DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
PPPP
PB1509GV
1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC
FOR PORTABLE SYSTEMS
PB1509GV is a divide by 2, 4, 8 prescaler IC for portable radio or cellular telephone applications. PPB1509GV is
P
a shrink package version of PPB587G so that this small package contributes to reduce the mounting space.
PB1509GV is manufactured using NEC’s high fT NESATTM IV silicon bipolar process. This process uses silicon
P
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
High toggle frequency :f
x
Low current consumption :5.0 mA @ VCC = 3.0 V
x
High-density surface mounting :8 pin plastic SSOP (175mil)
x
Supply voltage :VCC = 2.2 to 5.5 V
x
Selectable division :y 2, y 4, y 8
x
in
=50 MHz to 700 MHz @ y 2,
50 MHz to 800 MHz @ y 4,
50 MHz to 1000 MHz @ y 8
APPLICATION
Portable radio systems
x
Cellular/cordless telephone 2nd Local prescaler and so on.
x
ORDERING INFORMATION
PART NUMBER PACKAGE
PB1509GV-E1 8 pin plastic SSOP
P
(175 mil)
Remarks
:To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
PB1509GV)
P
Caution:Electro-static sensitive devices
MARKING
1509 Embossed tape 8 mm wide. Pin 1 is in tape pull-out
SUPPLYING FORM
direction. 1000p/reel.
Document No. P10769EJ2V0DS00 (2nd edition)
Date Published September 1997 N
Printed in Japan
©
1996
PIN CONNECTION (Top View)
Pin NO. Pin Name
PPPP
PB1509GV
1V
1
2
3
4
8
7
6
5
2IN
3IN
4 GND
5 SW1
6 SW2
7 OUT
8V
CC1
CC2
PRODUCT LINE-UP
2
y
Product No. I
PB587 G 5.5 2.2 to 3.5 50 to 300 50 to 600 50 to 1000 8 pin SOP (225 mil)
P
PB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1000 8 pin SSOP (175 mil)
P
CC
(mA)
V
(V)
CC
in
f
(MHz)
4
y
in
f
(MHz)
8
y
in
f
(MHz)
Package Pin Connection
NEC Original
Remarks
This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS.
PB587G is discontinued.
P
INTERNAL BLOCK DIAGRAM
IN
IN
D
CLK
Q
Q
D
CLK
Q
Q
D
CLK
Q
OUT
Q
SW1 SW2
2
SYSTEM APPLICATION EXAMPLE
One of the example for usage
PPPP
PB1509GV
RX
TX
SW
PA
VCO
÷N PLL
DEMO
VCO
PLL
µ
÷N PB1509GV
0°
φ
90°
I
Q
I
Q
This block diagram schematically shows the PPB1509GV’s location in one of the example application system.
The other applications are also acceptable for divider use.
3
Pin Explanations
PPPP
PB1509GV
Pin No. Symbol
1V
2IN
3IN
4 GND 0
5 SW1 H/L
6 SW2 H/L
7 OUT
8V
CC1
CC2
Applied
Voltage
2.2 to 5.5
•
•
•
2.2 to 5.5
Pin
Voltage
•
1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor
1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor
•
•
•
1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower
•
Power supply pin of a input amplifier and dividers. This pin must be
equipped with bypass capacitor (eg 1000 pF) to minimize ground
impedance.
(eg 1000 pF) for DC cut.
(eg 1000 pF) to minimize ground impedance.
Ground pin. Ground pattern on the board should be formed as wide as
possible to minimize ground impedance.
Divide ratio control pin. Divide ratio can be determined by following applied
level to these pins.
SW1
These pins must be each equipped with bypass capacitor to minimize their
impedance.
output. This pin can output 0.1 V
This pin should be coupled to load device with capacitor (eg 1000 pF) for
DC cut.
Power supply pin of output buffer amplifier. This pin must be equipped
with bypass capacitor (eg 1000 pF) to minimize ground impedance.
Functions and Explanation
SW2
HL
H 1/2 1/4
L 1/4 1/8
P-P
min with 200 : load.
