Datasheet UMA1014T-C2 Datasheet (Philips)

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Page 1

DATA SH EET

Product speciﬁcation Supersedes data of October 1991 File under Integrated circuits, IC03

October 1992

INTEGRATED CIRCUITS

UMA1014

Low-power frequency synthesizer for mobile radio communications

Page 2

October 1992 2

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

FEATURES

• Single chip synthesizer; compatible with Philips cellular radio chipset

• Fully programmable RF divider

• I2C interface for two-line serial bus

• On-chip crystal oscillator/TCXO buffer from 3 to 16 MHz

• 16 reference division ratios allowing 5 to 100 kHz

channel spacing

• 1/8 crystal frequency output

• On-chip out-of-lock indication

• Two extra VCO control outputs

• Latched synthesizer alarm output

• Status register including out-of-lock indication and

power failure

• Power-down mode.

APPLICATIONS

• Cellular mobile radio (NMT, AMPS, TACS)

• Private mobile radio (PMR)

• Cordless telephones.

GENERAL DESCRIPTION

The UMA1014 is a low-power universal synthesizer which has been designed for use in channelized radio communication. The IC is manufactured in bipolar technology and is designed to operate at 5 to 100 kHz channel spacing with an RF input from 50 to 1100 MHz. The channel is programmed via a standard I

C-bus. A low-power sensitive RF divider is incorporated together with a dead-zone eliminated, 3-state phase comparator. The low-noise charge pump delivers 1 mA or 1/2 mA output current to enable a better compromise between fast switching and loop bandwidth. A power-down circuit enables the synthesizer to be set to idle mode.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

, V

supply voltage range 4.5 5.0 5.5 V

+ I

supply current − 13 − mA

CCpd

ICC in power-down − 2.5 − mA

ref

phase comparator reference frequency 5 − 100 kHz

RF input frequency 50 − 1100 MHz

amb

operating ambient temperature range −40 − 85 °C

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

UMA1014T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for

mobile radio communications

UMA1014

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

1 2

15 9 10 7 13

MAIN

CONTROL

3-BITS

VCO buffer switch output B VCO buffer switch output A serial data input/output serial clock input

18-BITS 4-BITS 1-BIT 1-BIT

MAIN

DIVIDER

REFERENCE

DIVIDER

PHASE

COMPARATOR

CHARGE

PUMP

OUT-OF-

LOCK

31/32

BUFFER/

OSCILLATOR

UMA1014

internally

connected

+5 V charge pump supply

1/8 crystal frequency

output

ground+5 V supply

4 6 16 14 3

charge pump output

oscillator input

RF input

oscillator output

hardware

power-down

slave address

select input A

synthesizer

alarm

output

MRA396 - 1

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

PINNING

SYMBOL PIN DESCRIPTION

OSCIN 1 oscillator or TCXO input OSCOUT 2 oscillator output V

3 5 V charge pump supply

4 5 V supply PCD 5 charge pump output GND 6 ground VCOA 7 VCO buffer switch output A

(including out-of-lock) RF 8 RF input SCL 9 serial clock input SDA 10 serial data input/output HPD 11 hardware power-down (active LOW) SAA 12 slave address select input A VCOB 13 VCO buffer switch output B i.c. 14 internally connected SYA 15 synthesizer alarm output FX8 16 1/8 crystal frequency output

Fig.2 Pin configuration.

handbook, halfpage

215

UMA1014

OSCIN

OSCOUT

PCD

GND

VCOA

FX8

SYA

i.c.

VCOB

SDA

HPD

SAA

SCL

MRA397 - 1

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

FUNCTIONAL DESCRIPTION

The UMA1014 is a low-power frequency synthesizer for radio communication which operates in the 50 to 1100 MHz range. The device includes an oscillator/buffer circuit, a reference divider, an RF divider, a 3-state phase comparator, a charge pump and a main control circuit to transfer the serial data into the four internal 8-bit registers. The VCC supply feeds the logic part, the VCP supply feeds the charge-pump only. Both supplies are +5 V (±10%). The power-down facility puts the synthesizer in the idle mode (all current supplies are switched off except in the control part). This allows any I

C transfer and all information in the registers is retained thus enabling fast power-up.

Main divider

The main divider is a pulse swallow type counter which is fully programmable. After a sensitive input amplifier (50 mV, −13 dBm), the RF signal is applied to a 31/32 duo-modulus counter. The output is then used as the clock for the 5-bit swallow counter R = (MD4 to MD0) and the 13-bit main counter N = (MD17 to MD5). The ratio is transferred via the I

C-bus to the registers B, C and D, and then buffered in an 18-bit latch. The ratio in the divider chain is updated with the new information when the least significant bit is received (i.e. D0). This update is synchronized to the output of the divider in order to limit the phase error during small jumps of the synthesized frequency.

