Automatic reduction of power
dissipation in long Read or Write
cycles
p
Power supply voltage 5 V
p
Operating temperature range
-40 to 125 °C
p
Quality assessment according to
CECC 90000, CECC 90100 and
CECC 90111
p
ESD protection> 2000 V
(MIL STD 883C M3015.7)
p
Latch-up immunity> 200 mA
p
Package: SOP28 (300 mil)
Description
The U62H64SA is a static RAM
manufactured using a CMOS process technology with the following
operating modes:
- Read - Standby
- Write - Data Retention
The memory array is based on a
6-transistor cell.
The circuit is activated by the rising
edge of E2 (at E1
edge of E1
address and control inputs open
simultaneously.
According to the information of W
and G, the data inputs, or outputs,
are active. During the active state
(E1
= L and E2 = H), each address
change leads to a new Read or
Write cycle. In a Read cycle, the
data outputs are activated by the
falling edge of G
data word read will be available at
= L), or the falling
(at E2 = H). The
, afterwards the
the outputs DQ0 - DQ7. After the
address change, the data outputs
go High-Z until the new re ad information is available. The data outputs have no preferred state. If the
memory is driven by CMOS levels
in the active state, and if there is no
change of the address, data input
and control signals W
rating current (at I
the value of the operating current in
or G, the ope-
= 0 mA) drops to
O
the Standby mode. The Read cycle
is finished by the falling edge of E2
or W
, or by the rising edge of E1,
respectively.
Data retention is guaranteed down
to 2 V.
With the exception of E1
and E2, all
inputs consist of NOR gates, so that
no pull-up/pull-down resistors are
required. This gate circuit allows to
achieve low power standby requirements by activation with TTL-levels
too.
Pin Configuration
1
n.c.
2
A12
3
A7
4
A6
5
A5
6
A4
7
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
SOP
8
9
10
11
12
13
14
Top View
December 12, 19971
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
W (WE)
E2 (CE2)
A8
A9
A11
G (OE)
A10
E1 (CE1)
DQ7
DQ6
DQ5
DQ4
DQ3
Pin Description
Signal Name Signal Description
A0 - A12 Address Inputs
DQ0 - DQ7 Data In/Out
E1
E2
G
W
VCC Power Supply Voltage
VSS Ground
n.c.
Read L H H L Data Outputs Low-Z
Write L H L * Data Inputs High-Z
H or L
*
Characteristics
All voltages are referenced to VSS = 0 V (ground).
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.
Dynamic measurements are based on a rise and fall time of ≤ 5 ns, measured between 10 % and 90 % of V
input levels of V
with the exception of the t
= 0 V and VIH = 3 V. The timing reference level of all input and output signals is 1.5 V,
IL
-times and ten-times, in which cases transition is measured ± 200 mV from steady-state voltage.
dis
,as well as
I
Maximum Ratings Symbol Min. Max. Unit
Power Supply Voltage V
Input Voltage V
Output Voltage V
Operating Temperat ure T
Storage Temperature T
Output Short-Circuit Current
at V
= 5 V and VO = 0 V
CC
* Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 s.
*
CC
I
O
a
stg
|IOS|200mA
-0.3 7 V
-0.3 VCC + 0.5 V
-0.3 VCC + 0.5 V
-40 125 °C
-65 150 °C
December 12, 19972
Page 3
U62H64SA
Recommended
Operating Conditions
Power Supply Voltage V
Data Retention Voltage V
Input Low Voltage
*
Input High Voltage V
*
-2 V at Pulse Width 10 ns or -1 V at Pulse Width 50 ns
Symbol Conditions Min. Max. Unit
CC
CC(DR)
V
IL
IH
4.5 5.5 V
2.0
-
-0.3 0.8 V
2.2 VCC+0.3 V
Electrical Characteristics Symbol Conditions Min. Max. Unit
Supply Current - Operating Mode
Supply Current - Standby Mode
(CMOS level)
Supply Current - Standby Mode
(TTL level)
Supply Current - Data Retention
Mode
Output High Voltage
Output Low Voltage
Output High Current
Output Low Current
Input High Leakage Current
Input Low Leakage Current
I
CC(OP)
I
