Datasheet UG-277 Datasheet (ANALOG DEVICES)

Page 1
SDP User Guide
UG-277
One Technology Way P. O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com

INTRODUCTION

This user guide describes the EVAL-SDP-CB1Z system demonstration platform—Blackfin® (SDP-B) controller board from Analog Devices, Inc. The SDP-B controller board is part of the Analog Devices system demonstration platform (SDP). The SDP consists of a series of controller boards, interposer boards, and daughter boards.
SDP controller boards provide a means of communicating with the PC from the system under evaluation. Interposer boards route signals between two connectors. Daughter boards are a collection of product evaluation boards and Circuits from the Lab™ reference circuit boards. The SDP-B is used as part of the evaluation system for many Analog Devices components and reference circuits. The primary audience for this user guide is a system engineer who seeks to understand how to set up the SDP-B board and begin USB communications to the PC.
The SDP-B board is designed to be used in conjunction with various Analog Devices component evaluation boards and Circuits from the Lab reference circuits as part of a customer evaluation environment. The SDP-B provides USB connectivity through a USB 2.0 high speed connection to the computer allowing users to evaluate components on this platform from a PC application. The SDP-B is based on ADSP-BF527 Blackfin processor, with the Blackfin processor peripheral communi­cation lines available to the component daughter board through two identical 120-pin small footprint connectors.
The SDP-B user guide provides instructions for installing the SDP-B hardware (EVAL-SDP-CB1Z board) and software onto your computer. The necessary installation files are provided with the evaluation daughter board package. The Getting Started section provides software and hardware installation procedures, PC system requirements, and basic board informa­tion. The Hardware Description section provides information on the E VAL-SDP-CB1Z components. The EVAL-SDP-CB1Z schematics are provided in the Schematics section.
PLEASE SEE THE LAST PAGE FOR AN IMPORTANT WARNING AND LEGAL TERMS AND CONDITIONS.
Rev. B | Page 1 of 24
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UG-277 SDP User Guide

TABLE OF CONTENTS

Introduction ...................................................................................... 1
Revision History ............................................................................... 2
Product Overview ............................................................................. 3
Technical or Customer Support.................................................. 3
Product Information .................................................................... 3
Regulatory Compliance ............................................................... 3
Getting Started .................................................................................. 4
Package Contents .......................................................................... 4
PC Configuration ......................................................................... 4

REVISION HISTORY

12/11—Rev. A to Rev. B
Changes to Figure 7 ........................................................................ 14
Changes to Figure 8 ........................................................................ 15
Changes to Figure 9 ........................................................................ 16
Changes to Figure 10 ...................................................................... 17
Changes to Figure 11 ...................................................................... 18
Changes to Figure 12 ...................................................................... 19
Changes to Figure 13 ...................................................................... 20
10/11—Rev. 0 to Rev. A
Change to Product Overview Section ............................................ 3
Replaced Hardware Description Section ..................................... 15
Replaced Schematics Section ........................................................ 13
6/11—Revision 0: Initial Version
USB Installation .............................................................................4
Powering Up/Powering Down the SDP .....................................4
Hardware Description.......................................................................5
LEDs ................................................................................................5
Connector Details .........................................................................5
Power............................................................................................ 10
Daughter Board Design Guidelines ......................................... 10
Mechanical Specifications ......................................................... 12
Schematics ....................................................................................... 13
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SDP User Guide UG-277

PRODUCT OVERVIEW

The SDP-B board features
Analog Devices ADSP-BF527 Blackfin processor
Core performance up to 600 MHz
208-ball CSP-BGA package
24 MHz CLKIN oscillator
5 Mb of internal RAM memory
32 Mb flash memory
Numonyx M29W320EB or
Numonyx M25P32
SDRAM memory
Micron MT48LC16M16A2P-6A - 16 Mb x 16 bits
(256 Mb/32 MB)
3 × 120-pin small foot print connectors
Hirose FX8-120P-SV1(91), 120-pin header
Blackfin processor peripherals exposed
SPI
SPORT
TWI/I
GPIO
PPI
Asynchronous parallel
Timers
For more information, go to http://www.analog.com/sdp.
2
C

