Datasheet UPC8158K-E1, UPC8158K Datasheet (NEC)

Download

Page 1

PRELIMINARY DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

µµµµ

PC8158K

RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC

FOR DIGITAL MOBILE COMMUNICATION SYSTEMS

DESCRIPTION

The µPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature modulator for digital mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 MHz to 300 MHz quadrature modulator which are equipped with AGC and power save functions. This configuration suits to IF modulation system. The package is 28-pin QFN suitable for high density mounting. The chip is manufactured using NEC’s. 20 GHz fT silicon bipolar process NESATTM III to realize low power consumption. Consequently the

PC8158K can contribute to make RF blocks smaller size, higher performance and lower power consumption.

FEATURES

• Supply voltage: VCC = 2.7 to 4.0 V, ICC = 28 mA @ VCC = 3.0 V

• Built-in LPF suppresses spurious multipled by TX local (LO1)

• AGC amplifier is installed in local port of up converter: GCR = 35 dB MIN. @ fout = 1.5 GHz

• Excellent performance: P

• External IF filter can be applied between modulator output and up converter input terminal.

APPLICATIONS

• Digital cellular phones (PDC800M, PDC1.5G and so on)

ORDERING INFORMATION

Part Number Package Supplying Form

PC8158K-E1 28-pin plastic QFN

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PC8158K)

adj

= –65 dBc TYP. @ ∆f = ±50 kHz, EVM = 1.2 % rms TYP.

Embossed tape 12 mm wide.

(5.1 × 5.5 × 0.95 mm)

Pin 1 is in pull-out direct i on. QTY 2.5 kp/Reel.

Document No. P13831EJ1V1DS00 (1st edition) Date Published January 1999 N CP(K) Printed in Japan

Caution Electro-static sensitive device

The information in this document is subject to change without notice.

1998©

Page 2

INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (TOP View)

µµµµ

PC8158K

out

N.C.

Output Buffer

Fil1

Fil2

GND

QMOD + AGC + Up-Mix

N.C.

GND

N.C.

Output Buffer

QMOD + AGC + Up-Mix

22 21 20 19 18 17 16 15

AGCcont

Up-Mix

AGC

LPF

I/Q-Mix

AGC

REG

N.C.

GND

QMOD + AGC + Up-Mix

Phase Shifter

LO2inb

LO2in

GND

QMOD + AGC + Up-Mix

LO1in

LO1inb

12345678

Iin

Iinb

N.C.

Qinb

Qin

N.C.

Preliminary Data Sheet P13831EJ1V1DS00

Page 3

QUADRATURE MODULATOR SERIES

µµµµ

PC8158K

LO1in

Part Number Functions ICC (mA)

PC8101GR 150 MHz Quad. Mod

PC8104GR RF Up-Converter + IF

Quad. Mod

PC8105GR 400 MHz Quad. Mod

PC8110GR 1GHz Direct Quad. Mod

PC8125GR RF Up-Converter + IF

Quad. Mod + AGC

PC8126GR 915 to 960

PC8126K

PC8129GR

PC8139GR-7JH Tran scei ver IC

PC8158K RF Up-Converter + IF

900 MHz Direct Quad. Mod with Offset-Mix er

2LO IF Quad. Mod +

RF Up-Converter

(1.9 GHz Indirect Quad. Mod + RX-IF + IF VCO)

Quad. Mod + AGC

15/@ 2.7 V 28/@ 3.0 V

16/@ 3.0 V

24/@ 3.0 V

36/@ 3.0 V

35/@ 3.0 V

28/@ 3.0 V

TX: 32.5 RX: 4.8 /@ 3.0 V

28/@ 3.0 V

(MHz)

100 to 300 50 to 150

100 to 400

100 to 400 External 16-pin

800 to 1 000 Direct PDC800 MHz,

220 to 270

889 to 960

200 to 800 100 to 400

220 to 270

100 to 300

MODout

f (MHz)

Up-Converter

RFout

(MHz)

External F/F CT-2, etc.

900 to 1 900

1 800 to 2 000

915 to 960

(LO pre-mixer)

800 to 1900

1 800 to 2 000

800 to 1 500

Phase Shifter

Doubler

+ F/F

F/F 20-pin

Package Application

20-pin SSOP (225 mil)

SSOP (225 mil) 20-pin

SSOP (225 mil)

28-pin QFN

SSOP (225 mil) 30-pin

TSSOP (225 mil)

28-pin QFN PDC800 M/

Digital Comm.

etc. PHS

PDC800 MHz

GSM, DCS1800, etc.

