Datasheet UDA1340 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
UDA1340
Low-voltage low-power stereo audio CODEC with DSP features
Preliminary specification Supersedes data of 1997 May 20 File under Integrated Circuits, IC01
1997 Jul 09
Page 2
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
FEATURES
General
• Low power consumption
• 3.0 V power supply
• 256, 384 and 512f
• Small package size (SSOP28)
• ADC plus integrated high pass filter to cancel DC offset
• Overload detector for easy record level control
• Separate power control for ADC and DAC
• Integrated digital filter plus DAC
• No analog post filter required for DAC
• Easy application
• Functions controllable by microcontroller interface.
Multiple format input interface
2
S-bus, MSB-justified and LSB-justified format
• I compatible
• 1fs input and output format data rate.
DAC digital sound processing
• Digital volume control
• Digital tone control, bass boost and treble
• dB-linear volume and tone control (low microcontroller
load)
• Digital de-emphasis for 32, 44.1 and 48 kHz f
• Soft mute.
system clock
s
s
UDA1340
GENERAL DESCRIPTION
The UDA1340 is a single-chip stereo Analog-to-Digital Converter (ADC) and Digital-to-Analog Converter (DAC) with signal processing features employing bitstream conversion techniques. The low power consumption and low voltage requirements make the device eminently suitable for use in low-voltage low-power portable digital audio equipment which incorporates recording and playback functions.
The UDA1340 supports the I lengths of up to 20 bits, the MSB-justified data format with word lengths of up to 20 bits and the LSB justified serial data format with word lengths of 16, 18 and 20 bits.
The UDA1340 has special sound processing features in playback mode, de-emphasis, volume, bass boost, treble, and soft mute, which can be controlled via the microcontroller interface.
2
S-bus data format with word
Advanced audio configuration
• Stereo single-ended input configuration
• Stereo line output (under microcontroller volume
control)
• Power-down click prevention circuitry
• High linearity, dynamic range, low distortion.
ORDERING INFORMATION
TYPE
NUMBER
UDA1340M SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
1997 Jul 09 2
NAME DESCRIPTION VERSION
PACKAGE
Page 3
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DDA(ADC)
V
DDA(DAC)
V
DDO
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO
I
DDD
I
PD(ADC)
I
PD(DAC)
T
amb
Analog-to-digital converter
V
I(rms)
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio V
α
cs
Digital-to-analog converter
V
o(rms)
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio code = 0; A weighted − 100 − dBA
α
cs
Power performance
P
ADDA
P
DA
P
AD
P
PD
ADC analog supply voltage 2.7 3.0 3.6 V DAC analog supply voltage 2.7 3.0 3.6 V operational amplifiers supply voltage 2.7 3.0 3.6 V digital supply voltage 2.7 3.0 3.6 V ADC supply current − 4.5 − mA DAC supply current − 3.5 − mA operational amplifier supply current − 4 − mA digital supply current − 6 − mA digital ADC power-down supply current − 3 − mA digital DAC power-down supply current − 3 − mA operating ambient temperature −20 − +85
°
input voltage (RMS value) − 0.8 − V
at 0 dB −−85 −80 dB
noise-to-signal ratio
at −60 dB; A-weighted −−35 −30 dBA
= 0 V; A-weighted − 95 − dBA
i
channel separation − 100 − dB
output voltage (RMS value) − 0.8 − V
at 0 dB −−85 −80 dB
noise-to-signal ratio
at −60 dB; A-weighted −−35 − dBA
channel separation − 100 − dB
power consumption in record and
− 54 − mW
playback mode power consumption in playback only
− 33 − mW
mode power consumption in record only
− 27 − mW
mode power consumption in power-down
− 6 − mW
mode
C
1997 Jul 09 3
Page 4
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
BLOCK DIAGRAM
handbook, full pagewidth
V
V
VINL
DDD
SSD
V
DDA(ADC)VSSA(ADC)
21
3 5
10
11
UDA1340
DC-CANCELLATION FILTER
V
ADCP
76 4
ADC
DECIMATION FILTER
ADC
V
ADCN
V
ref(A)
UDA1340
VINR
8
TEST1
21
TEST2
20
TEST3
DATAO
BCK
WS
DATAI
OVERFL
VOUTL
18 16 17 19
9
26
25 27 23 22
V
DDO
DIGITAL INTERFACE
INTERPOLATION FILTER
V
SSO
DSP FEATURES
NOISE SHAPER
DAC
V
DAC
DDA(DAC)VSSA(DAC)
L3-BUS
INTERFACE
V
ref(D)
13
L3MODE
14
L3CLOCK
15
L3DATA
12
SYSCLK
24
VOUTR
28
MGG839
Fig.1 Block diagram.
