Datasheet UBA1702A, UBA1702 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

UBA1702; UBA1702A

Line interrupter driver and ringer

Product specification
Supersedes data of 1996 Jan 09
File under Integrated Circuits, IC03

1997 Sep 29

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

FEATURES
Speech part

• Driver for the line interrupter that can be either a PMOST
when UBA1702 is used or a PNP when UBA1702A is
used

• Adjustable over-current protection

• Adjustable over-voltage protection for transmission

circuit

• Adjustable mute (dialling mode voltage; DMO or NSA)

• Adjustable current loop detection (hook switch status)

• Microcontroller supply

• Provision for electronic hook switch.

Ringer part

• Over-voltage protection

• Ringer frequency output for frequency discrimination

• Adjustable ringer threshold for piezo-driver enable

• Three bits ringer volume control

• Bridge-tied-load (BTL) output stage for piezo transducer

• Fast start-up microcontroller supply.

Miscellaneous

• Separated ground pins for transmission circuit interface
and control signals (e.g. for TEA1064A)

• Possibility to supply the microcontroller with an external
voltage source.

APPLICATIONS

• Telephone sets with software controlled ringer function

• Telephone sets with electronic hook switch.

GENERAL DESCRIPTION

The UBA1702; UBA1702A performs the high voltage
interface and ringer functions of the corded analog
telephone set in close cooperation with a microcontroller
and transmission circuit.

The UBA1702; UBA1702A incorporates several
protections, a driver for the line interrupter and a ringer.
Because of the practical division of functions between the
microcontroller, the transmission circuit and the UBA1702;
UBA1702A, it is possible to have a higher integration level
thereby reducing significantly the number of discrete
components in a telephone set.

ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

UBA1702 DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
UBA1702A DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
UBA1702T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
UBA1702AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

PACKAGE

1997 Sep 29 2

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

QUICK REFERENCE DATA

Speech part: l
Ringer part: V
line and the RPI input.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Speech part

SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702A ONLY
R

SDO

SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 AND UBA1702A
R

SDI-SDO

R

SDI

MUTE SWITCH AND ADJUSTABLE PROTECTION ZENER VOLTAGE (PINS MSI, MSA AND ZPA)
V

SPO(M)

V

SPO(Z)

CURRENT MANAGEMENT (PINS SPI, SPO, CDA, CLA AND CDO)
l

SPI(lim)

I

SPI(det)

MICROCONTROLLER SUPPLY (V
V

DD

Ringer part

= 20 mA; DPI = LOW; T

line

= 45 V; f = 25 Hz; using an RC combination of 2.2 kΩ and 820 nF and a diode bridge between the

line(rms)

resistance between pins SDO and V

resistance between pins SDI and SDO V
resistance between pins SDI and V

adjustable mute voltage referenced to
V

EE

adjustable zener voltage referenced to
V

EE

current limitation (pin SPI) CLA shorted to V

=25°C; VEE= 0 V; unless otherwise specified.

amb

EE

SDI

EEVSDI

MSI = HIGH;

− V

<12V − 1.1 − MΩ

SDO

= 240 V; DPI = HIGH 5 −−MΩ

− 2.2 − kΩ

− 2.7 3 V

MSA open-circuit
MSI = LOW;

11 12 13 V

ZPA open-circuit

EE

− 120 − mA

current detection (pin SPI) CDA open-circuit 2 3 4 mA

AND V

DD

supply output voltage referenced to
V

SS

BB

)

VBB> 3.7 V; IDD= −1 mA 3.0 3.3 3.6 V

P

ROTECTION (PIN RPI)

I

RPI(max)

maximum input current 70 −−mA
RINGER THRESHOLD AND FREQUENCY DETECTION (PINS VRR,RTAAND RFO)
V

RR(th)

ringer supply threshold voltage

referenced to V

SS

RTA open-circuit − 11 − V

VOLUME CONTROL (PINS RV0, RV1 AND RV2)
∆G

s

step resolution (RV2, RV1, RV0) from

(0, 0, 0) to (1, 1, 0); note 1

∆G

ls

last step resolution (RV2, RV1, RV0) from

(1, 1, 0) to (1, 1, 1); note 2
RINGER MELODY INPUT AND PIEZO DRIVER (PINS RMI, ROA AND ROB)
V

o(max p−p)

maximum output voltage between pins

RV2=1; RV1=1; RV0=1 − 28.7 32 V

ROA and ROB (peak-to-peak value)

Notes

1. Independent of V

if greater than 10 V.

