Datasheet UPD784021GK-BE9, UPD784021GC-3B9, UPD784020GC-3B9 Datasheet (NEC)

Page 1
DATA SHEET
MOS INTEGRATED CIRCUIT
mm
m
PD784020, 784021
mm
The mPD784021 is a product of the mPD784026 sub-series in the 78K/IV series. It contains various peripheral hardware such as RAM, I/O ports, 8-bit resolution A/D and D/A converters, timers, serial interface, and interrupt functions, as well as a high-speed, high-performance CPU.
m
PD784021 is a ROM-less product of the mPD784025 or mPD784026.
The
m
PD784020 differs from the mPD784021 only in its RAM size: 512 bytes are allocated for the mPD784020,
The while 2048 bytes are allocated for the
For specific functions and other detailed information, consult the following user’s manual.
This manual is required reading for design work.
m
PD784026 Sub-Series User’s Manual, Hardware : U10898E
78K/IV Series User’s Manual, Instruction : U10905E
m
PD784021.
FEATURES
78K/IV series
Pin-compatible with the
Minimum instruction execution time: 160 ns
(at 25 MHz)
Number of I/O ports: 46
Timer/counters: 16-bit timer/counter ¥ 3 units
16-bit timer ¥ 1 unit
Serial interface: 3 channels
UART/IOE (3-wire serial I/O) :2 channels CSI (3-wire serial I/O, SBI) : 1 channel
APPLICATIONS
LBP, automatic-focusing camera, PPC, printer, electronic typewriter, air conditioner, electronic musical instru­ments, cellular telephone, etc.
m
PD78234 sub-series
PWM outputs: 2
Standby function
HALT/STOP/IDLE mode
Clock frequency division function
Watchdog timer : 1 channel
A/D converter : 8-bit resolution ¥ 8 channels
D/A converter : 8-bit resolution ¥ 2 channels
Supply voltage : VDD = 2.7 to 5.5 V
This manual describes the
The information in this document is subject to change without notice.
Document No. U11514EJ1V0DS00 (1st edition) (Previous No. IP-3234) Date Published July 1996 P Printed in Japan
mm
m
PD784021 unless otherwise specified.
mm
The mark H shows major revised points.
©
1990
1996
Page 2
ORDERING INFORMATION
Part number Package Internal ROM Internal RAM
H
m
PD784020GC-3B9 80-pin plastic QFP (14 ¥ 14 mm) None 512
m
PD784021GC-3B9 80-pin plastic QFP (14 ¥ 14 mm) None 2048
H
m
PD784021GK-BE9 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm) None 2048

78K/IV SERIES PRODUCT DEVELOPMENT DIAGRAM

H
: Product under mass production : Product under development
: Product under planning
Standard Products Development
PD784038Y sub-series
µ
 Product containing for 
2
C bus interface circuit
an I 
PD784038 sub-series
µ
 80-pin, 8-bit A/D, 8-bit D/A ROM: 48K/64K/96K/128K
mm
m
PD784020, 784021
mm
(bytes) (bytes)
µ
PD784026 sub-series 80-pin, 8-bit A/D, 8-bit D/A ROM: none/48K/64K
ASSP Development
PD784216 sub-series
µ
100-pin, 8-bit A/D, 8-bit D/A ROM: 96K/128K
PD784915 sub-series
µ
VTR servo, 100-pin, built-in  analog amplifier  ROM: 48K/62K
µ
PD784216Y sub-series
Product containing for 
2
two I
C bus interface circuits
PD784054
µ
80-pin, 10-bit A/D ROM: 32K
µ
PD784046 sub-series sub-set
PD784046 sub-series
µ
80-pin, 10-bit A/D ROM: 32K/64K
PD784908 sub-series
µ
100-pin, built-in IEBusTM  ROM: 96K/128K
PD784943 sub-series
µ
80-pin, for CD-ROM ROM: 56K
2
Page 3

FUNCTIONS

mm
m
PD784020, 784021
mm
Product
Item Number of basic instructions
(mnemonics) General-purpose register Minimum instruction execution
time Internal
memory Memory space
I/O ports
Additional function
Note
pins
Real-time output ports Timer/counter
PWM outputs Serial interface
A/D converter D/A converter Watchdog timer Standby Interrupt Source
Supply voltage Package
ROM RAM
Total Input Input/output Output Pins with pull-
up resistor LED direct
drive outputs Transistor
direct drive
Software Nonmaskable Maskable
m
PD784020
113
8 bits ¥ 16 registers ¥ 8 banks, or 16 bits ¥ 8 registers ¥ 8 banks (memory mapping) 160 ns/320 ns/640 ns/1280 ns (at 25 MHz)
None 512 bytes 2048 bytes Program and data: 1M byte 46 8 34 4 32
8
8
4 bits ¥ 2, or 8 bits ¥ 1 Timer/counter 0: Timer register ¥ 1 Pulse output capability
(16 bits) Capture register ¥ 1 Ý Toggle output
Compare register ¥ 2 Ý PWM/PPG output
Timer/counter 1: Timer register ¥ 1 Pulse output capability (8/16 bits) Capture register ¥ 1 Ý Real-time output (4 bits ¥ 2)
Capture/compare register ¥ 1 Compare register ¥ 1
Timer/counter 2: Timer register ¥ 1 Pulse output capability (8/16 bits) Capture register ¥ 1 Ý Toggle output
Capture/compare register ¥ 1 Ý PWM/PPG output Compare register ¥ 1
Timer 3 : Timer register ¥ 1 (8/16 bits) Compare register ¥ 1
12-bit resolution ¥ 2 channels UART/IOE (3-wire serial I/O) : 2 channels (incorporating baud rate generator)
CSI (3-wire serial I/O, SBI) : 1 channel 8-bit resolution ¥ 8 channels 8-bit resolution ¥ 2 channels 1 channel HALT/STOP/IDLE mode 23 (16 internal, 7 external (sampling clock variable input: 1)) + BRK instruction BRK instruction 1 internal, 1 external 15 internal, 6 external
Ý 4-level programmable priority Ý 3 operation statuses: vectored interrupt, macro service, context switching
VDD = 2.7 to 5.5 V 80-pin plastic QFP (14 ¥ 14 mm)
80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm): for the mPD784021 only
m
PD784021
Ý One-shot pulse output
H
H
Note Additional function pins are included in the I/O pins.
3
Page 4