1997 Jul 09 4
Page 5
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
PINNING
SYMBOL PIN
V
SSA(ADC)
V
DDA(ADC)
1 ADC analog ground
2 ADC analog supply voltage VINL 3 ADC input left V
ref(A)
4 ADC reference voltage VINR 5 ADC input right V
ADCN
V
ADCP
6 ADC negative reference voltage
7 ADC positive reference voltage TEST1 8 test control 1 (pull-down) OVERFL 9 overload flag output V V
DDD SSD
10 digital supply voltage
11 digital ground SYSCLK 12 system clock 256, 384 or 512f L3MODE 13 L3-bus mode input L3CLOCK 14 L3-bus clock input L3DATA 15 L3-bus data input BCK 16 bit clock input WS 17 word selection input DATAO 18 data output DATAI 19 data input TEST3 20 test output TEST2 21 test control 2 (pull-down) V
SSA(DAC)
V
DDA(DAC)
22 DAC analog ground
23 DAC analog supply voltage VOUTR 24 DAC output right V
DDO
25 operational amplifier supply voltage VOUTL 26 DAC output left V V
SSO ref(D)
27 operational amplifier ground
28 DAC reference voltage
Description
UDA1340
handbook, halfpage
s
V
SSA(ADC)
V
DDA(ADC)
V
ref(A)
V
ADCN
V
ADCP
TEST1
OVERFL
V
V
SYSCLK
L3MODE
L3CLOCK
VINL
VINR
DDD
SSD
1 2 3 4 5 6 7 8
9 10 11 12 13
UDA1340
MGG838
Fig.2 Pin configuration.
28 27 26 25 24 23 22 21 20 19 18 17 16 1514
V
ref(D)
V
SSO
VOUTL V
DDO
VOUTR V
DDA(DAC)
V
SSA(DAC)
TEST2 TEST3 DATAI DATAO WS BCK L3DATA
1997 Jul 09 5
Page 6
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
FUNCTIONAL DESCRIPTION System clock
The UDA1340 accommodates slave mode only, this means that in all applications the system devices must provide the system clock. The system frequency is selectable. The options are 256f The system clock must be locked in frequency to the digital interface input signals.
Multiple format input/output interface
The UDA1340 supports the following data input/output formats:
2
S-bus with data word length of up to 20 bits
• I
• MSB justified serial format with data word length of up to
20 bits
• LSB justified serial format with data word lengths of 16, 18 or 20 bits.
The formats are illustrated in Fig.3. Left and right data-channel words are time multiplexed.
Analog-to-Digital Converter (ADC)
The stereo ADC of the UDA1340 consists of two third-order Sigma-Delta modulators. They have a modified Ritchie-coder architecture in a differential switched capacitor implementation. The over-sampling ratio is 128.
Decimation filter (ADC)
The decimation from 128f
s
The first stage realizes 3rd-order characteristic. This filter decreases the sample rate by 16. The second stage,
an FIR filter, consists of 3 half-band filters, each decimating by a factor of 2.
Table 1 Decimation filter characteristics
ITEM CONDITION VALUE (dB)
Passband Ripple 0 − 0.45f Stop band >0.55f Dynamic range 0 − 0.45f Gain overall −1.16
, 384fs and 512fs.
s
is performed in two stages.
sin x
----------- ­x
s
s
s
±0.05
−60
108
UDA1340
DC cancellation filter (ADC)
An optional IIR high-pass filter is provided to remove unwanted DC components. The operation is selected by the microcontroller via the L3-bus. The filter characteristics are given in Table 2.