RR

2. Without piezo transducer, dependent on VRR.

1997 Sep 29 3

− 6 − dB

− 9.5 12 dB

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

BLOCK DIAGRAM

handbook, full pagewidth

DPI

EHI

V

BB

V

DD

RFO

SDO

SDI

21

14 V

4

28

V

SS

SWITCH
DRIVER

19

18

12

SUPPLY

V

V

SS

RINGER FREQUENCY

DETECTION

V

DD

V

SS

ref

V

DD

CDO

CLA

V

V

DD

SS

S

ref

LINE CURRENT MANAGEMENT

SPO

REFERENCES

V

SS

RINGER

SPI

CDA

SENSE

S

ref

S

ref

R

ref

SPO

65262425

SPEECH

ZENER PROTECTION

S

R

MUTE SWITCH

ref

V

DD

ref

V

SS

UBA1702; UBA1702A
UBA1702T; UBA1702AT

V

RR

V

RR

V

V

SS

V

SS

1/2 V

DD

RINGER MELODY INPUT AND PIEZO DRIVER

DD

V

DD

9

ZPA

10

MSA

8

MSI

17

V

SS

7

V

EE

22

ROA

20

ROB

23

RPI

R

ref

V

11

RTA

SS

RINGER

THRESHOLD

R

ref

RINGER

PROTECTION

21

V

RR

Fig.1 Block diagram.

1997 Sep 29 4

RMI

V

RR

DIGITAL

-TO-

ANALOG

CONVERTER

V

DD

VOLUME

CONTROL

16

V

DD

V

SS

V

DD

V

SS

V

DD

V

SS

MBE184

13

RV0

14

RV1

15

RV2

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

PINNING

SYMBOL PIN DESCRIPTION

SDI 1 switch driver input
SDO 2 switch driver output
n.c. 3 not connected
DPI 4 dialling pulse input
SPI 5 speech part input
SPO 6 speech part output
V

EE

7 ground for transmission circuit
MSI 8 mute switch input
ZPA 9 Zener protection adjustment input
MSA 10 mute switch adjustment input
RTA 11 ringer threshold adjustment input
RFO 12 ringer frequency output
RV0 13 ringer volume input; bit 0
RV1 14 ringer volume input; bit 1
RV2 15 ringer volume input; bit 2
RMI 16 ringer melody input
V

SS

17 ground for microcontroller and

ringer

V

DD

V

BB

18 microcontroller supply voltage
19 supply voltage from transmission

circuit
ROB 20 ringer output B
V

RR

21 ringer supply voltage
ROA 22 ringer output A
RPI 23 ringer part input
CDO 24 current detection output
CLA 25 current limitation adjustment input
CDA 26 current detection adjustment input
n.c. 27 not connected
EHI 28 electronic hook switch input

handbook, halfpage

1

SDI

2

SDO

3

n.c.

4

DPI
SPI

5
6

SPO

7
8

9
10
11
12
13

UBA1702
UBA1702T
UBA1702A

UBA1702AT

MBE183

V

EE

MSI

ZPA

MSA

RTA

RFO

RV0
RV1

Fig.2 Pin configuration.

28

EHI

27

n.c.

26

CDA

25

CLA

24

CDO

23

RPI

22

ROA
V

21

RR

20

ROB
V

19

BB

V

18

DD

V

17

SS

16

RMI

1514

RV2

1997 Sep 29 5

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

FUNCTIONAL DESCRIPTION

The values given in this functional description are typical
values except when otherwise specified.

Speech part

The speech part consists of three blocks, the switch driver,
the line current management and the mute switch (DMO or
NSA) combined with an adjustable over-voltage (zener)
protection circuit. The reference block, which generates
reference voltages and currents, is also used in the speech
part (see Fig.1) by the mute switch block.

WITCH DRIVER (PINS SDI, SDO, EHI AND DPI)

S

UBA1702

The UBA1702 switch driver block is intended to generate
the appropriate signal to drive an external PMOST
interrupter. The source and gate of this PMOST are
respectively connected to SDI and SDO. The electronic
hook switch input (EHI) and the dialling pulse input (DPI)
signals control the state of this PMOST.

The EHI pin is provided with high voltage capability. When
the voltage applied at pin EHI is HIGH, the switch driver
block will start and generate the proper signals to switch on
the external PMOST interrupter.

When the telephone set is equipped with a mechanical
hook switch, pin EHI can be connected directly to the
switch driver input (pin SDI). For electronic hook switch
applications, the EHI pin can be driven by the
microcontroller output.

voltage applied at pin DPI is LOW, the switch driver block
turns on the external PMOST interrupter.

The external PMOST interrupter is controlled by the
voltage between the switch driver input and output
(pins SDI and SDO).

When the voltage applied at pin EHI is HIGH and the
voltage applied at pin DPI is LOW, the voltage at SDO is
pulled down to a value less than 0.2 V in order to create a
high source-gate voltage (V

) for the external PMOST.

SG

However, in order to avoid break-down of the external
PMOST, the voltage difference between SDI and SDO is
internally limited to 14 V.