4
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL CONDITION RATINGS UNIT
Supply voltage V
Input voltage V
Total power dissipation P
CC
TA = +25 qC 6.0 V
in
TA = +25 qC, SW1, SW2 pins 6.0 V
D
Mounted on double sided copper clad 50 u 50 u 1.6
mm epoxy glass PWB (T
Operating ambient
A
T
temperature
Storage temperature T
stg
RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTICE
Supply voltage V
Operating ambient temperature T
CC
A
2.2 3.0 5.5 V
40 +25 +85
ð
A
= +85 qC)
PPPP
PB1509GV
250 mW
40 to +85
ð
55 to +150
ð
C
q
C
q
C
q
ELECTRICAL CHARACTERISTICS (TA =
PARAMETERS
Circuit current I
Upper Limit Operating Frequency 1 f
Upper Limit Operating Frequency 2 f
Lower Limit Operating Frequency 1 f
Lower Limit Operating Frequency 2 f
Input Power 1 P
Input Power 2 P
Output Voltage V
Divide ratio control input high V
Divide ratio control input low V
Divide ratio control input high V
Divide ratio control input low V
SYMBOLS
CC
in(U)1
in(U)2
in(L)1
in(L)2
in1
in2
out
IH1
IL1
IH2
IL2
40 to +85
ðððð
C, VCC = 2.2 to 5.5 V)
qqqq
TEST CONDITIONS MIN. TYP. MAX. UNIT
No signals, VCC = 3.0 V 3.5 5.0 5.9 mA
Pin = ð20 to 0 dBm 500
Pin = ð20 to ð5 dBm @ y 2
@ y 4
@ y 8
Pin = ð20 to 0 dBm
Pin = ð20 to ð5 dBm
fin = 50 MHz to 1000 MHz
fin = 50 MHz to 500 MHz
RL = 200
:
Connection in the test circuit V
700
800
1000
••
••
20
ð
20
ð
0.1 0.2
CC
Connection in the test circuit OPEN
or
GND
Connection in the test circuit V
CC
Connection in the test circuit OPEN
or
GND
••
•
•
•
•
•
•
50 MHz
500 MHz
•ð
•
5 dBm
0 dBm
•
CC
V
OPEN
or
GND
CC
V
OPEN
or
GND
CC
V
OPEN
or
GND
CC
V
OPEN
or
GND
MHz
MHz
V
•
•
•
•
P-P
5
TEST CIRCUIT
PPPP
PB1509GV
Power Supply
8
V
CC2
7
OUT
6
SW2
5
SW1
C5
C7
C6
C4
High impedance
Oscilloscope
R1
150 Ω
50 Ω
Counter
(or Spectrum Analizer)
50 Ω
Signal Generator
C3
C1
C2
1000 pF
V
1
CC1
2
IN
3
IN
4
GND
EQUIPMENTS
Signal Generator (HP-8665A)
Counter (HP-5350B) for measuring input sensitivity (Spectrum Analyzer for measuring output frequency)
Oscilloscope for measuring output swing (In measuring output power on Spectrum Analyzer, oscilloscope should
be turned off.)
Divide Ratio Setting
SW2
HL
SW1
H: SW pin should be connected to V
H 1/2 1/4
L 1/4 1/8
CC1
pin.
L: SW pin should be opened or connected to GND.
6
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
1P
V
CC1
PPPP
PB1509GV
V
CC2
Component List
No. Value
C1 to C7 1000 pF
R1
150 :
Note
IN OUT
C1
C3
µ
PB1506/08/09GV
C7
C4
C5
R1
C6C2
OUTIN
SW2
SW1
Notes for evaluation board
(1) 35 Pm thick double sided copper clad 50 u 50 u 0.4 mm polyimide board
(2) Back side : GND pattern
(3) Solder plated on pattern
O
(4)
: Through holes
O
(5) : Remove pattern
For Output load of IC, R1 is determined as follows; R1 + Impedance of measurement equipment = 200 :.
Note
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
The usage and applications of PPB1509GV should be referred to the application note (Document No. P12611E).