Table 2 DC cancellation filter characteristics
ITEM CONDITION VALUE (dB)
Passband ripple none Passband gain 0 Droop at 0.00045f Attenuation at DC at 0.00000036f Dynamic range 0 − 0.45f
s
s
s
Mute (ADC)
On recovery from power-down or switching on of the system clock, the serial data output DATAO is held LOW until valid data is available from the decimation filter. This time depends on whether the DC cancellation filter is selected:
DC cancel off: time = , t = 23.2 ms when f
= 44.1 kHz
s
DC cancel on: time = , t = 279 ms when f
= 44.1 kHz
s
1024
------------ ­f
s
12288
----------------
f
s
Overload detection (ADC)
In practice the output is used to indicate whenever the output data, in either the left or right channel, is greater than −1 dB (actual figure is −1.16 dB) of the maximum possible digital swing. When this condition is detected the OVERFL output is forced HIGH for at least 512f (11.6 ms at fs= 44.1 kHz). This time-out is reset for each infringement.
0.031 >40
>110
cycles
s
1997 Jul 09 6
Page 7
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
Interpolation filter (DAC)
The digital filter interpolates from 1fsto 128fs by means of a cascade of a recursive filter and an FIR filter.
Table 3 Interpolation filter characteristics
ITEM CONDITION VALUE (dB)
Passband ripple 0 − 0.45f Stop band >0.55f Dynamic range 0 − 0.45f Gain DC −3.5
Noise shaper (DAC)
The 3rd-order noise shaper operates at 128fs. It shifts in-band quantization noise to frequencies well above the audio band. This noise shaping technique enables high signal-to-noise ratios to be achieved. The noise shaper output is converted into an analog signal using a filter stream digital-to-analog converter.
s
s
s
±0.03
−50
108
UDA1340
The Filter Stream DAC (FSDAC)
The FSDAC is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. The filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. In this way very high signal-to-noise performance and low clock jitter sensitivity is achieved. A post-filter is not needed due to the inherent filter function of the DAC. On-board amplifiers convert the FSDAC output current to an output voltage signal capable of driving a line output.
1997 Jul 09 7
Page 8
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
21516 1
RIGHT
MSB LSBB2 B15
RIGHT
UDA1340
215161718 1
LSB
2151617181920 1
B17
RIGHT
MSB B2 B3 B4
LSB
B19
MSB B2 B3 B4 B5 B6
MGG841
book, full pagewidth
321321
RIGHT
>=8 >=8
LEFT
S-BUS
2
INPUT FORMAT I
MSB B2 MSBLSB LSB MSBB2
32
RIGHT
1321
>=8 >=8
LEFT
2
MSB-JUSTIFIED FORMAT
1516 1
LEFT
MSB B2 MSBLSB LSB MSB B2B2
B15
215161718 1
LSB-JUSTIFIED FORMAT 16 BITS
MSB LSBB2
LEFT
LSB
B17
LSB-JUSTIFIED FORMAT 18 BITS
MSB B2 B3 B4
2151617181920 1
LEFT
LSB
B19
LSB-JUSTIFIED FORMAT 20 BITS
Fig.3 Serial interface formats.
MSB B2 B3 B4 B5 B6
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
1997 Jul 09 8
WS
BCK
DATA
WS
BCK
DATA
Page 9
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
L3-Interface
The UDA1340 has a microcontroller input mode. In the microcontroller mode, all the digital sound processing features and the system controlling features can be controlled by the microcontroller. The controllable features are:
• System clock frequency
• Data input format
• Power control
• DC-filtering
• De-emphasis
• Volume
• Flat/min/max switch
• Bass boost
• Treble
• Mute.
The exchange of data and control information between the microcontroller and the UDA1340 is accomplished through a serial hardware interface comprising the following pins:
L3DATA: microcontroller interface data line L3MODE: microcontroller interface mode line L3CLOCK: microcontroller interface clock line.
Information transfer via the microcontroller bus is organized in accordance with the so called ‘L3’ format, in which two different modes of operation can be distinguished; address mode and data transfer mode (see Figs 4 and 5).
The address mode is required to select a device communicating via the L3-bus and to define the destination registers for the data transfer mode. Data transfer for the UDA1340 can only be in one direction, input to the UDA1340 to program its sound processing and other functional features.
Address mode
The address mode is used to select a device for subsequent data transfer and to define the destination registers. The address mode is characterized by L3MODE being LOW and a burst of 8 pulses on L3CLOCK, accompanied by 8 data bits. The fundamental timing is shown in Fig.4. Data bits 0 to 1 indicate the type of subsequent data transfer as given in Table 4.