When the voltage applied at pin EHI and the one applied
at pin DPI are both HIGH, pin SDO can be considered as
being connected to pin SDI via a 1.1 MΩ pull-up resistor
while the impedance between SDI and VEE becomes very
high (a few MΩ).

When the voltage applied at pin EHI is LOW, whatever the
one applied at DPI is, pin SDO can be considered as being
connected to pin SDI via a 1.1 MΩ pull-up resistor while
the impedance between SDI and VEE becomes almost
infinite.

80

handbook, halfpage

I

EHI

(µA)

60

MGD178

In some special applications, the EHI pin can be current
driven. In such a case, the current available at SDO to turn
on the PMOST interrupter is approximately 10 times the
EHI input current (providing I

EHI

<2µA).

The EHI pin presents an impedance of 250 kΩ at low input
voltage. When the applied voltage at EHI goes above
approximately 30 V, the EHI input current remains
constant (see Fig.3) so that the EHI impedance increases.

The DPI is designed to switch on or off the external
PMOST interrupter (providing EHI is HIGH). When the
voltage applied at pin DPI is HIGH, the switch driver block
turns off the external PMOST interrupter. When the

1997 Sep 29 6

40

20

0

0 100 200 400

300

V

EHI

Fig.3 EHI input characteristics.

(V)

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

UBA1702A

The UBA1702A switch driver block is intended to generate
the appropriate signal to drive an external PNP interrupter.
The emitter and base of this PNP are respectively
connected to SDI and SDO. The EHI and DPI signals
control the state of this PNP.

The EHI pin is provided with high voltage capability. When
the voltage applied at pin EHI is HIGH, the switch driver
block will start and generate the appropriate signals to
switch on the external PNP interrupter.

When the telephone set is equipped with a mechanical
hook switch, pin EHI can be connected directly to pin SDI.
For electronic hook switch applications, the EHI pin can be
driven by the microcontroller output.

The EHI pin presents an impedance of 250 kΩ at low input
voltage. When the applied voltage at EHI goes above
approximately 30 V, the EHI input current remains
constant (see Fig.3) so that the EHI impedance increases.

The DPI is designed to switch on or off the external PNP
interrupter (providing EHI is HIGH). When the voltage
applied at pin DPI is HIGH, the switch driver block turns off
the external PNP interrupter. When the voltage applied at
pin DPI is LOW, the switch driver block turns on the
external PNP interrupter.

The external PNP interrupter is controlled by the current
flowing into pin SDO.

When the voltage applied at pin EHI is HIGH and the
voltage applied at pin DPI is LOW, pin SDO can be
considered as being connected to pin V
resistor in order to create a base current for the external
PNP.

When the voltage applied at pin EHI and the one applied
at pin DPI are both HIGH, pin SDO can be considered as
being connected to pin SDI via a 1.1 MΩ pull-up resistor
while the impedance between SDI and VEE becomes very
high (a few MΩ).

via a 2.2 kΩ

EE

L

INE CURRENT MANAGEMENT

(PINS SPI, SPO, CDA, CLA AND CDO)
The line current is measured by an internal 2 Ω resistor

and a sense circuit connected between the speech part
input and output (pins SPI and SPO). The circuit delivers
information about the hook switch status at the current
detection output (pin CDO) and controls the line current
limitation.

When the SPI current exceeds a certain level (3 mA), the
sense circuit injects some image of the SPI current into an
internal resistor (see Fig.1). The created voltage becomes
higher than an internal reference (approximately 0.3 V)
and CDO goes HIGH. This current detection level can be
increased by connecting a resistor between pins CDA
(current detection adjustment) and VEE. It is also possible
to connect a capacitor between pins CDA and VEE to filter
unwanted AC components of the line current signal. Line
current interruption during pulse dialling influences the
CDO output.

When the SPI current exceeds another current level
(45 mA), the sense circuit injects some image of the SPI
current into an internal resistor (see Fig.1). The created
voltage becomes higher than an internal reference
(approximately 0.4 V) and an internal signal is generated
in order to limit the current in the external interrupter thus
resulting in a line current limitation. This line current
limitation level can be increased up to a maximum value of
120 mA by connecting a resistor between pins CLA
(current limitation adjustment) and VEE.

When a PMOST (UBA1702) is used as an interrupter, the
SPI current equals the drain or source current of the
PMOST and thus also equals the line current.

When a PNP (UBA1702A) is used as an interrupter, the
SPI current equals the collector current of the PNP and
thus differs from the line current (the PNP base current
does not flow into the SPI pin).

When the voltage applied at pin EHI is LOW, whatever the
one applied at DPI is, pin SDO can be considered as being
connected to pin SDI via a 1.1 MΩ pull-up resistor while
the impedance between SDI and VEE becomes almost
infinite.

1997 Sep 29 7

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

MUTE SWITCH AND ZENER PROTECTION
(PINS MSI, MSA AND ZPA)

The mute switch is, in fact, a switchable and electronic
zener diode connected between the speech part output
(pin SPO) and VEE.

