Datasheet TSA6060T, TSA6060 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TSA6060

Fast radio tuning PLL frequency
synthesizer

Product specification
Supersedes data of April 1994
File under Integrated Circuits, IC01

1995 Nov 23

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

FEATURES

• On-chip AM and FM prescalers with high input
sensitivity

• On-chip high-performance one-input-two-output, tuning
voltage amplifier for the AM and FM loop filters

• On-chip two-level current amplifier (charge pump) for
loop gain adjustment

• One reference oscillator (4 or 8 MHz) for both AM
and FM

• High-speed tuning provided by a powerful digital
memory phase detector

• 40 kHz output reference frequency for communication
between the FM/IF system and microcontroller-based
tuning interface IC (TEA6100)

• Oscillator frequency range of 500 kHz to 30 MHz and
30 MHz to 200 MHz

• Four selectable reference frequencies:
1, 10, 25 or 50 kHz, for both tuning ranges

2

C-bus interface to a microcontroller

• I

• Software controlled band switch output

• In-lock detector output.

TSA6060

APPLICATIONS

• FM mains and car radios

• VHF receivers 30 to 200 MHz.

GENERAL DESCRIPTION

The TSA6060 is a frequency synthesizer manufactured in
SUBILO-N technology (components laterally separated by
oxide). The device performs all the tuning functions of a
PLL radio tuning system.

The IC is designed for application in all types of
radio receivers.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC1

V

CC2

I

CC1

I

CC2

f

iAMmax

f

iAMmin

f

iFMmax

f

iFMmin

V

iAM(rms)

V

iFM(rms)

P

tot

T

amb

supply voltage (pin 3) 4.5 5.0 5.5 V
supply voltage (pin 16) V

+ 1 8.5 12.0 V

CC1

supply current (pin 3) no outputs loaded − 15 − mA
supply current (pin 16) no outputs loaded 0.7 1.0 1.5 mA
maximum AM input frequency 30 −−MHz
minimum AM input frequency −−500 kHz
maximum FM input frequency 200 −−MHz
minimum FM input frequency −−30 MHz
AM input voltage (RMS value) V
FM input voltage (RMS value) V

=0V; fi< 15 MHz 30 − 500 mV

iFM

=0V 20 − 300 mV

iAM

total power dissipation − 100 − mW
operating ambient temperature −40 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TSA6060 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TSA6060T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1995 Nov 23 2

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

BLOCK DIAGRAM

TSA6060

Fig.1 Block diagram.

1995 Nov 23 3

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

PINNING

SYMBOL PIN DESCRIPTION

INCLK 1 in-lock detector output
XTAL 2 crystal reference oscillator input
V

CC1

V

EE

FM

I

DEC 6 prescaler decoupling
AM

I

BS 8 band switch output
f

ref

SDA 10 serial data input (I
SCL 11 serial clock input (I
AS 12 address select input (I
FM

O

LOOP

I

AM

O

V

CC2

3 supply voltage (PLL supply 1)
4 ground
5 FM VCO input

7 AM VCO input

9 40 kHz reference output

2

C-bus)

2

C-bus)

2

C-bus)
13 FM output for external loop filter
14 tuning voltage amplifier input
15 AM output for external loop filter
16 supply voltage (PLL supply 2)

TSA6060

Fig.2 Pin configuration.

FUNCTIONAL DESCRIPTION

The TSA6060 contains the following parts:

• Separate input amplifiers for the AM and FM VCO
signals.

• A 17-bit programmable counter.

• A digital memory phase detector.

• A reference frequency channel which contains a 4 MHz

or 8 MHz crystal oscillator which is followed by a
reference counter. The reference frequency can be
either 1, 5, 10 or 50 kHz and is applied to the digital
memory phase detector. The reference counter can also
output a 40 kHz reference frequency to pin 9 for
communication between the FM/IF system and the
microcontroller-based tuning interface IC (TEA6100).

• A programmable current amplifier (charge pump) which
consists of a 25 mA and a 500 mA current source. This
allows adjustment of the loop gain thereby providing
high-current high-speed tuning and low-current stable
tuning.

• A one-input-two-output tuning voltage amplifier. One
output is connected to the external AM loop filter and the
other output to the external FM loop filter. Under
software control, the AM output is switched to a low

impedance to ground by the FM/AM switch in the FM
position. The FM output is switched to a low impedance
to ground by the AM/FM switch in the AM position. The
outputs can deliver a tuning voltage of up to 10.5 V.

2

C-bus interface with data latches and control logic.

• An I
The I2C-bus is intended for communication between
microcontrollers and different ICs or modules. Detailed
information concerning the I2C-bus specification is
available on request.

• A software controlled band switch output.

Controls

The TSA6060 is controlled via the 2-wire I

2

C-bus.
For programming there is one module address, a logic 0
(R/W bit) and four data bytes. The module address
contains an address select bit (AS) which enables two
TSA6060s to be operated in one system.

