The UC1825 family of PWM control ICs is optimized for high fre
quency switched mode power supply applications. Particular care
was given to minimizing propagation delays through the comparators
and logic circuitry while maximizing bandwidth and slew rate of the
error amplifier. This controller is designed for use in either cur
rent-mode or voltage mode systems with the capability for input volt
age feed-forward.
Protection circuitry includes a current limit comparator with a 1V
threshold, a TTL compatible shutdown port, and a soft start pin
which will double as a maximum duty cycle clamp. The logic is fully
latched to provide jitter free operation and prohibit multiple pulses at
an output. An under-voltage lockout section with 800mV of hysteresis
assures low start up current. During under-voltage lockout, the out
puts are high impedance.
These devices feature totem pole outputs designed to source and
sink high peak currents from capacitive loads, such as the gate of a
power MOSFET. The on state is designed as a high level.
Storage Temperature Range. . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . 300°C
SOIC-16 (Top View)
DW Package
CONNECTION DIAGRAMS
DIL-16 (Top View)
J or N Package
PLCC-20 & LCC-20
(Top View)
Q & L Packages
UC1825
UC2825
UC3825
PACKAGE PIN FUNCTION
FUNCTION
N/C1
INV2
NI3
E/A Out4
Clock5
N/C6
R
T7
C
T8
Ramp9
Soft Start10
N/C11
ILIM/SD12
Gnd13
Out A14
Pwr Gnd15
N/C16
V
C17
Out B18
V
CC19
V
REF 5.1V20
PIN
THERMAL RATINGS TABLE
PackageQ
DIL-16J80-12028
DIL-16N90
PLCC-2043-75(1)34
LCC-2070-8020
SOIC-1650-120
Q
Q
JA
(1)
(1)
Q
JC
(2)
45
(2)
35
2
Page 3
UC1825
UC2825
UC3825
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TO.
UC1825
PARAMETERSTEST CONDITIONSUC2825
UC3825
MINTOPMAXMINTOPMAX UNITS
Reference Section
Output VoltageT
Line Regulation10V < V
Load Regulation1mA < I
Temperature Stability*T
O = 25°C, IO = 1mA5.055.105.155.005.105.20V
CC < 30V220220mV
O < 10mA520520mV
MIN < TA <TMAX0.20.40.20.4mV/°C
Total Output Variation*Line, Load, Temperature5.005.204.955.25V
Output Noise Voltage*10Hz < f < 10kHz5050µV
Long Term Stability*T
Short Circuit CurrentV
Initial Accuracy*T
Voltage Stability*10V < V
Temperature Stability*T
J = 2°C360400440360400440kHz
CC < 30V0.220.22%
MIN < TA <TMAX55%
Total Variation*Line, Temperature340460340460kHz
Oscillator Section (cont.)
Clock Out High3.94.53.94.5V
Clock Out Low2.32.92.32.9V
Ramp Peak*2.62.83.02.62.83.0V
Ramp Valley*0.71.01.250.71.01.25V
Ramp Valley to Peak*1.61.82.01.61.82.0V
Error Amplifier Section
Input Offset Voltage1015mV
Input Bias Current0.630.63µA
Input Offset Current0.110.11µA
Open Loop Gain1V < V
CMRR1.5V < V
PSRR10V < V
Output Sink CurrentV
Output Source CurrentV
Output High VoltageI
Output Low VoltageI
High speed circuits demand careful attention to layout
and component placement. To assure proper perfor
mance of the UC1825 follow these rules: 1) Use a ground
plane. 2) Damp or clamp parasitic inductive kick energy
from the gate of driven MOSFETs. Do not allow the out
put pins to ring below ground. A series gate resistor or a
shunt 1 Amp Schottky diode at the output pin will serve
Error Amplifier Circuit
Simplified Schematic
UC1825
UC2825
UC3825
this purpose. 3) Bypass V
-
monolithic ceramic capacitors with low equivalent series
inductance. Allow less than 1 cm of total lead length for
each capacitor between the bypassed pin and the ground
-
plane. 4) Treat the timing capacitor, CT, like a bypass ca
pacitor.