When the voltage applied at the mute switch input
(pin MSI) is LOW, the switch is in over-voltage protection
mode and the maximum SPO voltage is limited to 12 V.
This level can be increased or decreased by connecting a
resistor between pins ZPA (zener protection adjustment)
and VEE or ZPA and SPO respectively.

When the voltage applied at pin MSI is HIGH, the switch is
in mute mode (DMO or NSA) resulting in a SPO voltage
below 3 V. This level can be decreased by connecting a
resistor between pins MSA (mute switch adjustment) and
SPO. It should be noted that the mute switch stage is
supplied from VDD thus a minimum voltage of
approximately 2.1 V is required on VDD.

R

EFERENCE

The bias currents and voltages for the various speech
blocks are generated by the reference block which is, in
most cases, supplied from pin SPO. This block guarantees
a high AC impedance at the SPO pin operating down to a
low SPO voltage. Therefore, most speech part blocks
operate independently from VDD.

Ringer part

The ringer part consists of five blocks, the ringer
protection, the ringer threshold, the ringer frequency
detection, the volume control and the piezo driver.
The reference block which generates reference voltages
and currents is also used in the ringer part (see Fig.1).

R

INGER PROTECTION (PINS RPI AND V

RR

)

The ringer protection block converts the ringing current
into a limited voltage between the ringer part input
(pin RPI) and V

. This voltage is used (via an internal

EE

diode) to generate the ringer supply voltage VRR which is
mainly used for all ringer parts. The voltage at pin V

RR

must be filtered with a 22 µF capacitor connected between
pins VRR and VSS.

In electronic hook switch applications and also in speech
mode (see Fig.8), pin RPI is always connected to the
telephone line (through a series RC network and a diode
bridge). In order not to disturb normal speech operation, a
high AC impedance is present at pin RPI (providing the
speech level is less than 1.5 V (RMS) i.e. 5.7 dBm).

In the DMO or NSA mode (i.e. MSI is HIGH), the voltage
across RPI and V

is limited to 2.1 V. With this feature

EE

and in electronic hook switch applications, several
additional ringers can be placed in parallel without tinkling
during pulse dialling phase.

R

INGER THRESHOLD (PIN RTA)

The piezo driver is internally enabled when the voltage at
pin VRR exceeds a threshold level of 11 V. This threshold
level can be increased or decreased by connecting a
resistor between pins RTA (ringer threshold adjustment)
and V

or RTA and VRR respectively.

SS

Because of the built-in 6.5 V hysteresis, a voltage change
at pin VRR (coming from current consumption increase
when the piezo output is driven with a melody) will have no
influence on this internal enabling signal.

R

INGER FREQUENCY DETECTION (PIN RFO)

The ringer frequency detection block generates a square
wave signal at the ringer frequency output (pin RFO) with
twice the ringer signal frequency. This RFO signal can be
used by the microcontroller for frequency discrimination.

When the voltage at pin RPI drops below the voltage at
pin VDD, RFO goes LOW. Pin RFO goes HIGH when the
voltage at pin RPI exceeds the voltage at pin VRR.
This VRR− VDD hysteresis allows the frequency detection
circuit to ignore parasitic signals superimposed on the
ringing signal.

The voltage at pin EHI must be LOW to get a square wave
at pin RFO. When the voltage at pin EHI is LOW, the
voltage at pin RFO is always HIGH whatever the one at pin
RPI is.

V

OLUME CONTROL (PINS RV0, RV1 AND RV2)

The volume control input has three bits RV2, RV1 and RV0
to realize eight volume levels. The volume is controlled by
regulating the supply voltage of the piezo output stage.
The first six steps have a fixed value of 6 dB, the value of
the last step (maximum volume) is dependent on the
available voltage at pin VRR.

Default setting during start-up is (RV2 = 0, RV1 = 0,
RV0 = 0) which corresponds to minimum volume. In order
not to damage the piezo transducer, the differential output
ROA − ROB is internally limited to a value less than
32 V (p-p).

1997 Sep 29 8

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

RINGER MELODY INPUT AND PIEZO DRIVER
(PINS RMI, ROA AND ROB)

The input signal at the ringer melody input (pin RMI) may
be a square wave or a sine wave which is generated by the
microcontroller. The input stage incorporates a small
hysteresis (between 0.48VDD and 0.52VDD) and is
referenced to1⁄2VDD which is also the DC level of the signal
coming from the microcontroller. Nevertheless, when a
sine wave is used, a coupling capacitor of 10 nF
(connected between pin RMI and the output of the
microcontroller) is required. This 10 nF capacitor value is
enough since the RMI input impedance is approximately
250 kΩ.

