Datasheet U0408FC36C, U0408FC3.3C, U0408FC24C, U0408FC15C, U0408FC08C Datasheet (PROTEK)

05161

Only One Name Means ProTek’Tion™

APPLICATIONS

✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 4 to 7 Lines

U0408FC3.3C

thru

U0408FC36C

UNBUMPED FLIP CHIP ARRAY

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel

PIN CONFIGURATION

105161.R2 8/03 www.protekdevices.com

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

U0408FC3.3C

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U0408FC36C

PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

200 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

U0408FC3.3C U0408FC05C U0408FC08C U0408FC12C U0408FC15C U0408FC24C U0408FC36C

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

3.3

5.0

8.0

12.0

15.0

24.0

36.0

MINIMUM

BREAKDOWN

VOLTAGE

@ 1mA

V

(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

40.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ IP = 1A

V

C

VOLTS

7.0

9.8

13.4

19.0

24.0

43.0

64.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

MAXIMUM

LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

10***

1 1 1 1

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF

150 100

75 50 40 30 25

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

t

- Pulse Duration - µs

d

250W, 8/20µs Waveform

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

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PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

PP

IPP/2

TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs

GRAPHS

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U0408FC36C

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

REFLOW SOLDER PROFILE

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

Pre-Heat

Time

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR U0408FC05C

35

25

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Soldering

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0408FC05C

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

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PACKAGE OUTLINE & DIMENSIONS

U0408FC3.3C

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U0408FC36C

PACKAGE OUTLINE

B

A

TOP

F

Metalized Die Contact

END

E

C

I

SIDE

MOUNTING PAD LAYOUT - Option 1

DIE SOLDER CONTACT

E

D

C

H

G

A

PACKAGE DIMENSIONS

MILLIMETERS

DIM

A B C E F

I

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”).

0.56 NOM

0.86 NOM

0.99 ± 0.0254

0.15 SQ

2.0 ± 0.0254

0.406 NOM

INCHES

0.022 NOM

0.034 NOM

0.039 ± 0.001

0.006 SQ

0.079 ± 0.001

0.016 NOM

PAD DIMENSIONS

DIM

A C D E

F G H

I

NOTE:

1.

Preferred:

MILLIMETERS

0.51

0.30

0.46

0.20

0.15 SQ

0.71

0.99

0.51

Using 0.1mm (0.004”) stencil.

INCHES

0.020

0.012

0.018

0.008

0.006 SQ

0.028

0.039

0.020

I

SOLDER PRINT 0.010” - 0.012” DIA.

SOLDER PADS

F

SOLDER

MASK

Outline & Dimensions: Rev 2 - 11/02, 06026

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PACKAGE OUTLINE & DIMENSIONS

U0408FC3.3C

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U0408FC36C

MOUNTING PAD LAYOUT - Option 2

COPPER CONTACT 0.009” [0.23] DIA.

G

H

SOLDER PRINT 0.014” [0.36] DIA.

PACKAGE DIMENSIONS

MILLIMETERS

DIM

A

DIE SOLDER CONTACT

I

F G

H

I

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”).

3.

Preferred:

Outline & Dimensions: Rev 2 - 11/02, 06026

0.51

0.15 SQ

0.71

0.99

0.51

Using 0.1mm (0.004”) stencil.

INCHES

0.020

0.006 SQ

0.028

0.039

0.020

TAPE & REEL ORIENTATION

F

SOLDER

MASK

Quad Die - 0408

NOTE:

1. Top view of tape. Solder bumps are face down in tape package.

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

pieces per reel. Ordering Suffix: -T75-1 (i.e., U0408FC05C-T75-1).

3.

8mm Paper Tape:

pieces per reel. Ordering Suffix: -T710-2 (i.e., U0408FC05C-T710-2).

7 Inch Reels - 5,000

7 Inch Reels -10,000

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com

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