Datasheet TSA5512M Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TSA5512

1.3 GHz Bidirectional I
controlled synthesizer

Product specification
File under Integrated Circuits, IC02

2

C-bus

October 1992

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

FEATURES

• Complete 1.3 GHz single chip system

• Low power 5 V, 35 mA

• I2C-bus programming

• In-lock flag

• Varicap drive disable

• Low radiation

• Address selection for Picture-In-Picture (PIP), DBS

tuner (3 addresses)

• Analog-to-digital converter

• 8 bus controlled ports (6 for TSA5512T), 8 open

collector outputs (4 bidirectional)

• Power-down flag

APPLICATIONS

• TV tuners

• VCR Tuners

DESCRIPTION

The TSA5512 is a single chip PLL frequency synthesizer
designed for TV tuning systems. Control data is entered
via the I2C-bus; five serial bytes are required to address
the device, select the oscillator frequency, programme the
eight output ports and set the charge-pump current. Four
of these ports can also be used as input ports (three
general purpose I/O ports, one ADC). Digital information
concerning those ports can be read out of the TSA5512 on
the SDA line (one status byte) during a READ operation. A
flag is set when the loop is “in-lock” and is read during a
READ operation. The device has one fixed I2C-bus
address and 3 programmable addresses, programmed by
applying a specific voltage on Port 3. The phase
comparator operates at 7.8125 kHz when a 4 MHz crystal
is used.

TSA5512

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

TSA5512 18 DIL plastic SOT102
TSA5512T 16 SO plastic SOT109A
TSA5512AT 20 SO plastic SOT163A
TSA5512M 20 SSOP plastic SOT266

Note

1. SOT102-1; 1996 December 5.

2. SOT109-1; 1996 December 5.

3. SOT163-1; 1996 December 5.

4. SOT266-1; 1996 December 5.

PINS PIN POSITION MATERIAL CODE

PACKAGE

(1)

(2)
(3)

(4)

October 1992 2

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

I

CC

supply voltage − 5 − V

supply current − 35 − mA
∆fr frequency range 64 − 1300 MHz
V

I

input voltage level

80 MHz to 150 MHz 12 − 300 mV
150 MHz to 1 GHz 9 − 300 mV
1 GHz to 1.3 GHz 40 − 300 mV

f

XTAL

I

O

T

amb

T

stg

crystal oscillator frequency 3.2 4.0 4.48 MHz

open-collector output current 5 −−mA

operating ambient temperature range −10 − +80 °C

IC storage temperature range −40 − +150 °C

October 1992 3

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled
synthesizer

TSA5512

October 1992 4

Fig.1 Block diagram.

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

Fig.2 Pin configuration for SOT102. Fig.3 Pin configuration for SOT109.

Fig.4 Pin configuration for SOT163/SOT266.

October 1992 5

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

PINNING

PIN

SYMBOL

SOT102 SOT109

SOT163
SOT266

PD 1 1 1 charge-pump output
Q1 2 2 2 crystal oscillator input 1
Q2 3 3 3 crystal oscillator reference voltage
n.c. −−4 not connected
SDA 4 4 5 serial data input/output
SCL 5 5 6 serial clock input
P7 6 6 7 port output/input (general purpose)
n.c. −−8 not connected
P6 7 7 9 port output/input for general purpose ADC
P5 8 8 10 port output/input (general purpose)
P4 9 9 11 port output/input (general purpose)
P3 10 10 12 port output/input for address selection
P2 11 11 13 port output
P1 12 − 14 port output
P0 13 − 15 port output
V
RF
RF
V

CC

IN1
IN2

EE

14 12 16 voltage supply
15 13 17 UHF/VHF signal input 1
16 14 18 UHF/VHF signal input 2 (decoupled)
17 15 19 ground

UD 18 16 20 drive output

DESCRIPTION

TSA5512

FUNCTIONAL DESCRIPTION

2

The TSA5512 is controlled via the two-wire I

C-bus. For programming, there is one module address (7 bits) and the R/W

bit for selecting READ or WRITE mode.

WRITE mode: R/W = 0 (see Table 1)

After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully
program the TSA5512. The bus transceiver has an auto-increment facility which permits the programming of the
TSA5512 within one single transmission (address + 4 data bytes).

The TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2
or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted
indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an
I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the
device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high
impedance state.

The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes
of 50 kHz.