TECHNICAL OR CUSTOMER SUPPORT

You can reach Analog Devices customer support in the following ways:
Visit the SDP website at
http://www.analog.com/sdp
Email processor questions to
processor.support@analog.com (worldwide support)
processor.europe@analog.com (Europe support)
processor.china@analog.com (China support)
Phone questions to
1-800-ANALOGD
Contact your Analog Devices local sales office or
authorized distributor.
Send questions by mail to
Analog Devices, Inc. Three Tec hnolo g y Wa y P.O. Box 9106 Norwood, MA 02062-9106 USA

PRODUCT INFORMATION

Product information can be obtained from the Analog Devices website.

Analog Devices Web Site

The Analog Devices website, www.analog.com, provides information about a broad range of products—analog integrated circuits, amplifiers, converters, and digital signal processors.
Note that MyAnalog.com is a free feature of the Analog Devices website that allows customization of a web page to display only the latest information about products of interest to you. You can choose to receive weekly email notifications containing updates to the web pages that meet your interests, including documentation errata against all documents. MyAnalog.com provides access to books, application notes, data sheets, code examples, and more.
Visit MyAnalog.com to sign up. If you are a registered user, just log on. Your user name is your email address.

REGULATORY COMPLIANCE

The E VA L -SDP-CB1Z is designed to be used solely in a labor- atory environment. The board is not intended for use as a consumer end product or as a portion of a consumer end product. The board is an open system design, which does not include a shielded enclosure and therefore may cause interfer­ence to other electrical devices in close proximity. This board should not be used in or near any medical equipment or RF devices. Store unused boards in the protective shipping package.
The E VA L -SDP-CB1Z board has been certified to comply with the essential requirements of the European EMC directive 89/36/EC amended by 93/68/EEC and therefore carries the CE mark.
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09865-001

GETTING STARTED

This section provides specific information to assist you with using the SDP-B board as part of your evaluation system.
The following topics are covered:
Package contents
PC configuration
USB installation
Powering up/powering down the SDP

PACKAGE CONTENTS

You r EVA L -SDP-CB1Z board package contains the following:
EVAL-SDP-CB1Z board
1 m USB Standard-A to Mini-B cable
Contact the vendor where you purchased your SDP-B board or contact Analog Devices if anything is missing.

PC CONFIGURATION

For correct operation of the SDP board, your computer must have the following minimum configuration:
Windows XP Service Pack 2 or Windows Vista®
USB 2.0 port

Verifying Driver Installation

Before using the SDP-B board, verify the driver software has installed properly.
Open the Windows Device Manager and verify the SDP board appears under ADI Development Too ls as shown in Figure 1.
When removing the SDP-B board from the package, handle the board carefully to avoid the discharge of static electricity, which can damage some components.

USB INSTALLATION

Perform the following tasks to safely install the SDP-B board onto the computer. There are two stages in the software application installation procedure. The first stage installs the application software. The second stage installs the .NET Framework 3.5 and the necessary drivers.

Installing the Software

1. Run the application install provided. The first stage installs
the applications GUI and the necessary support files onto the computer
2. Immediately following the application install, the .NET
Framework 3.5 and the driver package for the SDP board is installed. If the .NET Framework 3.5 is already preinstalled on the computer in question, this stage is skipped and Step 2 will consist of a driver package installation only

Connecting the SDP-B Board to the PC

Attach the SDP-B board to a USB 2.0 port on the computer via the Standard-A to Mini-B cable provided.
Figure 1. Device Manager

POWERING UP/POWERING DOWN THE SDP

The following sections describe how to safely power up and power down the SDP-B.

Powering Up the SDP-B Board

1. Connect the SDP-B board to the daughter evaluation board
through the 120-pin mating connectors.
2. Power the daughter board.
3. Connect the USB port on the computer to the SDP-B
board.