The main divider can be programmed to any value between 2048 and 262143 (i.e. 218−1). If ratio X, below 2048, is sent to the divider, the ratio (X + 2048) will be programmed. When it is required to switch between adjacent channels it is possible to program register D only, thus allowing shorter I2C programming time.

Oscillator

The oscillator is a common collector Colpitts type with external capacitive feedback. The oscillator has very small temperature drift and high voltage supply rejection. A TCXO or other type of clock can be used to drive the oscillator by connecting the source (preferably AC-coupled) to pin 1 and leaving pin 2 open-circuit. The oscillator acts as a buffer in this mode and requires no additional external components. The signal from the clock source should have a minimum space width of 31 ns.

Reference divider

The reference divider is semi-programmable with 16 division ratios which can be selected via the I

C-bus. The programming uses four bits of the register A (A3 to A0) as listed in Table 2. These ratios allow the use of a large number of crystal frequencies from 3 MHz up to 16 MHz. All main channel spacings can be obtained with a single crystal/TXCO frequency of 9.6 MHz.

Phase comparator

A diagram of the phase comparator and charge pump is illustrated in Fig.3.

The phase comparator is both a phase and frequency detector. The detector comprises dual flip-flops together with logic circuitry to eliminate the dead-zone. When a phase error is detected the UP or DOWN signal goes HIGH. This switches on the corresponding current generator which produces a source or sink current for the loop filter. When no phase error is detected PCD goes high impedance. The final tuning voltage for the VCO is provided by the loop filter. The charge pump current is programmable via the I

C-bus. When IPCD (bit 5) is set to logic 1 the charge pump delivers 1 mA; when IPCD is set to logic 0 the charge pump delivers 0.5 mA.

The phase comparator has a phase inverter logic input (PHI). This allows the use of inverted or non-inverted loop filter configurations. It is thus possible to use a passive loop filter which offers higher performances without an operational amplifier. The function of the phase comparator is given in Table 3 and a typical transfer curve is illustrated in Fig.4.

Out-of-lock detector

An out-of-lock detector using the UP and DOWN signals from the phase comparator is included on-chip. The pin VCOA is an open collector output which is forced LOW during an out-of-lock condition. The same information is also available via the I

C-bus in the status register (bit OOL). When the phase error (measured at the phase comparator) is greater than approximately 200 ns, an out-of-lock condition is immediately flagged. The flag is only released after 6 reference cycles when the phase error is less than 200 ns.

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

Table 1 Division ratio in the main divider

Table 2 Reference divider programming

Table 3 Operation of the phase comparator

MAIN COUNTER: N SWALLOW COUNTER: R

MD17 MD16 MD15 ... MD8 MD7 ... MD5 MD4 ... MD0

B1 B0 C7 ... C0 D7 ... D5 D4 ... D0

MSB LSB

A3(RD3) A2(RD2) A1(RD1) A0(RD0)

REFERENCE DIVISION

RATIO

CHANNEL SPACING FOR 9.6 MHz AT

OSCIN

0000 128 75 kHz 0001 160 60 kHz 0010 192 50 kHz 0011 240 40 kHz 0100 256 37.5 kHz 0101 320 30 kHz 0110 384 25 kHz 0111 480 20 kHz 1000 512 18.75 kHz 1001 640 15 kHz 1010 768 12.5 kHz 1011 960 10 kHz 1100 1024 9.375 kHz 1101 1280 7.5 kHz 1110 1536 6.25 kHz 1111 1920 5 kHz

PHI = 0 (PASSIVE LOOP FILTER) PHI = 1 (ACTIVE LOOP FILTER)

ref

< f

var

ref

> f

var

ref

= f

var

ref

< f

var

ref

> f

var

ref

= f

var

UP010100

DOWN 100010

pcd

−1 mA 1 mA <±5 nA 1 mA −1 mA <±5 nA

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

MAIN CONTROL

The control part consists mainly of the I2C-bus control interface and a set of four registers A, B, C and D. The serial input data (SDA) is converted into 8-bit parallel words and stored in the appropriate registers. The data transmission to the synthesizer is executed in the burst mode with the following format:

//slave addr./subaddr./data1/data2/.../datan//; n up to 4 Data byte 1 is written in the register indicated by the

subaddress. An auto-increment circuit, if enabled

(AVI = 1), then provides the correct addressing for the ensuing data bytes. Since the length of the data burst is not fixed, it is possible to program only one register or the whole set. The registers are structured in such a way so that the burst, for normal operation, is kept as short as possible. The bits that are only programmed during the set-up (reference division ratio, power-down, phase inversion and current on PCD) are stored in registers A and B.