CONTENTS

mm
m
PD784020, 784021
mm
1. DIFFERENCES BETWEEN
2. MAIN DIFFERENCES BETWEEN
mm
m
PD784026 SUB-SERIES ........................................................... 6
mm
mm
m
PD784026 AND
mm
mm
m
PD78234 SUB-SERIES..................... 7
mm
3. PIN CONFIGURATION (TOP VIEW) ........................................................................................ 8
4. SYSTEM CONFIGURATION EXAMPLE (PPC) ....................................................................... 10
5. BLOCK DIAGRAM..................................................................................................................... 1 1
6. LIST OF PIN FUNCTIONS ........................................................................................................ 12
6.1 PORT PINS...................................................................................................................................... 12
6.2 NON-PORT PINS ............................................................................................................................ 13
6.3 I/O CIRCUITS FOR PINS AND HANDLING OF UNUSED PINS ................................................. 15
7. CPU ARCHITECTURE .............................................................................................................. 18
7.1 MEMORY SPACE ........................................................................................................................... 18
7.2 CPU REGISTERS............................................................................................................................ 21
7.2.1 General-Purpose Registers.......................................................................................... 21
7.2.2 Control Registers ........................................................................................................... 22
7.2.3 Special Function Registers (SFRs)............................................................................. 23
8. PERIPHERAL HARDWARE FUNCTIONS ............................................................................... 28
8.1 PORTS ............................................................................................................................................. 28
8.2 CLOCK GENERATOR .................................................................................................................... 29
8.3 REAL-TIME OUTPUT PORT .......................................................................................................... 31
8.4 TIMERS/COUNTERS ...................................................................................................................... 32
8.5 PWM OUTPUT (PWM0, PWM1)..................................................................................................... 34
8.6 A/D CONVERTER ........................................................................................................................... 35
8.7 D/A CONVERTER ........................................................................................................................... 36
8.8 SERIAL INTERFACE ...................................................................................................................... 37
8.8.1 Asynchronous Serial Interface/Three-Wire Serial I/O (UART/IOE) ......................... 38
8.8.2 Synchronous Serial Interface (CSI)............................................................................. 40
8.9 EDGE DETECTION FUNCTION..................................................................................................... 41
8.10 WATCHDOG TIMER ....................................................................................................................... 42
9. INTERRUPT FUNCTION ........................................................................................................... 43
9.1 INTERRUPT SOURCE.................................................................................................................... 43
9.2 VECTORED INTERRUPT ............................................................................................................... 45
9.3 CONTEXT SWITCHING .................................................................................................................. 4 6
9.4 MACRO SERVICE ........................................................................................................................... 46
9.5 EXAMPLES OF MACRO SERVICE APPLICATIONS .................................................................. 47
4
Page 5
mm
m
PD784020, 784021
mm
10. LOCAL BUS INTERFACE......................................................................................................... 49
10.1 MEMORY EXPANSION .................................................................................................................. 49
10.2 MEMORY SPACE ........................................................................................................................... 50
10.3 PROGRAMMABLE WAIT............................................................................................................... 51
10.4 PSEUDO-STATIC RAM REFRESH FUNCTION ........................................................................... 51
10.5 BUS HOLD FUNCTION .................................................................................................................. 51
11. STANDBY FUNCTION .............................................................................................................. 5 2
12. RESET FUNCTION .................................................................................................................... 53
13. INSTRUCTION SET ................................................................................................................... 54
14. ELECTRICAL CHARACTERISTICS ......................................................................................... 59
15. PACKAGE DRAWINGS ............................................................................................................ 8 0
16. RECOMMENDED SOLDERING CONDITIONS ........................................................................ 82
APPENDIX A DEVELOPMENT TOOLS........................................................................................ 83
APPENDIX B RELATED DOCUMENTS ....................................................................................... 85
H
H
5
Page 6
mm
m
PD784020, 784021
mm
1. DIFFERENCES BETWEEN
H
mm
m
PD784026 SUB-SERIES
mm
The only difference between the mPD784020, mPD784021, mPD784025, and mPD784026 is their capacity of
internal memory, port functions, and part of their packages.
The mPD78P4026 is produced by replacing the masked ROM in the mPD784025 or mPD784026 with 64K-byte one-
time PROM or EPROM. Table 1-1 shows the differences between these products.
mm
m
PD784026 Sub-Series
mm
m
PD784025
Product
Item Internal ROM
Internal RAM P40-P47
P50-P57 P60-P63
P64, P65
Package
Table 1-1 Differences between the
m
PD784020
None
512 bytes Functions only as an address/data bus
Functions only as an address bus Can be switched to an output-only port
or address bus in units of 2 bits, by using software
Functions only as the RD or WR pin
80-pin plastic QFP (14 ¥ 14 mm)
m
PD784021
2048 bytes
80-pin plastic QFP (14 ¥ 14 mm)
80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm)
48K bytes (masked ROM)
Can be switched to a general-purpose port or address/data bus, by using software
Can be switched to a general-purpose port or address bus in units of 2 bits, by using software
Functions as the RD or WR pin when the local bus interface is used. Functions as a general-purpose port in other cases.
80-pin plastic QFP (14 ¥ 14 mm)
m
PD784026
64K bytes (masked ROM)
m
PD78P4026
64K bytes (one-time PROM or EPROM)
80-pin plastic QFP (14 ¥ 14 mm)
80-pin ceramic WQFN (14 ¥ 14 mm)
6
Page 7
mm
m
PD784020, 784021
mm
2. MAIN DIFFERENCES BETWEEN
Series
Item Number of basic instructions 113 65
(mnemonics) Minimum instruction execution 160 ns 333 ns
time (at 25 MHz) (at 12 MHz) Memory space (program/data) 1M byte in total 64K bytes/1M byte Timer/counter 16-bit timer/counter ¥ 1 16-bit timer/counter ¥ 1
8/16-bit timer/counter ¥ 2 8-bit timer/counter ¥ 2
8/16-bit timer ¥ 1 8-bit timer ¥ 1 Clock output function Available Unavailable Watchdog timer Available Unavailable Serial interface UART/IOE (3-wire serial I/O) ¥ 2 channels UART ¥ 1 channel
CSI (3-wire serial I/O, SBI) ¥ 1 channel CSI (3-wire serial I/O, SBI) ¥ 1 channel Interrupt Context switching Available Unavailable
Priority 4 levels 2 levels
Standby function 3 modes
mm
m
PD784026 AND
mm
m
PD784026 sub-series
(HALT, STOP, IDLE)
mm
m
PD78234 SUB-SERIES
mm
m
PD78234 sub-series
2 modes (HALT, STOP) Operation clock switching Selectable from fXX/2, fXX/4, fXX/8, or fXX/16 Fixed to fXX/2 Pin MODE pin Unavailable To specify ROM-less mode
functions (always in the high level for the mPD78233
or mPD78237)
TEST pin Pin for testing the device Unavailable
Low level during ordinary use
Package 80-pin plastic QFP (14 ¥ 14 mm) 80-pin plastic QFP (14 ¥ 14 mm)
80-pin plastic TQFP (fine pitch) 94-pin plastic QFP (20 ¥ 20 mm) (12 ¥ 12 mm): for the mPD784021 only 84-pin plastic QFJ (1150 ¥ 1150 mil) 80-pin ceramic WQFN (14 ¥ 14 mm): 94-pin ceramic WQFN (20 ¥ 20 mm): for the mPD78P4026 only for the mPD78P238 only
7
Page 8
3. PIN CONFIGURATION (TOP VIEW)
80-pin plastic QFP (14 ¥ 14 mm)
H
m
PD784020GC-3B9, mPD784021GC-3B9
80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm)
m
H
PD784021GK-BE9
P31/ TxD/SO1
P30/RxD/SI1
P27/SI0
P26/INTP5
P25/INTP4/ASCK/SCK1
P24/INTP3
P23/INTP2/CI
P22/INTP1
REF3
P21/INTP0
P20/NMI
AV
REF2
AV
ANO1
ANO0
SS
AV
REF1
AV
DD
P77/ANI7
AV
mm
m
PD784020, 784021
mm
P76/ANI6
P75/ANI5
P32/SCK0
P33/SO0/SB0
P34/ TO0
P35/TO1 P36/TO2 P37/TO3
RESET
V
X2 X1
V P00 P01 P02 P03 P04 P05 P06 P07
P67/REFRQ/HLDAK
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 2 3 4 5 6 7
DD
SS
8
9 10 11 12 13 14 15 16 17 18 19 20
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
A9
WR
RD
P63/A19
P62/A18
P61/A17
P60/A16
A15
A14
A13
A12
A11
A10
A8
AD7
AD6
AD5
AD4
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
AD3
P74/ANI4 P73/ANI3 P72/ANI2 P71/ANI1 P70/ANI0
DD
V P17 P16 P15 P14/T
X
D2/SO2
X
D2/SI2
P13/R P12/ASCK2/SCK2 P11/PWM1 P10/PWM0
Note
TEST V ASTB AD0 AD1 AD2
SS
P66/ WAIT/HLDRQ
Note Connect the TEST pin to VSS directly.
8
Page 9
mm
m
PD784020, 784021
mm
P00-P07 : Port 0 A8-A19 : Address bus P10-P17 : Port 1 RD : Read strobe P20-P27 : Port 2 WR : Write strobe P30-P37 : Port 3 WAIT : Wait P60-P63, P66, P67 : Port 6 HLDRQ : Hold request P70-P77 : Port 7 HLDAK : Hold acknowledge TO0-TO3 : Timer output ASTB : Address strobe CI : Clock input REFRQ : Refresh request RxD, RxD2 : Receive data RESET : Reset TxD, TxD2 : Transmit data X1, X2 : Crystal SCK0-SCK2 : Serial clock ANI0-ANI7 : Analog input ASCK, ASCK2 : Asynchronous serial clock ANO0, ANO1 : Analog output SI0-SI2 : Serial input AV SO0-SO2 : Serial output AV SB0 : Serial bus AV PWM0, PWM1 : Pulse width modulation output V NMI : Non-maskable interrupt V INTP0-INTP5 : Interrupt from peripherals TEST : Test AD0-AD7 : Address/data bus
REF1-AVREF3 : Reference voltage DD : Analog power supply
SS : Analog ground DD : Power supply SS : Ground
9
Page 10
4. SYSTEM CONFIGURATION EXAMPLE (PPC)
µ
PD784021
mm
m
PD784020, 784021
mm
Serial  communication
µ
PD27C1001A
O0-O7
A0-A7
Sensing paper transport
 Temperature of the 
fusing heater
Brightness of the lamp
Lever for adjusting  the tone of the copy
Lever for compensating  the tone of the copy
µ
PD74HC573
Reset  circuit
Latch
RxD TxD
RDOE A17CE
A8-A16A8-A16
AD0-AD7
ASTB
INTP0 ANI0
ANI1
ANI2
ANI3
RESET
P11 P15
P16 P17
SCK1
SI1
SO1
P04 P06
P07
P66
PWM0
P00-P03
P33
P34
P35
P36
P37
Sensing paper Sensing paper feed Sensing paper ejection Sensing the position of the scanner station
Operator 
panel
High-voltage  control circuit
Fusing heater  control circuit
Lamp regulator
Driver
Drum, toner, and charge for  transfer
Fusing roller
Lamp for lighting the original Lamp for discharging
(DC stepping motor) 
Solenoid 
Main motor
M
Clutch for stopping 
SL
the scanner station 
Clutch for forwarding 
SL
the scanner station
Clutch for the resist 
SL
shutter
Clutch for manual 
SL
feeding
Clutch for cassette 
SL
feeding
10
Page 11
5. BLOCK DIAGRAM
mm
m
PD784020, 784021
mm
NMI
INTP0-INTP5
INTP3
TO0 TO1
INTP0
INTP1
INTP2/CI
TO2 TO3
P00-P03
P04-P07
PWM0 PWM1
Programmable interrupt controller
Timer/counter 0
(16 bits)
Timer/counter 1
(16 bits)
Timer/counter 2
(16 bits)
Timer 3
(16 bits)
Real-time output port
PWM
78K/IV  CPU core
RAM
UART/IOE2
Baud-rate  generator
UART/IOE1
Baud-rate  generator
Clocked serial interface
Bus interface
Port 0
Port 1
Port 2
RxD/SI1 TxD/SO1
ASCK/SCK1
RxD2/SI2 TxD2/SO2
ASCK2/SCK2
SCK0 SO0/SB0 SI0
ASTB AD0-AD7 A8-A15 A16-A19
RD WR WAIT/HLDRQ REFRQ/HLDAK
P00-P07
P10-P17
P20-P27
ANO0 ANO1
AV
REF2
AV
REF3
ANI0-ANI7
AV
DD
AV
REF1
AV
INTP5
SS
D/A converter
A/D converter
Watchdog timer
Remark The internal ROM or RAM capacity differs for each product.
Port 3
Port 6
Port 7
System control
P30-P37
P60-P63 P60, P67
P70-P77 RESET
TEST X1
 X2
V
DD
V
SS
11
Page 12
6. LIST OF PIN FUNCTIONS
6.1 PORT PINS
mm
m
PD784020, 784021
mm
Pin
P00-P07
P10 P11 P12 P13 P14 P15-P17 P20 P21 P22 P23 P24 P25 P26 P27 P30 P31 P32 P33 P34-P37 P60-P63
P66
P67
P70-P77
I/O I/O
I/O
Input
I/O
I/O
I/O
Dual-function
PWM0 PWM1 ASCK2/SCK2 RxD2/SI2 TxD2/SO2
— NMI INTP0 INTP1 INTP2/CI INTP3 INTP4/ASCK/SCK1 INTP5 SI0 RxD/SI1 TxD/SO1 SCK0 SO0/SB0 TO0-TO3 A16-A19
WAIT/HLDRQ
REFRQ/HLDAK
ANI0-ANI7
Function
Port 0 (P0):
Ý 8-bit I/O port Ý Functions as a real-time output port (4 bits ¥ 2). Ý Inputs and outputs can be specified bit by bit. Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together. Ý Can drive a transistor. Port 1 (P1):
Ý 8-bit I/O port Ý Inputs and outputs can be specified bit by bit. Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together. Ý Can drive LED.
Port 2 (P2):
Ý 8-bit input-only port Ý P20 does not function as a general-purpose port (nonmaskable inter-
rupt). However, the input level can be checked by an interrupt service
routine. Ý The use of the pull-up resistors can be specified by software for pins
P22 to P27 (in units of 6 bits). Ý The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 output pin by
CSIM1. Port 3 (P3):
Ý 8-bit I/O port Ý Inputs and outputs can be specified bit by bit. Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Port 6 (P6):
Ý P60 to P63 are an output-only port. Ý Inputs and outputs can be specified bit by bit for pins P66 and P67. Ý The use of the pull-up resistors can be specified by software for the pins
in the input mode together. Port 7 (P7):
Ý 8-bit I/O port Ý Inputs and outputs can be specified bit by bit.
12
Page 13
mm
m
PD784020, 784021
mm
6.2 NON-PORT PINS (1/2)
Pin I/O Dual-function Function TO0-TO3 Output P34-P37 Timer output CI Input P23/INTP2 Input of a count clock for timer/counter 2 RXD Input P30/SI1 Serial data input (UART0) RXD2 P13/SI2 Serial data input (UART2) TXD Output P31/SO1 Serial data output (UART0) TXD2 P14/SO2 Serial data output (UART2) ASCK Input P25/INTP4/SCK1 Baud rate clock input (UART0) ASCK2 P12/SCK2 Baud rate clock input (UART2) SB0 I/O P33/SO0 Serial data I/O (SBI) SI0 Input P27 Serial data input (3-wire serial I/O0) SI1 P30/RXD Serial data input (3-wire serial I/O1) SI2 P13/RXD2 Serial data input (3-wire serial I/O2) SO0 Output P33/SB0 Serial data output (3-wire serial I/O0) SO1 P31/TXD Serial data output (3-wire serial I/O1) SO2 P14/TXD2 Serial data output (3-wire serial I/O2) SCK0 I/O P32 Serial clock I/O (3-wire serial I/O0, SBI) SCK1 P25/INTP4/ASCK Serial clock I/O (3-wire serial I/O1) SCK2 P12/ASCK2 Serial clock I/O (3-wire serial I/O2) NMI Input P20 INTP0 P21 Ý Input of a count clock for timer/counter 1
INTP1 P22 Ý Input of a count clock for timer/counter 2
INTP2 P23/CI Ý Input of a count clock for timer/counter 2
INTP3 P24 Ý Input of a count clock for timer/counter 0
INTP4 P25/ASCK/SCK1 — INTP5 P26 AD0-AD7 I/O Time multiplexing address/data bus (for connecting external memory) A8-A15 Output High-order address bus (for connecting external memory) A16-A19 Output P60-P63 RD Output Strobe signal output for reading the contents of external memory WR Output Strobe signal output for writing on external memory WAIT Input P66/HLDRQ Wait signal insertion REFRQ Output P67/HLDAK Refresh pulse output to external pseudo static memory HLDRQ Input P66/WAIT Input of bus hold request HLDAK Output P67/REFRQ Output of bus hold response ASTB Output Latch timing output of time multiplexing address (A0-A7) (for
External interrupt request
Ý Capture/trigger signal for CR11 or CR12
Ý Capture/trigger signal for CR22
Ý Capture/trigger signal for CR21
Ý Capture/trigger signal for CR02
Input of a conversion start trigger for A/D converter
High-order address bus during address expansion (for connecting external memory)
connecting external memory)
13
Page 14
mm
m
PD784020, 784021
mm
6.2 NON-PORT PINS (2/2)
Pin I/O Dual-function Function RESET Input Chip reset X1 Input Crystal input for system clock oscillation (A clock pulse can also be X2 — ANI0-ANI7 Input P70-P77 Analog voltage inputs for the A/D converter ANO0, ANO1 Output Analog voltage inputs for the D/A converter AVREF1 Application of A/D converter reference voltage AVREF2, AVREF3 AVDD Positive power supply for the A/D converter AVSS Ground for the A/D converter VDD Positive power supply VSS Ground TEST Directly connect to VSS. (The TEST pin is for the IC test.)
input to the X1 pin.)
Application of D/A converter reference voltage
14
Page 15
mm
m
PD784020, 784021
mm
6.3 I/O CIRCUITS FOR PINS AND HANDLING OF UNUSED PINS
Table 6-1 describes the types of I/O circuits for pins and the handling of unused pins. Fig. 6-1 shows the configuration of these various types of I/O circuits.
Table 6-1 Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)
Pin I/O circuit type I/O Recommended connection method for unused pins P00-P07 5-A I/O Input state : To be connected to VDD P10/PWM0 Output state: To be left open
P11/PWM1 P12/ASCK2/SCK2 8-A P13/RxD2/SI2 5-A P14/TxD2/SO2 P15-P17 P20/NMI 2 Input To be connected to VDD or VSS P21/INTP0 P22/INTP1 2-A To be connected to VDD P23/INTP2/CI P24/INTP3 P25/INTP4/ASCK/SCK1 8-A I/O Input state : To be connected to VDD
Output state: To be left open P26/INTP5 2-A Input To be connected to VDD P27/SI0 P30/RxD/SI1 5-A I/O Input state : To be connected to VDD P31/TxD/SO1 Output state: To be left open P32/SCK0 8-A P33/SO0/SB0 10-A P34/TO0-P37/TO3 5-A AD0-AD7 A8-A15 Output P60/A16-P63/A19 RD WR
Note
To be left open
P66/WAIT/HLDRQ I/O Input state : To be connected to VDD P67/REFRQ/HLDAK Output state: To be left open P70/ANI0-P77/ANI7 20 Input state : To be connected to VDD or VSS
Output state: To be left open ANO0, ANO1 12 Output To be left open ASTB 4
Note These pins function as output-only pins depending on the internal circuit, though their I/O type is 5-A.
15
Page 16
mm
m
PD784020, 784021
mm
Table 6-1 Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)
Pin I/O circuit type I/O Recommended connection method for unused pins RESET 2 Input — TEST 1 To be connected to VSS directly AVREF1-AVREF3 To be connected to VSS AVSS AVDD To be connected to VDD
Caution When the I/O mode of an I/O dual-function pin is unpredictable, connect the pin to VDD through
a resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher than that of the low level input at power-on or when I/O is switched by software).
Remark Since type numbers are consistent in the 78K series, those numbers are not always serial in each product.
(Some circuits are not included.)
16
Page 17
Fig. 6-1 I/O Circuits for Pins
mm
m
PD784020, 784021
mm
Type 1 Type 2-A
IN
Type 2
IN
Schmitt trigger input with hysteresis characteristics
Type 4
Data
DD
V
P
N
Type 5-A
DD
V
P
OUT
Output disable
N
Push-pull output which can output high impedance (both the positive and negative channels are off.)
Type 8-A
VDD
Type 12
V
DD
P
IN
Schmitt trigger input with hysteresis characteristics
V
Pull-up enable
Data
Output disable
Input enable
DD
V
P
N
Pull-up enable
DD
P
IN/OUT
Pull-up enable
Output disable
Type 10-A
Pull-up enable
Open drain Output disable
Data
Data
VDD
P
P
IN/OUT
N
Type 20
V
DD
P
V
DD
P
IN/OUT
N
Input enable
Analog output voltage
Data
Output disable
Comparator
(Threshold voltage)
P
OUT
N
V
DD
P
IN/OUT
N
+ –
V
REF
P N
17
Page 18
mm
m
PD784020, 784021
mm
7. CPU ARCHITECTURE
7.1 MEMORY SPACE
A 1M-byte memory space can be accessed. By using a LOCATION instruction, the mode for mapping internal data areas (special function registers and internal RAM) can be selected. A LOCATION instruction must always be executed after a reset, and can be used only once.
(1) When the LOCATION 0 instruction is executed
m
Internal data areas are mapped to 0FD00H-0FFFFH for the
(2) When the LOCATION 0FH instruction is executed
Internal data areas are mapped to FFD00H-FFFFFH for the
PD784020 and 0F700H-0FFFFH for the mPD784021.
m
PD784020 and FF700H-FFFFFH for the mPD784021.
18
Page 19
mm
m
PD784020, 784021
mm
Note
(256 bytes)
Internal RAM 
Special function registers (SFRs)
When the LOCATION 0FH 
instruction is executed
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH

HH
HH
H
FFEFFH
FFE80H
PD784020 Memory Map
mm
mm
m
Fig. 7-1
General-purpose 
0FEFFH
0FE80H
(512 bytes)
FFD00H
FFCFFH
FFE7FH
FFE2FH
registers 
(128 bytes)
FFE06H
Macro service control 
0FE7FH
0FE2FH
0FE06H
FFD00H
Data area (512 bytes)
word area (42 bytes)
0FD00H
External memory 
(1,047,808 bytes)
00FFFH
00FFFH
10000H
0FFFFH
00000H
00800H
007FFH
00080H
0007FH
CALLF entry area 
(2K bytes)CALLT table area 
00800H
007FFH
00080H
0007FH
(64 bytes)
Vector table area 
(64 bytes)
00040H
0003FH
00000H
External memory 
(960K bytes)
When the LOCATION 0 
instruction is executed
FFFFFH
10000H
(256 bytes)
Internal RAM 
(512 bytes)
Special function registers (SFRs)
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0FD00H
0FCFFH
00000H
Note
External memory 
(64,768 bytes)
Note Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
19
Page 20
(256 bytes)
Internal RAM 
(2,048 bytes)
Special function registers (SFRs)
When the LOCATION 0FH 
instruction is executed
External memory 
(1,046,272 bytes)
mm
m
PD784020, 784021
mm
Note
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF700H
FFEFFH
FFE80H
General-purpose 
PD784021 Memory Map
mm
mm
m
Fig. 7-2
registers 
0FEFFH
0FE80H
FF6FFH

FFE7FH
FFE2FH
(128 bytes)
0FE7FH
0FE2FH
FFE06H
Macro service control 
0FE06H
FFD00H
FFCFFH
FF700H
Program/data area 
(1,536 bytes)
Data area (512 bytes)
word area (42 bytes)
0FD00H
0FCFFH
0F700H
00FFFH
00FFFH
00800H
CALLF entry area 
00800H
Note
10000H
0FFFFH

