Datasheet ULC0402FC3.3C, ULC0402FC24C, ULC0402FC15C, ULC0402FC12C, ULC0402FC08C Datasheet (PROTEK)

05152

Only One Name Means ProTek’Tion™

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

APPLICATIONS

✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts ✔ Available in Six Voltage Types Ranging From 3.3V to 24V ✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Low Clamping Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line

✔

LOW CAPACITANCE

✔

LOW LEAKAGE CURRENT

ULC0402FC3.3C

thru

ULC0402FC24C

U0402

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0402 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel

PIN CONFIGURATION

105152.R5 8/03 www.protekdevices.com

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

ULC0402FC3.3C

thru

ULC0402FC24C

PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

200 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

ULC0402FC3.3C ULC0402FC05C ULC0402FC08C ULC0402FC12C ULC0402FC15C ULC0402FC24C

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

3.3

5.9

8.0

12.0

15.0

24.0

MINIMUM

BREAKDOWN

VOLTAGE

@ 1mA

V

(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ IP = 1A

V

C

VOLTS

7.0

11.0

13.2

19.8

25.4

37.2

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

12.5V @ 16A 13V @ 15A 18V @ 11A

26.9V @ 7.4A

34.5V @ 5.8A

50.6V @ 4A

MAXIMUM LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

1 1 1 1

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF 70

35 32 30 25 20

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

t

- Pulse Duration - µs

d

200W, 8/20µs Waveform

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

2 www.protekdevices.com05152.R5 8/03

PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

PP

IPP/2

TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs

GRAPHS

ULC0402FC3.3C

thru

ULC0402FC24C

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

REFLOW SOLDER PROFILE

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

Pre-Heat

Time

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR ULC0402FC05C

35

25

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Soldering

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0402FC05C

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

3 www.protekdevices.com05152.R5 8/03

PACKAGE OUTLINE & DIMENSIONS

ULC0402FC3.3C

thru

ULC0402FC24C

PACKAGE OUTLINE

Metalized Die Contacts

DIE

TOP

E F

END

A

D

I

MOUNTING PAD

B

H

C

A

SOLDER PAD

I

B

C

CONTACTS

U0402

SIDE

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and outline:

3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).

PACKAGE DIMENSIONS

DIM

A B C D E F

I

.xxx ± 0.05mm (± 0.002”).

MILLIMETERS

0.46 NOM

0.86 NOM

0.99 ± 0.0254

0.10 NOM

0.35 NOM

0.483 ± 0.0254

0.406 NOM

INCHES

0.018 NOM

0.034 NOM

0.039 ± 0.001

0.004 NOM

0.014 NOM

0.019 ± 0.001

0.016 NOM

PAD DIMENSIONS

DIM

A B

D

DIE

F

E

C D E F G H

I

NOTE:

1. Top view of tape. Metal contacts are face down in tape package.

MILLIMETERS

0.23

0.48

0.69

0.46

0.99

0.20

0.66

0.13

INCHES

0.009

0.019

0.027

0.018

0.039

0.008

0.026

0.005

TAPE & REEL ORIENTATION

SOLDER PRINT

DIAMETER 0.010” -

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

3.

8mm Paper Tape:

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULC0402FC05C-T75-1).

7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULC0402FC05C-T710-2).

0.012”

G

NOTE:

1.

Preferred:

Outline & Dimensions: Rev 3 - 11/02, 06020

4 www.protekdevices.com05152.R5 8/03

Single Die - 0402

Using 0.1mm (0.004”) stencil.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com