In the slave address six bits are fixed, the remaining two bits depend on the application.

Table 4 Slave address

110001

SAA R/W

SAA is the slave address. When SAA goes HIGH then SAA = 0, when SAA goes LOW then SAA = 1. This allows the use of two UMA1014s on the same bus but using a different address. R/W should be set to logic 0 when writing to the synthesizer or set to logic 1 when reading the status register.

The subaddress includes the register pointer, and sets the two flags related to the auto-increment (AVI) and the alarm disable (DI).

Table 5 Subaddress

X X X DI AVI X SB1 SB0

Where: X = not used DI (Disable Interrupt):

DI = 1 disables the alarm on SYA DI = 0 enables the alarm.

AVI (Auto Value Increment): AVI = 1 enables the automatic increment AVI = 0 disables the auto-increment.

SB1/SB0 are the pointers of the register where DATA1 will be written (see Table 6).

When the auto-increment is disabled (AVI = 0), the subaddress pointer will maintain the same value during the I2C-bus transfer. All the data bytes will then be written consecutively in the register pointed by the subaddress.

Table 6 Pointer of the registers

SB1 SB0 REGISTER POINTED

00 A 01 B 10 C 11 D

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

Status register and synthesizer alarm

When an out-of-lock condition or a power dip occurs, SYA, which is an open collector output, is forced LOW and latched. The pin SYA will be released after the status register is read via the I2C-bus.

The status register contains the following information:

Table 7 Status register

Where:

OOL = momentary out-of-lock LOOL = latched out-of-lock LPD = latched power dip DI = disable interrupt (of the last write cycle).

The I

C-bus protocol to read this internal register is a single byte without subaddressing:

//slave address (R/W = 1)/status register (read)//

Table 8 Bit allocation

Where X = not used

Table 9 Register allocation

0 0 0 OOL 0 LOOL LPD DI

76543210 A 00 PD X IPCD X RD3 RD2 RD1 RD0 00001110 B 01 1 0 1 PHI VCOB VCOA MD17 MD16 10100101 C 10 MD15 MD14 MD13 MD12 MD11 MD10 MD9 MD8 00111000 D 11 MD7 MD6 MD5 MD4 MD3 MD2 MD1 MD0 10000000

NAME

BIT NAME FUNCTION

PRESET

VALUE

A PD power down PD = 0 normal operation 0

IPCD programmable charge

pump current

IPCD = 1=1mA; IPCD = 0 = 0.5 mA

RD3...RD0 reference ratio see Table 2 1110; r = 1536

B PHI phase inverter PHI = 0 passive loop ﬁlter 0

VCOA VCO switch A set pin 7 1 VCOB VCO switch B set pin 13 0

MD17, MD16 bits 17 and 16 MSB of main divider ratio 01 C MD15 to MD8 bits 15 to 8 main divider ratio 00111000 D MD7 to MD0 bits 7 to 0 main divider ratio 10000000;

r = 80000

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

HANDLING

Every pin referenced to ground withstands ESD (HMB) tests in accordance with MIL-STD-883C method 3015 class 2. Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling Integrated Circuits.

SYMBOL PARAMETER MIN. MAX. UNIT

supply voltage range −0.3 7.0 V

voltage range to ground (all pins) 0 V

stg

IC storage temperature range −55 +125 °C

amb

operating ambient temperature range −40 +85 °C

Fig.3 Phase comparator block diagram.

handbook, full pagewidth

PHASE

COMPARATOR

DOWN

var

ref

PHI

on/off

1 mA (source)

1 mA (sink)

PCD

MRA399

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

CHARACTERISTICS

amb

= 25 °C; VCC = 4.5 to 5.5 V; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins V

and VCP)

supply voltage range 4.5 − 5.5 V

supply current − 11.5 13.5 mA

CCpd

supply current power-down − 2.5 3.3 mA

charge pump supply voltage 4.5 − 5.5 V

charge pump supply current IPCD = 0.5 mA − 1.4 1.8 mA

CPpd

charge pump supply current power-down − 0.01 − mA

RF dividers (pin RF)

frequency range 50 − 1100 MHz

RF(rms)

input voltage level (RMS value) 50 to 100 MHz 150 − 200 mV

100 to 1100 MHz 50 − 150 mV

input resistance at 1 GHz − 200 −Ω

at 100 MHz − 600 −Ω

input capacitance note 1 − 2.0 − pF

division ratios 2048 − 262143 −

Oscillator and reference divider (pins OSCIN and OSCOUT)