UDA1340
Table 4 Selection of data transfer
BIT 1 BIT 0 TRANSFER
0 0 DATA (volume, bass boost, treble,
de-emphasis, mute, mode and power
control) 0 1 not used 1 0 STATUS (system clock frequency, data
input format and DC-filter) 1 1 not used
Data bits 7 to 2 represent a 6-bit device address, with bit 7 being the MSB and bit 2 the LSB. The address of the UDA1340 is 000101 (bit 7 to bit 2). In the event that the UDA1340 receives a different address, it will deselect its microcontroller interface logic.
Data transfer mode
The selection preformed in the address mode remains active during subsequent data transfers, until the UDA1340 receives a new address command. The fundamental timing of data transfers is essentially the same as in the address mode, shown in Fig.4. The maximum input clock and data rate is 64f All transfers are byte wise, i.e. they are based on groups of 8 bits. Data will be stored in the UDA1340 after the eighth bit of a byte has been received. A multibyte transfer is illustrated in Fig.6.
P
ROGRAMMING THE SOUND PROCESSING AND OTHER
FEATURES
The sound processing and other feature values are stored in independent registers. The first selection of the registers is achieved by the choice of data type that is transferred. This is performed in the address mode, BIT 1 and BIT 0 (see Table 4). The second selection is performed by the 2 MSBs of the data byte (BIT 7 and BIT 6). The other bits in the data byte (BIT 5 to BIT 0) is the value that is placed in the selected registers.
When the data transfer of type ‘data’ is selected, the features VOLUME, BASS BOOST, TREBLE, DE-EMPHASIS, MUTE, MODE and POWER CONTROL can be controlled. When the data transfer of type ‘status’ is selected, the features SYSTEM CLOCK FREQUENCY, DATA INPUT FORMAT and DC-FILTER can be controlled.
.
s
1997 Jul 09 9
Page 10
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
t
h;MA
t
BIT 0
s;MA
t
s;DAT
t
HC
UDA1340
t
BIT 7
t
h;MA
s;MA
MGD016
t
LC
T
cy
t
h;DAT
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
write
t
s;MT
t
halt
BIT 0
Fig.4 Timing address mode.
t
LC
t
s;DAT
T
cy
t
HC
t
h;DAT
t
BIT 7
t
h;MT
h;DAT
t
halt
MGD017
Fig.5 Timing for data transfer mode.
1997 Jul 09 10
Page 11
Philips Semiconductors Preliminary specification
h
Low-voltage low-power stereo audio CODEC with DSP features
andbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
address
t
halt
UDA1340
addressdata byte #1 data byte #2
MGD018
Fig.6 Multibyte transfer.
Table 5 Data transfer of type ‘status’; note 1
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 REGISTER SELECTED
0 X SC1 SC0 IF2 IF1 IF0 DC System Clock frequency (1 : 0)
data Input Format (2 : 0) DC-filter
1XXXXXXXnot used
Note
1. X = don’t care.
Table 6 Data transfer of type ‘data’; note 1
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 REGISTER SELECTED
0 0 VC5 VC4 VC3 VC2 VC1 VC0 Volume Control (5 : 0) 0 1 BB3 BB2 BB1 BB0 TR1 TR0 Bass Boost (3 : 0)
Treble (1 : 0)
1 0 X DE1 DE0 MT M1 M0 DE-emphasis (1 : 0)
MuTe Mode (1 : 0)
11XXXXPC1PC0Power Control (1 : 0)
Note
1. X = don’t care.
1997 Jul 09 11
Page 12
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
SYSTEM CLOCK FREQUENCY A 2-bit value (SC1 and SC0) to select the used external
clock frequency (see Table 7).
Table 7 System clock frequency settings
SC1 SC0 FUNCTION
0 0 512f 0 1 384f 1 0 256f 1 1 not used
DATA INPUT FORMAT A 3-bit value (IF2 to IF0) to select the used data format
(see Table 8).
Table 8 Data input format settings
IF2 IF1 IF0 FUNCTION
000 I 0 0 1 LSB justified, 16 bits 0 1 0 LSB justified, 18 bits 0 1 1 LSB justified, 20 bits 1 0 0 MSB justified 1 0 1 not used 1 1 0 not used 1 1 1 not used
2
S-bus
s s s
UDA1340
DC-FILTER A 1-bit value to enable the digital DC-filter (see Table 9).
