•Shutdown Mode Disables On Chip
Logic Reference for Low Standby
Power
•Optional External Biasing of Logic
Circuitry can Reduce Overall Power
Dissipation
BLOCK DIAGRA M
DESCRIPTION
The UC1726 Isolated Drive Transmitter, and its companion chip, the
UC1727 Isolated High Side IGBT Driver, provide a unique solution to driving isolated power IGBTs. They are particularly suited to drive the high
side device s on a high voltage H-bridge. The UC1726 device transmits
the drive logic and drive power, along with transferring and receiving fault
information with the isolated gate circuit using a low cost pulse transformer.
This drive system utilizes a duty cycle modulation technique that gives instantaneous response to the drive control transitions, and reliably passes
steady state, or DC conditions. High frequency operation, up to 750kHz,
allows the cost and size of the coupling transformer to be minimized.
The UC1726 can be powered from a single V
generates a vol tage reference for the logic circuitry. It can also be placed
into a low power shutdown mode that disables the internal reference. The
IC’s logic ci rcuitry can b e powered from an external suppl y, V
mize overall power dissipation. Fault logic monitors the Isolated High Side
IGBT Driver UC1727 for faults. Based on user defined timing, the
UC1726 distinguishes valid faults, which it responds to by setting the fault
latch pin. This also disables the gate drive information until the fault reset
pin is toggled to a logic one.
The UC1726 opera te s ove r an 8 to 3 5 vo lt su ppl y range. The typical V
voltage will be greater than 28 volts to be compatible with the UC1727.
The undervoltage lockout circuitry of the Isolated High Side IGBT Driver
UC1727 locks out the driv e information during its undervoltage lockout.
Unless otherwise stated, VCC = 20V, RT = 4.32kΩ, CT = 330pF and CF = 2.2nF, no
load on any output, and −55°C < TA < 125°C for the UC1726, −40°C < TA < 85°C for
the UC2726, and 0°C < TA < 70°C for the UC3726, TA = T J.
ELECTRICAL CHARACTERISTICS:
PARAMETERSTEST CONDITIONSMINTYPMAX UNITS
Retriggerable one shot
Initial AccuracyT
Temperature StabilityOver operating TJ1.0002.200µsec
Voltage StabilityV
Operating Freque ncyL
PHI Input (Control Input)
HIGH Input Voltage2.0V
LOW Input Voltage0.8V
HIGH Input Current10µA
LOW Input Current-300−60 0µA
Delay to one shot100250nsec
Delay to OutputC
Output Drivers
Output Low Le velI
Output High Leve lI
(volts below V
CC)ISOURCE = −400mA2.02.9V
Rise and Fall TimesNo load3060nsec
Logic Voltage Reference
V
L - Logic VoltageInternal Voltage4.204 .4 04.60V
Logic Supply CurrentV
Shut Down Circuit
Logic Voltage - Off0.5V
High Input Curren tV
Low Input CurrentV
Fault Logic
Fault Reset High Input CurrentV
Fault Reset Low Input CurrentV
Fault High Input Cur rentV
Fault Low Input CurrentV
Fault Pulse WidthC
IH = 2.4
IL = 0.4-10µA
IH = 2.4
IL = 0.4-60µA
F = 330pF3.0µs
C
F = 2.2nF17.0µs
T = 1.4V2240mA
C
T = 1.4V, VL = 5.0V1220mA
±
5µA
±
5µA
CT = 1.4V, Shutdown = 5.0V2.5mA
UC1726
UC2726
UC3726
3
Page 4
UC1726
UC2726
UC3726
Refer to Typical Appli cati on on Pag e 5 and App l icati o n No te U-143A " New Chip Pair Provides Isolated Drive
for High Voltage IGBTs"
PIN DESCRIP TI ONS
CF: The timing input to the fault logic. A capacitor is
placed across the input of C
dow is approximately t = 2.1C
C
T: The connection to the timing capacitor that controls
F and ground. The timing win-
FRT.
the operating frequ ency. A capacitor to ground is repetitively charg ed during the one sh ot pulse width. It is discharged when a comparator senses zero current in the
primary side of the transformer. The one shot pulse width
is consequently determined by the time it takes to charge
the capacitor from a threshold voltage of V
L/4 to VL/2.