PHS

1.5 G

For outline of the quadrature modulator series, please refer to the application note ‘Usage of µPC8101, 8104, 8105, 8125, 8129’ (Document No. P13251E) and so on.

SYSTEM APPLICATION EXAMPLE

[PDC800 MHz/1.5 GHz]

ANTSUB

LNA

MAIN ANT

1st MIX

AGC

2nd MIX

1st LO

PLL1 PLL2

LO2 LO1

(CR)

2nd LO

0°

90°

RSSI

To DEMOD

RSSI OUT

PC8158K

Filter

Preliminary Data Sheet P13831EJ1V1DS00

Page 4

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Rating Unit

µµµµ

PC8158K

Supply Voltage V

Power Save and AGC Control Pi n

VPS/V

Applied Voltage Power Dissipation P Operating Ambient Temperature T Storage Temperature T

Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB.

Note

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage V Power Save Voltage V AGC Control Voltage V Operating Ambient Temperature T Up-converter RF Output Frequency f LO2 Input Frequency f I/Q Input Frequency f

LO1 Input Level P LO2 Input Level P I/Q Input Amplitude V Up-converter Input Frequency f Modulator Output Frequency f LO1 Input Frequency f

AGCPS

RFout

LO2in

UPCONin

MODout

LO1in

I/Qin

LO1in

LO2in

I/Qin

AGC

stg

Pin11, 20 and 25,

= +25°C

T Pin17, TA = +25°C 5.0 V

TA = +85°C

Note

5.0 V

430 mW

–40 to +85 °C

–55 to +150 °C

Pin11, 20 and 25 2.7 3.0 4.0 V Pin17 0 – 0.3 V Pin17 1.0 – 2.5 V

–30 +25 +80 °C 800 – 1500 MHz

LO2in

= –15 dBm 600 – 1750 MHz

I/Qin

= 500 mV

P-P

MAX.

DC – 10 MHz

(Differential input)

–18 –15 –12 dBm –18 –15 –12 dBm

I, Ib, Q, Qb each – 420 500 mV

P-P

100 – 300 MHz

LO1in

= –15 dBm

Preliminary Data Sheet P13831EJ1V1DS00

Page 5

ELECTRICAL CHARACTERISTICS

Conditions (Unless otherwise specified):

= +25 °C, VCC1 = VCC2

T I/Q (DC) = Ib/Qb (DC) = VCC/2 = 1.5 V, V

/4DQPSK wave input, transmission rate 42 kbps, filter roll-off α = 0.5,

= VCC

3 = 3.0 V, VPS/V

I/Ibin

= V

AGC

Q/Qbin

= 2.5 V,

= 500 mV

Modulation Pattern: <0000>

LO1in

= 178.05 MHz, P

LO2in

= 1619.05 MHz, P

RFout

= 1441 MHz – f

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit UP-CONVERTER + QUADRATURE MODULATOR TOTAL Total Circuit Current I Total Circuit Current at Power S ave Mode I

LO1in

LO2in

I/Qin

= –15 dBm

CC (TOTAL)

CC (PS) TOTAL

No input signal 23.7 28 37.6 mA VPS ≤ 0.5 V (Low),

No input signal

P-P

(each), f

I/Qin

= 2.625 kHz,

µµµµ

PC8158K

–0.310

Total Output Power 1 P Total Output Power 2 P

RFout

LO Carrier Leak LOL f

AGC

= 2.5 V –15 –11.5 –8 dBm

AGC

= 1.0 V –56.5 –52 –46.5 dBm

LOL

LO1

+ f

LO2

– –40 –30 dBc

= f Image Rejection (Side Band Leak ) ImR – –40 –30 dBc I/Q 3rd order distortion IM AGC Gain Control Range GCR V

3 (I/Q)

– –50 –30 dBc

AGC

= 2 V → 1 V 35 40 – dB Error Vector Magnitude EVM MOD Pattern: PN9 – 1.2 3.0 %rms Adjacent channel interference P

adj

f = ±50 kHz,

∆

– –65 –60 dBc

MOD Pattern: PN9

Spurious suppression P

out

Power Save Rise Time T Power Save Fall Time T I/Q input impedance Z I/Q input bias current I LO1 input VSWR Z

Without external LC between Fil1 and Fil2 pin on this frequency conditions.