CC(SB)
I
CC(SB)1
I
CC(DR)
V
OH
V
OL
I
OH
I
OL
I
IH
I
IL
V
CC
V
IL
V
IH
t
cW
V
CC
V
E1
VCC
V
E1
V
CC(DR)
V
E1
V
CC
I
OH
V
CC
I
OL
V
CC
V
OH
V
CC
V
OL
V
CC
V
IH
V
CC
V
IL
= V
= V
= V
= 5.5 V
= 0.8 V
= 2.2 V
=35 ns
= 5.5 V
= V
E2
= 5.5 V
= 2.2 V
E2
= 3.0 V
= V
E2
= 4.5 V
= -4.0 mA
= 4.5 V
= 8.0 mA
= 4.5 V
= 2.4 V
= 4.5 V
= 0.4 V
= 5.5 V
=5.5 V
= 5.5 V
= 0 V
- 0.2 V
CC
CC(DR)
- 0.2 V
2.4
8.0
-2
-
-
-
50
100
5
(typ. 2)
50
-
0.4
-4.0
-
2
-
Output Leakage Current
High at Three-State Outputs
Low at Three-State Outputs
I
OHZ
I
OLZ
V
CC
V
OH
V
CC
V
OL
= 5.5 V
= 5.5 V
= 5.5 V
= 0 V
-
-2
2
-
V
mA
µA
mA
µA
V
V
mA
mA
µA
µA
µA
µA
December 12, 19973
Page 4
U62H64SA
Switching Characteristics
Time to Output in Low-Z from
E1
LOW or E2 HIGH
G
LOW
W
HIGH
Cycle Time
Write Cycle Time
Read Cycle Time
Access Time
E1
LOW or E2 HIGH to Data Valid
G
LOW to Data Valid
Address to Data Valid
Pulse Widths
Write Pulse Width
Chip Enable to End of Write
Setup Times
Address Setup Time
Chip Enable to End of Write
Write Pulse Width
Data Setup Time
Data Hold Time
Address Hold from End of Write
Output Hold Time from Address Change t
E1
HIGH or E2 LOW to Output in High-Z
W
LOW to Output in High-Z
G
HIGH to Output in High-Z
E1
LOW or E2 HIGH to Power-Up t
E1 HIGH or E2 LOW to Power-Down t
Symbol Min. Max. Unit
Alt. IEC 35 35
t
LZCE
t
LZOE
t
LZWE
t
t
t
ACE
t
t
t
t
t
t
t
t
t
t
t
HZCE
t
HZWE
t
HZOE
WC
RC
OE
AA
WP
CW
AS
CW
WP
DS
DH
AH
OH
PU
PD
t
en(E)
t
en(G)
t
en(W)
t
cW
t
cR
t
a(E)
t
a(G)
t
a(A)
t
w(W)
t
w(E)
t
su(A)
t
su(E)
t
su(W)
t
su(D)
t
h(D)
t
h(A)
t
v(A)
t
dis(E)
t
dis(W)
t
dis(G)
5
0
0
35
35
35
15
35
20
25
0
25
20
15
0
0
5ns
15
15
12
0ns
35 ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Data Retention Mode E1-ControlledData Retention Mode E2-Controlled
V
4.5 V
V
≥ 2 V
CC(DR)
2.2 V
0 V
V
E2(DR)
V
CC(DR)
t
DR
≥ V
CC(DR)
- 0.2 V ≤ V
Data Retention
- 0.2 V or V
≤ V
E1(DR)
E2(DR)
CC(DR)
≤ 0.2 V
+ 0.3 V
t
rec
CC
4.5 V
V
≥ 2 V
CC(DR)
2.2 V
E1
0 V
V
E1(DR)
V
E2(DR)
0.8 V
≥ V
≤ 0.2 V
t
DR
CC(DR)
Data Retention
- 0.2 V or V
E1(DR)
Chip Deselect to Data Retention Time tDR: min 0 ns
Operating Recovery Time at V
CC(DR)
t
: min tcR
rec
t
rec
≤ 0.2 V
December 12, 19974
V
CC
E2
0.8 V
Page 5
Test Configuration for Functional Check
U62H64SA
5 V
481
V
O
Simultaneou s meas ur e-
ment of all 8 output pins
255
30 pF
1)
1)
In measurement of t
dis(E)
V
A0
A1
A2
A3
A4
relevant test measur em ent
en(E)
, t
A5
A6
A7
A8
A9
A10
A11
A12
E1
E2
W
G
en(W)
V
IH
V
IL
Input l ev el a cc ord ing to th e
, t
, t
dis(G)
, t
dis(W)
CC
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
V
SS
, t
the capacitance is 5 pF.
en(G)
Capacitance Conditions Symbol Min. Max. Unit
V
= 5.0 V
Input Capacitance
Output Capacitance
CC
V
= V
I
SS
f = 1 MHz
T
= 25 °C
a
C
I
C
O
8pF
10 pF
All pins not under test must be connected with ground by capacitors.
IC Code Number
Example
SU62H64
A
35
Type
Package
S = SOP
Access Time
35 = 35 ns
Operating Temperature Range
A = -40 to 125 °C
The date of manufacture is given by the last 4 digits of the mark, the first 2 digits indicating the year, and the last
2 digits the calendar week.
December 12, 19975
Page 6
U62H64SA
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Read Cycle 1 (during Read cycle: E1 = G = VIL, E2 = W = VIH, Ai-controlled)
ZMD products are not designed, intended, or authorized for use as components in
systems intend for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the ZMD
product could create a situation where personal injury or death may occur.
Components used in life-support devices or systems must be expressly authorized
by ZMD for such purpose.
The information describes the type of component and shall not be considered as
assured characteristics.
Terms of delivery and rights to change design reserved.