Datasheet ULN 2003 AD SMD Datasheet (FREI)

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ULN2003,04APG/AFWG

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

ULN2003APG,ULN2003AFWG,ULN2004APG,ULN2004AFWG

(Manufactured by Toshiba Malaysia)

7ch Darlington Sink Driver

The ULN2003APG/AFWG Series are high−voltage, high−current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product.

Features

 Output current (single output): 500 mA max  High sustaining voltage output: 50 V min  Output clamp diodes  Inputs compatible with various types of logic  Package Type-APG: DIP-16pin  Package Type-AFWG: SOL-16pin

Type

ULN2003APG/AFWG 2.7 kΩ TTL, 5 V CMOS

ULN2004APG/AFWG 10.5 kΩ 6~15 V PMOS, CMOS

Pin Connection

(top view)

Input Base

Resistor

Designation

ULN2003APG ULN2004APG

ULN2003AFWG ULN2004AFWG

Weight DIP16−P-300-2.54A : 1.11 g (typ.) SOL16−P-150-1.27A : 0.15 g (typ.)

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ULN2003,04APG/AFWG

Schematics

(each driver)

ULN2003APG/AFWG ULN2004APG/AFWG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Absolute Maximum Ratings

Characteristic Symbol Rating Unit

Output sustaining voltage V

Output current I

Input voltage V

Clamp diode reverse voltage V

Clamp diode forward current I

Power dissipation

Operating temperature T

Storage temperature T

APG 1.47

AFWG

(Ta = 25°C)

CE (SUS)

OUT

opr

stg

0.5~50 V

−

500 mA/ch

0.5~30 V

−

50 V

500 mA

1.25 (Note)

−40~85 °C

55~150 °C

−

Note: On PCB (Test Board: JEDEC 2s2p)

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ULN2003,04APG/AFWG

Recommended Operati ng Co ndi tions

Characteristic Symbol Test Condition Min Typ. Max Unit

Output sustaining voltage V

APG

Output current

AFWG

Input voltage V

Input voltage (output on)

Input voltage (output off)

Clamp diode reverse voltage V

Clamp diode forward current IF

Power dissipation

ULN2003A 2.8 ⎯ 24

ULN2004A

ULN2003A 0 ⎯ 0.7

ULN2004A

APG Ta

AFWG

Note: On PCB (Test Board: JEDEC 2s2p)

CE (SUS)

OUT

IN (ON)

IN (OFF)

(Ta = −40 to 85°C)

0 ⎯ 50 V

= 25 ms

7 Circuits Ta = 85°C T

= 120°C

= 400 mA

OUT

= 800

0 ⎯ 1.0

⎯ ⎯ 50 V

85°C

Ta = 85°C (Note)

Duty = 10% 0 ⎯ 350

Duty = 50% 0 ⎯ 100

Duty = 10% 0

Duty = 50% 0

300

⎯

24 V

⎯

6.2 ⎯ 24

⎯

350 mA

⎯

0.76

⎯

0.65

⎯

mA/ch

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ULN2003,04APG/AFWG

Electrical Characteristics

Characteristic Symbol

Output leakage current I

Collector−emitter saturation voltage V

DC Current transfer ratio h

Input current (output on)

Input current (output off) I

ULN2003A VIN = 2.4 V, I

ULN2004A

(Ta = 25°C unless otherwise noted)

Test

Circuit

CEX

CE (sat)

IN (ON)

IN (OFF)

2 VCE = 2 V, I

4 I

ULN2003A

Input voltage (output on)

IN (ON)

ULN2004A

Clamp diode reverse current IR 6

Clamp diode forward voltage V

Input capacitance C

Turn−on delay t

Turn−off delay t

OFF

7 IF = 350 mA ⎯ ⎯ 2.0 V

⎯ ⎯ 15 ⎯ pF

Test Condition Min Typ. Max Unit

VCE = 50 V, Ta = 25°C ⎯ ⎯ 50

= 50 V, Ta = 85°C ⎯ ⎯ 100

= 350 mA, IIN = 500 µA ⎯ 1.3 1.6

OUT

= 200 mA, IIN = 350 µA

OUT

= 100 mA, IIN = 250 µA

OUT

= 350 mA 1000

OUT

= 350 mA ⎯ 0.4 0.7

OUT

= 9.5 V, I

= 500 µA, Ta = 85°C 50 65 ⎯ µA

OUT

= 2 V

= 800

= 350 mA ⎯ 0.8 1.2

OUT

= 350 mA ⎯ ⎯ 2.6

OUT

= 200 mA ⎯ ⎯ 2.0

OUT

= 350 mA

OUT

= 200 mA

OUT

VR = 50 V, Ta = 25°C

= 50 V, Ta = 85°C ⎯ ⎯ 100

= 50 V, RL = 125 Ω

OUT

= 15 pF

= 50 V, RL = 125 Ω

OUT

= 15 pF

1.1 1.3

⎯

0.9 1.1

⎯

4.7

⎯

4.4

⎯

⎯ 0.1 ⎯

0.2 ⎯

⎯

µA

µs

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Te st Cir cuit

ULN2003,04APG/AFWG

1. I

CEX

4. I

IN (OFF)

7. VF

2. V

CE (sat), hFE

5. V

IN (ON)

3. I

IN (ON)

6. IR

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ULN2003,04APG/AFWG

8. tON, t

Note 1: Pulse width 50 µs, duty cycle 10%

Note 2: See below

Input Condition

OFF

Output impedance 50 Ω, t

≤ 5 ns, tf ≤ 10 ns

Type Number R1 VIH

ULN2003A 0 3 V

ULN2004A 0 8 V

Note 3: CL includes probe and jig capacitance.

Precautions for Using

This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

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ULN2003,04APG/AFWG

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ULN2003,04APG/AFWG

2.00

1.75

(W)

(1)

1.50

(2)

1.25

1.00

0.75

– Ta

(1) Type-APG free air

(2) Type-AFWG on PCB

(Test Board: JEDEC 2s2p)

0.50

Power dissipation P

0.25

25 100 125 75

Ambient temperature Ta (°C)

15050

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Package Dimensions

ULN2003,04APG/AFWG

Weight: 1.11 g (typ.)

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Package Dimensions

ULN2003,04APG/AFWG

Weight: 0.15 g (typ.)

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Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

ULN2003,04APG/AFWG

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Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

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About solderability, following conditions were confirmed

•

Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

ULN2003,04APG/AFWG

RESTRICTIONS ON PRODUCT USE

• The information contained herein is subject to change without notice. 021023_D

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion c ontrol instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.

021023_A

021023_B

060106_Q

021023_C

060116EBA

• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E

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