007FFH
00080H
0007FH
(2K bytes)CALLT table area 
007FFH
00080H
0007FH
00000H
(64 bytes)
Vector table area 
(64 bytes)
00040H
0003FH
00000H
20
External memory 
(960K bytes)
When the LOCATION 0 
instruction is executed
FFFFFH
(256 bytes)
Internal RAM 
(2,048 bytes)
Special function registers (SFRs)
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0FD00H
0FCFFH
0F700H
0F6FFH
External memory 
(63,232 bytes)
00000H
Note Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
Page 21
mm
m
PD784020, 784021
mm
7.2 CPU REGISTERS
7.2.1 General-Purpose Registers
A set of general-purpose registers consists of sixteen general-purpose 8-bit registers. Two 8-bit general-purpose registers can be combined to form a 16-bit general-purpose register. Moreover, four 16-bit general-purpose registers, when combined with an 8-bit register for address extension, can be used as 24-bit address specification registers.
Eight banks of this register set are provided. The user can switch between banks by software or the context switching function.
General-purpose registers other than the V, U, T, and W registers used for address extension are mapped onto internal RAM.
Fig. 7-3 General-Purpose Register Format
A (R1) X (R0)
AX (RP0)
B (R3) C (R2)
BC (RP1)
R5 R4
RP2
R7 R6
RP3
V
VVP (RG4)
U
UUP (RG5)
T
TDE (RG6)
W L (R14)
WHL (RG7)
The character strings enclosed in  parentheses represent absolute names. 
R9 R8
VP (RP4)
R11 R10
UP (RP5)
D (R13) E (R12)
DE (RP6)
H (R15)
HL (RP7)
8 banks
Caution By setting the RSS bit of PSW to 1, R4, R5, R6, R7, RP2, and RP3 can be used as the X, A, C, B,
AX, and BC registers, respectively. However, this function must be used only when using programs for the 78K/III series.
21
Page 22
mm
m
PD784020, 784021
mm
7.2.2 Control Registers
(1) Program counter (PC)
This register is a 20-bit program counter. The program counter is automatically updated by program execution.
Fig. 7-4 Format of Program Counter (PC)
19 0
PC
(2) Program Status Word (PSW)
This register holds the CPU state. The program status word is automatically updated by program execution.
Fig. 7-5 Format of Program Status Word (PSW)
15 14 13 12
PSWH
PSW
PSWL
Note This flag is used to maintain compatibility with the 78K/III series. This flag must be set to 0 when programs
for the 78K/III series are being used.
(3) Stack pointer (SP)
This register is a 24-bit pointer for holding the start address of the stack. The high-order 4 bits must be set to 0.
PC 0 0 0 0
UF RBS2 RBS1 RBS0
76543210
Note
S Z RSS
Fig. 7-6 Format of Stack Pointer (SP)
23 20 0
AC IE P/V 0 CY
11 10 9 8
22
Page 23
mm
m
PD784020, 784021
mm
7.2.3 Special Function Registers (SFRs)
The special function registers are registers with special functions such as mode registers and control registers for built-in peripheral hardware. The special function registers are mapped onto the 256-byte space between 0FF00H
Note
and 0FFFFH
Note Applicable when the LOCATION 0 instruction is executed. FFF00H-FFFFFH when the LOCATION 0FH
Caution Never attempt to access addresses in this area where no SFR is allocated. Otherwise, the
Table 7-1 lists the special function registers (SFRs). The titles of the table columns are explained below.
.
instruction is executed.
mm
m
PD784021 may be placed in the deadlock state. The deadlock state can be cleared only by a
mm
reset.
Abbreviation ................... Symbol used to represent a built-in SFR. The abbreviations listed in the table are
reserved words for the NEC assembler (RA78K4). The C compiler (CC78K4) allows the abbreviations to be used as sfr variables of bit type with the #pragma sfr command.
R/W ................................. Indicates whether each SFR allows read and/or write operations.
R/W : Allows both read and write operations. R : Allows read operations only. W : Allows write operations only.
Manipulatable bits .......... Indicates the maximum number of bits that can be manipulated whenever an SFR is
manipulated. An SFR that supports 16-bit manipulation can be described in the sf r operand. For address specification, an even-numbered address must be speci­fied. An SFR that supports 1-bit manipulation can be described in a bit manipulation instruction.
When reset ..................... Indicates the state of each register when RESET is applied.
H
23
Page 24
Table 7-1 Special Function Registers (SFRs) (1/4)
mm
m
PD784020, 784021
mm
Note
Address
0FF00H Port 0 P0 R/W ll Undefined 0FF01H Port 1 P1 ll – 0FF02H Port 2 P2 R ll – 0FF03H Port 3 P3 R/W ll – 0FF06H Port 6 P6 ll 00H 0FF07H Port 7 P7 ll Undefined 0FF0EH Port 0 buffer register L P0L ll – 0FF0FH Port 0 buffer register H P0H ll – 0FF10H Compare register (timer/counter 0) CR00 l 0FF12H Capture/compare register (timer/counter 0) CR01 l 0FF14H Compare register L (timer/counter 1) CR10 0FF15H Compare register H (timer/counter 1) – 0FF16H Capture/compare register L (timer/counter 1) CR11 0FF17H Capture/compare register H (timer/counter 1) – 0FF18H Compare register L (timer/counter 2) CR20 0FF19H Compare register H (timer/counter 2) – 0FF1AH Capture/compare register L (timer/counter 2) CR21
Special function register (SFR) name Abbreviation R/W
CR10W
CR11W
CR20W
CR21W
Manipulatable bits
1 bit 8 bits 16 bits
ll
ll
ll
ll
When reset
0FF1BH Capture/compare register H (timer/counter 2) – 0FF1CH Compare register L (timer 3) CR30 0FF1DH Compare register H (timer 3) – 0FF20H Port 0 mode register PM0 ll FFH 0FF21H Port 1 mode register PM1 ll – 0FF23H Port 3 mode register PM3 ll – 0FF26H Port 6 mode register PM6 ll – 0FF27H Port 7 mode register PM7 ll – 0FF2EH Real-time output port control register RTPC ll 00H 0FF30H Capture/compare control register 0 CRC0 l 10H 0FF31H Timer output control register TOC ll 00H 0FF32H Capture/compare control register 1 CRC1 l – 0FF33H Capture/compare control register 2 CRC2 l 10H
CR30W
ll
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
24
Page 25
mm
m
mm
Table 7-1 Special Function Registers (SFRs) (2/4)
PD784020, 784021
Address
0FF36H Capture register (timer/counter 0) CR02 R l 0000H 0FF38H Capture register L (timer/counter 1) CR12 0FF39H Capture register H (timer/counter 1) – 0FF3AH Capture register L (timer/counter 2) CR22 0FF3BH Capture register H (timer/counter 2) – 0FF41H Port 1 mode control register PMC1 R/W ll 00H 0FF43H Port 3 mode control register PMC3 ll – 0FF4EH Register for optional pull-up resistor PUO ll – 0FF50H Timer register 0 TM0 R l 0000H 0FF51H –– 0FF52H Timer register 1 TM1 TM1W ll 0FF53H – 0FF54H Timer register 2 TM2 TM2W ll 0FF55H – 0FF56H Timer register 3 TM3 TM3W ll 0FF57H
Note
Special function register (SFR) name Abbreviation R/W
CR12W
CR22W
Manipulatable bits
1 bit 8 bits 16 bits
ll
ll
When reset
0FF5CH Prescaler mode register 0 PRM0 R/W l 11H 0FF5DH Timer control register 0 TMC0 ll 00H 0FF5EH Prescaler mode register 1 PRM1 l 11H 0FF5FH Timer control register 1 TMC1 ll 00H 0FF60H D/A conversion value setting register 0 DACS0 l – 0FF61H D/A conversion value setting register 1 DACS1 l – 0FF62H D/A converter mode register DAM ll 03H 0FF68H A/D converter mode register ADM ll 00H 0FF6AH A/D conversion result register ADCR R l Undefined 0FF70H PWM control register PWMC R/W ll 05H 0FF71H PWM prescaler register PWPR l 00H 0FF72H PWM modulo register 0 PWM0 l Undefined 0FF74H PWM modulo register 1 PWM1 l 0FF7DH One-shot pulse output control register OSPC ll 00H 0FF80H Serial bus interface control register SBIC ll – 0FF82H Synchronous serial interface mode register CSIM ll
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
25
Page 26
Table 7-1 Special Function Registers (SFRs) (3/4)
mm
m
PD784020, 784021
mm
Note 1
Address
0FF84H Synchronous serial interface mode register 1 CSIM1 R/W ll 00H 0FF85H Synchronous serial interface mode register 2 CSIM2 ll – 0FF86H Serial shift register SIO l – 0FF88H Asynchronous serial interface mode register ASIM ll – 0FF89H Asynchronous serial interface mode register 2 ASIM2 ll – 0FF8AH Asynchronous serial interface status register ASIS R ll– 0FF8BH Asynchronous serial interface status register 2 ASIS2 ll – 0FF8CH Serial receive buffer: UART0 RXB l Undefined
0FF8DH Serial receive buffer: UART2 RXB2 R l
0FF90H Baud rate generator control register BRGC l 00H 0FF91H Baud rate generator control register 2 BRGC2 l – 0FFA0H External interrupt mode register 0 INTM0 ll – 0FFA1H External interrupt mode register 1 INTM1 ll
Special function register (SFR) name Abbreviation R/W
Serial transmission shift register: UART0 TXS W l – Serial shift register: IOE1 SIO1 R/W l
Serial transmission shift register: UART2 TXS2 W l – Serial shift register: IOE2 SIO2 R/W l
Manipulatable bits
1 bit 8 bits 16 bits
When reset
0FFA4H Sampling clock selection register SCS0 l – 0FFA8H In-service priority register ISPR R ll – 0FFAAH Interrupt mode control register IMC R/W ll 80H 0FFACH Interrupt mask register 0L MK0L MK0 ll lFFFFH 0FFADH Interrupt mask register 0H MK0H ll 0FFAEH Interrupt mask register 1L MK1L ll FFH 0FFC0H Standby control register STBC l 0FFC2H Watchdog timer mode register WDM l 0FFC4H Memory expansion mode register MM ll 20H 0FFC5H Hold mode register HLDM ll 00H 0FFC6H Clock output mode register CLOM ll – 0FFC7H Programmable wait control register 1 PWC1 l AAH 0FFC8H Programmable wait control register 2 PWC2 l AAAAH
Note 2
Note 2
30H – 00H
Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
2. A write operation can be performed only with special instructions MOV STBC,#byte and MOV WDM,#byte. Other instructions cannot perform a write operation.
26
Page 27
mm
m
mm
Table 7-1 Special Function Registers (SFRs) (4/4)
PD784020, 784021
Address
0FFCCH Refresh mode register RFM R/W ll 00H 0FFCDH Refresh area specification register RFA ll – 0FFCFH Oscillation settling time specification register OSTS l – 0FFD0H- External SFR area ll – 0FFDFH 0FFE0H Interrupt control register (INTP0) PIC0 ll 43H 0FFE1H Interrupt control register (INTP1) PIC1 ll – 0FFE2H Interrupt control register (INTP2) PIC2 ll – 0FFE3H Interrupt control register (INTP3) PIC3 ll – 0FFE4H Interrupt control register (INTC00) CIC00 ll– 0FFE5H Interrupt control register (INTC01) CIC01 ll– 0FFE6H Interrupt control register (INTC10) CIC10 ll– 0FFE7H Interrupt control register (INTC11) CIC11 ll– 0FFE8H Interrupt control register (INTC20) CIC20 ll– 0FFE9H Interrupt control register (INTC21) CIC21 ll– 0FFEAH Interrupt control register (INTC30) CIC30 ll – 0FFEBH Interrupt control register (INTP4) PIC4 ll
Note
Special function register (SFR) name Abbreviation R/W
Manipulatable bits
1 bit 8 bits 16 bits
When reset
0FFECH Interrupt control register (INTP5) PIC5 ll – 0FFEDH Interrupt control register (INTAD) ADIC ll– 0FFEEH Interrupt control register (INTSER) SERIC ll– 0FFEFH Interrupt control register (INTSR) SRIC ll
Interrupt control register (INTCSI1) CSIIC1 ll– 0FFF0H Interrupt control register (INTST) STIC ll – 0FFF1H Interrupt control register (INTCSI) CSIIC ll – 0FFF2H Interrupt control register (INTSER2) SERIC2 ll– 0FFF3H Interrupt control register (INTSR2) SRIC2 ll
Interrupt control register (INTCSI2) CSIIC2 ll– 0FFF4H Interrupt control register (INTST2) STIC2 ll
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
27
Page 28
mm
m
PD784020, 784021
mm
8. PERIPHERAL HARDWARE FUNCTIONS
8.1 PORTS
The ports shown in Fig. 8-1 are provided to enable the application of wide-ranging control. Table 8-1 lists the
functions of the ports. For the inputs to port 0 to port 6, a built-in pull-up resistor can be specified by software.
Fig. 8-1 Port Configuration
P00
Port 0
P07
P10
Port 1
P17
P30
P37 P60
P63 P66 P67
P70
P77
Port 2P20-P27
8
Port 3
Port 6
Port 7
28
Page 29
mm
m
PD784020, 784021
mm
Table 8-1 Port Functions
Port name Pin Function Pull-up specification by software
Port 0 P00-P07 • Bit-by-bit input/output setting supported Specified as a batch for all pins placed in
• Operable as 4-bit real-time outputs input mode. (P00-P03, P04-P07)
• Capable of driving transistors
Port 1 P10-P17 • Bit-by-bit input/output setting supported Specified as a batch for all pins placed in
• Capable of driving LEDs input mode.
Port 2 P20-P27 • Input port Specified for the 6 bits (P22-P27) as a batch. Port 3 P30-P37 • Bit-by-bit input/output setting supported Specified as a batch for all pins placed in
input mode.
Port 6 P60-P63 • Output-only port
P66, P67 • Bit-by-bit input/output setting supported
Port 7 P70-P77 • Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in input mode.
8.2 CLOCK GENERATOR
A circuit for generating the clock signal required for operation is provided. The clock generator includes a frequency divider; low current consumption can be achieved by operating at a lower internal frequency when high-speed operation is not necessary.
Fig. 8-2 Block Diagram of Clock Generator
X1
Oscillator
X2
XX
f
1/2 1/2 1/2 1/2
XX
/2
f
UART/IOE INTP0 noise eliminator Oscillation settling timer
Selector
f
CLK
CPU Peripheral circuits
Remark f
XX : Oscillator frequency or external clock input CLK : Internal operating frequency
f
29
Page 30
Fig. 8-3 Examples of Using Oscillator
(1) Crystal/ceramic oscillation
µ
PD784021
V
SS
X1
X2
mm
m
PD784020, 784021
mm
H
When EXTC bit of OSTS = 1 When EXTC bit of OSTS = 0
µ
PD784021
X1
PD74HC04, etc.
µ
Caution When using the clock generator, to avoid problems caused by influences such as stray
capacitance, run all wiring within the area indicated by the dotted lines according to the following rules:
X2
(2) External clock
Open
X1
X2
PD784021
µ
Minimize the wiring length.
Wires must never cross other signal lines.
Wires must never run near a line carrying a large varying current.
The grounding point of the capacitor of the oscillator circuit must always be at the same
potential as V
SS. Never connect the capacitor to a ground pattern carrying a large current.
Never extract a signal from the oscillator circuit.
30
Page 31
mm
m
PD784020, 784021
mm
8.3 REAL-TIME OUTPUT PORT
The real-time output port outputs data stored in the buffer, synchronized with a timer/counter 1 match interrupt or external interrupt. Thus, pulse output that is free of jitter can be obtained.
Therefore, the real-time output port is best suited to applications (such as open-loop control over stepping motors) where an arbitrary pattern is output at arbitrary intervals.
As shown in Fig. 8-4, the real-time output port is built around port 0 and the port 0 buffer register (P0H, P0L).
Fig. 8-4 Block Diagram of Real-Time Output Port
Internal bus
INTP0 (externally) INTC10 (from timer/counter 1) INTC11 (from timer/counter 1)
8
Real-time output port  control register  (RTPC)
Output trigger
control circuit
4
P07
4
Buffer register
Output latch (P0)
4
8
P0LP0H
4
P00
31
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8.4 TIMERS/COUNTERS
Three timer/counter units and one timer unit are incorporated. Moreover, seven interrupt requests are supported, allowing these units to function as seven timer/counter units.
Table 8-2 Timer/Counter Operation
Name
Item Count pulse width 8 bits lll
H
Operating mode Interval timer 2ch 2ch 2ch 1ch
Function Timer output 2ch 2ch
Note The one-shot pulse output function makes the level of a pulse output active by software, and makes the
level of a pulse output inactive by hardware (interrupt request signal). Note that this function differs from the one-shot timer function of timer/counter 2.
16 bits llll
External event counter lll– One-shot timer l
Toggle output l l – PWM/PPG output l l – One-shot pulse output Real-time output l –– Pulse width measurement 1 input 1 input 2 inputs – Number of interrupt requests 2 2 2 1
Timer/counter 0 Timer/counter 1 Timer/counter 2 Timer 3
Note
l –––
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Timer/counter 0
fxx/8
INTP3
Timer/counter 1
fxx/8
INTP0
Prescaler
Edge detection
Prescaler
Event input
Edge detection
Fig. 8-5 Timer/Counter Block Diagram
Clear information
Timer register 0
Selector
INTP3
Selector
INTP0
(TM0)
Compare register (CR00)
Compare register (CR01)
Capture register (CR02)
Clear information
Timer register 1 (TM1/TM1M)
Compare register (CR10/CR10W)
Capture/compare register  (CR11/CR11W)
Capture register (CR12/CR12W) 
Match
Match
Match
Match
Software trigger
OVF
Pulse output control
INTC00 INTC01
OVF
INTC10
To real-time  output port
INTC11
H
TO0
TO1
Timer/counter 2
INTP2/C1
INTP1
fxx/8
Edge detection
Prescaler
Edge detection
Timer 3
fxx/8
Remark OVF: Overflow flag
INTP2
Prescaler
Selector
INTP1
Clear information
Timer register 2 (TM2/TM2W)
Compare register (CR20/CR20W)
Capture/compare register (CR21/CR21W)
Capture register (CR22/CR22W)
Timer register 3  (TM3/TM3W)
Compare register (CR30/CR30W)
Match
Match
Clear
Match
OVF
TO2
TO3
Pulse output control
INTC20 INTC21
CSI
INTC30
33
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8.5 PWM OUTPUT (PWM0, PWM1)
Two channels of PWM (pulse width modulation) output circuitry with a resolution of 12 bits and a repetition frequency of 48.8 kHz (fCLK = 12.5 MHz) are incorporated. Low or high active level can be selected for the PWM output channels, independently of each other. This output is best suited to DC motor speed control.
Fig. 8-6 Block Diagram of PWM Output Unit
Internal bus
CLK
f
Prescaler
Remark n = 0, 1
 PWM modulo register
15 0
PWMn
84
8-bit  down-counter
1/256
16
8 7 4 3
Pulse control circuit
4-bit counter
8
PWM control register (PWMC)
Reload
control
Output control
PWMn (output pin)
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8.6 A/D CONVERTER
An analog/digital (A/D) converter having 8 multiplexed analog inputs (ANI0-ANI7) is incorporated.
The successive approximation system is used for conversion. The result of conversion is held in the 8-bit A/D conversion result register (ADCR). Thus, speedy high-precision conversion can be achieved. (The conversion time is about 10 ms at fCLK = 12.5 MHz.)
A/D conversion can be started in any of the following modes:
Hardware start: Conversion is started by means of trigger input (INTP5).
Software start : Conversion is started by means of bit setting the A/D converter mode register (ADM).
After conversion has started, one of the following modes can be selected:
Scan mode : Multiple analog inputs are selected sequentially to obtain conversion data from all pins.
Select mode: A single analog input is selected at all times to enable conversion data to be obtained
continuously.
ADM is used to specify the above modes, as well as the termination of conversion.
When the result of conversion is transferred to ADCR, an interrupt request (INTAD) is generated. Using this feature, the results of conversion can be continuously transferred to memory by the macro service.
ANI0 ANI1 ANI2 ANI3 ANI4 ANI5 ANI6 ANI7
INTP5
Input selector
Edge  detector
A/D converter mode  register (ADM)
Fig. 8-7 Block Diagram of A/D Converter
Sample-and-hold circuit
Voltage comparator
Successive conver- sion register (SAR)
Conversion  trigger  
Trigger enable
8
Control  circuit
8
A/D conversion  result register (ADCR)
8
INTAD
Series resistor string
R/2
R
Tap selector
R/2
AV
AV
REF1
SS
Internal bus
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8.7 D/A CONVERTER
Two digital/analog (D/A) converter channels of voltage output type, having a resolution of 8 bits, are incorporated.
A resistor string system is used for conversion. By writing the value to be subject to D/A conversion in the 8-bit D/A conversion value setting register (DACSn: n = 0, 1), the resulting analog value is output on ANOn (n = 0, 1). The range of the output voltages is determined by the voltages applied to the AVREF2 and AVREF3 pins.
Because of its high output impedance, no current can be obtained from an output pin. When the load impedance is low, insert a buffer amplifier between the load and the converter.
The impedance of the ANOn pin goes high while the RESET signal is low. DACSn is set to 0 after a reset is released.
Fig. 8-8 Block Diagram of D/A Converter
AV
REF2
R
R
AV
REF3
ANOn
R
R
DACSn
8
Tap selector
RESET
DACEn
8
Internal bus
36
Remark n = 0, 1
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8.8 SERIAL INTERFACE
Three independent serial interface channels are incorporated.
Asynchronous serial interface (UART)/three-wire serial I/O (IOE) ¥ 2
Synchronous serial interface (CSI) ¥ 1
• Three-wire serial I/O (IOE)
• Serial bus interface (SBI)
So, communication with points external to the system and local communication within the system can be performed
at the same time. (See Fig. 8-9.)
Fig. 8-9 Example Serial Interfaces
(a) UART + SBI
PD784021 (master)
PD4711A
µ
RS-232-C  driver/ receiver
PD4711A
µ
RS-232-C  driver/ receiver
(UART)
(UART)
µ
RxD TxD
Port
RxD2 TxD2
Port
SB0
SCK0
(SBI)
V
DD
µ
µ
PD75402A (slave)
SB0 SCK
PD75328 (slave)
SB0 SCK
LCD
PD4711A
µ
RS-232-C  driver/ receiver
(b) UART + Three-wire serial I/O
PD784021 (master)
µ
(UART)
RxD TxD
Port
Note Handshake line
[Three-wire serial I/O]
SO0
SI0
SCK0
INTPm
Port
SO1
SI1
SCK1
INTPn
Port
Note
Note
PD75108 (slave)
µ
SI SO SCK Port
INT
PD78014 (slave)
µ
SI SO SCK Port
INT