The piezo driver is an output stage for a piezo transducer
which has to be connected between ringer output A and
ringer output B (pins ROA and ROB) as a Bridged Tied
Load (BTL) or between ROA and VSS as a Single-Ended
Load (SEL). The ROA and ROB output signals are square
wave and in opposite phase driven by the ringer melody
input stage. The minimum output current capability of the
ROA and ROB outputs is greater than 80 mA at maximum
volume setting (RV2 = 1, RV1 = 1, RV0 = 1) and becomes
even greater during output switching. This gives fast rise
and fall times resulting in a lot of harmonics.

To obtain maximum efficiency, the piezo driver stage is
supplied in series with the VDD supply.

Supply part (pins V

The supply block regulates the voltage at pin V

and VDD)

BB

DD

,
referenced to VSS, to a typical value of 3.3 V and can
deliver a minimum of 2 mA. This is sufficient to supply
most normal microcontrollers. The voltage at pin VDD must
be filtered with a 22 µF capacitor connected between
pins VDD and VSS.

In speech mode, this block is supplied from the
transmission circuit using pin VBB. The voltage drop
between VBB and VDD has been minimized (100 mV at
1 mA, providing 2.5 V < VBB< 3.0 V) in order to allow low
voltage operation of the transmission circuit.

In ringer mode, this block is supplied from the ringer part
using pin VRR and pin VBB which are tied together through
an internal diode (see Fig.1).

When an external (mains or battery) supply is connected
to VBB and no speech or ringer signal is applied, V

DD

(3.3 V) is still present.
During on-hook phase, and when a small current is derived

from the line to the microcontroller supply, the circuit stays
in a kind of stand-by mode to provide sufficient voltage at
pin VDD. This is done to ensure memory retention in the
microcontroller.

EFERENCE

R
The bias current for the various ringer blocks is generated

by the reference block while this block is supplied from pin
VRR or VDD.

1997 Sep 29 9

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

, V

SDI

V

EHI

V

i(max)

V

n(max)

I

SPI(max)

I

RPI(max)

P

tot

T

stg

T

amb

SDO

maximum input/output switch driver voltage
(pins SDI or SDO)

DC; note 1 − 240 V
pulsed; note 2 − 400 V

maximum hook switch input voltage (pin EHI) DC; note 1 − 240 V

pulsed; note 2 − 400 V

maximum voltage at all logic inputs

VSS− 0.4 VDD+ 0.4 V

(pins DPI, MSI, RV0, RV1, RV2 and RMI)
maximum voltage at all other pins − 24 V
maximum speech part input current (pin SPI) − 150 mA
maximum ringer part input current (pin RPI) − 70 mA
total power dissipation T

amb

=75°C
UBA1702 − 1W
UBA1702T − 0.625 W

IC storage temperature −40 +150 °C
operating ambient temperature −25 +75 °C

Notes

1. Continuous.

2. 2 kV surge:
a) according to IEC 805-1 part 5. Test generator 10 µs/700 µs according to CCITT (Rm1 = 15 Ω and Rm2 = 25 Ω).
b) pulse sequence > 60 s.
c) number of surges: 10.
d) polarity change after 5 surges.
e) test circuit in combination with 150 V Voltage Dependent Resistor (VDR) and a 3.9 Ωresistor connected in series

with the source of the PMOST interrupter (UBA1702).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j−a

thermal resistance from junction to ambient in free air

UBA1702, UBA1702A 45 K/W
UBA1702T, UBA1702AT 70 K/W

1997 Sep 29 10

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

CHARACTERISTICS

Speech part: l
Ringer part: V
line and the RPI input.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Speech Part

WITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 ONLY

S
I

EE

V

SDO

SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702A ONLY
I

EE

R

SDO

I

SDO(max)

SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 AND UBA1702A
I

SS

V

SDI−SDO

R

SDI-SDO

R

SDI

R

EHI

Z

 impedance between pins SPO and V

SPO

Z

 impedance between pins VSSand V

VSS

V

IH

V

IL

I

IH

I

IL

V

IH

V

IL

I

IH

I

IL

= 20 mA; DPI = LOW; T

line

= 45 V; f = 25 Hz; using an RC combination of 2.2 kΩ and 820 nF and a diode bridge between the

line(rms)

VEE current consumption V
switch driver output voltage V

VEE current consumption; excluding PNP

=25°C; VEE= 0 V; unless otherwise specified.

amb

= 4.2 V −−330 −µA

SPO

<12V −−0.2 V

SDI

V

= 4.2 V −−510 −µA

SDO

interrupter base current
resistance between pins SDO and V

EE

− 2.2 − kΩ

maximum input current (pin SDO) 7.0 −− mA

VSS current consumption V
internal voltage limitation between

= 4.2 V; note 1 −−280 −µA

SPO

− 14 − V

pins SDI and SDO
resistance between pins SDI and SDO V
resistance between pins SDI and V

