Datasheet U62H64SA35 Datasheet (ZMD)

Page 1
U62H64SA
Automotive Fast 8K x 8 SRAM
Features
p
Fast 8192 x 8 bit static CMOS RAM
p
35 ns Access Time
p
Bidirectional data inputs and data outputs
p
Three-state outputs
p
Data retention current at 3 V: < 50 µA
p
Standby current < 100 µA
p
TTL/CMOS-compatible
p
Automatic reduction of power dissipation in long Read or Write cycles
p
Power supply voltage 5 V
p
Operating temperature range
-40 to 125 °C
p
Quality assessment according to CECC 90000, CECC 90100 and CECC 90111
p
ESD protection> 2000 V
(MIL STD 883C M3015.7)
p
Latch-up immunity> 200 mA
p
Package: SOP28 (300 mil)
Description
The U62H64SA is a static RAM manufactured using a CMOS pro­cess technology with the following operating modes:
- Read - Standby
= L and E2 = H), each address change leads to a new Read or Write cycle. In a Read cycle, the data outputs are activated by the falling edge of G data word read will be available at
= L), or the falling
(at E2 = H). The
, afterwards the
the outputs DQ0 - DQ7. After the address change, the data outputs go High-Z until the new re ad infor­mation is available. The data out­puts have no preferred state. If the memory is driven by CMOS levels in the active state, and if there is no change of the address, data input and control signals W rating current (at I the value of the operating current in
or G, the ope-
= 0 mA) drops to
O
the Standby mode. The Read cycle is finished by the falling edge of E2 or W
, or by the rising edge of E1, respectively. Data retention is guaranteed down to 2 V. With the exception of E1
and E2, all inputs consist of NOR gates, so that no pull-up/pull-down resistors are required. This gate circuit allows to achieve low power standby require­ments by activation with TTL-levels too.
Pin Configuration
1
n.c.
2
A12
3
A7
4
A6
5
A5
6
A4
7
A3 A2 A1
A0 DQ0 DQ1 DQ2 VSS
SOP
8 9 10 11 12 13 14
Top View
December 12, 1997 1
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VCC W (WE) E2 (CE2) A8 A9 A11 G (OE) A10 E1 (CE1) DQ7 DQ6 DQ5 DQ4 DQ3
Pin Description
Signal Name Signal Description
A0 - A12 Address Inputs DQ0 - DQ7 Data In/Out E1 E2 G W VCC Power Supply Voltage VSS Ground n.c.
Chip Enable 1 Chip Enable 2 Output Enable Write Enable
not connected
Page 2
U62H64SA
Block Diagram
A6 A7 A8 A9 A10 A11 A12
A0 A1 A2 A3 A4 A5
Inputs
Row Address
Inputs
Column Address
Address Change Detector
Row Decoder
Column Decoder
Memory Cell
Array
128 Rows
64 x 8 Columns
Sense Amplifier/
Write Control Logic
Clock
Generator
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5
Bidirectional Data I/O
DQ6 DQ7
E2 E1
V
CC
W G
SS
V
Truth Table
Operating Mode E1 E2 W G DQ0 - DQ7
Standby/not
selected
* L * * High-Z
H * * * High-Z
Internal Read L H H H High-Z
Read L H H L Data Outputs Low-Z Write L H L * Data Inputs High-Z
H or L
*
Characteristics
All voltages are referenced to VSS = 0 V (ground). All characteristics are valid in the power supply voltage range and in the operating temperature range specified. Dynamic measurements are based on a rise and fall time of 5 ns, measured between 10 % and 90 % of V input levels of V with the exception of the t
= 0 V and VIH = 3 V. The timing reference level of all input and output signals is 1.5 V,
IL
-times and ten-times, in which cases transition is measured ± 200 mV from steady-state voltage.
dis
,as well as
I
Maximum Ratings Symbol Min. Max. Unit
Power Supply Voltage V Input Voltage V Output Voltage V Operating Temperat ure T Storage Temperature T Output Short-Circuit Current
at V
= 5 V and VO = 0 V
CC
* Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 s.
