
m
mm
Documents Related to Software to Be Incorporated into the Product (User’s Manual)
PD784020, 784021
Document name
78K/IV Series Real-Time OSBasicU10603J—
InstallationU10604J—
DebuggerU10364J—
OS for 78K/IV Series MX78K4To be created—
Other Documents
Document name
IC PACKAGE MANUALC10943X
SMD Surface Mount Technology ManualC10535JC10535E
Quality Grades on NEC Semiconductor DeviceIEI-620IEI-1209
NEC Semiconductor Device Reliability/Quality Control SystemC10983JC10983E
Electrostatic Discharge (ESD) TestMEM-539—
Guide to Quality Assurance for Semiconductor DeviceMEI-603MEI-1202
Guide for Products Related to Micro-Computer: Other CompaniesMEI-604—
Document No.
JapaneseEnglish
Document No.
JapaneseEnglish
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
86
Page 87
[MEMO]
mm
m
PD784020, 784021
mm
87
Page 88
mm
m
PD784020, 784021
mm
Cautions on CMOS Devices
Countermeasures against static electricity for all MOSs
Caution When handling MOS devices, take care so that they are not electrostatically charged.
Strong static electricity may cause dielectric breakdown in gates. When transporting or storing
MOS devices, use conductive trays, magazine cases, shock absorbers, or metal cases that NEC
uses for packaging and shipping. Be sure to ground MOS devices during assembling. Do not
allow MOS devices to stand on plastic plates or do not touch pins.
Also handle boards on which MOS devices are mounted in the same way.
CMOS-specific handling of unused input pins
Caution Hold CMOS devices at a fixed input level.
Unlike bipolar or NMOS devices, if a CMOS device is operated with no input, an intermediatelevel input may be caused by noise. This allows current to flow in the CMOS device, resulting
in a malfunction. Use a pull-up or pull-down resistor to hold a fixed input level. Since unused
pins may function as output pins at unexpected times, each unused pin should be separately
connected to the V
If handling of unused pins is documented, follow the instructions in the document.
DD or GND pin through a resistor.
Statuses of all MOS devices at initialization
Caution The initial status of a MOS device is unpredictable when power is turned on.
Since characteristics of a MOS device are determined by the amount of ions implanted in
molecules, the initial status cannot be determined in the manufacture process. NEC has no
responsibility for the output statuses of pins, input and output settings, and the contents of
registers at power on. However, NEC assures operation after reset and items for mode setting
if they are defined.
When you turn on a device having a reset function, be sure to reset the device first.
MS-DOS and Windows are trademarks of Microsoft Corporation.
IBM DOS, PC/AT, and PC DOS are trademarks of IBM Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of SONY Corporation.
88
Page 89
mm
m
PD784020, 784021
mm
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Mountain View, California
Tel: 800-366-9782
Fax: 800-729-9288
United Square, Singapore 1130
Tel:253-8311
Fax: 250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
Fax: 02-719-5951
NEC do Brasil S.A.
Sao Paulo-SP, Brasil
Tel: 011-889-1680
Fax: 011-889-1689
J96. 3
89
Page 90
mm
m
PD784020, 784021
mm
Some related documents may be preliminary versions. Note that, however, what documents are preliminary is not indicated
in this document.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
90
M4 94. 11
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