DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µµµµ
PB1510GV
3 GHz INPUT DIVIDE BY 4 PRESCALER IC
FOR DBS TUNERS
The µPB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. The µPB1510GV is
suitable for use of frequency divider for PLL synthesizer block. The µPB1510GV is a shrink package version of the
PB585G so that this small package contributes to reduce the mounting space.
µ
The µPB1510GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses
silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High toggle frequency : fin = 0.5 GHz to 3.0 GHz
• High-density surface mounting : 8-pin plastic SSOP (175 mil)
• Low current consumption : 5 V, 14 mA TYP.
• Fixed division :÷4
APPLICATION
• Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
• DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
Part Number Package Marking Supplying Form
µ
PB1510GV-E1 8-pin plastic SSOP
(175 mil)
Remark
To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order:
µ
PB1510GV)
1510 Embossed tape 8 mm wide.
Pin 1 is in tape pull-out direc tion.
1000 p/reel
Document No. P12752EJ2V0DS00 (2nd edition)
Date Published October 1998 N CP(K)
Printed in Japan
Caution Electro-static sensitive devices
The information in this document is subject to change without notice.
The mark shows major revised points.
1997©
µµµµ
PIN CONNECTION (Top View)
1
2
3
4
PRODUCT LINE-UP
PB1510GV
Pin No. Pin name
8
7
6
5
1V
2IN
3IN
4GND
5GND
6NC
7OUT
8NC
CC
Features
(Division, Frequency)
4, 2.5 GHz input
÷
4, 3.0 GHz input
÷
Remark
This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTER-
Part number I
PB585G 18 0.5 to 2.5 4.5 to 5.5 8-pin SOP (225 m i l ) NEC Original
µ
PB1510GV 14 0.5 to 3.0 4.5 to 5.5 8-pin SS OP (175 mil)
µ
ISTICS.
PB585G is discontinued.
µ
INTERNAL BLOCK DIAGRAM
IN
IN CLK
D
CLK
SYSTEM APPLICATION EXAMPLE
RF unit block of DBS tuners
1st IF input
from DBS converter
BPF
CC
(mA) fin (GHz) VCC (V) Package Pin Connection
D
Q
Q
MIX
CLK
Q
Q
AMP
SAW AGC amp. FM demo.
OUT
Baseband output
PB1510GV
OSC
µ
÷ 4
Prescaler
LPF
PLL synth.
for VHF/UHF
band
2
µµµµ
PIN EXPLANATION
PB1510GV
Pin No. Symbol
1VCC4.5 to 5.5
2IN
3IN
4, 5 GND 0
6, 8 NC
7OUT
Applied Voltage
(Unit: V)
Pin Voltage
(Unit: V)
1.7 to 4.95 Signal input pin. This pi n should be coupled to signal
1.7 to 4.95 Signal input bypass pi n. This pin must be equipped with
1.0 to 4.7 Divided frequency output pin. Thi s pin is designed as
Supply voltage pin. This pi n m ust be equipped with
bypass capacitor (e.g. 1 000 pF) to minimize ground
impedance.
source with capacitor (e. g. 1 000 pF) for DC cut.
bypass capacitor (e.g. 1 000 pF) to minimize ground
impedance.
Ground pin. Ground pattern on the board should be
formed as wide as possible to minimize ground
impedance.
Non connection pins. These pins should be opened.
emitter follower output. Thi s pin can be connected to
input of prescaler withi n P LL synthesizer through DC cu t
capacitor.
Functions and Explanation
3
µµµµ
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Ratings Unit
PB1510GV
Supply voltage V
Total power dissipation P
Operating ambient temperature T
Storage temperature T
CC
D
A
stg
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit Notice
Supply voltage V
Operating ambient temperature T
ELECTRICAL CHARACTERISTICS (TA =
Parameter Symbol Test Conditi ons MIN. TYP. MAX. Unit
Circuit current I
Upper limit operating frequency 1 f
Upper limit operating frequency 2 f
Lower limit operating frequency f
Input power 1 P
Input power 2 P
Output power P
CC
A
CC
in(U)1
in(U)2
in(L)
in1
in2
out
40 to +85
−−−−
TA = +25 °C6.0V
Mounted on double sided copper clad
50 × 50 × 1.6 mm epoxy glass P WB (T
A
= +85 °C)
250 mW
40 to +85
−
55 to +150
−
C
°
C
°
4.5 5.0 5.5 V
40 +25 +85
−
C, VCC = 4.5 to 5.5 V, ZS = ZL = 50
°°°°
C
°
)
ΩΩΩΩ
No signals 10.5 14 17 mA
Pin = −10 to +6 dBm 3.0
Pin = −15 to +6 dBm 2.7
Pin = −15 to +6 dBm
fin = 2.7 to 3.0 GHz
fin = 0.5 to 2.7 GHz
Pin = 0 dBm, fin = 2.0 GHz
−
−
−
10
15
12
0.5 GHz
−
7
+6 dBm
+6 dBm
GHz
GHz
dBm
4
µµµµ
TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 5 V, unless otherwise specified)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