7
CHARACTERISTIC CURVES
Circuit Current vs. Supply Voltage
9
PPPP
PB1509GV
8
TA = –40°C
7
6
(mA)
CC
5
4
Recommended operating range
TA = +25°C
TA = +85°C
3
Circuit Current I
2
1
0
0123
Supply Voltage V
456
CC
(V)
Divide by 2 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C)
Input power vs. Input frequency
20
10
VCC = 3.0 V
VCC = 2.2 V
Guaranteed
operating window
(dBm)
in
–10
(dBm)
in
VCC = 5.5 V
0
–20
–30
Input power P
–40
–50
TA = +25°C VCC = 3.0 V
–60
10 100
Input frequency f
VCC = 2.2 V
VCC = 3.0 V
VCC = 5.5 V
in
(MHz)
Input power P
1000 2000
20
10
0
–10
–20
–30
–40
–50
–60
10 100
Input power vs. Input frequency
TA = +25°C
TA = –40°C
Guaranteed
operating window
TA = –40°C
TA = +25°C
Input frequency f
T
A = +85°C
TA = +85°C
in
(MHz)
1000 2000
8
PPPP
PB1509GV
Input power vs. Input frequency
20
TA = +25°C
10
T
A
= +85°C
–10
(dBm)
in
0
–20
–30
Input power P
–40
TA = +25°C
–50
VCC = 2.2 V VCC = 5.5 V
–60
10 100
Output voltage swing vs. Input frequency
VCC = 3.0 V
in
= 0 dBm
P
0.3
(V)
P-P
TA = +25°C
TA = –40°C
Guaranteed
operating window
TA = +85°C
TA = –40°C
Input frequency f
T
A
= +85°C
in
(MHz)
TA = +25°C
1000 2000
20
10
0
–10
(dBm)
in
–20
–30
Input power P
–40
–50
–60
TA = –40°C
10 100
Output voltage swing vs. Input frequency
TA = +25°C
in
= 0 dBm
P
0.3
(V)
VCC = 3.0 V
P-P
Input power vs. Input frequency
TA = +25°C
TA = –40°C
TA = +85°C
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
in
(MHz)
VCC = 5.5 V
1000 2000
0.2
TA = –40°C
0.1
Output voltage swing V
0
10 100
Input frequency f
Output voltage swing vs. Input frequency
TA = –40°C
P
in
= 0 dBm
0.3
(V)
P-P
VCC = 3.0 V
0.2
0.1
Output voltage swing V
TA = +85°C
TA = –40°C
in
VCC = 5.5 V
VCC = 2.2 V
(MHz)
1000 2000
0.2
0.1
Output voltage swing V
0
10 100
Input frequency f
Output voltage swing vs. Input frequency
TA = +85°C
P
in
= 0 dBm
0.3
VCC = 3.0 V
(V)
P-P
0.2
0.1
Output voltage swing V
VCC = 2.2 V
VCC = 5.5 V
VCC = 2.2 V
in
(MHz)
1000 2000
0
10 100
Input frequency f
in
(MHz)
1000 2000
0
10 100
Input frequency f
in
(MHz)
1000 2000
9
Divide by 4 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C)
PPPP
PB1509GV
20
10
0
VCC = 2.2 V
–10
(dBm)
in
–20
–30
Input power P
–40
VCC = 5.5 V
–50
TA = +25°C VCC = 3.0 V
–60
10 100
Input power vs. Input frequency
20
T
A
= +85°C
10
0
Input power vs. Input frequency
VCC = 5.5 V
VCC = 3.0 V
Guaranteed
operating window
VCC = 2.2 V
VCC = 3.0 V
VCC = 5.5 V
Input frequency f
in
(MHz)
TA = +25°C
TA = –40°C
1000 2000
20
10
0
–10
(dBm)
in
–20
–30
Input power P
–40
–50
–60
TA = –40°C
10 100
20
10
TA = –40°C
0
Input power vs. Input frequency
T
A
= +85°C
TA = –40°C
TA = +25°C
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
in
(MHz)
Input power vs. Input frequency
TA = +85°C
TA = +25°C
1000 2000
–10
(dBm)
in
–20
–30
Input power P
–40
TA = –40°C
–50
VCC = 2.2 V VCC = 5.5 V
–60
10 100
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
in
(MHz)