EE

− V

SDI

V

SDI=VEHI

<12V − 1.1 − MΩ

SDO

=48V;

− 4 − MΩ

DPI = HIGH
V

SDI=VEHI

= 240 V;

520−MΩ

DPI = HIGH

resistance between pins EHI and V

EE

V

= 4.2 V 170 420 − kΩ

EHI

V

=48V − 740 − kΩ

EHI

= 240 V − 3.5 − MΩ

V

EHI

f = 0.3 to 3.4 kHz 20 −− kΩ

EE

f= 0.3 to 3.4 kHz 10 −− kΩ

EE

HIGH-level input voltage (pin EHI) VSS+ 1.5 − 240 V
LOW-level input voltage (pin EHI) V
HIGH-level input current (pin EHI) V
LOW-level input current (pin EHI) V

= 4.2 V 0 10 20 µA

EHI

= LOW − 0 −µA

EHI

SS

HIGH-level input voltage (pin DPI) VSS+ 1.5 − V
LOW-level input voltage (pin DPI) V
HIGH-level input current (pin DPI) V
LOW-level input current (pin DPI) V

= HIGH 0 − 10 µA

DPI

= LOW − 0 −µA

DPI

SS

− VSS+ 0.3 V

DD

− VSS+ 0.3 V

V

1997 Sep 29 11

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

MUTE SWITCH AND ZENER PROTECTION (PINS MSI, MSA AND ZPA)
V

SPO(M)

V

SPO(Z)

I

SPI

V

IH

V

IL

I

IH

I

IL

adjustable mute voltage referenced to
V

EE

adjustable zener voltage referenced to
V

EE

current capability (pin SPI) 150 −− mA
HIGH-level input voltage (pin MSI) 0.7V
LOW-level input voltage (pin MSI) V
HIGH-level input current (pin MSI) V

LOW-level input current (pin MSI) V
CURRENT MANAGEMENT (PINS SPI, SPO, CDA, CLA AND CDO)
I

SPI(lim)

I

SPI(det)

R

SPI-SPO

current limitation (pin SPI) CLA open-circuit − 45 − mA

current detection (pin SPI) CDA open-circuit 2 3 4 mA

series resistance between pins SPI and

SPO
I

OH

I

OL

MICROCONTROLLER SUPPLY (PINS V
V

DD

∆V

DD

HIGH level output current (pin CDO) V

LOW level output current (pin CDO) V

AND V

DD

BB

supply output voltage referenced to V

/∆T supply output voltage temperature

)

gradient
I

DD

V

BB−VDD

V

DDM

supply output current capability VBB> 3.7 V −−−2mA

voltage drop between VBB and V

DD

voltage at pin VDD when neither speech

nor ringer signal is applied

MSI = HIGH;

− 2.7 3 V

MSA open-circuit
MSI = HIGH;

− 1.7 − V

MSA shorted to SPO
MSI = LOW;

11.0 12.0 13.0 V

ZPA open-circuit
MSI = LOW;

8.3 9.0 9.7 V

ZPA shorted to SPO
MSI = LOW;

ZPA shorted to V

= HIGH 0 − 10 µA

MSI

= LOW − 0 −µA

MSI

CLA shorted to V

EE

EE

16.4 18.0 19.6 V

− V

DD

SS

− VSS+ 0.3 V

− 120 − mA

− 2 −Ω

CDO=VDD
CDO=VSS

SSVBB

> 3.7 V;

− 0.5 V −−−100 µA

+ 0.5 V 100 −− µA

3.0 3.3 3.6 V

IDD= −1mA

−−0.2 − mV/K

IDD= −1 mA;

− 100 − mV

2.5 V < VBB< 3.0 V
IDD=9µA − 1.4 − V

DD

V

1997 Sep 29 12

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Ringer part

PROTECTION (PIN RPI)
I

SS

current consumption RV2 = 0; RV1 = 0;

RV0 = 0

I

RPI(max)

V

RPI

V

RPId

Z

RPI

maximum input current 70 −− mA

voltage limit referenced to V

voltage limit in DMO or NSA mode

referenced to V

EE

 AC input impedance referenced to V

EE

I

RPI

MSI = HIGH
f = 0.3 to 3.4 kHz;

EE

V

RPI

=30mA;

< 1.5 V (RMS)
RINGER THRESHOLD AND FREQUENCY DETECTION (PINS VRR,RTAAND RFO)
V

RRth

V

RRhys

V

RPIhys

I

OH

I

OL

ringer supply threshold voltage
referenced to V

SS

ringer threshold hysteresis voltage − 6.5 − V
ringer frequency detection hysteresis

voltage referenced to V

EE

HIGH-level output current (pin RFO) V
LOW-level output current (pin RFO) V

RTA open-circuit; − 11 − V

RFO = HIGH − V
RFO = LOW − V

RFO=VDD
RFO=VSS

− 0.5 V −−−100 µA

+ 0.5 V 100 −− µA
VOLUME CONTROL (PINS RV0, RV1 AND RV2)
∆G gain adjustment range (RV2, RV1, RV0) from