Note

(8fLO1)

PS (Rise)

PS (Fall)

I/Q

LO1

fLO1 × 8, fLO1 × 8 (image) VPS VPS

(Low)

(High)

→ VPS → VPS

(High)

(Low)

Between pin I/Ib, Q/Qb 80 200 – k Between pin I/Ib, Q/Qb – 5 13

LO1

= 100 M to 300 MHz – 1.5:1 – –

Note

– –70 –65 dBc –25 –25

Ω

Spectrum analyzer conditions: VBW = 300 Hz, RBW = 300 Hz.

Remark

Electrical characteristics in this document is described for 1.5 GHz system.

Preliminary Data Sheet P13831EJ1V1DS00

Page 6

PIN EXPLANATIONS

µµµµ

PC8158K

Pin No.

Symbol

Supply Voltage

(V)

Pin Voltage

Note

(V)

Function and Application

1IinVCC/2 – Input for I s i gnal . This input

impedance is 200 kΩ. In the case of that I/Q input signals are single ended, amplitude of the signal i s

P-P

500 m V

max.

2IinbVCC/2 – Input for I s i gnal . This input

impedance is 200 kΩ. In the case of that I/Q input signals are single

ended, V

/2 biased DC signal should be input. In the cas e of the I/Q input signals are dif ferential, amplitude of the signal is 500 m V max.

3 N.C. – – This pin is not connected to internal

circuit. This pin s houl d be opened or grounded.

4QinbVCC/2 – Input for Q s i gnal . Thi s input

impedance is 200 kΩ. In the case of that I/Q input signals are single ended, amplitude of the signal i s

P-P

500 m V

max.

5QinVCC/2 – Input for I s i gnal . This input

impedance is 200 kΩ. In the case of that I/Q input signals are single

ended, V

/2 biased DC signal should be input. In case of the I/Q input signals are different i al , amplitude of the signal is 500 m V max.

6N.C. 7N.C.

– – These pins are not connected to

internal circuit. Thes e pi ns should be opened or grounded.

8N.C. 9 LO1inb – 2.98 Bypass pin of modulator’s local

input. This pin should be decoupl ed with 330 pF capacitor.

10 LO1in – 2.98 Local signal input f or modulator.

This pin must be coupled wit h DC cut capacitor 330 pF and should be terminated with 51 Ω resistor.

11 V

2.7 to 4.0 – Supply voltage pin for modulator, up-converter and AGC circui ts.

Internal Equivalent Circ ui t

P-P

–––––––––––––––––

P-P

–––––––––––––––––

9 10

–––––––––––––––––

Pin Voltages are measured on V

Note

= 3.0 V.

Preliminary Data Sheet P13831EJ1V1DS00

Page 7

µµµµ

PC8158K

Symbol

No.

12 GND 0 – Ground pin for modulator, up-

13 LO2in – 1.8 Local signal input for modulator.

14 LO2inb – 1.8 Bypass pin of up-converter’s loc al

15 N.C. – – This pin i s not connected to internal

16 GND 0 – Ground pin for modulator, up-

17 VPS/V

Supply Voltage

(V)

AGCVPS/VAGC

Pin Voltage

Note

(V)

–

Function and Application

converter and AGC circuit s. This pin should be grounded with minimum inductance. Form the ground pattern as widely as poss i bl e to minimize ground impedance.

This pin must be coupled wit h DC cut capacitor 33 pF and should be terminated with 51 Ω resistor.

signal input. This pin s houl d be decoupled with 33 pF capacitor.

circuit. This pin s houl d be opened or grounded.

converter and AGC circuit s. This pin should be grounded with minimum inductance.

Power save control pin for modulator, up-converter and AGC circuits. This pi n al so assigned as gain control pin for AGC circ ui ts. Operation status with appli ed voltages are as follows.

AGC

VPS/V

(V) STATE 0 to 0 .4 OFF (Sleep Mode) 1 to 2.5 On (AGC Mode)

Internal Equivalent Circ ui t

–––––––––––––––––

13 14

–––––––––––––––––

REG

AGC Cont

18 N.C. – – This pin i s not connected to internal

circuit. This pin s houl d be opened or grounded.

