Datasheet tsa6057 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TSA6057
TSA6057T

Radio tuning PLL frequency
synthesizer

Product specification
File under Integrated Circuits, IC01

August 1988

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

FEA TURES

• On-chip AM and FM prescalers with high input
sensitivity

• On-chip high performance one input (two output) tuning
voltage amplifier for the AM and FM loop filters

• On-chip 2-level current amplifier (charge pump) to
adjust the loop gain

• Only one reference oscillator (4 MHz) for both AM and
FM

• High speed tuning due to a powerful digital memory
phase detector

• 40 kHz output reference frequency for co-operation with
the FM/IF system and microcomputer-based tuning
interface IC (TEA6100)

• Oscillator frequency ranges of: 512 kHz to 30 MHz and
30 MHz to 150 MHz

• Three selectable reference frequencies of 1 kHz, 10 kHz
or 25 kHz for both tuning ranges

• Serial 2-wire I2C-bus interface to a microcomputer and
one programmable address input

• Software controlled bandswitch output.

TSA6057

TSA6057T

GENERAL DESCRIPTION

The TSA6057/6057T is a bipolar single chip frequency
synthesizer manufactured in SUBILO-N technology
(components laterally separated by oxide). It performs all
the tuning functions of a PLL radio tuning system. The IC
is designed for application in all types of radio receivers.

PACKAGE OUTLINES

TSA6057: 16-lead DIL; plastic (SOT38);
SOT38-1; 1996 August 07.

TSA6057T: 16-lead minipack; plastic (SO16L; SOT162A);
SOT162-1; 1996 August 07.

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage

pin 3 V
pin 16 V

Supply current no outputs loaded

pin 3 I

pin 16 I
Max. input frequency on AM
Min. input frequency on AM
Max. input frequency on FM
Min. input frequency on FM
Input voltage on AM

I

l

l

I

I

V

= 0 V

iFM

(RMS value) V

V

Input voltage on FM

I

iAM

= 0 V

(RMS value) V
Total power dissipation P
Operating ambient

temperature range T

CC1
CC2

3
16

f

iAM

f

iAM

f

iFM

f

iFM

iAM(rms)

iFM(rms)
tot

amb

= V

3-4

= V

16-4VCC1

4.5 5.0 5.5 V

8.5 12 V

12 20 28 mA

0.7 1.0 1.3 mA
30 −−MHz

−−0.512 MHz
150 −−MHz

−−30 MHz

30 − 500 mV

20 − 300 mV

− 0.14 − W

−30 −+ 85 °C

August 1988 2

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

TSA6057

TSA6057T

August 1988 3

Fig.1 Block diagram.

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

PINNING

1 XTAL1 reference oscillator output
2 XTAL2 reference oscillator input
3V

CC1

4V

EE

5FM
6 DEC prescaler decoupling
7AM
8 BS bandswitch output
9f

ref

10 SDA serial data input; I
11 SCL serial clock input; I
12 AS address select input; I
13 FM
14 LOOP
15 AM
16 V

CC2

positive supply voltage
ground
FM VCO input

I

AM VCO input

I

40 kHz reference output

FM output for external loop filter

O

tuning voltage amplifier input

I

AM output for external loop filter

O

positive supply voltage

2

C-bus

2

C-bus

2

C-bus

TSA6057

TSA6057T

Fig.2 Pinning diagram.

FUNCTIONAL DESCRIPTION

The TSA6057/6057T contains the following parts and facilities:

• Separate input amplifiers for the AM and FM VCO-signals.

• A prescaler with the divisors 3:4 on AM and 15:16 on FM, a multiplexer to select AM or FM and a 4-bit programmable

swallow counter.

• A 13-bit programmable counter.

• A digital memory phase detector.

• A reference frequency channel comprised of a 4 MHz crystal oscillator followed by a reference counter. The reference

frequency can be 1 kHz, 10 kHz or 25 kHz and is applied to the digital memory phase detector. The reference counter
also outputs a 40 kHz reference frequency to pin 9 for co-operation with the FM/IF system and microcomputer-based
tuning interface IC (TEA6100).

• A programmable current amplifier (charge pump) which consists of a 5 µA and a 450 µA current source. This allows
adjustment of loop gain, thus providing high current-high speed tuning and low current-stable tuning.