Table 9 DC-filtering
DC FUNCTION
0 no DC-filtering 1 DC-filtering
VOLUME CONTROL A 6-bit value to program the left and right channel volume
attenuation (VC5 to VC0). The range is 0 dB to −∞ dB in steps of 1 dB (see Table 10).
Table 10 Volume settings
VC5 VC4 VC3 VC2 VC1 VC0
000000 0 000001 0 000010 −1 000011 −2
:::::: : 111011 −58 111100 −59 111101 −60 111110 −∞ 111111 −∞
VOLUME
(dB)
1997 Jul 09 12
Page 13
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
BASS BOOST A 4-bit value to program the bass boost setting. The used set depends on the MODE bits.
Table 11 Bass boost settings
BB3 BB2 BB1 BB0
FLAT SET (dB) MIN. SET (dB) MAX. SET (dB)
0000 0 0 0 0001 0 2 2 0010 0 4 4 0011 0 6 6 0100 0 8 8 0101 0 10 10 0110 0 12 12 0111 0 14 14 1000 0 16 16 1001 0 18 18 1010 0 18 20 1011 0 18 22 1100 0 18 24 1101 0 18 24 1110 0 18 24 1111 0 18 24
BASS BOOST
TREBLE A 2-bit value to program the treble setting. The used set depends on the MODE bits.
Table 12 Treble settings
TR1 TR0
FLAT SET (dB) MIN. SET (dB) MAX. SET (dB)
00 0 0 0 01 0 2 2 10 0 4 4 11 0 6 6
TREBLE
1997 Jul 09 13
Page 14
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
DE-EMPHASIS A 2-bit value to enable the digital de-emphasis filter.
Table 13 De-emphasis settings
DE1 DE0 FUNCTION
0 0 no de-emphasis 0 1 de-emphasis, 32 kHz 1 0 de-emphasis, 44.1 kHz 1 1 de-emphasis, 48 kHz
MUTE A 1-bit value to enable the digital mute.
Table 14 Mute
MT FUNCTION
0 no muting 1 muting
ODE
M
UDA1340
Table 15 The flat/min./max. switch
M1 M0 FUNCTION
0 0 flat 0 1 min. 1 0 min. 1 1 max.
OWER CONTROL
P A 2-bit value to disable the ADC and/or DAC to reduce
power consumption.
Table 16 Power control settings
PC1 PC0
00offoff 0 1 off on 1 0 on off 1 1 on on
FUNCTION
ADC DAC
A 2-bit value to program the mode of the sound processing filters of Bass Boost and Treble. There are three modes: flat, min. and max.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). All voltage referenced to ground, V
DDD=VDDA=VDDO
= 3 V; T
=25°C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DDD
T
xtal(max)
T
stg
T
amb
V
es
supply voltage note 1 − 5.0 V maximum crystal temperature − 150 °C storage temperature −65 +125 °C operating ambient temperature −20 +85 °C electrostatic handling note 2 −3000 +3000 V
note 3 −300 +300 V
Notes
1. All V
and VSS connections must be made to the same power supply.
DD
2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor, except pins 24, 26 and 28 which can withstand ESD pulses of −1500 V to +1500 V.
3. Equivalent to discharging a 200 pF capacitor via a 2.5 µH series inductor.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 90 K/W
1997 Jul 09 14
Page 15
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
DC CHARACTERISTICS
V
DDD=VDDA=VDDO
=3V; T
unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DDA(ADC)
V
DDA(DAC)
V
DDO
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO
I
DDD
ADC analog supply voltage 2.7 3.0 3.6 V DAC analog supply voltage 2.7 3.0 3.6 V operational amplifiers supply voltage 2.7 3.0 3.6 V digital supply voltage 2.7 3.0 3.6 V ADC supply current operation mode − 4.5 − mA
DAC supply current operation mode − 3.5 − mA
operational amplifier supply current operation mode − 4 − mA
digital supply current operation mode − 6 − mA
Digital input pins
V
IH
V
IL
I
input leakage current −−10 µA
LI
C
i
HIGH level input voltage 0.8V LOW level input voltage −0.5 − +0.2V
input capacitance −−10 pF
Digital output pins
V
OH
V
OL
HIGH level output voltage IOH= −2 mA 0.85V LOW level output voltage IOL=2mA −−0.4 V
Analog-to-digital converter
V R R C
ref
o(ref) i i
reference voltage with respect to V V
reference output resistance pin 4 − 24 − kΩ
refA
input resistance 1 kHz − 9.8 − kΩ input capacitance − 20 − pF
Digital-to-analog converter
V
ref
R
o(ref)
R
o
I
o(max)
R
L
C
L
reference voltage with respect to V V
reference output resistance pin 28 − 28 − kΩ
refD
DAC output resistance − 0.13 3.0 Ω maximum output current (THD + N)/S < 0.1%
load resistance 3 −− kΩ load capacitance note 2 −−200 pF
=25°C; RL=5kΩ; note 1; all voltages referenced to ground (pins 1, 11, 22 and 27);
amb
ADC power-down − 200 −µA
DAC power-down − 15 −µA
DAC power-down − 15 −µA
DAC power-down − 3 − mA ADC power-down − 3 − mA
SSA
SSA
0.45V
0.45V
− V
DDD
−− V
DDD
0.5V
DDA
DDA
0.5V
DDA
DDA
DDD
0.55V
0.55V
+ 0.5 V
DDD
DDA
DDA
− 0.22 − mA
RL=5kΩ
V
V
V
Notes
1. All power supply pins (V
and VSS) must be connected to the same external power supply unit.