Powering Down the SDP-B Board

1. Power down the daughter evaluation board.
2. Disconnect the USB port on the computer from the SDP-B
board.
3. Disconnect the SDP-B board from the daughter evaluation
board.
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POWER
CON B
CON C
STATUS
CON A
LED
LED

HARDWARE DESCRIPTION

This section describes the hardware design of the EVA L-SDP-
CB1Z board.
The following topics are covered:
LEDs—This section describes the SDP on-board LEDs.
Connector Details—This section details the pin
assignments on the 120-pin connectors.
Power—This section lists power requirements of the SDP
and identifies connector power inputs and output pins.
Daughter board design guidelines—This section provides
guidelines on how to design daughter boards for use with the SDP.
Mechanical specifications—This section provides
dimensional information.

LEDS

There are two LEDs located on the SDP-B board (see Figure 2).

POWER LED

The green power LED indicates that the SDP-B board is powered. This is not an indication of USB connectivity between the SDP-B and the PC.

STATUS LED

The orange status LED is an LED used as a diagnostic tool for evaluation application developers. When there are two or more identical SDP controller board and daughter board combin­ations connected to the PC simultaneously, the status LED flashes during the connect routine to help the user identify which board they will communicate with.

CONNECTOR DETAILS

The SDP-B board contains three Hirose FX8-120P-SV1(91), 120-pin header connectors. Connector A and Connector B share identical pinouts and through these connectors, the peripheral communication interfaces of ADSP-BF527 Blackfin processor are exposed. The exposed peripherals are
SPI
SPORT
2
I
C/TWI
GPIO
Asynchronous parallel
PPI
UART
Timers
Figure 2. SDP-B Board LEDs
In addition, included on the connector specification are input and output power pins, ground pins, and pins reserved for future use. For further details on the peripheral interfaces, including timing diagrams, see the ADSP-BF52x Blackfin Processor Hardware Reference.
Connector C exposes the entire Blackfin memory space, but is not used as part of the SDP platform.