The auto-increment facility of the I2C-bus allows
programming of the TSA6060 within one transmission
(address + 4 data bytes).

The TSA6060 can also be partially programmed.
Transmission must then be ended by a STOP condition.

1995 Nov 23 4

Philips Semiconductors Product specification

Fast radio tuning PLL frequency

TSA6060

synthesizer

The bit organization of the 4 data bytes is shown in Fig.3. Further information is given in Tables 2, 3, 4 and 5.
The bits S0 to S16 (DB0: D7 to D1; DB1: D7 to D0; DB2: D1 to D0) together with bit FM/AM (DB2: D5) are used to set

the divider of the input frequency at inputs AMI (pin 7) or FMI (pin 5). If the system is in-lock the following is valid, as
shown in Table 1.

Table 1 System-in-lock (note 1).

FM/AM INPUT FREQUENCY (fi) INPUT

0

0 (S2 × 2
1 (S0 × 2

Note

1. The minimum dividing ratio for the AM mode is 2

Table 2 Bit CP is used to control the charge pump

current (DB0: D0).

CP CURRENT

0 LOW
1 HIGH

+S3×21..... + S15 × 213+ S16 × 214) × f

0

+S1×21..... + S15 × 215+ S16 × 216) × f

ref

ref

6

= 64 and for the FM mode is 28= 256.

Table 5 Bit BS controls the open-collector band switch

output (DB2: D2).

BS BAND SWITCH OUTPUT

1 sink current
0 floating

AM
FM

Table 3 Bits REF1 and REF2 are used to set the

reference frequency applied to the phase
detector (DB2: D7 to D6).

REF1 REF2

00 1
01 10
10 25
11 50

Table 4 Bit

FM/AM

OPERATIONAL

AMPLIFIER

FM/AM OPAMP controls the switch AM/FM,
FM/AM in the tuning voltage amplifier circuits
(DB2: D4).

1 closed open
0 open closed

FM/AM AM/FM

REFERENCE

FREQUENCY (kHZ)

SWITCH

The bit 8/4 MHz controls a divide-by-1/divide-by-2 divider
cell in the reference oscillator section. This allows the use
of a 4 MHz or 8 MHz crystal.

Table 6 Test mode.

T3 T2 T1 FUNCTION

0 X 0 normal
1 0 1 CP source
0 1 1 CP sink
1 1 1 CP 3-state
0 0 1 CP sink + source
1 1 X BS = main divider output
1 0 X BS = reference divider output

The data byte DB3 must be set to 0.....0. It is also used for

test purposes (see Fig.3)).

1995 Nov 23 5

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

TSA6060

Fig.3 Bit organization.

1995 Nov 23 6

Philips Semiconductors Product specification

Fast radio tuning PLL frequency

TSA6060

synthesizer

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC !34).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC1

V

CC2

V

XTAL

P

tot

T

amb

T

stg

V

es

Note

1. Classification: machine model; C = 200 pF; R = 0 Ω; V = ±200 V.

CHARACTERISTICS

V

= 5 V; V

CC1

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

supply voltage (pin 3) −0.3 +6 V
supply voltage (pin 16) V
crystal bias voltage

+ 1 12.5 V

CC1

1

⁄2V

CC1

V

CC1

total power dissipation − 850 mW
operating ambient temperature −40 +85 °C
IC storage temperature −65 +150 °C
electrostatic handling note 1 −200 +200 V

CC2

= 8.5 V; T

=25°C; unless otherwise specified.

amb

V

Supplies

V

CC1

V

CC2

I

CC1

I

CC2

2

C-bus inputs: SDA and SCL (pins 10 and 11)

I

V

IH

V

IL

I

IH

I

IH

supply voltage (pin 3) 4.5 5.0 5.5 V
supply voltage (pin 16) V
supply current (pin 3) no outputs loaded − 15 − mA
supply current (pin 16) no outputs loaded 0.7 1.0 1.5 mA

HIGH level input voltage 3.0 − 5.0 V
LOW level input voltage −0.3 − 1.5 V
HIGH level input current −−10 µA
LOW level input current −−10 µA

SDA output (pin 10)

V

OL

LOW level output voltage open collector;

AS input (pin 12)

V

IH

V

IL

I

IH

I

IH

HIGH level input voltage 3.0 − 5.0 V
LOW level input voltage −0.3 − 1.0 V
HIGH level input current −−10 µA

LOW level input current −−10 µA
INCLK output (pin 1); INCLK = HIGH; see Fig.5
V

OH

V

OL

HIGH level output voltage IOH= −10 µAV

LOW level output voltage IOL= 1 mA 0 − 0.4 V

IOL=3mA

+ 1 8.5 12.0 V

CC1

−−0.4 V

− 1 − V

CC

CC

V

1995 Nov 23 7

Philips Semiconductors Product specification

Fast radio tuning PLL frequency

TSA6060

synthesizer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RF inputs: AMI and FMI (pins 5 and 7)

f

iAMmax

f

iAMmin

f

iFMmax

f

iFMmin

V

iAM(rms)