OSC

oscillator frequency range 3 − 16 MHz

OSC(RMS)

input level sine wave (RMS value) 0.15 − VCC/2.8 V

OSC(p-p)

input level square wave (peak-to-peak value)

0.45 − V

OSC_mk

input mark width see Fig.8 10 −−ns

OSC_sp

input space width 31 −−ns

OSC

output impedance at pin OSCOUT

−−2kΩ

ref

reference division ratio see Table 1 128 − 1920

1/8 crystal frequency (open collector output) (pin FX8)

LOW level output current VOL≥ 0.6 V 1.0 −−mA

Phase comparator (pin PCD)

PCD

frequency range 5 − 100 kHz

PCD

output current V

PCD

= 2.5 V bit IPCD = 1 0.9 1.2 1.4 mA bit IPCD = 0 0.45 0.6 0.75 mA

PCDL

output leakage current −5 ±1+5nA

PCD

output voltage 0.4 − VCP−0.5 V

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October 1992 11

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

Notes

1. CI is in parallel with RI.

2. Pin VCOA is forced to logic 0 during out-of-lock condition.

Serial clock and serial data input (pins SCL and SDA)

CLK

clock frequency 0 − 100 kHz

HIGH level input voltage 3 −−V

LOW level input voltage −−1.5 V

HIGH level input current − 310µA

LOW level input current −10 −5 −µA

input capacitance −−10 pF

sink

SDA sink current VOL = 0.4 V 3 −−mA

Slave address select input (pin SAA) and Hardware power-down input (pin HPDN)

HIGH level input voltage 3 −−V

LOW level input voltage −−0.4 V

HIGH level input current −−0.1 µA

LOW level input current −10 −−µA VCO output switches (pins VCOA and VCOB) and synthesizer alarm (pin SYA); note2 I

LOW level sink current VOL≥ 0.4 V 400 −−µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.4 Gain of phase detector and charge pump.

The current I

PCD

is averaged over a reference period of 24 µs.

2.0

1.0

-1.0

-2.0

-20 0 20

I = 1 mA

PCD

I = 0.5 mA

PCD

phase difference (t = ns)

(µA)

MRA400

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Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

Fig.5 Out-of-lock function.

UP or DOWN

REF

OOL

VCOA

MRA401

Fig.6 RF input high frequency sensitivity.

200

100

50 100 200 500

1000

1100

1200

guaranteed area

of operation

RF input

(mV RMS)

f (MHz)

typical RF sensitivity (T = 25 C)

amb

MRA402 - 1

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October 1992 13

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

Fig.7 RF input low frequency sensitivity.

guaranteed area

of operation

RF input

(mV RMS)

100

200

typical RF sensitivity (T = 25 C)

amb

f (MHz)

MRA403 - 1

200

150

100

150

Fig.8 Oscillator input timing.

handbook, halfpage

OSCIN

OSC mk

OSC sp

MLA436 - 1

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October 1992 14

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

APPLICATION INFORMATION

Fig.9 Typical cellular mobile radio application.

ETACS application for: VCO sensitivity = 11 MHz/V. Channel spacing = 12.5 kHz.

C12 68 pF

C13 120 pF

9.6 MHz

C8 2-20 pF

C11 39 pF

C9 47 Fµ

R7 68Ω

R8 12Ω

C10 47 Fµ

R10 10 k

Ω

10 kΩ

SDA

SCL

low

current

LED

3.9 kΩ

100 nF

R3 12Ω

C5 47 Fµ

modulation

input

VOLTAGE

CONTROLLED

OSCILLATOR

870 to 910

MHz

1 nF

R11 56Ω

R5 18Ω

C17 1 nF

18 Ω

R4 18

Ω

C1 33 nF

C3 180 nF

2.2 nF

18 kΩ

R2 10 kΩ

control voltage

RF output

UMA 1014

MRA404 - 1

Page 15

October 1992 15

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

PACKAGE OUTLINE

w M

detail X

v M

(A )

pin 1 index

UNIT

max.

A1A2A

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8 0

o o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

95-01-23 97-05-22

076E07S MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

Page 16

October 1992 16

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

(order code 9398 652 90011).

Reﬂow soldering

Reflow soldering techniques are suitable for all SO packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

Wave soldering

Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not from part of the speciﬁcation.

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October 1992 17

Philips Semiconductors Product speciﬁcation

Low-power frequency synthesizer for mobile radio communications

UMA1014

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Purchase of Philips I

C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.