Connector Pin Assignments

The connector pin assignments for Connector A and Connector B have been defined independently of the any internal pin sharing that occurs on the Blackfin processor. Table 1 lists the connector pins and identifies the functionality assigned to each connector pin for Connector A and Connector B on the SDP-B board.
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Pin No.
Pin Name
Description
13
PAR_D13
Parallel Data Bus Bit 13.
18
PAR_D5
Parallel Data Bus Bit 5.
23
GND
Connect to ground plane of board.
24
PAR_A3
Parallel Address Bus Bit 3.
35
SERIAL_INT
Serial Interrupt. Used to trigger a nonperiodic serial event.
Table 1. 120-Pin Connector Pin Assignments
1 VIN Power to SDP Board. Requires 200 mA at 5 V. 2 NC No Connect. Leave this pin unconnected. Do not ground. 3 GND Connect to ground plane of board. 4 GND Connect to ground plane of board. 5 USB_VBUS Connected directly to the USB +5 V supply. 6 GND Connect to ground plane of board. 7 PAR_D23 Parallel Data Bus Bit 23. (No connect.)1 8 PAR_D21 Parallel Data Bus Bit 21. (No connect.)1 9 PAR_D19 Parallel Data Bus Bit 19. (No connect.)1 10 PAR_D17 Parallel Data Bus Bit 17. (No connect.)1 11 GND Connect to ground plane of board. 12 PAR_D14 Parallel Data Bus Bit 14.
14 PAR_D11 Parallel Data Bus Bit 11. 15 PAR_D9 Parallel Data Bus Bit 9. 16 PAR_D7 Parallel Data Bus Bit 7. 17 GND Connect to ground plane of board.
19 PAR_D3 Parallel Data Bus Bit 3. 20 PAR_D1 Parallel Data Bus Bit 1. 21 22
Asynchronous Parallel Read Strobe.
PAR_RD
Asynchronous Parallel Chip Select.
PAR_CS
25 PAR_A1 Parallel Address Bus Bit 1. 26 PAR_FS3 Synchronous (PPI) Parallel Frame Sync 3. 27 PAR_FS1 Synchronous (PPI) Parallel Frame Sync 1. 28 GND Connect to ground plane of board. 29 SPORT_TDV0 SPI Data Line 3. (No connect.)1 30 SPORT_TDV1 SPI Data Line 2. (No connect.)1 31 SPORT_DR1 SPORT Data Receive 1. Secondary SPORT data into processor. 32 SPORT_DT1 SPORT Data Transmit 1. Secondary SPORT data from processor. 33 SPI_D2 SPORT Data Line. (No connect.)1 34 SPI_D3 SPORT Data Line. (No connect.)1
36 GND Connect to ground plane of board. 37 38 39
40 GND Connect to ground plane of board. 41 SDA_1 I2C Data 1. 42 SCL_1 I2C Data 1.2 43 GPIO0 General-Purpose Input/Output. 44 GPIO2 General-Purpose Input/Output. 45 GPIO4 General-Purpose Input/Output. 46 GND Connect to ground plane of board. 47 GPIO6 General-Purpose Input/Output.2 48 TMR_A Timer A Flag Pin. Use as first timer, if required. 49 TMR_C Timer C Flag Pin.1 (No connect.) 50 NC No Connect. Leave this pin unconnected. Do not ground.
SPI_SEL_B SPI_SEL_C SPI_SEL1/SPI_SS
SPI Chip Select B. Use this to control a second device on the SPI bus. SPI Chip Select C. Use this for a third device on the SPI bus.
SPI Chip Select 1.2 Used to connect to SPI boot flash, if required. Also used as chip select when Blackfin
processor is operating as SPI slave.
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SDP User Guide UG-277
55
NC
No Connect. Leave this pin unconnected. Do not ground.
71
CLKOUT
CLKOUT from processor.
72
TMR_D
Timer D Flag Pin.2
83
SPI_MISO
SPI Master In, Slave Out Data.
99
PAR_INT
Parallel Interrupt. Used to trigger a nonperiodic parallel event.
100
Asynchronous Parallel Write Strobe.
Pin No. Pin Name Description
51 NC No Connect. Leave this pin unconnected. Do not ground. 52 GND Connect to ground plane of board. 53 NC No Connect. Leave this pin unconnected. Do not ground. 54 NC No Connect. Leave this pin unconnected. Do not ground.
56 EEPROM_A0 EEPROM A0. Connect to A0 address line of the EEPROM. 57 58 GND Connect to ground plane of board. 59 UART_RX UART Receive Data.2 60 61 BMODE1 Boot Mode 1. Pull up with 10 kΩ resistor to set SDP to boot from SPI Flash. Enabled on Connector A only. 62 UART_TX UART Transmit Data2. 63 GND Connect to ground plane of board. 64 65 WAKE External wake up to processor board. 66 NC No Connect. Leave this pin unconnected. Do not ground. 67 NC No Connect. Leave this pin unconnected. Do not ground. 68 NC No Connect. Leave this pin unconnected. Do not ground. 69 GND Connect to ground plane of board. 70 NC No Connect. Leave this pin unconnected. Do not ground.