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8.8.1 Asynchronous Serial Interface/Three-Wire Serial I/O (UART/IOE)
Two serial interface channels are available; for each channel, asynchronous serial interface mode or three-wire serial I/O mode can be selected.
(1) Asynchronous serial interface mode
In this mode, 1-byte data is transferred after a start bit. A baud rate generator is incorporated to enable communication at a wide range of baud rates. Moreover, the frequency of a clock signal applied to the ASCK pin can be divided to define a baud rate. With the baud rate generator, the baud rate conforming to the MIDI standard (31.25 kbps) can be obtained.
Fig. 8-10 Block Diagram of Asynchronous Serial Interface Mode
Internal bus
RxD, RxD2
TxD, TxD2
Baud rate generator
XX
/2
f
ASCK, ASCK2
Selector
1/2
n+1
Receive buffer
Receive  shift register
Reception control parity  check
1/2m
1/2m
RXB, RXB2
INTSR, INTSR2 INTSER, INTSER2
Transmission shift register
Transmission control parity  bit addition 
TXS, TXS2
INTST, INTST2
38
Remark f
XX: Oscillator frequency or external clock input
n = 0 to 11 m = 16 to 30
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(2) Three-wire serial I/O mode
In this mode, the master device makes the serial clock active to start transmission, then transfers 1-byte data in phase with the clock. This mode is designed for communication with a device incorporating a conventional synchronous serial interface. Basically, three lines are used for communication: the serial clock line (SCK) and the two serial data lines (SI and SO). In general, a handshake line is required to check the state of communication.
Fig. 8-11 Block Diagram of Three-Wire Serial I/O Mode
Internal bus
Direction control  circuit
SIO1, SIO2
Shift register Output latch
SI1, SI2
SO1, SO2
SCK1, SCK2
Remark f
Serial clock counter
Serial clock control circuit
XX: Oscillator frequency or external clock input
n = 0 to 11 m = 1, 16 to 30
Interrupt signal generator
1/m 1/2
Selector
INTCSI1, INTCSI2
n+1
fXX/2
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8.8.2 Synchronous Serial Interface (CSI)
With this interface, the master device makes the serial clock active to start transmission, then transfers 1-byte data in phase with the clock.
Fig. 8-12 Block Diagram of Synchronous Serial Interface
Internal bus
Direction control circuit
Set
Clear
SI0
SO0/SB0
Shift register
Selector
N-ch open-drain output enabled  (when SB0 or  SBI mode is used)
SIO
Output latch
Busy/ acknowledge  detection  circuit
Bus release/ command/ acknowledge detection  circuit
Remark f
Serial clock counter
Serial clock control circuit
CLK: Internal system clock frequency (system clock frequency/2)
Interrupt signal  generation  circuit
INTCSISCK0
Selector
TM 3 output/2
CLK
/8
f
CLK
/32
f
40
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(1) Three-wire serial I/O mode
This mode is designed for communication with a device incorporating a conventional synchronous serial interface. Basically, three lines are used for communication: the serial clock line (SCK0) and serial data lines (SI0 and SO0). In general, a handshake line is required to check the state of communication.
(2) SBI mode
The SBI mode allows communication with more than one device via two lines: the serial clock (SCK0) and serial bus (SB0). The SBI mode is the standard NEC serial interface. A master device outputs an address through the SB0 pin to select a slave device with which communication is to be performed. After a target device is selected, commands and data are transmitted between the master device and slave device.
8.9 EDGE DETECTION FUNCTION
The interrupt input pins (NMI, INTP0-INTP5) are used to apply not only interrupt requests but also trigger signals for the built-in circuits. As these pins are triggered by an edge (rising or falling) of an input signal, a function for edge detection is incorporated. Moreover, a noise suppression function is provided to prevent erroneous edge detection caused by noise.
Pin Detectable edge Noise suppression method NMI Rising edge or falling edge Analog delay INTP0-INTP3 Rising edge or falling edge, or both edges Clock sampling INTP4, INTP5 Analog delay
Note INTP0 is used for sampling clock selection.
Note
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8.10 WATCHDOG TIMER
A watchdog timer is incorporated for CPU runaway detection. The watchdog timer, if not cleared by software within a specified interval, generates a nonmaskable interrupt. Furthermore, once watchdog timer operation is enabled, it cannot be disabled by software. The user can specify whether priority is placed on an interrupt based on the watchdog timer or on an interrupt based on the NMI pin.
H
f
Fig. 8-13 Block Diagram of Watchdog Timer
CLK
Clear signal
Timer
f
f
CLK
f
CLK
f
CLK
CLK
21
/2
20
/2
19
/2
17
/2
Selector
INTWDT
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9. INTERRUPT FUNCTION
Table 9-1 lists the interrupt request handling modes. These modes are selected by software.
Table 9-1 Interrupt Request Handling Modes
Handling mode Handled by Handling PC and PSW contents
Vectored interrupt Software Branches to a handling routine for execution The PC and PSW contents are pushed
(arbitrary handling). to and popped from the stack.
Context switching Automatically selects a register bank, and The PC and PSW contents are saved to
branches to a handling routine for execution and read from a fixed area in the (arbitrary handling). register bank.
Macro service Firmware Performs operations such as memory-to-I/O- Maintained
device data transfer (fixed handling).
9.1 INTERRUPT SOURCE
An interrupt can be issued from any one of the interrupt sources listed in Table 9-2: execution of a BRK instruction,
an operand error, or any of the 23 other interrupt sources.
Four levels of interrupt handling priority can be set. Priority levels can be set to nest control during interrupt handling
or to concurrently generate interrupt requests. Nested macro services, however, are performed without suspension.
When interrupt requests having the same priority level are generated, they are handled according to the default
priority (fixed). (See Table 9-2.)
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Table 9-2 Interrupt Sources
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Type
Software BRK instruction Instruction execution
Nonmaskable NMI Detection of edge input on the pin External
H
Maskable 0 (highest) INTP0 Detection of edge input on the pin (TM1/TM1W capture trigger) External Enabled
Default priority
1 INTP1 Detection of edge input on the pin (TM2/TM2W capture trigger) 2 INTP2 3 INTP3 Detection of edge input on the pin (TM0 capture trigger) 4 INTC00 TM0-CR00 match signal issued Internal Enabled 5 INTC01 TM0-CR01 match signal issued 6 INTC10 TM1-CR10 match signal issued (in 8-bit operation mode)
7 INTC11 TM1-CR11 match signal issued (in 8-bit operation mode)
8 INTC20 TM2-CR20 match signal issued (in 8-bit operation mode)
9 INTC21 TM2-CR21 match signal issued (in 8-bit operation mode)
10 INTC30 TM3-CR30 match signal issued (in 8-bit operation mode)
11 INTP4 Detection of edge input on the pin External Enabled 12 INTP5 Detection of edge input on the pin 13 INTAD A/D converter processing completed (ADCR transfer) Internal Enabled 14 INTSER ASI0 reception error – 15 INTSR ASI0 reception completed or CSI1 transfer completed Enabled
16 INTST ASI0 transmission completed 17 INTCSI CSI0 transfer completed 18 INTSER2 ASI2 reception error – 19 INTSR2 ASI2 reception completed or CSI2 transfer completed Enabled
20 (lowest) INTST2 ASI2 transmission completed
Name Trigger
Operand error When the MOV STBC,#byte or MOV WDM,#byte instruction is
executed, exclusive OR of the byte operand and byte does not produce FFH.
WDT Watchdog timer overflow Internal
Detection of edge input on the pin (TM2/TM2W event counter input)
TM1W-CR10W match signal issued (in 16-bit operation mode)
TM1W-CR11W match signal issued (in 16-bit operation mode)
TM2W-CR20W match signal issued (in 16-bit operation mode)
TM2W-CR21W match signal issued (in 16-bit operation mode)
TM3W-CR30W match signal issued (in 16-bit operation mode)
INTCSI1
INTCSI2
Source
Internal/ Macro external service
Remark ASI: Asynchronous serial interface
CSI: Synchronous serial interface
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9.2 VECTORED INTERRUPT
When a branch to an interrupt handling routine occurs, the vector table address corresponding to the interrupt
source is used as the branch address.
Interrupt handling by the CPU consists of the following operations :
When a branch occurs : Push the CPU status (PC and PSW contents) to the stack.
When control is returned: Pop the CPU status (PC and PSW contents) from the stack.
To return control from the handling routine to the main routine, use the RETI instruction. The branch destination
addresses must be within the range of 0 to FFFFH.
Table 9-3 Vector Table Address
Interrupt source Vector table address BRK instruction 003EH Operand error 003CH NMI 0002H WDT 0004H INTP0 0006H INTP1 0008H INTP2 000AH INTP3 000CH INTC00 000EH INTC01 0010H INTC10 0012H INTC11 0014H INTC20 0016H INTC21 0018H INTC30 001AH INTP4 001CH INTP5 001EH INTAD 0020H INTSER 0022H INTSR 0024H INTCSI1 INTST 0026H INTCSI 0028H INTSER2 002AH INTSR2 002CH INTCSI2 INTST2 002EH
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9.3 CONTEXT SWITCHING
When an interrupt request is generated, or when the BRKCS instruction is executed, an appropriate register bank is selected by the hardware. Then, a branch to a vector address stored in that register bank occurs. At the same time, the contents of the current program counter (PC) and program status word (PSW) are stacked in the register bank.
The branch address must be within the range of 0 to FFFFH.
Fig. 9-1 Context Switching Caused by an Interrupt Request
0000B
7
PC19-16
2
Save
(Bits 8 to 11 of  temporary register)
Temporary register
1
Save
Transfer
PC15-0
6
Exchange
5
Save
Register bank n (n = 0-7)
AX BC
R5 R4
R7 V U
T
WL
DE H
VP UP
R6
Switching between register banks
3
RSS 0
4
IE 0
Register bank (0-7)
(RBS0-RBS2n)
PSW
9.4 MACRO SERVICE
The macro service function enables data transfer between memory and special function registers (SFRs) without requiring the intervention of the CPU. The macro service controller accesses both memory and SFRs within the same transfer cycle to directly transfer data without having to perform data fetch.
Since the CPU status is neither saved nor restored, nor is data fetch performed, high-speed data transfer is possible.
Fig. 9-2 Macro Service
CPU SFRMemory
Internal bus
Read Write
Macro service controller
Write Read
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9.5 EXAMPLES OF MACRO SERVICE APPLICATIONS
(1) Serial interface transmission
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PD784020, 784021
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Transmission data storage buffer (memory)
TxD
Transmission control
Data n
Data n-1
Data 2 Data 1
Internal bus
Transmission
shift register
TXS (SFR)
INTST
Each time a macro service request (INTST) is generated, the next transmission data is transferred from memory to TXS. When data n (last byte) has been transferred to TXS (that is, once the transmission data storage buffer becomes empty), a vectored interrupt request (INTST) is generated.
(2) Serial interface reception
Reception data storage buffer (memory)
Data n
Data n-1
Data 2 Data 1
Internal bus
RxD
Reception buffer
Reception  shift register
Reception control
RXB (SFR)
INTSR
Each time a macro service request (INTSR) is generated, reception data is transferred from RXB to memory. When data n (last byte) has been transferred to memory (that is, once the reception data storage buffer becomes full), a vectored interrupt request (INTSR) is generated.
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(3) Real-time output port
INTC10 and INTC11 function as the output triggers for the real-time output ports. For these triggers, the macro service can simultaneously set the next output pattern and interval. Therefore, INTC10 and INTC11 can be used to independently control two stepping motors. They can also be applied to PWM and DC motor control.
Output pattern profile (memory) Output timing profile (memory)
n
P
P
n–1
P
2
P
1
n
T
T
n–1
T
2
T
1
P00-P03
(SFR)
Internal bus
P0L
Output latch
Match
INTC10
Internal bus
CR10
TM1
(SFR)
Each time a macro service request (INTC10) is generated, a pattern and timing data are transferred to the buffer register (P0L) and compare register (CR10), respectively. When the contents of timer register 1 (TM1) and CR10 match, another INTC10 is generated, and the P0L contents are transferred to the output latch. When Tn (last byte) is transferred to CR10, a vectored interrupt request (INTC10) is generated. For INTC11, the same operation as that performed for INTC10 is performed.
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10. LOCAL BUS INTERFACE
The local bus interface enables the connection of external memory and I/O devices (memory-mapped I/O). It
supports a 1M-byte memory space. (See Fig. 10-1.)
Fig. 10-1 Example of Local Bus Interface
PD784021
µ
A16-A19
Decoder
RD
WR
REFRQ
AD0-AD7
Pseudo SRAM
PROM PD27C1001A
µ
Data bus
Data bus
Kanji character generator PD24C1000
µ
ASTB
A8-A15
Latch
Address bus
Gate array for I/O  expansion including  Centronics interface  circuit, etc.
10.1 MEMORY EXPANSION
By adding external memory, program memory or data memory can be expanded, 64K bytes at a time, to
approximately 1M byte (three steps).
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10.2 MEMORY SPACE
The 1M-byte memory space is divided into eight spaces, each having a logical address. Each of these spaces can be controlled using the programmable wait and pseudo-static RAM refresh functions.
Fig. 10-2 Memory Space
FFFFFH
512K bytes
80000H
7FFFFH
256K bytes
40000H
3FFFFH
20000H
1FFFFH
10000H
0FFFFH
0C000H
0BFFFH
08000H
07FFFH
04000H
03FFFH
00000H
128K bytes
64K bytes
16K bytes
16K bytes
16K bytes
16K bytes
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10.3 PROGRAMMABLE WAIT
When the memory space is divided into eight spaces, a wait state can be separately inserted for each memory space while the RD or WR signal is active. This prevents the overall system efficiency from being degraded even when memory devices having different access times are connected.
In addition, an address wait function that extends the ASTB signal active period is provided to produce a longer address decode time. (This function is set for the entire space.)
10.4 PSEUDO-STATIC RAM REFRESH FUNCTION
Refresh is performed as follows:
Pulse refresh : A bus cycle is inserted where a refresh pulse is output on the REFRQ pin at regular
intervals. When the memory space is divided into eight, and a specified area is being accessed, refresh pulses can also be output on the REFRQ pin as the memory is being accessed. This can prevent the refresh cycle from suspending normal memory access.
Power-down self-refresh : In standby mode, a low-level signal is output on the REFRQ pin to maintain the
contents of pseudo-static RAM.
10.5 BUS HOLD FUNCTION
A bus hold function is provided to facilitate connection to devices such as a DMA controller. Suppose that a bus hold request signal (HLDRQ) is received from an external bus master. In this case, upon the completion of the bus cycle being performed, the address bus, address/data bus, ASTB, RD, and WR pins are placed in the high-impedance state, and the bus hold acknowledge signal (HLDAK) is made active to release the bus for the external bus master.
While the bus hold function is being used, the external wait and pseudo-static RAM refresh functions are disabled.
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11. STANDBY FUNCTION
The standby function allows the power consumption of the chip to be reduced. The following standby modes are
supported:
• HALT mode : The CPU operation clock is stopped. By occassionally inserting the HALT mode during normal operation, the overall average power consumption can be reduced.
• IDLE mode : The entire system is stopped, with the exception of the oscillator circuit. This mode consumes only very little more power than STOP mode, but normal program operation can be restored in almost as little time as that required to restore normal program operation from HALT mode.
• STOP mode : The oscillator is stopped. All operations in the chip stop, such that only leakage current flows.
These modes can be selected by software. A macro service can be initiated in HALT mode.
Fig. 11-1 Standby Mode Status Transition
Macro service request
End of one operation
End of macro service
Interrupt request
RESET input
Set HALT
Note 2
Macro service request
End of one operation
HALT
(standby)
Macro
service
Note 1
NMI, INTP4, INTP5 input
STOP
(standby)
Wait for 
oscillation 
settling
Set STOP
RESET input
IDLE
(standby)
Oscillation settling 
time elapses
Set IDLE
RESET input
NMI, INTP4, INTP5 input
Request for masked interrupt
Program
operation
Note 1
Notes 1. INTP4 and INTP5 are applied when not masked.
2. Only when the interrupt request is not masked
Remark NMI is enabled only by external input. The watchdog timer cannot be used to release one of the standby
modes (STOP or IDLE mode).
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12. RESET FUNCTION
Applying a low-level signal to the RESET pin initializes the internal hardware (reset status). When the RESET input makes a low-to-high transition, the following data is loaded into the program counter (PC):
Eight low-order bits of the PC : Contents of location at address 0000H
Intermediate eight bits of the PC : Contents of location at address 0001H
Four high-order bits of the PC : 0
The PC contents are used as a branch destination address. Program execution starts from that address. Therefore,
a reset start can be performed from an arbitrary address.
The contents of each register can be set by software, as required. The RESET input circuit contains a noise eliminator to prevent malfunctions caused by noise. This noise eliminator
is an analog delay sampling circuit.
Fig. 12-1 Accepting a Reset
Delay
RESET (input)
Internal reset signal 
For power-on reset, the RESET signal must be held active until the oscillation settling time (approximately 40 ms)
has elapsed.
Oscillation settling time Delay
V
DD
RESET
(input)
Delay
Start reset
Fig. 12-2 Power-On Reset
Delay
End reset
Initialize PC
Initialize PC
Execute instruction  at reset start address
Execute instruction at reset start address
Internal reset signal
End reset
53
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mm
m
PD784020, 784021
mm
13. INSTRUCTION SET
(1) 8-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where A is described as r.)
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC, MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA
Table 13-1 Instructions Implemented by 8-Bit Addressing
2nd operand #byte A r saddr sfr !addr16 mem r3 [WHL+] n
r' saddr' !!addr24 [saddrp] PSWL [WHL–]
1st operand [%saddrg] PSWH
Note 6
A (MOV) (MOV) MOV
Note 1
ADD
r MOV (MOV) MOV MOV MOV MOV
ADD
saddr MOV
ADD
sfr MOV MOV MOV PUSH
ADD
!addr16 MOV (MOV) MOV !!addr24
mem MOV [saddrp] [%saddrg]
mem3 ROR4
r3 MOV MOV PSWL PSWH
B, C DBNZ STBC, WDM MOV [TDE+] (MOV)
[TDE–]
(XCH) XCH
Note 1
(ADD)
Note 1
(XCH) XCH XCH XCH XCH DIVUW (ADD)
(MOV)
Note 1
(ADD)
Note 1
(ADD)
ADD
ADD
(ADD) MOVM
(ADD)
Note 1
ADD
Note 6
MOV MOV INC
Note 1
ADD
Note 1
ADD
Note 1
Note 1
Note 1
Note 4
(MOV) (XCH)
Note 1
(ADD)
Note 1
ADD
Note 1
XCH DEC ADD
Note 1
MOV (MOV) MOV MOV (MOV)
Note 6
(XCH) (XCH) XCH (XCH)
Notes 1, 6
Note 1
Note 1
(ADD)
ADD
Note 1
Note 1
ADD
Note 1
ADD
Note 1
Note 1
(ADD)
Note 5
MOVBK
ROR
Note 3
None
MULU
INC DEC
DBNZ
POP CHKL CHKLA
ROL4
Note 2
Notes 1. ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as ADD.
2. There is no second operand, or the second operand is not an operand address.
3. ROL, RORC, ROLC, SHR, and SHL are the same as ROR.
4. XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as MOVM.
5. XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as MOVBK.
6. When saddr is saddr2 with this combination, an instruction with a short code exists.
54
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mm
m
PD784020, 784021
mm
(2) 16-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where AX is described as rp.)
MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP, ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW
Table 13-2 Instructions Implemented by 16-Bit Addressing
2nd operand #word AX rp saddrp strp !addr16 mem [WHL+] byte n
rp' saddrp' !!addr24 [saddrp]
1st operand [%saddrg]
AX (MOVW) (MOVW) (MOVW)
Note 1
ADDW
rp MOVW (MOVW) MOVW MOVW MOVW MOVW SHRW
ADDW
saddrp MOVW
ADDW
sfrp MOVW MOVW MOVW PUSH
ADDW
!addr16 MOVW (MOVW) MOVW !!addr24
mem MOVW [saddrp] [%saddrg]
PSW PUSH
SP ADDWG
SUBWG
post PUSH
[TDE+] (MOVW) SACW byte MACW