*
CC
I
O
a
stg
|IOS|200mA
-0.3 7 V
-0.3 VCC + 0.5 V
-0.3 VCC + 0.5 V
-40 125 °C
-65 150 °C
December 12, 19972
Page 3
U62H64SA
Recommended Operating Conditions
Power Supply Voltage V Data Retention Voltage V
Input Low Voltage
*
Input High Voltage V
*
-2 V at Pulse Width 10 ns or -1 V at Pulse Width 50 ns
Symbol Conditions Min. Max. Unit
CC
CC(DR)
V
IL
IH
4.5 5.5 V
2.0
-
-0.3 0.8 V
2.2 VCC+0.3 V
Electrical Characteristics Symbol Conditions Min. Max. Unit
Supply Current - Operating Mode
Supply Current - Standby Mode (CMOS level)
Supply Current - Standby Mode (TTL level)
Supply Current - Data Retention Mode
Output High Voltage Output Low Voltage
Output High Current Output Low Current
Input High Leakage Current Input Low Leakage Current
I
CC(OP)
I
CC(SB)
I
CC(SB)1
I
CC(DR)
V
OH
V
OL
I
OH
I
OL
I
IH
I
IL
V
CC
V
IL
V
IH
t
cW
V
CC
V
E1
VCC V
E1
V
CC(DR)
V
E1
V
CC
I
OH
V
CC
I
OL
V
CC
V
OH
V
CC
V
OL
V
CC
V
IH
V
CC
V
IL
= V
= V
= V
= 5.5 V = 0.8 V = 2.2 V =35 ns
= 5.5 V = V
E2
= 5.5 V = 2.2 V
E2
= 3.0 V = V
E2
= 4.5 V = -4.0 mA = 4.5 V = 8.0 mA
= 4.5 V = 2.4 V = 4.5 V = 0.4 V
= 5.5 V =5.5 V = 5.5 V = 0 V
- 0.2 V
CC
CC(DR)
- 0.2 V
2.4
8.0
-2
-
-
-
50
100
5
(typ. 2)
50
-
0.4
-4.0
-
2
-
Output Leakage Current
High at Three-State Outputs Low at Three-State Outputs
I
OHZ
I
OLZ
V
CC
V
OH
V
CC
V
OL
= 5.5 V = 5.5 V = 5.5 V = 0 V
-
-2
2
-
V
mA
µA
mA
µA
V V
mA mA
µA µA
µA µA
December 12, 1997 3
Page 4
U62H64SA
Switching Characteristics
Time to Output in Low-Z from
E1
LOW or E2 HIGH
G
LOW
W
HIGH
Cycle Time
Write Cycle Time Read Cycle Time
Access Time
E1
LOW or E2 HIGH to Data Valid
G
LOW to Data Valid
Address to Data Valid
Pulse Widths
Write Pulse Width Chip Enable to End of Write
Setup Times
Address Setup Time Chip Enable to End of Write Write Pulse Width Data Setup Time
Data Hold Time Address Hold from End of Write
Output Hold Time from Address Change t
E1
HIGH or E2 LOW to Output in High-Z
W
LOW to Output in High-Z
G
HIGH to Output in High-Z
E1
LOW or E2 HIGH to Power-Up t
E1 HIGH or E2 LOW to Power-Down t
Symbol Min. Max. Unit
Alt. IEC 35 35
t
LZCE
t
LZOE
t
LZWE
t t
t
ACE
t t
t t
t t t t
t t
t
HZCE
t
HZWE
t
HZOE
WC RC
OE
AA
WP CW
AS CW WP
DS
DH
AH
OH
PU
PD
t
en(E)
t
en(G)
t
en(W)
t
cW
t
cR
t
a(E)
t
a(G)
t
a(A)
t
w(W)
t
w(E)
t
su(A)
t
su(E)
t
su(W)
t
su(D)
t
h(D)
t
h(A)
t
v(A)
t
dis(E)
t
dis(W)
t
dis(G)
5 0 0
35 35
35 15 35
20 25
0 25 20 15
0
0
5ns
15 15 12
0ns
35 ns
ns ns ns
ns ns
ns ns ns
ns ns
ns ns ns ns
ns ns
ns ns ns
Data Retention Mode E1-Controlled Data Retention Mode E2-Controlled
V
4.5 V V
2 V
CC(DR)
2.2 V
0 V
V
E2(DR)
V
CC(DR)
t
DR
V
CC(DR)
- 0.2 V V
Data Retention
- 0.2 V or V V
E1(DR)
E2(DR)
CC(DR)
0.2 V
+ 0.3 V
t
rec
CC
4.5 V V
2 V
CC(DR)
2.2 V E1
0 V
V
E1(DR)
V
E2(DR)
0.8 V
V 0.2 V
t
DR
CC(DR)
Data Retention
- 0.2 V or V
E1(DR)
Chip Deselect to Data Retention Time tDR: min 0 ns Operating Recovery Time at V
CC(DR)
t
: min tcR
rec
t
rec
0.2 V
December 12, 19974
V
CC
E2
0.8 V
Page 5
Test Configuration for Functional Check
U62H64SA
5 V
481
V
O
Simultaneou s meas ur e-
ment of all 8 output pins
255
30 pF
1)
1)
In measurement of t
dis(E)
V
A0 A1 A2 A3 A4
relevant test measur em ent
en(E)
, t
A5 A6 A7 A8 A9 A10 A11 A12
E1 E2 W G
en(W)
V
IH
V
IL
Input l ev el a cc ord ing to th e
, t
, t
dis(G)
, t
dis(W)
CC
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
V
SS
, t
the capacitance is 5 pF.