DD
2. When higher capacitive loads must be driven then a 100 Ω resistor must be connected in series with the DAC output in order to prevent oscillations in the output operational amplifier.
1997 Jul 09 15
Page 16
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
AC CHARACTERISTICS (ANALOG)
V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Analog-to-digital converter
V
i(rms)
∆V
i
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio V
α
CS
PSRR power supply rejection ratio f
Digital-to-analog converter
V
o(rms)
∆V
o
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio code = 0; A-weighted − 100 − dBA
α
cs
PSRR power supply rejection ratio f
=3V; fi= 1 kHz; T
=25°C; RL=5kΩ all voltages referenced to ground
amb
input voltage (RMS value) − 0.8 − V unbalance between channels − 0.1 − dB
at 0 dB −−85 −80 dB
noise-to-signal ratio
at −60 dB; A-weighted −−35 −30 dBA
= 0 V; A-weighted − 95 − dBA
i
channel separation − 100 − dB
ripple
V
ripple(p-p)
= 1 kHz;
=30mV
− 30 − dB
output voltage (RMS value) − 0.8 − V unbalance between channels − 0.1 − dB
at 0 dB −−85 −80 dB
noise-to-signal ratio
at −60 dB; A-weighted −−35 − dBA
channel separation − 80 − dB
ripple
V
ripple(p-p)
= 1 kHz;
= 100 mV
− 50 − dB
1997 Jul 09 16
Page 17
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
AC CHARACTERISTICS (DIGITAL)
V
DDD=VDDA=VDDO
= 2.7 to 3.6 V; T
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
T
cy
t
CWL
t
CWH
clock cycle f
f
LOW level pulse width f
sys
f
HIGH level pulse width f
sys
Serial input/output data timing; see Fig.7 t
BCK
t
BCK(H)
t
BCK(L)
t
r
t
f
t
s;DATI
t
h;DATI
t
d(DATO)(BCK)
t
d(DATO)(WS)
t
h;DATO
t
s;WS
t
h;WS
bit clock period bit clock HIGH time 100 −−ns bit clock LOW time 100 −−ns rise time −−20 ns fall time −−20 ns data input set-up time 20 −−ns data input hold time 0 −−ns data output delay time (from BCK falling edge) −−80 ns data output delay time (from WS edge) MSB-justified format −−80 ns data output hold time 0 −−ns word selection set-up time 20 −−ns
word selection hold time 10 −−ns Address and data transfer mode timing; see Figs 4 and 5 T
cy
t
HC
t
LC
t
s;MA
t
h;MA
t
s;MT
t
h;MT
t
s;DAT
t
h;DAT
t
halt
L3CLK cycle time 500 −−ns
L3CLK HIGH period 250 −−ns
L3CLK LOW period 250 −−ns
L3MODE set-up time address mode 190 −−ns
L3MODE hold time address mode 190 −−ns
L3MODE set-up time data transfer mode 190 −−ns
L3MODE hold time data transfer mode 190 −−ns
L3DATA set-up time data transfer mode
L3DATA hold time data transfer mode
L3MODE halt time 190 −−ns
= −20 to +85 °C; RL=5kΩ; all voltages referenced to ground
amb
= 256f f f
f
f
sys sys sys sys sys sys sys
s
= 384f
s
= 512f
s
< 19.2 MHz 30 − 70 %T
≥ 19.2 MHz 40 − 60 %T
< 19.2 MHz 30 − 70 %T
≥ 19.2 MHz 40 − 60 %T
78 88 131 ns 52 59 87 ns 39 44 66 ns
1
⁄64fs−−ns
190 −−ns
and address mode
30 −−ns
and address mode
sys sys sys sys
1997 Jul 09 17
Page 18
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
handbook, full pagewidth
WS
t
BCK
DATAO
DATAI
t
r
BCK(H)
t
f
t
T
BCK(L)
cy
t
h;WS
t
d(DATO)(WS)
t
s;WS
t
h;DATO
t
d(DATO)(BCK)
t
s;DATI
UDA1340
t
h;DATI
MGG840
Fig.7 Serial interface timing.