20
No input signal
15
TA = 25 °C
10
ICC - Circuit Current - mA
5
0
TA = 85 °C
TA = –40 °C
01234567
V
CC - Supply Voltage - V
PB1510GV
INPUT POWER vs. INPUT FREQUENCY
20
TA = 25 °C
10
0
Guaranteed
operating range
–10
–20
VCC = 4.5 to 5.5 V
Pin - Input Power - dBm
–30
–40
–50
0.1 0.5 1 3 10
f
in - Input Frequency - GHz
OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY
0
TA = 85 °C
–5
TA = 25 °C
INPUT POWER vs. INPUT FREQUENCY
20
TA = –40 °C
TA = 25 °C
10
TA = 85 °C
–10
0
TA = 85 °C
TA = 25 °C
Guaranteed
operating range
–20
TA = –40 °C
Pin - Input Power - dBm
–30
–40
V
–50
CC = 5 V
0.1 0.5 1 3 10
fin - Input Frequency - GHz
0
VCC = 5 V
VCC = 5.5 V
–5
TA = –40 °C
–10
Pout - Output Power - dBm
CC = 5 V
V
P
in = 0 dBm
L
= 50 Ω
Z
–15
0.1 0.5 1 3 10
f
in - Input Frequency - GHz
VCC = 4.5V
–10
Pout - Output Power - dBm
A = 25 °C
T
in = 0 dBm
P
L
= 50 Ω
Z
–15
0.1 0.5 1 3 10
f
in - Input Frequency - GHz
5
µµµµ
TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 5V, unless otherwise specified)
PB1510GV
OUTPUT POWER vs. INPUT FREQUENCY
0
V
CC
= 5 V
–5
CC
= 4.5 V
V
–10
- Output Power - dBm
out
P
CC
V
= 5.5 V
TA = –40 ˚C
in
= 0 dBm
P
L
= 50 Ω
Z
–15
0.1 0.5 1 3 10
in
- Input Frequency - GHz
f
S11 vs. INPUT FREQUENCY
CC
V
= 5.0 V, TA = 25°C, ZO = 50
Ω
OUTPUT POWER vs. INPUT FREQUENCY
0
VCC = 5 V
CC
V
= 5.5 V
–5
CC
= 4.5 V
V
–10
- Output Power - dBm
out
P
TA = 85 ˚C
in
= 0 dBm
P
L
= 50 Ω
Z
–15
0.1 0.5 1 3 10
f
in
- Input Frequency - GHz
S
11
Z
REF 1.0 Units
4 200.0 mUnits/
27.159 Ω –27.582 Ω
hp
MARKER 4
Z
3 GH
START 0.500000000 GH
STOP 3.000000000 GH
Frequency (MHz) S11 (Ω)
1 : 500 MH
2 : 1000 MH
3 : 2000 MH
4 : 3000 MH
Z
Z
Z
Z
4
1
3
2
Z
Z
500 37.1 – j207.8
1000 14.2 – j105.1
2000 7.9 – j35.8
3000 27.1 – j27.5
6
µµµµ
S22 vs. OUTPUT FREQUENCY
CC
V
= 5.0V, fin = 500 MHz, TA = 25°C, ZO = 50
S
22
REF 1.0 Units
4 200.0 mUnits/
60.925 Ω 104.77 Ω
hp
Z
PB1510GV
Ω
MARKER 4
Z
750 MH
1
START 0.125000000 GH
STOP 0.750000000 GH
S22 vs. OUTPUT FREQUENCY
CC
V
= 5.0V, fin = 3 GHz, TA = 25°C, ZO = 50
S
22
REF 1.0 Units
4 200.0 mUnits/
15.613 Ω 98.168 Ω
hp
Z
4
3
2
1 : 125 MH
2 : 250 MH
3 : 500 MH
4 : 750 MH
Z
Z
Z
Z
Frequency (MHz) S22 (Ω)
125 55.5 + j6.7
250 53.7 + j30.4
500 55.0 + j60.3
750 60.9 + j104.8
Z
Z
Ω
MARKER 4
Z
750 MH
3
2
1
START 0.125000000 GH
STOP 0.750000000 GH
4
Frequency (MHz) S22 (Ω)
1 : 125 MH
2 : 250 MH
3 : 500 MH
4 : 750 MH
Z
Z
Z
Z
125 28.5 + j11.5
250 27.6 + j23.6
500 20.5 + j50.7
750 15.6 + j98.2
Z
Z
7
µµµµ
TEST CIRCUIT
PB1510GV
Supply Voltage
Signal Generator
50 Ω
HP8665A
1000 pF
1000 pF
C1
1000 pF
1000 pF
C2
C3
5 V±0.5 V
1
2
3
4
8
OPEN
1000 pF
7
C4
OPEN
6
5
Counter HP5350B
(Spectrum Analyzer)
50 Ω
8
µµµµ
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
,,,,
,,
,
1P
V
CC
PB1510GV
IN OUT
COMPONENT LIST
Symbol Value
C1 to C4 1000 pF
IN
C2 C4
C1
C3
PB1506/08/09GV
µ
OUT
EVALUATION BOARD CHARACTERS
(1) 35
m thick double-sided copper clad 50 × 50 × 0.4 mm
µ
polyimide board
(2) Back side: GND pattern
(3) Solder plated patterns
(4)
(5)
(6)
: Through holes
°
of pin 3 : partern should be removed.
of pin 5 : short chip must be attached to be grounded.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
9
µµµµ
PACKAGE DIMENSIONS
8 PIN PLASTIC SSOP (175 mil) (UNIT: mm)
85
14
+7°
–3°
3°
4.94±0.2
PB1510GV
1.8 MAX.
0.1±0.1
1.5±0.1
0.575 MAX.
3.0 MAX.
0.65
0.3
+0.10
–0.05
+0.10
–0.05
0.15
0.10
0.5±0.2
M
3.2±0.1
0.87±0.2
0.15
10
PB1510GV
µµµµ
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Soldering Conditions Recommended Condition Symbol
CC
pin.
Infrared Reflow Package peak temperature: 235 ° C or bel ow
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t
VPS Package peak temperature: 215 ° C or bel ow
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t
Wave Soldering Soldering bath temperature: 260 ° C or bel ow
Time: 10 seconds or less
Count: 1, Exposure limi t
Partial Heating Pi n temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Note
Note
: None
Note
Note
Note
: None
: None
: None
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
11
PB1510GV
µµµµ
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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