RESET_OUT
RESET_IN
SLEEP
Active low reset signal from processor board.
Active low pin to reset controller board.
Active low sleep from processor board.
73 TMR_B Timer B Flag Pin. Use as second timer, if required. 74 GPIO7 General-Purpose Input/Output. 75 GND Connect to ground plane of board. 76 GPIO5 General-Purpose Input/Output. 77 GPIO3 General-Purpose Input/Output. 78 GPIO1 General-Purpose Input/Output. 79 SCL_0 I2C Clock 0. Daughter board EEPROM must be connected to this bus. 80 SDA_0 I2C Data 0. Daughter board EEPROM must be connected to this bus. 81 GND Connect to ground plane of board. 82 SPI_CLK SPI Clock.
84 SPI_MOSI SPI Master Out, Slave In Data. 85 86 GND Connect to ground plane of board. 87 SPORT_TSCLK SPORT Transmit Clock. 88 SPORT_DT0 SPORT Data Transmit 0. Primary SPORT data from processor. 89 SPORT_TFS SPORT Transmit Frame Sync. 90 SPORT_RFS SPORT Receive Frame Sync. 91 SPORT_DR0 SPORT Data Receive 0. Primary SPORT data into processor. 92 SPORT_RSCLK SPORT Receive Clock. 93 GND Connect to ground plane of board. 94 PAR_CLK Clock for Synchronous Parallel Interface (PPI). 95 PAR_FS2 Synchronous (PPI) Parallel Frame Sync 2. 96 PAR_A0 Parallel Address Bus Bit 0. 97 PAR_A2 Parallel Address Bus Bit 2. 98 GND Connect to ground plane of board.
SPI_SEL_A
SPI Chip Select A. Use this to control the first device on the SPI bus.
PAR_WR 101 PAR_D0 Parallel Data Bus Bit 0. 102 PAR_D2 Parallel Data Bus Bit 2. 103 PAR_D4 Parallel Data Bus Bit 4.
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Pin No.
Pin Name
Description
111
PAR_D16
Parallel Data Bus Bit 16.1 (No connect.)1
104 GND Connect to ground plane of board. 105 PAR_D6 Parallel Data Bus Bit 6. 106 PAR_D8 Parallel Data Bus Bit 8. 107 PAR_D10 Parallel Data Bus Bit 10. 108 PAR_D12 Parallel Data Bus Bit 12. 109 GND Connect to ground plane of board. 110 PAR_D15 Parallel Data Bus Bit 15.
112 PAR_D18 Parallel Data Bus Bit 18.1 (No connect.)1 113 PAR_D20 Parallel Data Bus Bit 20.1 (No connect.)1 114 PAR_D22 Parallel Data Bus Bit 22. (No connect.)1 115 GND Connect to ground plane of board. 116 VIO (+3.3 V) +3.3 V Output. 20 mA maximum current available to power IO voltage on daughter board. 117 GND Connect to ground plane of board. 118 GND Connect to ground plane of board. 119 NC No Connect. Leave this pin unconnected. Do not ground. 120 NC No Connect. Leave this pin unconnected. Do not ground.
1
Functionality not implemented on the SDP board.
2
Shared across both connectors.
Each interface provided by the SDP-B is available on unique pins of the SDP-B 120-pin connector. The connector pin numbering scheme is outlined in Figure 3.
Rev. B | Page 8 of 24
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SDP User Guide UG-277
09865-003
*NC ON BLACKFI N S DP
*
*
*
*
*
*
*
*
*
*
*
*
*
TIMERS
INPUT/OUTPUT
GENERAL
I2C
SPI
SPORT
PORT
PARALLEL
SDP
STANDARD
CONNECTOR
120
NC
119
NC
118
GND
117
GND
116
VIO(+3.3V)
115
GND
114
PAR_D22
113
PAR_D20
112
PAR_D18
111
PAR_D16
110
PAR_D15
109
GND
108
PAR_D12
107
PAR_D10
106
PAR_D8
105
PAR_D6
104
GND
103
PAR_D4
102
PAR_D2
101
PAR_D0
100
PAR_WR
99
PAR_INT
98
GND
97
PAR_A2
96
PAR_A0
95
PAR_FS2
94
PAR_CLK
93
GND
92
SPORT_RSCLK
91
SPORT_DR0
90
SPORT_RFS
89
SPORT_TFS
88
SPORT_DT0
87
SPORT_TSCLK
86
GND
85
SPI_SEL_A
84
SPI_MOSI
83
SPI_MISO
82
SPI_CLK
81
GND
80
SDA_0
79
SCL_0
78
GPIO1
77
GPIO3
76
GPIO5
75
GND
74
GPIO7
73
TMR_B
72
TMR_D
71
NC
70
NC
69
GND
68
NC
67
NC
66
NC
65
WAKE
64
SLEEP
63
GND
62
UART_TX
61
BMODE1
60
RESET_IN
59
UART_RX
58
GND
57
RESET_OUT
56
EEPROM_A0
55
NC
54
NC
53
NC
52
GND
51
NC
50
NC
49
TMR_C
48
TMR_A
47
GPIO6
46
GND
45
GPIO4
44
GPIO2
43
GPIO0
42
SCL_1
41
SDA_1
40
GND
39
SPI_SEL1/SPI_SS
38
SPI_SEL_C
37
SPI_SEL_B
36
GND
35
SERIAL_INT
34
SPI_D3
33
SPI_D2
32
SPORT_DT1
31
SPORT_DR1
30
SPORT_TDV1
29
SPORT_TDV0
28
GND
27
PAR_FS1
26
PAR_FS3
25
PAR_A1
24
PAR_A3
23
GND
22
PAR_CS
21
PAR_RD
20
PAR_D1
19
PAR_D3
18
PAR_D5
17
GND
16
PAR_D7
15
PAR_D9
14
PAR_D11
13
PAR_D13
12
PAR_D14
11
GND
10
PAR_D17
9
PAR_D19
8
PAR_D21
7
PAR_D23
6
GND
5
USB_VBUS
4
GND
3
GND
2
NC
1
VIN
Figure 3. 120-Pin Connector Outline
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Pin Sharing