1997 Jul 09 18
Page 19
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
APPLICATION INFORMATION
3 V
ground
system
clock
L1
8LM32A07
L2
8LM32A07
C12
100 µF
(16 V)
R30
47 Ω
C11
100 µF
(16 V)
V
DDA
V
DDD
SYSCLK
DATAO
BCK
DATAI
WS
12
18 16
17 19
100 µF
(16 V)
100 nF
(63 V)
V
SSA(ADC)
1
C2
C21
26711
handbook, full pagewidth
V
DDA
R21 1 Ω
R24
C25
100 nF
V
DDA(ADC)VADCNVADCPVSSD
(63 V)
C9
100 µF
(16 V)
C29
100 nF
(63 V)
V
DDD
R28 1 Ω
V
DDD
10
UDA1340
V
ref(A)
4
C22 100 nF (63 V)
C3 47 µF (16 V)
overload
flag
left
input
right
input
OVERFL
9
C1
X4
C31
47 µF
1 nF
(16 V)
(63 V)
C6
X5
C32
47 µF
1 nF
(16 V)
(63 V)
R32 1 MΩ
R33 680 kΩ
L3CLOCK
VINL
VINR
L3MODE
L3DATA
3
5
13 14 15
27
V
SSO
100 nF (63 V)
100 µF
(16 V)
C26
C7
UDA1340
25
V
R25 1 Ω
V
DDO
DDO
22
V
SSA(DAC)
C27
100 nF
(63 V)
C10
100 µF (16 V)
V
23
V
DDA(DAC)
R29 1 Ω
DDA
26
24
28
VOUTL
VOUTR
V
ref(D)
C5
47 µF (16 V)
C8
47 µF (16 V)
C23 100 nF (63 V)
R22 10 kΩ
R27 10 kΩ
R23
100 Ω
R26
100 Ω
C4 47 µF (16 V)
X2
X3
MGK582
left
output
right
output
Fig.8 Application diagram.
1997 Jul 09 19
Page 20
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
c
y
Z
28 15
UDA1340
SOT341-1
E
H
E
A
X
v M
A
pin 1 index
114
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
2
A3b
0.25
0.38
0.25
p
cD
0.20
0.09
UNIT A1A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
0 2.5 5 mm
scale
(1)E(1) (1)
10.4
10.0
eHELLpQZywv θ
5.4
0.65 1.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
1.03
0.9
0.63
0.7
(A )
L
p
L
0.13 0.10.2
A
3
θ
1.1
0.7
o
8
o
0
OUTLINE VERSION
SOT341-1 MO-150AH
IEC JEDEC EIAJ
REFERENCES
1997 Jul 09 20
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08 95-02-04
Page 21
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SSOP packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
(order code 9398 652 90011).
UDA1340
If wave soldering cannot be avoided, the following conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate solder thieves at the downstream end.
Even with these conditions, only consider wave soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1997 Jul 09 21
Page 22
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio
UDA1340
CODEC with DSP features
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Jul 09 22
Page 23
Philips Semiconductors Preliminary specification
Low-voltage low-power stereo audio CODEC with DSP features
UDA1340
NOTES
1997 Jul 09 23
Page 24
Philips Semiconductors – a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands Brazil: seeSouth America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: seeAustria India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,
Tel. +3140 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 547027/1200/02/pp24 Date of release: 1997 Jul 09 Document order number: 9397 750 02548
Loading...