CC,VC, and VREF. Use 0.1µF
-
Open Loop Frequency ResponseUnity Gain Slew Rate
PWM Applications
Conventional (Voltage Mode)
Current-Mode
5
Page 6
Oscillator Circuit
UC1825
UC2825
UC3825
Deadtime vs CT(3k RT100k)
µ
Timing Resistance vs Frequency
Synchronized Operation
Two Units in Close Proximity
Deadtime vs Frequency
160
140
120
D
T (ns)
100
80
10k100k
1.0nF
470pF
FREQ (Hz)
Generalized Synchronization
1M
6
Page 7
Forward Technique for Off-Line Voltage Mode Application
Constant Volt-Second Clamp Circuit
The circuit shown here will achieve a constant
volt-second product clamp over varying input voltages.
The ramp generator components, R
sen so that the ramp at Pin 9 crosses the 1V threshold
at the same time the desired maximum volt-second
product is reached. The delay through the functional
nor block must be such that the ramp capacitor can be
completely discharged during the minimum deadtime.
T and CR are cho
-
UC1825
UC2825
UC3825
Output Section
Simplified SchematicRise/Fall Time (CL=1nF)
Rise/Fall Time (CL=10nF)
Saturation Curves
7
Page 8
Open Loop Laboratory Test Fixture
This test fixture is useful for exercising many of the
UC1825’s functions and measuring their specifications.
UC1825
UC2825
UC3825
UDG-92032-2
As with any wideband circuit, careful grounding and bypass procedures should be followed. The use of a
ground plane is highly recommended.
Design Example: 50W, 48V to 5V DC to DC Converter - 1.5MHz Clock Frequency
UDG-92033-3
8
Page 9
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
5962-87681012AACTIVELCCCFK201TBDPOST-PLATEN / A for Pkg Type-55 to 1255962-
5962-8768101EAACTIVECDIPJ161TBDA42N / A for Pkg Type-55 to 1255962-8768101EA
5962-8768101QFAACTIVECFPW161TBDA42N / A for Pkg Type-55 to 1255962-8768101QF
UC1825JACTIVECDIPJ161TBDA42N / A for Pkg Type-55 to 125UC1825J
UC1825J883BACTIVECDIPJ161TBDA42N / A for Pkg Type-55 to 1255962-8768101EA
UC1825LACTIVELCCCFK201TBDPOST-PLATEN / A for Pkg Type-55 to 125UC1825L
UC1825L883BACTIVELCCCFK201TBDPOST-PLATEN / A for Pkg Type-55 to 1255962-
UC1825W883BACTIVECFPW161TBDA42N / A for Pkg Type-55 to 1255962-8768101QF
UC2825DWACTIVESOICDW1640Green (RoHS
UC2825DWG4ACTIVESOICDW1640Green (RoHS
UC2825DWTRACTIVESOICDW162000Green (RoHS
UC2825DWTRG4ACTIVESOICDW162000Green (RoHS
UC2825JACTIVECDIPJ161TBDA42N / A for Pkg Type-40 to 85UC2825J
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
87681012A
UC1825L/
883B
UC1825J/883B
A
UC1825W/883B
UC1825J/883B
87681012A
UC1825L/
883B
A
UC1825W/883B
CU NIPDAULevel-2-260C-1 YEAR-40 to 85UC2825DW
CU NIPDAULevel-2-260C-1 YEAR-40 to 85UC2825DW
CU NIPDAULevel-2-260C-1 YEAR-40 to 85UC2825DW
CU NIPDAULevel-2-260C-1 YEAR-40 to 85UC2825DW
11-Jul-2015
Samples
(4/5)
UC2825NACTIVEPDIPN1625Green (RoHS
& no Sb/Br)
UC2825NG4ACTIVEPDIPN1625Green (RoHS
& no Sb/Br)
Addendum-Page 1
CU NIPDAUN / A for Pkg Type-40 to 85UC2825N
CU NIPDAUN / A for Pkg Type-40 to 85UC2825N
Page 10
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
UC2825QACTIVEPLCCFN2046Green (RoHS
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
CU SNLevel-2-260C-1 YEAR-40 to 85UC2825Q
(4/5)
& no Sb/Br)
UC2825QTROBSOLETEPLCCFN20TBDCall TICall TI-40 to 85UC2825Q
