Datasheet U0402FC36C, U0402FC3.3C, U0402FC24C, U0402FC15C, U0402FC12C Datasheet (PROTEK)

U0402FC3.3C

05149

Only One Name Means ProTek’Tion™

APPLICATIONS

✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line

thru

U0402FC36C

UNBUMPED FLIP CHIP ARRAY

U0402

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0402 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel

PIN CONFIGURATION

105149.R3 8/03 www.protekdevices.com

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

U0402FC3.3C

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U0402FC36C

PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

250 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

RATED

STAND-OFF

VOLTAGE

MINIMUM

BREAKDOWN

VOLTAGE

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

= 1A

@ 1mA

V

WM

VOLTS

U0402FC3.3C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC36C

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.

3.3

5.0

8.0

12.0

15.0

24.0

36.0

V

(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

40.0

@ I

P

V

VOLTS

7.0

9.8

13.4

19.0

24.0

43.0

64.0

C

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

MAXIMUM

LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

10***

1 1 1 1

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF

150 100

75 50 40 30 25

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

t

- Pulse Duration - µs

d

250W, 8/20µs Waveform

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

2 www.protekdevices.com05149.R3 8/03

PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

PP

IPP/2

TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs

GRAPHS

U0402FC3.3C

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U0402FC36C

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

REFLOW SOLDER PROFILE

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

Pre-Heat

Time

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR U0402FC05C

35

25

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Soldering

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0402FC05C

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

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PACKAGE OUTLINE & DIMENSIONS

U0402FC3.3C

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U0402FC36C

PACKAGE OUTLINE

Metalized Die Contacts

DIE

TOP

E F

END

A

D

I

MOUNTING PAD

B

H

C

A

SOLDER PAD

I

B

C

CONTACTS

U0402

SIDE

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and outline:

3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).

PACKAGE DIMENSIONS

DIM

A B C D E F

I

.xxx ± 0.05mm (± 0.002”).

MILLIMETERS

0.46 NOM

0.86 NOM

0.99 ± 0.0254

0.10 NOM

0.35 NOM

0.483 ± 0.0254

0.406 NOM

INCHES

0.018 NOM

0.034 NOM

0.039 ± 0.001

0.004 NOM

0.014 NOM

0.019 ± 0.001

0.016 NOM

PAD DIMENSIONS

DIM

A B

D

DIE

F

E

C D E

F G H

I

NOTE:

1. Top view of tape. Metal contacts are face down in tape package.

MILLIMETERS

0.23

0.48

0.69

0.46

0.99

0.20

0.66

0.13

INCHES

0.009

0.019

0.027

0.018

0.039

0.008

0.026

0.005

TAPE & REEL ORIENTATION

SOLDER PRINT

DIAMETER 0.010” -

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

3.

8mm Paper Tape:

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., U0402FC05C-T75-1).

7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., U0402FC05C-T710-2).

0.012”

G

NOTE:

1.

Preferred:

Outline & Dimensions: Rev 3 - 11/02, 06020

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Single Die - 0402

Using 0.1mm (0.004”) stencil.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com