Datasheet UPB1505GR-E1, UPB1505GR Datasheet (NEC)

DATA SHEET

BIPOLAR DIGITAL INTEGRATED CIRCUIT

µ

PB1505GR

3.0 GHz PRESCALER DIVIDED BY 256, 128, 64
FOR BS/CS TUNER

DESCRIPTION

µ

PB1505GR is a silicon prescaler IC operating up to 3.0 GHz and divided by 256, 128, 64. Due to 3.0 GHz operation and
high division, this IC can contribute to produce BS/CS tuners with kit-use of 17K series DTS controller or standard CMOS
PLL IC. The package is 8 pin plastic SOP suitable for surface mounting.

This IC is manufactured using NEC’s 20 GHz f
passivation film and gold electrodes. These materials can protect the chips from external pollution and prevent corrosion/
migration. Thus, this IC has with excellent performance, uniformity and reliability.

T NESAT



III silicon bipolar process. This process uses silicon nitride

FEATURES

• High toggle-frequency : 0.5 GHz to 3.0 GHz

• Low power-consumption : 14 mA TYP. at 5 V

• High divide-ratio : ÷256, ÷128, ÷64

• High input-sensitivity : –14 to +10 dBm @ 1.0 GHz to 2.7 GHz

• Wide output-swing : 1.6 Vp-p (CL = 8 pF load)

ORDERING INFORMATION

PART NUMBER PACKAGE SUPPLYING FORM

µ

PB1505GR-E1

Remarks To order evaluation samples, please contact your local NEC sales office. (Order number : µPB1505GR)

8 pin plastic SOP Embossed tape 12 mm wide. QTY 2.5 k/reel
(225 mil) Pin 1 is in tape pull-out direction.

PIN ASSIGNMENT (Top View)

IN

1

V

2

CC

8

IN

7

GND

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.

Document No. P10872EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan

SW1

OUT

3

4

Caution electro-static sensitive devices

The mark shows major revised points.

6

5

SW2

GND

©

1996,1999

SELECTOR GUIDE

µ

PB1505GR

FEATURES

2.5 GHz / ÷512, ÷256

2.5 GHz / ÷128, ÷64

3.0 GHz / ÷256, ÷128, ÷64

PRODUCT ICC fin VCC

NUMBER (mA) (GHz) (V)

µ

PB586G 28 0.5 to 2.5 5 8 pin SOP

µ

PB588G 26 0.5 to 2.5 5 8 pin SOP

µ

PB1505GR 14 0.5 to 3.0 5 8 pin SOP Typical of prescaler

Notice Typical performance. Please refer to Electrical Characteristics in detail.

To know the associated products, please refer to their latest data sheets.

INTERNAL BLOCK DIAGRAM

CC

V

2

INPUT

BYPASS

1

1 / 64 1 / 2 1 / 2 Buff.

8

5, 7

GND SW1 SW2

36

PACKAGE PIN ASSIGNMENT

NEC original

OUTPUT

4

PIN DESCRIPTIONS

PIN NO. SYMBOL ASSIGNMENT FUNCTIONS AND EXPLANATION

1 IN Frequency input

pin

2VCC Power supply pin

3 SW1 Divided ratio

control input pin 1

6 SW2 Divided ratio

control input pin 2

4 OUT Divided frequency

output pin

5 GND Ground pin
7

Input frequency from an external VCO output.
Must be coupled with capacitor (e.g. 1 000 pF) for DC cut.

Supply voltage 5.0±0.5 V for operation. Must be connected bypass capacitor
(e.g. 1 000 pF) to minimize ground impedance.

Divided ratio control can be governed by following input data to these pins.

SW2

HL

SW1

H
L

This frequency output can be interfaced to CMOS PLL.
Must be coupled with capacitor (e.g. 1 000 pF) for DC cut.

This pin must be connected to the system ground with minimum inductance.
Ground pattern on the board should be formed as wide as possible.
(Track length should be kept as short as possible.)

1/64 1/128

1/128

1/256

8 IN Frequency-input

bypass pin

2

This pin must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground
impedance.

Data Sheet P10872EJ3V0DS00

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL RATING UNIT CONDITIONS
Supply voltage VCC –0.5 to +6 V TA = +25 °C
Input voltage VIN –0.5 to VCC +0.5 V TA = +25 °C

µ

PB1505GR

Power dissipation PD 250 mW

Operating temperature Topt –40 to +85 °C
Storage temperature Tstg –55 to +150 °C

Mounted on 50 × 50 × 1.6 mm double copper clad
epoxy glass PWB (TA = +85 °C)

RECOMMENDED OPERATING RANGE

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Supply voltage VCC 4.5 5.0 5.5 V
Operating temperature Topt –40 +25 +85 °C

ELECTRICAL CHARACTERISTICS (TA = –40 to +85 °C, VCC = 4.5 to 5.5 V)

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS
Circuit current ICC 9.0 14.0 19.5 mA No input signal
Upper response frequency 1 fin(U)1 3.0 GHz Pin = –10 to +10 dBm
Upper response frequency 2 fin(U)2 2.7 GHz Pin = –14 to –10 dBm
Lower response frequency 1 fin(L)1 0.5 GHz Pin = –10 to +8 dBm
Lower response frequency 2 fin(L)2 1.0 GHz Pin = –14 to –10 dBm, +8 to +10 dBm
Input sensitivity 1 Pin1 –10 +8 dBm fin = 0.5 to 1.0 GHz
Input sensitivity 2 Pin2 –14 +10 dBm fin = 1.0 to 2.7 GHz
Input sensitivity 3 Pin3 –10 +10 dBm fin = 2.7 to 3.0 GHz
Output Swing VOUT 1.3 1.6 VP-P CL = 8 pF
SW1 input voltage (H) VIH1 VCC VCC VCC V
SW1 input voltage (L) VIL1 OPEN OPEN OPEN V
SW2 input voltage (H) VIH2 VCC VCC VCC V
SW2 input voltage (L) VIL2 OPEN OPEN OPEN V

Data Sheet P10872EJ3V0DS00

3

TEST CIRCUIT

µ

PB1505GR

V

CC

= +5.0 V ±10 %

S.G.