• A one input − two output tuning voltage amplifier. One output is connected to the external AM loop filter and the other
output to the external FM loop filter. Under software control, the AM output is switched to a high impedance state by
the FM/AM switch in the FM position and the FM output is switched to a high impedance state by the AM/FM switch in
the AM position. The outputs can deliver a tuning voltage of up to 10.5 V.

• An I2C-bus interface with data latches and control logic. The I2C-bus is intended for communication between
microcontrollers and different ICs or modules. Detailed information on the I2C-bus specification is available on request.

• A software-controlled bandswitch output.

August 1988 4

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

TSA6057

TSA6057T

Controls

The TSA6057/6057T is controlled via the 2-wire I2C-bus. For programming there is one module address, a logic 0 R/W
bit, a subaddress byte and four data bytes. The subaddress determines which one of the four data bytes is transmitted
first. The module address contains a programmable address bit (D1) which with address select input AS (pin 12) makes
it possible to operate two TSA6057s in one system.

The auto increment facility of the I2C-bus allows programming of the TSA6057/6057T within one transmission
(address + subaddress + 4 data bytes).

• The TSA6057/6057T can also be partially programmed. Transmission must then be ended by a stop condition.

The bit organization of the 4 data bytes is shown in Fig.3 and are described in sections (a) to (f).

(a) The bits S0 to S16 (DB0: D7-D1; DB1: D7-D0; DB2: D1-D0) together with bit FM/AM (DB2: D5) are used to set the
divisor of the input frequency at inputs AMI (pin 7) or FMI (pin 5). If the system is in lock the following is valid:

FM/AM INPUT FREQUENCY (FI) INPUT

0

0 (S0 × 2

1 (S0 × 20+ S1 × 21..... + S15 × 215+ S16 × 216) × f

Where

The minimum dividing ratio for AM mode is 2
The minimum dividing ratio for FM mode is 28 = 256

+ S1 × 21..... + S13 × 213+ S14 × 214) × f

6

= 64

ref

ref

AM
FM

l
I

(b) The bit CP is used to control the charge pump current (DB0: D0).

CP CURRENT

0 low
1 high

(c) The bits REF1 and REF2 are used to set the reference frequency applied to the phase detector (DB2: D7-D6).

REF1 REF2

00 1
01 10
10 25
1 1 none

(d) The bit

FM/AM OPAMP SWITCH FM/AM SWITCH AM/FM

1 closed open
0 open closed

FM/AM OPAMP controls the switch AM/FM; FM/AM in the tuning voltage amplifier output circuitry (DB2: D4).

FREQUENCY

(kHZ)

August 1988 5

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

(e) The bit BS controls the open collector bandswitch output (DB2: D2).

BS BANDSWITCH OUTPUT

1 sink current
0 floating

(f) The data byte DB3 must be set to 0 . . . . . . 0. It is also used for test purposes.

TSA6057

TSA6057T

August 1988 6

Fig.3 Bit organization.

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER SYMBOL MIN. MAX. UNIT

Supply voltage (pin 3) V
Supply voltage (pin 16) V
Total power dissipation P
Operating ambient temperature T
Storage temperature range T

CHARACTERISTICS

V

CC1

= 5 V; V

= 8.5 V; T

CC2

= 25 °C; unless otherwise specified

amb

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage (pin 3) V
Supply voltage (pin 16) V
Supply current no outputs loaded

pin 3 l
pin 16 l

2

C-bus inputs

I

(SDA; SCL)
Input voltage HIGH V
Input voltage LOW V
Input current HIGH I
Input current LOW I

SDA output

Output voltage LOW I

open collector

= 3.0 mA V

OL

AS input

Input voltage HIGH V
Input voltage LOW V
Input current HIGH I
Input current LOW I

RF input (AM; FM)

Max. input frequency on AM
Min. input frequency on AM
Max. input frequency on FM
Min. input frequency on FM
Input voltage on AM

I

I

I

I

I

V

= 0 V

iFM

(RMS value) measured in Fig.4 V

Input impedance AM

I

resistance R
capacitance C

CC1
CC2
tot
amb
stg

CC1
CC2

CC1
CC2

IH

IL
IH
IL

OL

IH

IL
IH
IL

f

iAM

f

iAM

f

iFM

f

iFM

iAM(rms)