UC2825QTRG3ACTIVEPLCCFN20TBDCall TICall TI-40 to 85
UC3825DWACTIVESOICDW1640Green (RoHS
CU NIPDAULevel-2-260C-1 YEAR0 to 70UC3825DW
& no Sb/Br)
UC3825DWG4ACTIVESOICDW1640Green (RoHS
CU NIPDAULevel-2-260C-1 YEAR0 to 70UC3825DW
& no Sb/Br)
UC3825DWTRACTIVESOICDW162000Green (RoHS
CU NIPDAULevel-2-260C-1 YEAR0 to 70UC3825DW
& no Sb/Br)
UC3825DWTRG4ACTIVESOICDW162000Green (RoHS
CU NIPDAULevel-2-260C-1 YEAR0 to 70UC3825DW
& no Sb/Br)
UC3825JLIFEBUYCDIPJ161TBDA42N / A for Pkg Type0 to 70UC3825J
UC3825NACTIVEPDIPN1625Green (RoHS
CU NIPDAUN / A for Pkg Type0 to 70UC3825N
& no Sb/Br)
UC3825NG4ACTIVEPDIPN1625Green (RoHS
CU NIPDAUN / A for Pkg Type0 to 70UC3825N
& no Sb/Br)
UC3825QACTIVEPLCCFN2046Green (RoHS
CU SNLevel-2-260C-1 YEAR0 to 70UC3825Q
& no Sb/Br)
UC3825QTRACTIVEPLCCFN201000Green (RoHS
CU SNLevel-2-260C-1 YEAR0 to 70UC3825Q
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
11-Jul-2015
Samples
Addendum-Page 2
Page 11
PACKAGE OPTION ADDENDUM
www.ti.com
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1825, UC2825, UC2825M, UC3825, UC3825M :
Catalog: UC3825, UC2825, UC3825M, UC3825
•
11-Jul-2015
Military: UC2825M, UC1825
•
Space: UC1825-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 3
Page 12
Page 13
Page 14
Page 15
Page 16
MECHANICAL DATA
MPLC004A – OCT OBER 1994
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
D
D1
13
4
E1E
8
9
NO. OF
PINS
**
D/E
19
13
18
14
0.032 (0,81)
0.026 (0,66)
0.050 (1,27)
0.008 (0,20) NOM
D1/E1
MINMAXMIN
MAX
D2/E2
MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
0.020 (0,51) MIN
D2/E2
D2/E2
0.021 (0,53)
0.013 (0,33)
0.007 (0,18)
MAX
M
20
28
44
52
68
84
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
0.785 (19,94)
0.985 (25,02)
1.185 (30,10)
0.395 (10,03)
0.495 (12,57)
0.695 (17,65)
0.795 (20,19)
0.995 (25,27)
1.195 (30,35)
0.350 (8,89)
0.450 (11,43)
0.650 (16,51)
0.750 (19,05)
0.950 (24,13)
1.150 (29,21)
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.756 (19,20)
0.958 (24,33)
1.158 (29,41)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.441 (11,20)
0.541 (13,74)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
0.469 (11,91)
0.569 (14,45)
4040005/B 03/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
Page 17
Page 18
Page 19
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
ProductsApplications
Audiowww.ti.com/audioAutomotive and Transportationwww.ti.com/automotive
Amplifiersamplifier.ti.comCommunications and Telecomwww.ti.com/communications
Data Convertersdataconverter.ti.comComputers and Peripheralswww.ti.com/computers
DLP® Productswww.dlp.comConsumer Electronicswww.ti.com/consumer-apps
DSPdsp.ti.comEnergy and Lightingwww.ti.com/energy
Clocks and Timerswww.ti.com/clocksIndustrialwww.ti.com/industrial
Interfaceinterface.ti.comMedicalwww.ti.com/medical
Logiclogic.ti.comSecuritywww.ti.com/security
Power Mgmtpower.ti.comSpace, Avionics and Defensewww.ti.com/space-avionics-defense
Microcontrollersmicrocontroller.ti.comVideo and Imagingwww.ti.com/video
RFIDwww.ti-rfid.com
OMAP Applications Processorswww.ti.com/omapTI E2E Communitye2e.ti.com
Wireless Connectivitywww.ti.com/wirelessconnectivity