The TSA5515T is a single chip PLL frequency synthesizer
designed for TV tuning systems. Control data is entered
via the I2C-bus; five serial bytes are required to address
the device, select the oscillator frequency, programme the
three output ports and set the charge-pump current. A flag
is set when the loop is “in-lock”. Another flag is set when a
power dip occurs on the supply line. These flags are read
out of the TSA5515T on SDA line (one status byte) during
a READ operation. The device has 4 programmable
addresses, programmed by applying a specific voltage on
the AS pin. The phase comparator operates at
7.8125 kHz when a 4 MHz crystal is used.
FEATURES
• Complete 1.3 GHz single-chip system
• Low power 5 V, 35 mA
2
• I
C-bus programming
• In-lock flag
• Varicap drive disable
• Low radiation
• Address selection for Picture-In-Picture (PIP), DBS
tuner, etc.
• 3 bus-controlled output ports
• Power-down flag
• Available in SOT108A package
APPLICATIONS
• TV tuners
• VCR tuners
TSA5515T
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
V
CC
I
CC
supply voltage−5−V
supply current−35−mA
∆ffrequency range64−1300MHz
V
The TSA5515T is controlled via the two-wire I2C-bus. For
programming, there is one module address (7 bits) and the
R/W bit for selecting READ or WRITE mode.
WRITE mode:
R/
W = 0 (see Table 1)
After the address transmission (first byte), data bytes can
be sent to the device. Four data bytes are needed to fully
program the TSA5515T. The bus transceiver has an
auto-increment facility, which permits the programming of
the TSA5515T within one single transmission
(address + 4 data bytes).
byte 2 or byte 4. The meaning of the bits in the data bytes
is given in Table 1. The first bit of the first data byte
transmitted indicates whether frequency data (first bit = 0)
or charge pump and port information (first bit = 1) will
follow. Until an I
controller, additional data bytes can be entered without the
need to re-address the device. This allows a smooth
frequency sweep for fine tuning. At power-on, the ports are
set to the high impedance state.
The 7.8125 kHz reference frequency is obtained by
dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of the UHF/VHF signal is first divided by
8, the step size is 62.5 kHz. A 3.2 MHz crystal can offer a
step size of 50 kHz.
2
C-bus STOP condition is sent by the
TSA5515T
The TSA5515T can also be partly programmed on the
condition that the first data byte following the address is
Table 1 Write data format
MSBLSB
Address11000MA1MA00 Abyte 1
Programmable
0N14N13N12N11N10N9N8Abyte 2
divider
Programmable
N7N6N5N4N3N2N1N0Abyte 3
divider
Charge-pump
1CPT1T0XXXOSAbyte 4
and test bits
Output ports control
P7XXXXP2P1X Abyte 5
bits
MA1, MA0 programmable address bits (see Table 3)
Aacknowledge bit
N14 to N0programmable divider bits
N = N14 × 2
14
+N13 × 213+...+N1 × 21+N0
CPcharge-pump current
CP = 050 µA
CP = 1220 µA
P7, P2, P1 = 1open-collector outputs are active
P7, P2, P1 = 0outputs are in high impedance state
T1, T0, OS = 0 0 0normal operation
T1=1, P2=f
, P7 = f
ref
DIV
T0 = 1 3-state charge-pump
OS = 1operational amplifier output is switched off (varicap drive disable)
Data can be read out of the TSA5515T by setting the R/W
bit to 1. After the slave address has been recognized, the
TSA5515T generates an acknowledge pulse and the first
data byte (status word) is transferred on the SDA line
(MSB first). Data is valid on the SDA line during a high
position of the SCL clock signal.
A second data byte can be read out of the TSA5515T if the
processor generates an acknowledge on the SDA line.
End of transmission will occur if no acknowledge from the
Table 2 Read data format
MSBLSB
Address11000MA1MA01Abyte 1
Status bytePORFL111111−byte 2
Notes
1. PORpower-on-reset flag. (POR = 1 on power-on)
2. FLin-lock flag (FL = 1 when the loop is phase-locked).
processor occurs. The TSA5515T will then release the
data line to allow the processor to generate a STOP
condition.
The POR flag (power-on-reset) is set to 1 when V
below 3 V and at power-on. It is reset when an end of data
is detected by the TSA5515T (end of a READ sequence).
Control of the loop is made possible with the in-lock flag
FL, which indicates (FL = 1) when the loop is
phase-locked.
TSA5515T
CC
goes
MSB is transmitted first.
Address selection (see Table 3)
The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several
synthesizers (up to 4) in one system. The relationship between MA1 and MA0 and the input voltage on AS input is given
in Table 3.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
TSA5515T
PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
November 199115
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