en(G)
Capacitance Conditions Symbol Min. Max. Unit
V
= 5.0 V
Input Capacitance
Output Capacitance
CC
V
= V
I
SS
f = 1 MHz T
= 25 °C
a
C
I
C
O
8pF
10 pF
All pins not under test must be connected with ground by capacitors.
IC Code Number
Example
SU62H64
A
35
Type
Package
S = SOP
Access Time
35 = 35 ns
Operating Temperature Range
A = -40 to 125 °C
The date of manufacture is given by the last 4 digits of the mark, the first 2 digits indicating the year, and the last 2 digits the calendar week.
December 12, 1997 5
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U62H64SA
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Read Cycle 1 (during Read cycle: E1 = G = VIL, E2 = W = VIH, Ai-controlled)
t
cR
Ai
DQi
Output
Previous Data Valid
Read Cycle 2 (during Read cycle:W = VIH, G-, E1- or E2-controlled)
Ai
t
su(A)
E1
t
E2
su(A)
G
DQi
Output
I
CC(OP)
I
CC(SB)
High-Z
*
t
PU
50 %
t
a(A)
t
v(A)
Addresses Valid
t
a(E)
t
en(E)
t
en(E)
t
en(G)
Addresses Valid
t
cR
t
a(E)
t
a(G)
Output Data Valid
t
dis(E)
t
dis(G)
Output Data Valid
t
dis(E)
*
t
PD
50 %
* The same applies to E1
Write Cycle 1 (W-controlled)
Ai
E1
E2
W
DQi
Input
DQi
Output
G
t
su(A)
t
dis(W)
t
cW
Addresses Valid
t
su(E)
t
su(E)
t
w(W)
t
su(D)
Input Data Valid
High-Z
t
t
t
h(D)
en(W)
h(A)
December 12, 19976
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A
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Write Cycle 2 (E1-controlled)
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Ai
E1
E2
W DQi
Input
DQi
Output
G
Write Cycle 3 (E2-controlled)
t
en(E)
t
su(A)
t
cW
Addresses Valid
t
w(E)
t
su(E)
t
su(W)
t
su(D)
t
dis(W)
t
Input Data Valid
High-Z
h(A)
U62H64SA
t
h(D)
t
cW
Ai
E1
t
su(A)
Addresses Valid
t
su(E)
t
w(E)
E2
t
su(W)
W
DQi
Input
DQi
Output
t
en(E)
t
dis(W)
G
AAA
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AAA
AAAA
undefined
AAA
t
su(D)
t
h(A)
t
h(D)
Input Data
Valid
High-Z
L- or H-level
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December 12, 1997 7
Page 8
Memory Products 1998
Automotive Fast 8K x 8 SRAM U62H64SA
LIFE SUPPORT POLICY
ZMD products are not designed, intended, or authorized for use as components in systems intend for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the ZMD product could create a situation where personal injury or death may occur. Components used in life-support devices or systems must be expressly authorized by ZMD for such purpose.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
Zentrum Mikroelektronik Dresden GmbH
Grenzstraße 28
Phone: +49 351 88 22-3 06 • Fax: +49 351 88 22-3 37 • Email: sales@zmd.de
• D-01109 Dresden P. O. B. 80 01 34 D-01101 Dresden Germany
Internet Web Site: http://www.zmd.de
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