AM

AM

= V
= V

TSA6057

TSA6057T

−0.3 5.5 V

3-4
16-4VCC1

− 0.85 W

−30 +85 °C

−65 +150 °C

4.5 5.0 5.5 V
V

CC1

12 20 28 mA

0.7 1.0 1.3 mA

3.0 − 5.0 V

−0.3 − 1.5 V

−−10 µA

−−10 µA

−−0.4 V

3.0 − 5.0 V

−0.3 − 1.0 V

−−10 µA

−−10 µA

30 −−MHz

−−0.512 MHz
150 −− MHz

−−30 MHz

30 − 500 mV

− 5.9 − kΩ

− 2 − pF

12.5 V

8.5 12 V

August 1988 7

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

RF input (AM; FM); continued

V

Input voltage on FM

I

(RMS value) measured in Fig.4 V

Input impedance FM

I

resistance R
capacitance C

Oscillator (XTAL1; XTAL2)

Crystal resonance

resistance (4 MHz) see Fig.5 R

Programmable charge pump

Output current to loop filter

bit CP = logic 0 I
bit CP = logic 1 I

Ripple rejection

20 log ∆V
20 log ∆V

CC1
CC2

/∆V
/∆V

O
O

Bandswitch output (pin 8)

Output voltage HIGH V
Output voltage LOW I
Output leakage current V

Reference frequency output

(pin 9)
Output frequency 4 MHz crystal f
Output voltage HIGH I
Output voltage LOW V

Tuning voltage amplifier outputs

AM output (pin 15)

max. output voltage I

min. output voltage I
max. output source current I
max. output sink current I

= 0 V

iAM

f

= 100 Hz

ripple

= 3 mA V

OL

= 12 V I

OH

= 5 µAVOH1.2 1.4 1.7 V

source

= 0.5 mA V

source

= 1 mA V

sink

TSA6057

TSA6057T

iFM(rms)

FM

FM

XTAL

chp
chp

RR 40 50 − dB
RR 40 50 − dB

OH

OL
LO

ref

OL

O(max)

O(min)
source
sink

20 − 300 mV

− 3.6 − kΩ

− 2 − pF

−−150 Ω

357µA
400 500 600 µA

−−12 V

−−0.8 V

−−10 µA

− 40 − kHz

− 0.1 0.2 V

VCC2

−− V

−1.5

−−0.8 V

0.5 −− mA

1.0 −− mA

August 1988 8

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Tuning voltage amplifier outputs; continued

FM output (pin 13)

max. output voltage I

min. output voltage I
max. output source current I
max. output sink current I

Impedance of switched off

output Z

Input bias current

(absolute value) I

= 0.5 mA V

source

= 1 mA V

sink

O(max)

O(min)
source
sink

O(off)

bias

TSA6057

TSA6057T

V

CC2

− 1.5

−−0.8 V

0.5 −− mA

1.0 −− mA

5 −− MΩ

− 15 nA

−− V

August 1988 9

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

SENSITIVITY MEASUREMENT

TSA6057

TSA6057T

APPLICATION INFORMATION

Fig.4 Prescaler input sensitivity.

Fig.5 Crystal connection (4 MHz).

August 1988 10

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

TSA6057

TSA6057T

August 1988 11

Fig.6 Application diagram.

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

e

b

b

1

9

A

1

w M

TSA6057

TSA6057T

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

1

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

D

21.8

21.4

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

E

(1)

Z

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

w

H

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02
95-01-19

max.

2.2

0.087

August 1988 12

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TSA6057

TSA6057T

SOT162-1

E

H

E

A

X

v M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.36

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w M

b

p

0 5 10 mm

scale

(1)E(1) (1)

cD

0.32

10.5

0.23

10.1

0.41

0.40

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

A

2

10.65

10.00

0.42

0.39

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.25 0.1

0.01

A

θ

ywv θ

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE
VERSION

SOT162-1

August 1988 13

REFERENCES

IEC JEDEC EIAJ

075E03 MS-013AA

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17

95-01-24

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

DIP

OLDERING BY DIPPING OR BY WAVE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TSA6057

TSA6057T

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

August 1988 14

Philips Semiconductors Product specification

Radio tuning PLL frequency synthesizer

TSA6057

TSA6057T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

August 1988 15