The UC1708 family of power drivers is made with a high-speed,
high-voltage, Schottky process to interface control functions and high-power
switching devices – particularly power MOSFETs. Operating over a 5 to 35
volt supply range, these devices contain two independent channels. The A
and B inputs are compatible with TTL and CMOS logic families, but can
withstand input voltages as high as V
to 3A as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs,
they can be forced low in common through the action of either a digital high
signal at the Shutdown terminal or by forcing the Enable terminal low. The
Shutdown terminal will only force the outputs low, it will not effect the behav
ior of the rest of the device.The Enable terminal effectively places the device
in under-voltage lockout, reducing power consumption by as much as 90%.
During under-voltage and disable (Enable terminal forced low) conditions,
the outputs are held in a self-biasing, low-voltage, state.
application
INFO
available
IN. Each output can source or sink up
UC1708
UC2708
UC3708
-
•Enable and Shutdown Functions
•Wide Input Voltage Range
•ESD Protection to 2kV
BLOCK DIAGRAM
The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin
“bat-wing” DIP packages for commercial operation over a 0
perature range and industrial temperature range of -25
respectively. For operation over a -55
UC1708 is available in hermetically sealed 8-pin MINI CDIP, 16 pin CDIP
and 20 pin CLCC packages.Surface mount devices are also available.
o
C to +125oC temperature range, the
o
Cto+70oC tem-
o
Cto+85oC
Note: Shutdown feature is not available in J or N packages only.
NOTE 1: All voltages are with respect to Logic Gnd pin.All currents are positive into, negative out of, device terminals.
NOTE 2:Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages.
CONNECTION DIAGRAMS
DIL-8 (Top View)
J Or N Package
DIL-16 (Top View)
JE or NE Package
SOIC-16 (Top View)
DW Package
CLCC-20 (Top View)
L Package
INPUT A
N/C
N/C
PWR GND A
OUTPUT A
Note: In JE package Pin 4 is logic ground. Pins 5, 12,
and 13 are N/C.
N/C
N/C
20 19
PWR GND B
18
17
16
15
14
OUTPUT B
VIN
N/C
N/C
N/C
VIN
ENABLE
LOGIC GND
N/C 6
N/C
SHUTDOWN
321
4
5
7
8
910111213
INPUT B
2
Page 3
UC1708
UC2708
UC3708
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, V
for: –55
o
C<TA<125oC for the UC1708, –25oC<TA<+85oC for the UC2708, and 0oC<TA<70oC for the UC3708.TA =TJ.
=10V to 35V, and these specifications apply
IN
PARAMETERTEST CONDITIONSMINTYPMAX UNITS
IN Supply CurrentOutputsLow1826mA
V
Outputs High1418mA
Enable = 0V14mA
A, B and Shutdown Inputs Low
0.8V
Level
A, B and Shutdown Inputs High
2.0V
Level
A, B Input Current LowV
A, B Input Current HighV
A, B Input Leakage Current HighV
Shutdown Input Current LowV
Shutdown Input Current HighV
Enable Input Current LowV
Enable Input Current HighV
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
Page 7
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
0.063 (1,60)
0.015 (0,38)
0.100 (2,54)
8
1
5
4
0.065 (1,65)
0.045 (1,14)
0.020 (0,51) MIN
0.023 (0,58)
0.015 (0,38)
0.280 (7,11)
0.245 (6,22)
0.310 (7,87)
0.290 (7,37)
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0°–15°
0.014 (0,36)
0.008 (0,20)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
4040107/C 08/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 8
Page 9
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
Page 10
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
0.021 (0,53)
0.015 (0,38)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
4
0.070 (1,78) MAX
0.020 (0,51) MIN
0.200 (5,08) MAX
0.125 (3,18) MIN
0.100 (2,54)
0.010 (0,25)
Seating Plane
M
0.325 (8,26)
0.300 (7,62)
0.015 (0,38)
Gage Plane
0.010 (0,25) NOM
0.430 (10,92)
MAX
4040082/D 05/98
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 11
Page 12
Page 13
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