Two types of pin sharing occur on the SDP-B board and must be considered when using two or more of the connector’s peripheral interfaces between a daughter board and the SDP board. The first type is pin sharing that occurs internally in the Blackfin processor. The second type is pin sharing that occurs when a single Blackfin processor output pin is shared across both Connector A and Connector B.
Internal Blackfin processor pin sharing can restrict the simultaneous availability of peripheral interfaces on a single connector or across both connectors. The Blackfin processor's internal design has multiple signals physically sharing each single output pin. As mentioned previously, the pins on the 120­pin connector were defined independently of this pin sharing. This has the effect of limiting the peripherals, which can be used simultaneously on the SDP. A system designer must consult the ADSP-BF52x Blackfin Processor Hardware Reference for the ADSP-BF527 processor to ensure the selected peripherals are available simultaneously and their signals do not share Blackfin processor output pins. An example of this sharing is that the SPORT and PPI peripherals physically share the same Blackfin processor pins. Therefore, these two interfaces cannot be utilized in a single application. Pin sharing also occurs from certain Blackfin processor output pins to both Connector A and Connector B. The following signals are connected from a single Blackfin processor output pin to both Connector A and Connector B:
2
I
C Bus 1, Pin 41 and Pin 42
SCL 0 on I
2
C Bus 0, Pin 79
GPIO 6 and GPIO 7, Pin 47 and Pin 67
Timer D, Pin 72
UA RT, Pin 59 and Pin 62