(XCHW) (XCHW)
Note 1
(ADD)
Note 1
(XCHW) XCHW XCHW XCHW SHLW INCW
Note 1
(ADDW)
Note 3
(MOVW)
Note 1
Note 1
(ADDW)
(ADDW)
Note 1
Note 1
Note 1
(ADDW)
Note 1
ADDW MOVW MOVW INCW
Note 1
ADDW
Note 1
ADDW
Note 3
(MOVW) (XCHW) (ADDW)
ADDW
XCHW DECW ADDW
MOVW (MOVW) MOVW (MOVW)
Note 3
(XCHW) XCHW XCHW (XCHW)
Notes 1,3
Note 1
Note 1
(ADDW)
Note 1
ADDW
Note 1
MOVTBLW
None
MULW
DECW
POP
POP
POP PUSHU POPU
MACSW
Note 2
Note 4
Notes 1. SUBW and CMPW are the same as ADDW.
2. There is no second operand, or the second operand is not an operand address.
3. When saddrp is saddrp2 with this combination, an instruction with a short code exists.
4. MULUW and DIVUX are the same as MULW.
55
Page 56
mm
m
PD784020, 784021
mm
(3) 24-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where WHL is described as rg.)
MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP
Table 13-3 Instructions Implemented by 24-Bit Addressing
2nd operand
1st operand
WHL (MOVG) (MOVG) (MOVG) (MOVG) (MOVG) MOVG MOVG MOVG
rg MOVG (MOVG) MOVG MOVG MOVG INCG
saddrg (MOVG) MOVG !!addr24 (MOVG) MOVG mem1 MOVG [%saddrg] MOVG SP MOVG MOVG INCG
#imm24 WHL rg saddrg !!addr24 mem1 [%saddrg] SP None
rg'
(ADDG) (ADDG) (ADDG) ADDG (SUBG) (SUBG) (SUBG) SUBG
ADDG (ADDG) ADDG DECG SUBG (SUBG) SUBG PUSH
Note There is no second operand, or the second operand is not an operand address.
Note
POP
DECG
56
Page 57
(4) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET
Table 13-4 Bit Manipulation Instructions Implemented by Addressing
mm
m
PD784020, 784021
mm
2nd operand CY saddr.bit sfr.bit /saddr.bit /sfr.bit None
A.bit X.bit /A.bit /X.bit PSWL.bit PSWH.bit /PSWL.bit /PSWH.bit mem2.bit /mem2.bit
1st operand !addr16.bit !!addr24.bit /!addr16.bit /!!addr24.bit CY MOV1 AND1 NOT1
AND1 OR1 SET1 OR1 CLR1 XOR1
saddr.bit MOV1 NOT1 sfr.bit SET1 A.bit CLR1 X.bit BF PSWL.bit BT PSWH.bit BTCLR mem2.bit BFSET !addr16.bit !!addr24.bit
Note There is no second operand, or the second operand is not an operand address.
Note
57
Page 58
mm
m
PD784020, 784021
mm
(5) Call/return instructions and branch instructions
CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL, BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ
Table 13-5 Call/Return and Branch Instructions Implemented by Addressing
Instruction $addr20 $!addr20 !addr16 !!addr20 rp rg [rp] [rg] !addr11 [addr5] RBn None address operand
Basic BC instruction BR BR BR BR BR BR BR BR RET
Composite BF instruction BT
Note
BTCLR BFSET DBNZ
CALL CALL CALL CALL CALL CALL CALL CALLF CALLF BRKCS BRK
RETCS RETI RETCSB RETB
Note BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, and BH
are the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT EI, DI, SWRS
58
Page 59
mm
m
PD784020, 784021
mm
14. ELECTRICAL CHARACTERISTICS
The electrical characteristics described in this chapter apply to the products which are improved versions of the
m
PD784020 and mPD784021 (other than K-rank products). For K-rank products yet to be improved (K-rank products),
please consult with our sales offices.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Supply voltage
Input voltage Output voltage Low-level output current
High-level output current
A/D converter reference input voltage D/A converter reference input voltage
Operating ambient temperature Storage temperature
Symbol
VDD
AVDD
AVSS
VI VO IOL
IOH
AVREF1 AVREF2 AVREF3
TA
Tstg
Each pin Total of all output pins Each pin Total of all output pins
Conditions
Rating
–0.5 to +7.0
AVSS to VDD + 0.5
–0.5 to +0.5 –0.5 to VDD + 0.5 –0.5 to VDD + 0.5
15 150 –10
–100 –0.5 to VDD + 0.3 –0.5 to VDD + 0.3 –0.5 to VDD + 0.3
–40 to +85
–65 to +150
Unit
V V V V
V mA mA mA mA
V
V
V
°C °C
H
Caution Absolute maximum ratings are rated values beyond which some physical damages may be
caused to the product; if any of the parameters in the table above exceeds its rated value even for a moment, the quality of the product may deteriorate. Be sure to use the product within the rated values.
59
Page 60
OPERATING CONDITIONS
Operating ambient temperature (TA): –40 to +85 °C
Rising and falling time (tr, tf) (for pins not especially specified): 0 to 200
Power supply voltage and clock cycle time: See Fig. 14-1.
Fig. 14-1 Relationship between Power Supply Voltage and Clock Cycle Time
10000
4000
[ns]
1000
CYK
125 100
Clock cycle time t
80
Operation  guarantee  range
mm
m
PD784020, 784021
mm
m
s
CAPACITANCE (T
Parameter Input capacitance Output capacitance I/O capacitance
10
01234567
A = 25 °C, VDD = VSS = 0 V)
CI CO CIO
f = 1 MHz 0 V on pins other than measured pins
Power supply voltage [V]
Conditions
Typ.Min.Symbol
Max.
10 10 10
Unit
pF pF pF
60
Page 61
mm
m
PD784020, 784021
mm
OSCILLATOR CHARACTERISTICS (TA = –40 to +85 °C, VDD = 4.5 to 5.5 V, VSS = 0 V)
Resonator
Ceramic resonator or crystal
External clock
Recommended circuit Min.
Oscillator frequency (fXX)
X1 X2V
SS
C1 C2
X1 input frequency (fX)
X1 X2
HCMOS Inverter
X1 input rising and falling times (tXR, tXF)
X1 input high-level and low­level widths (tWXH, tWXL)
Parameter
4
4
0
10
Max.
25
25
10
125
Unit
MHz
MHz
ns
ns
Caution When using the system clock generator, run wires in the portion surrounded by dotted lines
according to the following rules to avoid effects such as stray capacitance:
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
SS. Never connect the capacitor to a ground pattern carrying a large current.
as V
Never extract a signal from the oscillator.
61
Page 62
OSCILLATOR CHARACTERISTICS (TA = –40 to +85 °C, VDD = 2.7 to 5.5 V, VSS = 0 V)
mm
m
PD784020, 784021
mm
Resonator
Ceramic resonator or crystal
External clock
Recommended circuit Min.
Oscillator frequency (fXX)
X1 X2V
SS
C1 C2
X1 input frequency (fX)
X1 X2
HCMOS Inverter
X1 input rising and falling times (tXR, tXF)
X1 input high-level and low­level widths (tWXH, tWXL)
Parameter
4
4
0
10
Max.
16
16
10
125
Unit
MHz
MHz
ns
ns
Caution When using the system clock generator, run wires in the portion surrounded by dotted lines
according to the following rules to avoid effects such as stray capacitance:
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
SS. Never connect the capacitor to a ground pattern carrying a large current.
as V
Never extract a signal from the oscillator.
62
Page 63
mm
m
PD784020, 784021
mm
DC CHARACTERISTICS (TA = –40 to +85 °C, VDD = AV DD = 2.7 to 5.5 V, VSS = AVSS = 0 V) (1/2)
Parameter
Low-level input voltage
High-level input voltage
Low-level output voltage
High-level output voltage
X1 low-level input current X1 high-level input current
Symbol
VIL1
VIL2 VIL3
VIH1 VIH2 VIH3
VOL1 VOL2
VOH1 VOH2
IIL IIH
Conditions
Pins other than those described in Notes 1, 2, 3, and 4
Pins described in Notes 1, 2, 3, and 4 VDD = +5.0 V ±10 % Pins described in Notes 2, 3, and 4 Pins other than those described in Note 1 Pins described in Note 1 VDD = +5.0 V ±10 % Pins described in Notes 2, 3, and 4 IOL = 2 mA VDD = +5.0 V ±10 % IOL = 8 mA Pins described in Notes 2 and 5 IOH = –2 mA VDD = +5.0 V ±10 % IOH = –5 mA Pins described in Note 4 0 V £ VI £ VIL2 VIH2 £ VI £ VDD
Min. –0.3
–0.3 –0.3
0.7VDD
0.8VDD
2.2
VDD – 1.0
2.0
Typ. Max.
0.3VDD
0.2VDD +0.8
VDD + 0.3 VDD + 0.3 VDD + 0.3
0.4
1.0
–30 +30
Unit
V
V V
V V V
V V
V V
m
m
A A
Notes 1. X1, X2, RESET, P12/ASCK2/SCK2, P13/RxD2/SI2, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI,
P24/INTP3, P25/INTP4/ASCK/SCK1, P26/INTP5, P27/SI0, P30/RxD/SI1, P32/SCK0, P33/SO0/SB0, and TEST
2. AD0 to AD7 and A8 to A15
3. P60/A16 to P63/A19, RD, WR, P66/WAIT/HLDRQ, and P67/REFRQ/HLDAK
4. P00 to P07
5. P10 to P17
63
Page 64
mm
m
PD784020, 784021
mm
DC CHARACTERISTICS (TA = –40 to +85 °C, VDD = AV DD = 2.7 to 5.5 V, VSS = AVSS = 0 V) (2/2)
Parameter
Input leakage current
Output leakage current VDD supply current
Pull-up resistance
Symbol
ILI
ILO IDD1
IDD2
IDD3
RL
Conditions 0 V £ VI £ VDD Except for the X1 pin when EXTC = 0 0 V £ VI £ VDD Analog input pins 0 V £ VO £ VDD Operating mode fXX = 25 MHz
fXX = 16 MHz VDD = 2.7 to 5.5 V
HALT mode fXX = 25 MHz
fXX = 16 MHz
VDD = 2.7 to 5.5 V IDLE mode fXX = 25 MHz (EXTC = 0) fXX = 16 MHz
VDD = 2.7 to 5.5 V VI = 0 V VDD = +5.0 V ±10 % VI = 0 V VDD = 2.7 to 4.5 V
Min.
15
15
Typ.
40 12
22
8
Max. ±10
±3
±10
60 25
30 12
12
8
100
160
Unit
m
m
m
mA mA
mA mA
mA mA
kW
kW
A
A
A
64
Page 65
mm
m
PD784020, 784021
mm
AC CHARACTERISTICS (TA = –40 to +85 °C, VDD = AVDD = 2.7 to 5.5 V, VSS = AVSS = 0 V)
(1) Read/write operation (1/2)
Parameter
Address setup time
ASTB high-level width
Address hold time (referred to ASTBØ) Address hold time (referred to RD•) Address Æ RDØ delay time
Address float time (referred to RDØ) Address Æ data input time
ASTBØ Æ data input time
RDØ Æ data input time
ASTBØ Æ RDØ delay time Data hold time (referred to RD•) RD• Æ address active time
RDÆ ASTB• delay time RD low-level width
Address hold time (referred to WR•) Address Æ WRØ delay time
ASTBØ Æ data output delay time
ASTBØ Æ data output time ASTBØ Æ WRØ output delay time
Symbol
tSAST
tWSTH
tHSTLA
tHRA
tDAR
tFRA
tDAID
tDSTID
tDRID
tDSTR tHRID
tDRA
tDRST tWRL
tHWA
tDAW
tDSTOD
tDWOD tDSTW
Conditions
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Upon program VDD = +5.0 V ±10 % read Upon data read VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Min. (0.5 + a) T – 11 (0.5 + a) T – 15 (0.5 + a) T – 17 (0.5 + a) T – 40
0.5T – 24
0.5T – 34
0.5T – 14
(1 + a) T – 5
(1 + a) T – 10
0.5T – 9 0
0.5T – 2
0.5T – 12
1.5T – 2
1.5T – 12
0.5T – 9
(1.5 + n) T – 30 (1.5 + n) T – 40
0.5T – 14
(1 + a) T – 5
(1 + a) T – 10
0.5T – 9
Max.
0
(2.5 + a + n) T – 37 (2.5 + a + n) T – 52 (2 + n) T – 40
(2 + n) T – 60 (1.5 + n) T – 50 (1.5 + n) T – 70
0.5T + 15
0.5T + 20
0.5T – 11
Unit
ns ns ns ns ns ns ns
ns ns ns
ns ns ns ns ns ns ns ns
ns ns ns ns ns ns ns ns
ns ns ns ns ns ns
Remark T: T
a: 1 when address wait is applied, 0 in other cases n: number of wait cycles (n • 0)
CYK (system clock cycle time)
65
Page 66
(1) Read/write operation (2/2)
mm
m
PD784020, 784021
mm
Parameter Data setup time (referred to WR•) Data hold time (referred to WR•) WRÆ ASTB• delay time WR low-level width
Note
Symbol
tSODW
tHWOD
tDWST tWWL
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Note The hold time includes the time for holding V
4.7 kW.
Remark T: T
CYK (system clock cycle time)
n: number of wait cycles (n • 0)
(2) Bus hold timing
Parameter
HLDRQÆ float delay time HLDRQ Æ HLDAK delay time
Float Æ HLDAK delay time HLDRQØ Æ HLDAKØ delay time
HLDAKØ Æ active delay time
Symbol
tFHQC tDHQHHAH
tDCFHA tDHQLHAL
tDHAC
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Min. (1.5 + n) T – 30 (1.5 + n) T – 40
0.5T – 5
0.5T – 14
0.5T – 9 (1.5 + n) T – 30 (1.5 + n) T – 40
OH1 and VOL1 on the load conditions of CL = 50 pF and RL =
Conditions
Min.
1T – 20 1T – 30
Max.Conditions
Max. (6 + a + n) T + 50 (7 + a + n) T + 30 (7 + a + n) T + 40
1T + 30 2T + 40 2T + 60
Unit
ns ns ns ns ns ns ns
Unit
ns ns ns ns ns ns ns ns
Remark T: T
66
CYK (system clock cycle time)
a: 1 when address wait is applied, 0 in other cases n: number of wait cycles (n • 0)
Page 67
(3) External wait timing
mm
m
PD784020, 784021
mm
Parameter
Address Æ WAITØ input time
ASTBØ Æ WAITØ input time
ASTBØ Æ WAIT hold time
ASTBØ Æ WAIT• delay time
RDØ Æ WAITØ input time
RDØ Æ WAITØ hold time
RDØ Æ WAIT• delay time
WAITÆ data input time
WAITÆ WR delay time WAIT• Æ RD• delay time WRØ Æ WAITØ input time
WRØ Æ WAIT hold time
WRØ Æ WAIT• delay time
Symbol
tDAWT
tDSTWT
tHSTWTH
tDSTWTH
tDRWTL
tHRWT
tDRWTH
tDWTID
tDWTW tDWTR tDWWTL
tHWWT
tDWWTH
Conditions
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Min.
(0.5 + n) T + 5
(0.5 + n) T + 10
nT + 5
nT + 10
0.5T
0.5T
nT + 5
nT + 10
Max. (2 + a) T – 40 (2 + a) T – 60
1.5T – 40
1.5T – 60
(1.5 + n) T – 40 (1.5 + n) T – 60
T – 50 T – 70
(1 + n) T – 40 (1 + n) T – 60
0.5T – 5
0.5T – 10
T – 50 T – 75
(1 + n) T – 40 (1 + n) T – 60
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Remark T: T
CYK (system clock cycle time)
a: 1 when address wait is applied, 0 in other cases n: number of wait cycles (n • 0)
(4) Refresh timing
Parameter Random read/write cycle time REFRQ low-level pulse width
ASTBØ Æ REFRQ delay time RDÆ REFRQ delay time WRÆ REFRQ delay time REFRQÆ ASTB delay time REFRQ high-level pulse width
Symbol
tRC tWRFQL
tDSTRFQ tDRRFQ tDWRFQ tDRFQST tWRFQH
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
Remark T: TCYK (system clock cycle time)
Min.
3T
1.5T – 25
1.5T – 30
0.5T – 9
1.5T – 9
1.5T – 9
0.5T – 9
1.5T – 25
1.5T – 30
Max.Conditions
Unit
ns ns ns ns ns ns ns ns ns
67
Page 68
SERIAL OPERATION (CSI)
mm
m
PD784020, 784021
mm
Parameter Serial clock cycle time (SCK0)
Serial clock low-level width (SCK0)
Serial clock high-level width (SCK0)
SI0, SB0 setup time (referred to SCK0•) SI0, SB0 hold time (referred to SCK0•) SO0, SB0 output delay time (referred to SCK0Ø)
SO0, SB0 output hold time (referred to SCK0•) SB0 high hold time (referred to SCK0•) SB0 low setup time (referred to SCK0Ø) SB0 low-level width SB0 high-level width
Symbol
tCYSK0
tWSKL0
tWSKH0
tSSSK0
tHSSK0
tDSBSK1
tDSBSK2
tHSBSK1
tHSBSK2
tSSBSK
tWSBL tWSBH
Conditions
Input VDD = +5.0 V ±10 %
Output Input VDD = +5.0 V ±10 %
Output Input VDD = +5.0 V ±10 %
Output
CMOS push-pull output (three-wire serial I/O mode) Open-drain output (SBI mode), RL = 1 kW During data transfer
SBI mode
Min.
500
1000
T 210 460
0.5T – 40 210 460
0.5T – 40
80
80
0
0
0.5TCYSK0 – 40
4
4
4 4
Max.
150
400
Unit
ns ns ns ns ns ns ns ns ns ns
ns
ns
ns
ns
tCYX
tCYX
tCYX tCYX
Remarks 1. The values listed in the above table are obtained when f
CYX = 1/fXX
2. t
3. T: Serial clock frequency specified using software. The minimum value is 16/fXX.
68
XX = 25 MHz and CL = 100 pF.
Page 69
SERIAL OPERATION (IOE1, IOE2)
mm
m
PD784020, 784021
mm
Parameter Serial clock cycle time (SCK1, SCK2)
Serial clock low-level width (SCK1, SCK2)
Serial clock high-level width (SCK1, SCK2)
SI1, SI2 setup time (referred to SCK1, SCK2•) SI1, SI2 hold time (referred to SCK1, SCK2•) SO1, SO2 output delay time (referred to SCK1, SCK2Ø) SO1, SO2 output hold time (referred to SCK1, SCK2•)
Symbol
tCYSK1
tWSKL1
tWSKH1
tSSSK1
tHSSK1
tDSOSK
tHSOSK
Conditions
Input VDD = +5.0 V ±10 %
Output Internal clock divided by 16 Input VDD = +5.0 V ±10 %
Output Internal clock divided by 16 Input VDD = +5.0 V ±10 %
Output Internal clock divided by 16
During data transfer
Min.
250 500
T
85
210
0.5T – 40 85
210
0.5T – 40 40
40
0
0.5TCYSK1 – 40
Max.
50
Unit
ns ns ns ns ns ns ns ns ns ns
ns
ns
ns
Remarks 1. The values listed in the above table are obtained when C
2. T: Serial clock frequency specified using software. The minimum value is 16/f
SERIAL OPERATION (UART, UART2)
Parameter
ASCK clock input cycle time
ASCK clock low-level width
ASCK clock high-level width
Symbol
tCYASK
tWASKL
tWASKH
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
VDD = +5.0 V ±10 %
L = 100 pF.
Min.
125 250
52.5 85
52.5 85
XX.
Max.Conditions
Unit
ns ns ns ns ns ns
69
Page 70
OTHER OPERATIONS
mm
m
PD784020, 784021
mm
Parameter NMI low-level width NMI high-level width INTP0 low-level width INTP0 high-level width INTP1-INTP3 and CI low-
level width INTP1-INTP3 and CI high-
level width INTP4 and INTP5 low-level
width INTP4 and INTP5 high-level
width RESET low-level width RESET high-level width
Remark t
CYSMP: sampling clock specified using software CYCPU: CPU operating clock specified using CPU software
t
Symbol
tWNIL tWNIH tWIT0L tWIT0H tWIT1L
tWIT1H
tWIT2L
tWIT2H
tWRSL tWRSH
Min.
10
10 3tCYSMP + 10 3tCYSMP + 10 3tCYCPU + 10
3tCYCPU + 10
10
10
10
10
Max.Conditions
Unit
m
m
ns ns ns
ns
m
m
m
m
s s
s
s
s s
A/D CONVERTER CHARACTERISTICS (TA = –40 to +85 °C, VDD = AVDD = 3.4 to 5.5 V, +3.4 V £ AVREF1 £ AVDD,
SS = AVSS = 0 V)
V
Parameter Resolution Total error
Linearity calibration Quantization error Conversion time
Sampling time
Analog input voltage Analog input impedance AVREF1 current AVDD supply current
Note
Note
Symbol
tCONV
tSAMP
VIAN RAN AIREF1 AIDD1 AIDD2
Conditions
VDD = AVDD = +5.0 V ±10 % +3.4 V £ AV REF1 £ AVDD +2.7 V £ VDD = AVDD £ +3.3 V +2.5 V £ AV REF1 £ AVDD
tCYK £ 500 ns, FR = 1 tCYK £ 500 ns, FR = 0 tCYK £ 500 ns, FR = 1 tCYK £ 500 ns, FR = 0
fXX = 25 MHz STOP mode, CS = 0
Min.
8
120 180
24 36
–0.3
Typ.
1000
0.5
2.0
Max.
1.2
1.0
1.0
0.6
±1/2
AVREF1 + 0.3
1.5
5.0 20
Unit
bit % %
%
%
LSB
tCYK tCYK tCYK tCYK
V MW mA mA
m
A
Note Quantization error is excluded. The error is represented in percent with respect to a full-scale value.
Remark t
CYK: system clock cycle time
70
Page 71
mm
m
PD784020, 784021
mm
D/A CONVERTER CHARACTERISTICS (TA = –40 to +85 °C, AVREF2 = VDD = AVDD = 2.7 to 5.5 V, AVREF3 = V SS
= AVSS = 0 V)
Parameter Resolution Total error
Settling time Output resistance Analog reference voltage
Reference supply input current
Note
Symbol
RO AVREF2 AVREF3 AIREF2 AIREF3
Conditions
Load condition: VDD = 4.5 to 5.5 V 4 MW, 30 pF
VDD = 4.5 to 5.5 V AVREF2 = 0.75VDD AVREF3 = 0.25VDD AVREF2 = 0.75VDD
AVREF3 = 0.25VDD Load condition: VDD = 4.5 to 5.5 V 2 MW, 30 pF
VDD = 4.5 to 5.5 V
AVREF2 = 0.75VDD
AVREF3 = 0.25VDD
AVREF2 = 0.75VDD
AVREF3 = 0.25VDD Load condition: 2 MW, 30 pF
Note
Min.
8
0.75VDD 0 0
–5
Typ.
20
Max.
0.4
0.6
0.6
0.8
0.6
0.8
0.8
1.0
10
VDD
0.25VDD 5 0
Unit
bit
% % %
%
% % %
%
m
kW
V
V mA mA
s
Note DACS0, DACS1 = 7FH
71
Page 72
DATA RETENTION CHARACTERISTICS (TA = –40 to +85 °C)
mm
m
PD784020, 784021
mm
Parameter Data retention voltage Data retention current
VDD rising time VDD falling time VDD retention time (referred to STOP mode setting) STOP release signal input time Oscillation settling time
Low-level input voltage High-level input voltage
Symbol
VDDDR IDDDR
tRVD tFVD tHVD
tDREL tWAIT
VIL VIH
Conditions STOP mode VDDDR = 2.5 to 5.5 V VDDDR = 2.5 V
Crystal Ceramic resonator Specified pins
Note 1
Note 2
Note 1
Notes 1. When the input voltage for the pins described in Note 2 satisfies the V
table
2. Pins RESET, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3, P25/INTP4/ASCK/SCK1, P26/INTP5, P27/SI0, P32/SCK0, and P33/SO0/SB0
AC Timing Test Points
Min.
2.5
200 200
0
0
30
5 0
0.9VDDDR
Typ.
10
2
IL and VIH conditions in the above
Max.
5.5 50 10
0.1VDDDR VDDDR
Unit
V
m
m
m
m
ms
ms ms ms
V V
A A
s s
VDD – 1 V
0.45 V
0.8V
0.8 V
DD
or 2.2 V
Test points
0.8V
DD
or 2.2 V
0.8 V
72
Page 73
Timing Waveform
(1) Read operation
ASTB
A8-A19
AD0-AD7
t
WSTH
t
SAST
t
DAR
t
t
DSTR
HSTLA
t
DAID
t
DSTID
mm
m
PD784020, 784021
mm
t
DRST
t
HRA
t
t
FRA
t
DRID
t
HRID
DRA
RD
(2) Write operation
ASTB
A8-A19
AD0-AD7
WR
t
WSTH
t
SAST
t
DAW
t
DSTW
t
HSTLA
t
DSTOD
t
DWOD
t
WRL
t
DSODW
t
DWST
t
HWA
t
HWOD
t
WWL
73
Page 74
Hold Timing
ASTB, A8-A19,
AD0-AD7, RD, WR
FHQC
t
HLDRQ
t
DHQHHAH
HLDAK
External WAIT Signal Input Timing
(1) Read operation
ASTB
t
DSTWT
t
DCFHA
t
DSTWTH
t
HSTWTH
t
DHQLHAL
mm
m
PD784020, 784021
mm
t
DHAC
A8-A19
AD0-AD7
RD
WAIT
(2) Write operation
ASTB
A8-A19
AD0-AD7
t
DAWT
t
DSTWT
t
DRWTL
t
DSTWTH
t
HSTWTH
t
HRWT
t
DRWTH
t
DWTID
t
DWTR
74
WR
WAIT
t
DAWT
t
DWWTL
t
HWWT
t
DWWTH
t
DWTW
Page 75
Timing Waveform for Refresh
(1) Random read/write cycle
t
RC
ASTB
WR
t
RC
t
RC
t
RC
RD
(2) When a refresh is performed simultaneously with a memory access
ASTB
mm
m
PD784020, 784021
mm
t
RC
RD, WR
REFRQ
(3) Refresh after reading
ASTB
RD
REFRQ
(4) Refresh after writing
t
DSTRFQ
t
WRFQL
t
DRFQST
t
WRFQH
t
DRRFQ
t
WRFQL
t
DRFQST
ASTB
WR
REFRQ
t
DWRFQ
t
WRFQL
t
DRFQST
75
Page 76
Serial Operation (CSI)
(1) Three-wire serial I/O mode
SCK
t
WSKL0
t
CYSK0
t
WSKH0
t
SSSK0tHSSK0
mm
m
PD784020, 784021
mm
SI
SO
(2) SBI mode
Ý Bus release signal transfer
SCK
t
HSBSK2
SB0
Ý Command signal transfer
SCK
tHSBSK2 tSSBSK
SB0
t
WSBL
t
WSBH
t
DSBSK1
Output data
t
SSBSK
t
WSKL0
t
HSBSK1
t
CYSK0
t
WSKH0
t
DSBSK2
Input data
t
HSSK0
t
SSSK0
HSBSK1
t
Input/Output data
76
Page 77
Serial Operation (IOE1, IOE2)
mm
m
PD784020, 784021
mm
WSKL1
t
SCK
SI
SO
Serial Operation (UART, UART2)
ASCK,
ASCK2
t
CYSK1
t
WSKH1
t
WASKH
0.8V
DD
0.8 V
t
t
DSOSK
Output data
CYASK
t
t
WASKL
HSOSK
t
SSSK1tHSSK1
Input data
77
Page 78
Interrupt Input Timing
NMI
INTP0
CI,
INTP1-INTP3
t
t
WIT0H
t
WIT1H
WNIH
0.8V
0.8V
0.8V
0.8 V
DD
0.8 V
DD
0.8 V
mm
m
PD784020, 784021
mm
t
WNIL
DD
t
WIT0L
t
WIT1L
INTP4, INTP5
Reset Input Timing
RESET
t
WIT2H
t
WRSH
0.8V
0.8V
DD
0.8 V
DD
0.8 V
t
WIT2L
t
WRSL
78
Page 79
External Clock Timing
X1
0.8V
0.8 V
Data Retention Timing
Set STOP mode.
mm
m
PD784020, 784021
mm
t
WXH
DD
t
t
XR
t
CYX
XF
t
WXL
VDD
tHVD tFVD
RESET
NMI
(Released by a falling edge)
NMI
(Released by a rising edge)
V
DDDR
tRVD
tDREL
0.8VDD
0.8V
0.8V
tWAIT
0.8 V
DD
0.8 V
DD
0.8 V
79
Page 80
15. PACKAGE DRAWINGS
80 PIN PLASTIC QFP (14×14)
mm
m
PD784020, 784021
mm
A B
61
60
41
40
CD
80
1
20
21
F
G
M
H
I
P
J
K
N
L
NOTE
Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
detail of lead end
S
Q
R
M
ITEM MILLIMETERS INCHES
A 17.2±0.4 0.677±0.016 B 14.0±0.2 0.551
C 14.0±0.2 0.551 D 17.2±0.4 0.677±0.016
F 0.825 0.032 G 0.825 0.032
H 0.30±0.10 0.012
I 0.13 0.005 J 0.65 (T.P.) 0.026 (T.P.) K 1.6±0.2 0.063±0.008
L 0.8±0.2 0.031
M 0.15 0.006 N 0.10 0.004
P 2.7 0.106 Q 0.1±0.1 0.004±0.004 R5°±5° 5°±5° S 3.0 MAX. 0.119 MAX.
 