1000 2000
–10
(dBm)
in
–20
–30
Input power P
–40
–50
–60
TA = –40°C
10 100
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
TA = –40°C
in
(MHz)
1000 2000
10
Divide by 8 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C)
PPPP
PB1509GV
Input power vs. Input frequency
20
10
VCC = 5.5 V
0
–10
(dBm)
in
–20
–30
Input power P
–40
–50
TA = +25°C VCC = 3.0 V
–60
10 100
Input power vs. Input frequency
20
TA = +85°C
10
0
TA = +25°C
–10
(dBm)
in
–20
–30
Input power P
–40
TA = –40°C
–50
VCC = 2.2 V VCC = 5.5 V
–60
10 100
VCC = 3.0 V
VCC = 2.2 V
Guaranteed
operating window
VCC = 5.5 V
VCC = 3.0 V
Input frequency f
TA = +25°C
TA = –40°C
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
VCC = 2.2 V
in
(MHz)
in
(MHz)
1000 2000
1000 2000
Input power vs. Input frequency
20
10
TA = –40°C
0
–10
(dBm)
in
–20
–30
Input power P
–40
TA = –40°C
–50
–60
10 100
Input power vs. Input frequency
20
10
TA = –40°C
0
–10
(dBm)
in
–20
–30
Input power P
–40
TA = –40°C
–50
–60
10 100
TA = +25°C
TA = –40°C
TA = +85°C
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
TA = +25°C
Guaranteed
operating window
TA = +85°C
TA = +25°C
Input frequency f
1000 2000
in
(MHz)
TA = +85°C
1000 2000
in
(MHz)
11
S11 vs. Input Frequency
S
11
REF 21.0 Units/
200.0 mUnits/
55.375 Ω – 142.79 Ω
MARKER 2
700.0 MHz
PPPP
PB1509GV
V
CC1
= V
CC2
= 3.0 V, SW1 = SW2 = 3.0 V
FREQUENCY
MHz
100.0000
200.0000
300.0000
400.0000
500.0000
1
2
600.0000
700.0000
800.0000
900.0000
1000.0000
3
MAG
.929
.898
.866
.840
.834
.819
.803
.792
.787
.771
S11
ANG
–6.7
–10.5
–13.6
–15.9
–19.1
–21.9
–24.7
–27.0
–30.0
–32.7
START
STOP
0.050000000 GHz
1.000000000 GHz
S22 vs. Output Frequency
S
22
REF 1.0 Units/
200.0 mUnits/
START
STOP
Z
50 MHz
149.09 Ω + j 14.86 Ω
350 MHz
194.21 Ω – j 36.64 Ω
0.050000000 GHz
0.350000000 GHz
12
PACKAGE DIMENSIONS (UNIT: mm)
8 PIN PLASTIC SSOP (175 mil)
85
14
Detail of lead end
+7°
–3°
3°
4.94±0.2
PPPP
PB1509GV
1.8 MAX.
0.1±0.1
1.5±0.1
0.575 MAX.
3.0 MAX.
0.65
0.3
+0.10
–0.05
+0.10
–0.05
0.15
0.10
0.5±0.2
M
3.2±0.1
0.87±0.2
0.15
13
PPPP
PB1509GV
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales representatives.
PB1509GV
PPPP
Soldering method Soldering conditions
Infrared ray reflow Package peak temperature: 235qC,
Hour: within 30 s. (more than 210qC),
Time: 3 times, Limited days: no.*
VPS Package peak temperature: 215qC,
Hour: within 40 s. (more than 200qC),
Time: 3 times, Limited days: no.*
Wave soldering Soldering tub temperature: less than 260qC,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin part heating Pin area temparature: less than 300qC,
Hour: within 3 s./pin
Limited days: no.*
It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH.
*
Recommended
condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
14
[MEMO]
PPPP
PB1509GV
15
PPPP
PB1509GV
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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