This pin must be tied to a capacitor. See Recommended
Operating Conditions.
FAULT: This input t o the faul t logi c i nitiates th e user programmable timer. This time interval, specified by the capacitor on C
F, determines the validity of the fault. The pin
is tied to a low cost optocoupler, and is high until the
UC1727 sends drive information from the PHI pin through
the transformer while the FAULT pin stays low. Once this
pin goes high, it must stay high during the entire fault window to be a ccepted as a va li d fau lt. A valid fault sets the
F
LATCH pin high and prevents the transmitting of gate
drive information until the F
RESET is toggled high. If fault
logic is not used, the FAULT pin must be grounded.
F
LATCH: A valid fault sets this pin to a logic one and pre-
vents the transmitting of gate drive information. The
F
LATCH pin can only be reset by connecting the FRESET to
a logic 0.
F
RESET: The input to the fault logic that resets the fault
logic latch (F
LATCH) and enables drive transmit data. This
input must be low when powered up and stay low until after the fault latch has been set.
GND: The signal a nd power ground for the device. The
power ground of the output transistor is isolated on the
chip from the subs trate groun d which biases the remainder of the device.
OUTA: One output of the two totem pole outputs connected across the transformer primary winding. When
PHI is high, the output toggles between 0.3V during the
one shot charge time and approximately V
CC + 0.4V dur-
ing the remainder of the period. When PHI is low the output toggles between V
time and approximately 0.6V
CC - 2V during the one shot charge
CC during the remainder of
the period.
OUTB: One output of the two totem pole outputs connected across the transformer primary winding. When
PHI is high, the output toggl es between V
the one shot charge time and approximately 0.6V
CC - 2V during
CC dur-
ing the remainder of the period. When PHI is low the output toggles between 0.3V during the one shot charge
time and approximately V
CC + 0.4V during the remainder
of the period.
PGND: This is the ground for the output transistors
bonded i n the 28 pin packag es. On the six teen pin packages it is bonded separately to the GND pin.
PHI: A logic control input to the isolated gate drive that
changes the outputs as described above. This changes
the duty cycle of the voltage wave form applied across
the transformer. The Isolated High Side IGBT Driver
UC1727 senses the different duty cycles as different
drive commands.
PV
CC: This is the input vol tage for the output transistors
on the 28 pin package. On the sixteen pin packages it is
bonded separately to the V
R
T: The input that sets the CT and CF capacitor currents
with a resistor to ground . The voltage on R
mately 0.3V
IC
F = VL / 4RT.
L. The resulting charge currents are: ICT =
CC pin.
T is approxi-
SHTDWN: This input shuts down the internal reference. A
TTL logic one puts the UC1726 into a low standby current
mode. This input has a pull down resistor on the chip to
guarantee proper operation when left open. If an external
logic voltage i s applied to V
L, this shutdown feature can-
not be used without bringi ng the external voltage source
to zero volts.
V
CC: The input voltage that biases the outputs and the in-
ternal reference. It can vary between 8V to 35V. This supply pin will typically be greater than 28V to be compatible
with the UC1727. In order to min imize pow er dissipation
use an external logic supply, V
CC approximately 15V, and
a step up transformer (N = 2).
V
L: The logic supply pin that biases all circuits except for
the totem pole outputs. A bypass capacitor is recommended on thi s pin when lef t unconnected. The internal
reference is approximately 4.4V. A 5.0V supply can be
applied to thi s pin to assure minimum power dissipation.
When an external supply higher than the V
L voltage is
applied to this pin, the internal reference turns off.
4
Page 5
OPERATING FREQ UENCY :
The chip operating frequency is determined by the values
of components connected to the R
tor connected between R
current to IC
T = VL / 4RT. The operating frequency varies
T and ground sets the charge
slightly depending on the V
T and CT pins. A resis-
CC and VL voltages. The fol-
lowing equations approximate the one shot pulse width at
operating frequency when V
CC = 20V.
TYPICAL APPLICATIO N
UC1726
UC2726
UC3726
T
PW = 1.1RT(CT + 50pF)
F
O
=
3.3
The 50pF additional capacity represents internal chip capacitance at the C
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