 
+0.10
–0.05
+0.009 
–0.008 
+0.009 
–0.008
+0.004 
–0.005
+0.009 
–0.008 +0.004
 –0.003
S80GC-65-3B9-4
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
products.
80
Page 81
80 PIN PLASTIC TQFP (FINE PITCH) ( 12)
ITEM MILLIMETERS INCHES
I
J 0.5 (T.P.)
0.10
0.004
0.020 (T.P.)
A
NOTE
Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.
S
A 14.0±0.2 0.551
+0.009 –0.008
B 12.0±0.2 0.472
+0.009 –0.008
C 12.0±0.2 0.472
+0.009 –0.008
D 14.0±0.2 0.551
+0.009 –0.008
F
G 1.25
1.25
0.049
0.049
H 0.22 0.009±0.002
P80GK-50-BE9-4
S 1.27 MAX. 0.050 MAX.
K 1.0±0.2 0.039
+0.009 –0.008
L 0.5±0.2 0.020
+0.008 –0.009
M 0.145 0.006±0.002
N 0.10 0.004 P 1.05 0.041
Q 0.05±0.05
0.002±0.002
R 5°±5° 5°±5°
+0.05 –0.04
+0.055
–0.045
B
C
D
J
H
I
G
F
P
N
L
K
M
Q
R
detail of lead end
M
61
60
41
40
21
20
1
80
mm
m
PD784020, 784021
mm
H
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
products.
81
Page 82
H
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the mPD784021. For details of the recommended soldering conditions, refer to our document
Manual
(C10535E)
.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1 Soldering Conditions for Surface-Mount Devices
mm
m
PD784020GC-3B9: 80-pin plastic QFP (14 ¥ 14 mm)
(1)
mm mm
m
PD784021GC-3B9: 80-pin plastic QFP (14
mm
¥¥
¥ 14 mm)
¥¥
mm
m
PD784020, 784021
mm
SMD Surface Mount Technology
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
mm
m
PD784021GK-BE9: 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm)
(2)
mm
Soldering process
Infrared ray reflow
VPS
Partial heating method
Peak package’s surface temperature: 235 ½C Reflow time: 30 seconds or less (at 210 ½C or more) Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 ½C Reflow time: 40 seconds or less (at 210 ½C or more) Maximum allowable number of reflow processes: 3
Solder temperature: 260 ½C or less Flow time: 10 seconds or less Number of flow process: 1 Preheating temperature: 120 ½C max. (measured on the package surface)
Terminal temperature: 300 ½C or less Flow time: 3 seconds or less (for each side of device)
Peak package’s surface temperature: 235 ½C Reflow time: 30 seconds or less (at 210 ½C or more) Maximum allowable number of reflow processes: 2 Exposure limit
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking. Peak package’s surface temperature: 215 ½C
Reflow time: 40 seconds or less (at 200 ½C or more) Maximum allowable number of reflow processes: 2 Exposure limit
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking. Terminal temperature: 300 ½C or less
Flow time: 3 seconds or less (for each side of device)
Note
Note
Soldering conditions
Soldering conditions
: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Symbol
IR35-107-2
VP15-107-2
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ½C and maximum relative humidity at 65 % or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
82
Page 83
mm
m
PD784020, 784021
mm