(0, 0, 0) to (1 ,1, 0);
note 2

∆G

s

step resolution (RV2, RV1, RV0) from

(0, 0, 0) to (1, 1, 0);
note 2

∆G

ls

last step resolution (RV2, RV1, RV0) from

(1, 1, 0) to (1, 1, 1);
note 3

V

IH

V

IL

I

IH

I

IL

HIGH-level input voltage (pins RVx) 0.7V
LOW-level input voltage (pins RVx) V
HIGH-level input current (pins RVx) V
LOW-level input current (pins RVx) V

= HIGH 0 − 5 µA

RVx

= LOW 0 − 5 µA

RVx

−−850 −µA

− 21 − V

− 2.1 − V

100 220 − kΩ

− V

RR

− V

DD

− 36 − dB

− 6 − dB

− 9.5 12 dB

SS

DD

− V

DD

− 0.3V

DD

V
V

1997 Sep 29 13

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

INGER MELODY INPUT AND PIEZO DRIVER (PINS RMI, ROA AND ROB)

R
V

IH

V

IL

I

IH

I

IL

V

o(min p-p)

V

o(p-p)

V

o(max p-p)

|I

| ROA or ROB output current capability sink and source;

RO

HIGH-level input voltage (pin RMI) 0.52V
LOW-level input voltage (pin RMI) V
HIGH-level input current (pin RMI) V
LOW-level input current (pin RMI) V
minimum output voltage between pins

ROA and ROB (peak-to-peak value)
output voltage between pins ROA and

ROB (peak-to-peak value)
maximum output voltage between pins

ROA and ROB (peak-to-peak value)

= HIGH 0 − 10 µA

RMI

= LOW −10 − 0 µA

RMI

RV2 = 0; RV1 = 0;
RV0 = 0

RV2 = 1; RV1 = 1;
RV0 = 0

RV2 = 1; RV1 = 1;
RV0 = 1

SS

− 0.15 − V

− 9.6 − V

− 28.7 32 V

80 −− mA
RV2 = 1; RV1 = 1;
RV0 = 1

REGULATED MICROCONTROLLER SUPPLY (PIN VDD)
V

∆V

DD

DD

supply output voltage referenced to V

/∆T supply output voltage temperature

SSIDD

= −1 mA 3.0 3.35 3.6 V

− 0 − mV/K

gradient

I

DD

supply output current capability −−−2mA

Notes

1. ISS has no influence on AGC characteristics of the TEA106x transmission circuit when VSS is connected to the
SLPE pin of TEA106x.

2. Independent of VRR if greater than 10 V.

3. Without piezo transducer, dependent on VRR.

− V

DD

− 0.48V

DD

DD

V
V

1997 Sep 29 14

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

TEST AND APPLICATION INFORMATION

RTA

R

CDA

R

SPO

V

4.2 V

CLA CDA MSA ZPA RTA

SPI

SP0

BB

V

SDO

20 Ω

22 µF

RR

UBA1702

UBA1702A

EHI

C

V

VDD

DD

RPI

22 µF

VSSV

ROA

EE

ROB

RF0 CD0 DPI

RMI MSIRV0 RV1 RV2

VRR

C

BB

V

V

SDI

MBE750

handbook, full pagewidth

Fig.4 Test circuit.

1997 Sep 29 15

R

ring

2.2 kΩ

80

BRIDGE

ring

C

nF

RO

C

4 x BAS11

line

V

820 nF

45 V (RMS)

240 V

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

R9

R1

D1

620 Ω

BAT85

LN

C

CC

V

VRR

22 µF

SLPE
EE

V

TEA106X

PD

VDD

C

22 µF

C1

20 Ω

100 µF

MBE746

SP0

CLA CDA MSA ZPA RTA

M1

BSP254

prot

R

SPI

BB

V

RR

V

DD

V

VSSV

EE

CDO MSI DPI

UBA1702

SDO

SDI

EHI

RPI

ROA

ROB

RMI RVO RV1 RV2 RFO

MDT RV0 RV1 RV2 CE T1 NSA DP

buzzer

3.9 Ω

DD

V

PCD33xx

XTAL1

3.58 MHz

SS

V

handbook, full pagewidth

XTAL2

Fig.5 Simplified basic application of the UBA1702 with the TEA106x.