R

iAM

C

iAM

V

iFM(rms)

R

iFM

C

iFM

Oscillator (pin 2)

R

xtal

maximum AM input frequency 30 −−MHz

minimum AM input frequency −−500 kHz

maximum FM input frequency 200 −−MHz

minimum FM input frequency −−30 MHz

AM input voltage (RMS value) fi< 15 MHz;

30 − 500 mV

measured in Fig.4
15 MHz < f

< 30 MHz;

i

40 − 500 mV

measured in Fig.4
AM input resistance − 5.9 − kΩ
AM input capacitance − 2 − pF
FM input voltage (RMS value) V

=0V 20 − 300 mV

iAM

FM input resistance − 3.6 − kΩ
FM input capacitance − 2 − pF

crystal resonance resistance

see Fig.6 −−150 Ω
(4 or 8 MHz)

Programmable charge pump

I

chp

output current to loop filter bit CP = logic 0 16 − 30 µA

bit CP = logic 1 400 − 600 µA

Ripple rejection

SVRR

SVRR

1

2

supply voltage ripple rejection;
20 log ∆V

CC1

/∆V

tune

supply voltage ripple rejection;
20 log ∆V

CC2

/∆V

tune

f

= 100 Hz 40 50 − dB

ripple

f

= 100 Hz 40 50 − dB

ripple

Band switch output: BS (pin 8)

V

o(max)

V

OL

|I

| output leakage current VOH=12V −−10 µA

OL

Reference frequency output: f

f

ref

V

OH

V

OL

maximum output voltage programmed HIGH −−12 V
LOW level output voltage IOL=3mA −−0.8 V

(pin 9)

ref

reference output frequency − 40 − kHz
HIGH level output voltage I
LOW level output voltage I

=5µA 1.2 1.4 1.7 V

source

=5µA − 0.1 0.2 V

source

1995 Nov 23 8

Philips Semiconductors Product specification

Fast radio tuning PLL frequency

TSA6060

synthesizer

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Tuning voltage amplifiers

AM OUTPUT (PIN 15)
∆V

OH

∆V

OL

HIGH level output voltage swing IO= −0.6 mA V
LOW level output voltage swing IO= 0.6 mA −−0.8 V

FM OUTPUT (PIN 13)
∆V

OH

∆V

OL

Z

o(off)

HIGH level output voltage swing IO= −0.6 mA V
LOW level output voltage swing IO= 0.6 mA −−0.8 V
impedance of switched-off output

to ground

|I

| input bias current − 15nA

bias

− 0.9 −−V

CC2

− 0.9 −−V

CC2

− 500 −Ω

Fig.4 Prescaler input sensitivity.

1995 Nov 23 9

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

TSA6060

Fig.5 Timing diagram.

APPLICATION INFORMATION

Fig.6 Crystal connection.

1995 Nov 23 10

Fig.7 Equivalent output circuit.

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

TSA6060

For FM: VCO =5 MHz/V; R2 = 10 kΩ; C4 = 68 nF; C6 = 3.9 nF.
For AM: VCO = 0.75 MHz/V; R1 = 47 kΩ; C3 = 440 nF; C5 = 0.47 nF.

Fig.8 Application example; loop filter dependent on VCO and tuning speed.

1995 Nov 23 11

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

e

b

b

1

9

A

w M

TSA6060

SOT38-1

M

E

A

2

A

1

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

D

21.8

21.4

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

E

(1)

Z

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

w

H

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02
95-01-19

max.

2.2

0.087

1995 Nov 23 12

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TSA6060

SOT162-1

E

H

E

A

X

v M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.36

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w M

b

p

0 5 10 mm

scale

(1)E(1) (1)

cD

0.32

10.5

0.23

10.1

0.41

0.40

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

A

2

10.65

10.00

0.419

0.394

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.25 0.1

0.01

A

θ

ywv θ

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE
VERSION

SOT162-1

IEC JEDEC EIAJ

075E03 MS-013AA

REFERENCES

1995 Nov 23 13

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

Fast radio tuning PLL frequency
synthesizer

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING

(order code 9398 652 90011).

). If the

stg max

TSA6060

method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating

1995 Nov 23 14

Philips Semiconductors Product specification

Fast radio tuning PLL frequency

TSA6060

synthesizer

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1995 Nov 23 15

Philips Semiconductors – a worldwide company

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th

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Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,
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SCD46 © Philips Electronics N.V. 1995

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513061/1100/02/pp16 Date of release: 1995 Nov 23
Document order number: 9397 750 00458