APPENDIX A DEVELOPMENT TOOLS

The following development tools are available for system development using the mPD784021.
Language Processing Software
RA78K4 CC78K4 CC78K4-L
Note 1
Note 1
Note 1
Assembler package for all 78K/IV series models C compiler package for all 78K/IV series models C compiler library source file for all 78K/IV series models
PROM Write Tools
PG-1500 PROM programmer PA-78P4026GC Programmer adaptor, connects to PG-1500
PA-78P4038GK PA-78P4026KK
PG-1500 controller
Note 2
Control program for PG-1500
Debugging Tools
IE-784000-R In-circuit emulator for all mPD784026 sub-series models IE-784000-R-BK Break board for all 78K/IV series models
IE-784026-R-EM1 Emulation board for evaluating mPD784026 sub-series models IE-784000-R-EM
IE-70000-98-IF-B Interface adapter when the PC-9800 series computer (other than a notebook)
IE-70000-98N-IF Interface adapter and cable when a PC-9800 series notebook is used as the
IE-70000-PC-IF-B Interface adapter when the IBM PC/ATTM is used as the host machine IE-78000-R-SV3 Interface adapter and cable when the EWS is used as the host machine
is used as the host machine
host machine
EP-78230GC-R Emulation probe for 80-pin plastic QFP (14 ¥ 14 mm) for all mPD784026
EP-78054GK-R Emulation probe for 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm) for all
EV-9200GC-80 Socket for mounting on target system board made for 80-pin plastic QFP
EV-9500GK-80 Adapter for mounting on target system board made for 80-pin plastic TQFP
EV-9900 Tool used to remove the mPD78P4026KK-T from the EV-9200GC-80 SM78K4 ID78K4
DF784026
Note 3
Note 3
Note 4
sub-series
m
PD784021
(14 ¥ 14 mm)
(fine pitch) (12 ¥ 12 mm)
System simulator for all 78K/IV series models Integrated debugger for IE-784000-R
Device file for all mPD784026 sub-series models
Real-time OS
RX78K/IV MX78K4
Note 4
Note 2
Real-time OS for 78K/IV series models OS for all 78K/IV series models
Remark The RA78K4, CC78K4, SM78K4, and ID78K4 are used with the DF784026.
83
Page 84
Notes 1. Based on PC-9800 series (MS-DOSTM)
Based on IBM PC/AT and compatibles (PC DOS
Based on HP9000 series 700
Based on SPARCstation
Based on NEWS
Based on PC-9800 series (MS-DOS)
2.
TM
(NEWS-OSTM)
TM
TM
(SunOSTM)
(HP-UXTM)
Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
3.
Based on PC-9800 series (MS-DOS + Windows)
Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
Based on HP9000 series 700 (HP-UX)
Based on SPARCstation (SunOS)
Based on PC-9800 series (MS-DOS)
4.
Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)
Based on HP9000 series 700 (HP-UX)
Based on SPARCstation (SunOS)
mm
m
PD784020, 784021
mm
TM
, WindowsTM, MS-DOS, and IBM DOSTM)
84
Page 85

APPENDIX B RELATED DOCUMENTS

Documents Related to Devices
mm
m
PD784020, 784021
mm
Document name
m
PD784020, 784021 Data Sheet U11514J This manual
m
PD784025, 784026 Data Sheet
m
PD78P4026 Data Sheet
m
PD784026 Sub-Series User's Manual, Hardware U10898J U10898E
m
PD784026 Sub-Series Special Function Registers U10593J
m
PD784026 Sub-Series Application Note, Hardware Basic U10573J 78K/IV Series User's Manual, Instruction U10905J IEU-1386 78K/IV Series Instruction Summary Sheet U10594J — 78K/IV Series Instruction Set U10595J
78K/IV Series Application Note, Software Basic U10095J
To be released soon To be released soon
Document No.
Japanese English
IP-3230
IP3231
Documents Related to Development Tools (User’s Manual)
Document name
RA78K Series Assembler Package Operation EEU-809 EEU-1399
Language EEU-815 EEU-1404 RA78K Series Structured Assembler Preprocessor EEU-817 EEU-1402 CC78K Series C Compiler Operation EEU-656 EEU-1280
Language EEU-655 EEU-1284 CC78K Series Library Source File EEU-777 — PG-1500 PROM Programmer EEU-651 EEU-1335 PG-1500 Controller PC-9800 Series (MS-DOS) Base EEU-704 EEU-1291 PG-1500 Controller IBM PC Series (PC DOS) Base EEU-5008 U10540E IE-784000-R EEU-5004 EEU-1534 IE-784026-R-EM1 EEU-5017 EEU-1528 EP-78230 EEU-985 EEU-1515 EP-78054GK-R EEU-932 EEU-1468 SM78K4 System Simulator Windows Base Reference U10093J U10093E SM78K Series System Simulator
ID78K4 Integrated Debugger Reference U10440J U10440E
External Parts User Open
Interface Specifications
Document No.
Japanese English
U10092J U10092E
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
85
Page 86
mm
m
mm
Documents Related to Software to Be Incorporated into the Product (User’s Manual)
PD784020, 784021
Document name
78K/IV Series Real-Time OS Basic U10603J
Installation U10604J — Debugger U10364J
OS for 78K/IV Series MX78K4 To be created
Other Documents
Document name
IC PACKAGE MANUAL C10943X SMD Surface Mount Technology Manual C10535J C10535E Quality Grades on NEC Semiconductor Device IEI-620 IEI-1209 NEC Semiconductor Device Reliability/Quality Control System C10983J C10983E Electrostatic Discharge (ESD) Test MEM-539 — Guide to Quality Assurance for Semiconductor Device MEI-603 MEI-1202 Guide for Products Related to Micro-Computer: Other Companies MEI-604
Document No.
Japanese English
Document No.
Japanese English
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
86
Page 87
[MEMO]
mm
m
PD784020, 784021
mm
87
Page 88
mm
m
PD784020, 784021
mm
Cautions on CMOS Devices
Countermeasures against static electricity for all MOSs
Caution When handling MOS devices, take care so that they are not electrostatically charged.
Strong static electricity may cause dielectric breakdown in gates. When transporting or storing MOS devices, use conductive trays, magazine cases, shock absorbers, or metal cases that NEC uses for packaging and shipping. Be sure to ground MOS devices during assembling. Do not allow MOS devices to stand on plastic plates or do not touch pins. Also handle boards on which MOS devices are mounted in the same way.
CMOS-specific handling of unused input pins
Caution Hold CMOS devices at a fixed input level.
Unlike bipolar or NMOS devices, if a CMOS device is operated with no input, an intermediate­level input may be caused by noise. This allows current to flow in the CMOS device, resulting in a malfunction. Use a pull-up or pull-down resistor to hold a fixed input level. Since unused pins may function as output pins at unexpected times, each unused pin should be separately connected to the V If handling of unused pins is documented, follow the instructions in the document.
DD or GND pin through a resistor.
Statuses of all MOS devices at initialization
Caution The initial status of a MOS device is unpredictable when power is turned on.
Since characteristics of a MOS device are determined by the amount of ions implanted in molecules, the initial status cannot be determined in the manufacture process. NEC has no responsibility for the output statuses of pins, input and output settings, and the contents of registers at power on. However, NEC assures operation after reset and items for mode setting if they are defined. When you turn on a device having a reset function, be sure to reset the device first.
MS-DOS and Windows are trademarks of Microsoft Corporation. IBM DOS, PC/AT, and PC DOS are trademarks of IBM Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. SunOS is a trademark of Sun Microsystems, Inc. NEWS and NEWS-OS are trademarks of SONY Corporation.
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Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, please contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Mountain View, California Tel: 800-366-9782 Fax: 800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel:040-2445845 Fax: 040-2444580
NEC Electronics (France) S.A.
France Tel:01-30-67 58 00 Fax: 01-30-67 58 99
NEC Electronics Hong Kong Ltd.
Hong Kong Tel:2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290
NEC Electronics Italiana s.r.1.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby Sweden Tel: 8-63 80 820 Fax: 8-63 80 388
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel:253-8311 Fax: 250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan Tel: 02-719-2377 Fax: 02-719-5951
NEC do Brasil S.A.
Sao Paulo-SP, Brasil Tel: 011-889-1680 Fax: 011-889-1689
J96. 3
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Some related documents may be preliminary versions. Note that, however, what documents are preliminary is not indicated in this document.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc.
The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
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