POWER

The SDP-B board requires that any daughter board connected to the SDP-B board provides the SDP-B board with 5 V at 200 mA. This supply should be made available on Pin 1 (VIN) of the 120-pin connector. This supply is required to power the Blackfin processor, the memory, and the other components on the SDP-B board. The SDP board also provides 3.3 V at 20 mA on Pin 116 (VIO_3.3) to connected daughter boards as the VIO voltage for the daughter board. Pin 5 (USB_VBUS) is connected to the +5 V line of the USB connector, providing 5 V ±10% as an output of the SDP board.

DAUGHTER BOARD DESIGN GUIDELINES

The daughter board design guidelines specify the layout, connector position, keep out areas, and dimensions of potential daughter boards. This guidance is to ensure that a daughter board can connect off either Connector A or Connector B of the SDP-B board. Following these guidelines ensures that both connectors on the SDP can have any one of the catalogue of daughter boards physically attached to the connectors simultaneously.

Connector Location

The daughter board connector and securing screw holes are to be located in the top left hand corner. This arrangement can be seen for Daughter Board A in Figure 4. Note that Daughter Board B is the same as Daughter Board A rotated clockwise through 90°. The exact location of the connector from the board's edge is important in order to allow both boards connect at the same time. As seen in Figure 4, if either board exceeds these dimensions, it is not possible to connect the other. Every effort was made to extend the 5.9 mm dimension as large as possible in order to allow space for vias between the connector and the edge of the board. These are absolute maximum dimensions and should not be exceeded.
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5.9mm
3.3mm
3.3mm
5.9mm
DAUGHTERBOARD B
DAUGHTERBOARD A
09865-004
1.75mm
5.90mm
3.30mm
5.15mm
60 61
1 120
50.50mm
ORIGIN (0,0)
NO RIGHT-ANGLED CONNECTORS ALLOWED ALONG THIS EDGE
x = 5.9mm, y = –3.3mm
x = 5.95mm, y = –53.8mm
EVAL-xxxxx-DB Rev. D
D3.10mm
12.65mm
PLACEMENT KEEPOUT FOR COMPONENTS OVER 3mm IN HEIGHT (EXTENDS DOWN ENTIRE HEIGHT O F LEFT HAND SIDE OF PCB)
D3.10mm
x = 5.95mm, y = –28.55mm (CE NTER OF CONNECTOR)
09865-005
Figure 4. Maximum Board Dimensions for Connector Placement
The full specification drawing for the connector location on the daughter board can be seen in Figure 5.
Figure 5. Connector Placement on Compatible Daughter Boards
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POWER
CON B
STATUS
CON C
CON A
CON B A
0.152”/8.86mm
LED
LED
CON B
CON A
2.75”
69.85mm
2.25”
57.15mm
0.125”/3.17mm
0.21875”/5.54mm
CON C
The mating daughter board 120-pin connector is the Hirose FX8-120S-SV(21), 120-pin receptacle, FEC 132-4660, Digi-Key H1219-ND. Consult the connector's data sheet for full details on the connector. Note that Pin 1 to Pin 60 are placed on the left side of the connector and Pin 61 to Pin 120 are placed on the right side of the connector.

Keep Out Area

In order to allow the greatest flexibility for future controller boards, a keep out area is established for components higher that 3 mm. The keep out area is 12.65 mm wide and extends down the entire left side of the daughter board.

Restriction on Right Angle Connectors

Due to the close proximity of the edges of the A and B daughter boards (seen in Figure 4) right angle connectors are not allowed
on the top and left edges of the daughter boards and (if required) should be placed on the right or bottom edges. The phrase "right angle connector" is used to describe any connector that requires the connection to protrude over the edge of the board (for example, right angle SMB or screw terminal)

MECHANICAL SPECIFICATIONS

The mechanical specifications of the SDP-B board are 2.75" ×
2.25" (69.85 mm × 27.15 mm). The height of the 120-pin con­nectors from the bottom of the board is approximately 0.152" (3.86 mm). The tallest component on the top is approximately
0.125" (3.175 mm), and the tallest components on the bottoms are the connectors at approximately 0.152" (3.86 mm). Refer to Figure 6.
Figure 6. SDP-B Board Mechanical Specifications
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SCHEMATICS

This section provides the schematic drawings for the E VA L -SDP-CB1Z board. The schematic pages include
SDP-B—Power
SDP-B—Memory
SDP-B—Clocks_USB
SDP-B—Blackfin_I/O
SDP-B—Connector A
SDP-B—Connector B
SDP-B—Connector C
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Figure 7. SDP-B —Power
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Figure 8. SDP-B —Memory
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Figure 9. SDP-B —Clocks_USB
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Figure 10. SDP-B —Blackfin_I/O
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Figure 11. SDP-B —Connector A
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Figure 12. SDP-B —Connector B
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Figure 13. SDP-B —Connector C
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NOTES
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NOTES
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SDP User Guide UG-277
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UG-277 SDP User Guide
omer understands and agrees that the Evaluation Board is provided
LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF
NOTES
ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection
circuitry, damage may occur on devices subjected to high e nergy ESD. Therefore, proper ESD precaution s should be taken to avoid performance degradation or loss of functionality.
Legal Terms and Conditions
By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be boun d by the terms and condition s set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement . Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer ”) and Analog Devices, Inc. (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Cust for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Further more, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of t he Evaluation Board, are res erved by ADI. CONFIDENTI ALIT Y. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to th e Evaluation Board must comply wi th applicable law, including but not limit ed to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDE D “AS IS” AND ADI MAKES NO WARRANTIES OR REPRES ENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICAL LY DISC LAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUA RANTEES, OR WARRANT IES, EXPRESS OR IMPLIED, RE LATE D TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE THE EVALUAT ION BOARD, INCLUDING BUT NOT LIMI TED TO LOST PROFITS, DE LAY COSTS, LABOR COSTS OR LOSS OF GOODWI LL. ADI’S TOTAL LIA BILITY FROM AN Y AND ALL CAUSES S HALL BE LIMITE D TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall no t apply to this Agreement and is exp ressly disclaimed.
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. UG09865-0-12/11(B)
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