19 GND 0 – Ground pin for modulator, up-

converter and AGC circuit s. This pin should be grounded with minimum inductance.

20 V

21 GND 0 – Ground pin for RF output buf fer.

2.7 to 4.0 – Supply voltage pin for modulator,

Pin Voltages are measured on V

Note

up-converter and AGC circui ts.

This pin should be grounded with minimum inductance.

= 3.0 V.

Preliminary Data Sheet P13831EJ1V1DS00

–––––––––––––––––

Page 8

µµµµ

PC8158K

Symbol

No.

22 N.C. – – This pin i s not connected to internal

23 RFout – 1.75 RF output pi n. Thi s pin is emitter

24 N.C. – – These pins are not connected to

25 V

26 Fil1 – 2.76 27 Fil2 – 2.76

Supply Voltage

(V)

2.7 to 4.0 – Supply voltage pin for RF output

Pin Voltage

Note

(V)

Function and Application

circuit. This pin s houl d be opened or grounded.

follower which is low im pedance output port. This pin can be eas i l y matched to 50 Ω impedance using external coupling and decoupling capacitors.

internal circuit. Thes e pi ns should be opened or grounded.

buffer. External inductor and capac i tor can

supress harmonics spuri ous of LO1 frequency. LC value should be determined according to LO1 input frequency and suppression level.

Internal Equivalent Circ ui t

–––––––––––––––––

External

–––––––––––––––––

External

26 27

28 GND 0 – Ground pin for modulator, up-

converter and AGC circuit s. This pin should be grounded with minimum inductance. Form the ground pattern as widely as poss i bl e to minimize ground impedance.

Pin Voltages are measured on V

Note

= 3.0 V.

–––––––––––––––––

Preliminary Data Sheet P13831EJ1V1DS00

Page 9

TEST CIRCUIT

Voltage Source

Vector Signal Analyzer or Spectrum Analyzer

0.22 F

1 000 pF

Voltage Source

2 pF

100 pF

23 24 25

26 27 28

Fil1 Fil2

GND

0.22 F

out

Voltage Source or Pulse Pattern Generator

1 000 pF

100 pF

22 21 20 19 18

GND

VCCGND

AGCcont

UP-CON

AGC

LPF

I/Q Mixer

1 2 3 4 5

µµµµ

PC8158K

16 15

AGC

GND

33 pF

LO2b

14 13 12

11 10

330 pF

33 pF

330 pF

LO2in GND

REG REG

Phase Shifter

LO1in LO1b

7 8

Signal Generator

51 Ω

BPF

Ω

1 000 pF

100 pF

BPF

51 Ω

Signal Generator or Network Analyzer

Voltage Source

0.22 F

TEST CONDITIONS

LO1in

= 178.05 MHz, P

LO2in

= 1619.05 MHz, P

RFout

= 1441 MHz – f

LO1in

LO2in

I/Qin

100 pF 100 pF

= –15 dBm

100 pF 100 pF

I/Q Signal

Generator

Preliminary Data Sheet P13831EJ1V1DS00

Page 10

PACKAGE DIMENSIONS

28 pin plastic QFN (UNIT: mm)

4 – 0.5

0.5

2 × 0.5 = 1

µµµµ

PC8158K

Pin 28

Pin 1

0.22

0.5

7 × 0.5 = 3.5

5.5 ± 0.1

(5.5 ± 0.1)

(5.1)

0.22

0.125

0.5

0.95 ± 0.1

1.2

2 × 0.5 = 1

5.1 ± 0.1

0.5(4.1)0.5

(5.1 ± 0.1)

(0.22)

0.5

(4.7)

(0.22)

(4.5)

0.3

0.5

Bottom View

Preliminary Data Sheet P13831EJ1V1DS00

Page 11

µµµµ

PC8158K

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

PC8158K

µµµµ

Soldering Method Solderi ng Condi tions

Infrared Reflow P ackage peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C) Count: 2, Exposure limi t

Partial Heating Pin temperature: 300°C

Time: 3 seconds or less (per side of device) Exposure limit

After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Note

: None

Note

: None

Recommended Condition Symbol

IR35-00-2

–

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Preliminary Data Sheet P13831EJ1V1DS00

Page 12

µµµµ

PC8158K

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.

M4 96. 5