BRIDGE

4 x BAS11

double hook switch

2.2 kΩ

820 nF

a/b

R

C

ring

ring

BOD

BR211-240

b/a

1997 Sep 29 16

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SP0

R1

R16

D1

V

620 Ω

390 Ω

BAT85

BB

V

LN

CC2

V

VRR

C

V

TEA1064A

CC1

C15

22 µF

RR

V

UBA1702

SLPE
EE

PD

220

VDD

C

R9

20 Ω

C1

100 µF

µF

22 µF

VSSV

EE

CD0 MSI DPI

DD

V

V

DD

SS

V

MBE747

handbook, full pagewidth

PCD33xx

SPI

SDO

SDI

EHI

BRIDGE

4 x BAS11

BOD

BR211-240

RPI

b/a

CLA CDA MSA ZPA RTA

M1

BSP254

prot

3.9 Ω

R

double hook switch

2.2 kΩ

820 nF

a/b

ring

R

ring

C

1997 Sep 29 17

ROA

ROB

buzzer

RMI RV0 RV1 RV2 RF0

MDT RV0 RV1 RV2 CE T1 NSA DP

XTAL1

3.58 MHz

XTAL2

Fig.6 Simplified basic application of the UBA1702 with the TEA1064A.

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

R9

R1

20 Ω

SLPE

TEA106X

CC

EE

V

PD

C1

100 µF

LN

V

620 Ω

MBE748

SP0

CLA CDA MSA ZPA RTA

TP1

D1

BAT85

V

SPI

MPSA92

BB

VRR

C

SDO

22 µF

RR

V

UBA1702A

SDI

VDD

C

EHI

22 µF

VSSV

EE

CD0 MSI DPI

DD

V

SS

DD

V

V

handbook, full pagewidth

PCD33xx

RPI

ROA

ROB

RMI RV0 RV1 RV2 RF0

buzzer

MDT RV0 RV1 RV2 CE T1 NSA DP

XTAL1

3.58 MHz

XTAL2

Fig.7 Simplified basic application of the UBA1702A with the TEA106x.

BRIDGE

4 x BAS11

double hook switch

2.2 kΩ

820 nF

a/b

R

C

ring

ring

BOD

BR211-240

b/a

1997 Sep 29 18

1997 Sep 29 19

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

a/b

BOD

BR211-240

b/a

BRIDGE

4 x BAS11

1.8 µF 1.8 µF

BRIDGE

4 x BAS11

speaker-phone

button

cradle

2.2 kΩ

3.58 MHz

M1

R

prot

BSP254

3.9 Ω

D2

D3

buzzer

D5

D4

3.3 V

EHD MHD EHT RV0 RV1 RV2 CE T1 TONE
XTAL1

CLA CDA MSA ZPA RTA

SPI

SDO
SDI

EHI
RPI
ROA

ROB

RMI RV0 RV1 RV2 RF0

C

RMI

10 nF

UBA1702

CD0 MSI DPI

PCD33xx

XTAL2

MHD: Mechanical Hook switch Detection
EHD: Electronic Hook switch Detection
EHT: Electronic Hook switch Take-over

SP0

V

V

RR

V

DD

V
V

V

DD

V

BB

SS
EE

SS

D1
BAT85

C

VRR

22 µF

C

VDD

22 µF

R1
620 Ω

V

C1
100 µF

LSP1

LSP2

CC

TEA106x

DTMF

100

nF

Loudspeaking

TEA1093

LN

QR

V

EE

SLPE

R9
20 Ω

SUP

RIN

GND

MBE749

handbook, full pagewidth

Fig.8 Simplified proposal for electronic hook switch application of the UBA1702 in combination with a transmission and a hands-free circuit.

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

PACKAGE OUTLINES

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

seating plane

L

Z

28

1

pin 1 index

D

A

2

A

A

1

e

b

w M

b

1

15

E

14

c

M

(e )

M

E

1

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE
VERSION

SOT117-1

1 2

min.

max.

0.066

0.051

IEC JEDEC EIAJ

051G05 MO-015AH

1.7

1.3

b

b

1

0.53

0.38

0.020

0.014

REFERENCES

0.32

0.23

0.013

0.009

cD E weM

(1) (1)

36.0

35.0

1.41

1.34

1997 Sep 29 20

14.1

13.7

0.56

0.54

(1)

92-11-17
95-01-14

Z

max.

1.75.1 0.51 4.0

0.0670.20 0.020 0.16

L

3.9

15.80

3.4

15.24

EUROPEAN

PROJECTION

M

0.62

0.60

H

E

17.15

15.90

0.68

0.63

0.252.54 15.24

0.010.10 0.60

ISSUE DATE

e

1

0.15

0.13

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w M

b

p

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE

VERSION

SOT136-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

REFERENCES

1997 Sep 29 21

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

95-01-24
97-05-22

o

8

o

0

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1997 Sep 29 22

Philips Semiconductors Product specification

Line interrupter driver and ringer UBA1702; UBA1702A

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale

1997 Sep 29 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 417027/1200/03/pp24 Date of release: 1997Sep 29 Document order number: 9397750 02514