1 000 pF

50 Ω

C

2

5 pF

1 000 pF

C

1

1 000 pF

C

C

1 000 pF

IN

1

V

2

CC

3

SW1

4

OUT

3

MONITOR

5

1 MΩ

3 pF

OSCILLOSCOPE

IN

GND

SW2

GND

8

C

7

6

5

Divided Ratio Control

H

SW1

L

4

SW2

HL

1/64 1/128

1/128

1/256

ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

KB-1505

IN

CC

V

C2

SW1 SW2

C5

OUT

C1

C3

1

C4

B

A

COMPONENT LIST
No. Value

C1 to C4 1 000 pF

C5 5 pF

A, B shorting chip

4

Data Sheet P10872EJ3V0DS00

Note :
(*1) 50 × 50 × 0.4 mm double copper clad polyimide board

(*2) Back side : GND pattern
(*3) Solder plated on pattern
(*4) : Through holes

(*5) pattern should be removed on this testing.

TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C)

µ

PB1505GR

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

20

10

– Circuit Current – mA

CC

I

2.0

V

CC

– Supply Voltage – V

OUTPUT SWING vs. FREQUENCY

2.0

X

1.8

P-P

1.6

1.4

– Output Swing – V

OUT

1.2

V

1.0

0.2

X

1.00.5 2.0 5.0

f – Input Frequency – GHz

4.0 6.0

X

X

X

X

X

X

X

: VCC = 5.5 V

CC

= 5.0 V

: V
: V

CC

= 4.5 V

INPUT POWER vs. FREQUENCY

40

20

VCC = 4.5 to 5.5 V

0

Guaranteed operating
range

–20

–40

– Input Power Level – dBm

in

P

–60

0.2 0.5 1.0 2.0 5.00
f – Input Frequency – GHz

OUTPUT POWER vs. FREQUENCY

–6

T

A

= –40 °C

P

in

= –10 dBm

–8

–10

X

–12

– Output Power Level – dBm

O

P

–14

0.2 0.5 1.0 2.0 5.0

X

X

X

X

X

f – Input Frequency – GHz

VCC = 4.5 to 5.5 V

: VCC = 5.5 V

X

: V
: V

X

X

X

X

X

X

CC

= 5.0 V

CC

= 4.5 V

X

X

X

OUTPUT POWER vs. FREQUENCY OUTPUT POWER vs. FREQUENCY

–6

T

A

= +25 °C

P

in

= –10 dBm

–8

–10

X

–12

– Output Power Level – dBm

O

P

–14

0.2 0.5 1.0 2.0 5.0

X

X

X

X

X

f – Input Frequency – GHz

: VCC = 5.5 V

X

: V

CC

= 5.0 V

: V

CC

= 4.5 V

–6

T

A

= +85 °C

P

in

= –10 dBm

: VCC = 5.5 V

X

: V

CC

= 5.0 V

: V

CC

= 4.5 V

–8

XXX

X

X

X

X

X

X

X

X

X

X

X

X

X

X

–10

–12

– Output Power Level – dBm

O

P

–14

X

0.2 0.5 1.0 2.0 5.0

X

X

X

X

X

f – Input Frequency – GHz

Data Sheet P10872EJ3V0DS00

5

PACKAGE DIMENSIONS

8 PIN PLASTIC SOP (225 mil) (UNIT: mm)

85

detail of lead end

+7°

3°

–3°

µ

PB1505GR

1

4

5.2 ± 0.2

6.5 ± 0.3

1.57 ± 0.2

4.4 ± 0.15

1.49

0.42

1.27

+0.08

–0.07

M

0.12

0.85 MAX.

0.17

0.6 ± 0.2

+0.08

–0.07

0.1 ± 0.1

Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.

NOTE

1.1 ± 0.2

0.10

6

Data Sheet P10872EJ3V0DS00

µ

PB1505GR

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V

CC pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions than

the recommended conditions are to be consulted with our sales representatives.

µ

PB1505GR

Soldering method Soldering conditions

Infrared ray reflow Package peak temperature : 235 °C, Hour : within 30 s. (more than 210 °C), IR35-00-3

Time : 3 time, Limited days : no. *

VPS Package peak temperature : 215 °C, Hour : within 40 s. (more than 200 °C) , VP-15-00-3

Time : 3 time, Limited days : no. *

Wave soldering Soldering tub temperature : less than 260 °C, Hour : within 10 s. WS60-00-1

Time : 1 time, Limited days : no. *

Pin part heating Pin area temperature : less than 300 °C, Hour : within 3 s./pin

Limited days : no. *

* : It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

Recommended conditoin

symbol

For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR
DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P10872EJ3V0DS00

7

µ

PB1505GR

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

SENSITIVE

DEVICES

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

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property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
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parties arising from the use of these circuits, software, and information.

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the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
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• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.

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support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98.8