October 1992 6

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

Table 1 Write data format

MSB LSB

Address 11000MA1MA00Abyte 1
Programmable

divider
Programmable

divider
Charge-pump

and test bits
Output ports

control bits

Note to Table 1

* not valid for TSA5512T
MA1,MAO programmable address bits (see Table 4)
A acknowledge bit
N14 to N0 programmable divider bits

N = N14 × 2
CP charge-pump current
CP = 0 50 µA
CP = 1 220 µA
P7 to P0 = 1 open-collector output is active
P7 to P0 = 0 outputs are in high impedance state
T1, T0, OS = 0 0 0 normal operation
T1 = 1 P6 = f
T0 = 1 3-state charge-pump
OS = 1 operational amplifier output is switched off (varicap drive disable)

14

+ N13 × 213 +... +N1 × 21+ NO

0 N14 N13 N12 N11 N10 N9 N8 A byte 2

N7 N6 N5 N4 N3 N2 N1 N0 A byte 3

1 CP T1 T0 1 1 1 OS A byte 4

P7 P6 P5 P4 P3 P2 P1* P0* A byte 5

, P7 = f

ref

DIV

TSA5512

October 1992 7

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

READ mode: R/W = 1 (see Table 2)

Data can be read out of the TSA5512 by setting the R/W bit to 1. After the slave address has been recognized, the
TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first).
Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the
TSA5512 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge
from the processor occurs. The TSA5512 will then release the data line to allow the processor to generate a STOP
condition. When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR
flag (power-on reset) is set to 1 when VCC goes below 3 V and at power-on. It is reset when an end of data is detected
by the TSA5512 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates
(FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4
respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available
on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television
as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage
on port P6 is given in Table 3.

Table 2 Read data format

MSB LSB

Address 11000MA1MA01A byte 1
Status byte POR FL I2 I1 I0 A2 A1 A0 − byte 2

TSA5512

Note to Table 2

POR power-on reset flag. (POR = 1 on power-on)
FL in-lock flag (FL = 1 when the loop is phase-locked)
I2, I1, I0 digital information for I/O ports P7, P5 and P4 respectively
A2, A1 A0 digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)

MSB is transmitted first

Address selection

The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the
possibility of having several synthesizers (up to 3) in one system.
The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4

October 1992 8

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

Table 3 ADC levels

VOLTAGE APPLIED ON THE PORT P6 A2 A1 A0

0.6 V

0.45 V

0.3 V

0.15 V
0 to 0.15 V

Table 4 Address selection

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version

to 13.5 V 1 0 0

CC

to 0.6 V

CC

to 0.45 V

CC

to 0.3 V

CC

CC
CC
CC

CC

011
010
001
000

MA1 MA0 VOLTAGE APPLIED ON PORT P3

0 0 0 to 0.1 V

CC

0 1 always valid
1 0 0.4 to 0.6 V

CC

1 1 0.9 VCC to 13.5 V

TSA5512

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

1

V

2

V

4

V

5

V

6-13

V

15

V

18

I

6-13

I

4

T

stg

T

j

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE

R

th j-a

supply voltage −0.3 6 V
charge-pump output voltage −0.3 V
crystal (Q1) input voltage −0.3 V

CC
CC

V

V
serial data input/output voltage −0.3 6 V
serial clock input voltage −0.3 6 V
P7 to P0 input/output voltage −0.3 +16 V
prescaler input voltage −0.3 V
drive output voltage −0.3 V

CC
CC

V

V
P7 to P0 output current (open collector) −115mA
SDA output current (open collector) −15 mA
IC storage temperature range −40 +150 °C
maximum junction temperature − 150 °C

from junction to ambient in free air

DIL18 80 K/W
SO16 110 K/W
SO20 80 K/W
SSOP20 120 K/W

October 1992 9

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

CHARACTERISTICS

V

CC

= 5V;T

= 25 °C, unless otherwise specified

amb

All pin numbers refer to DIL18 version

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Functional range

V

CC

T

amb

supply voltage range 4.5 − 5.5 V
operating ambient

−10 − +80 °C

temperature range
f input frequency 64 − 1300 MHz
N divider 256 − 32767
I

CC

f

XTAL

Z

I

supply current 25 35 50 mA

crystal oscillator

frequency range

crystal series resonance
resistance ≤ 150 Ω

3.2 4.0 4.48 MHz

input impedance (pin 2) −480 −400 −320 Ω

input level V

= 4.5 V to 5.5 V;

CC

T

= −10 to +80 °C;

amb

see typical sensitivity curve

Fig.6
f = 80 to 150 MHz 12/−25 − 300/2.6 mV/dBm
f = 150 to 1000 MHz 9/−28 − 300/2.6 mV/dBm
f = 1000 to 1300 MHz 40/−15 − 300/2.6 mV/dBm

R

I

prescaler input resistance

− 50 −Ω

(see Fig.7)

C

I

input capacitance − 2 − pF

Output ports (open collector) P0 to P7 (see note 1)

I

LO

V

OL

output leakage current VO = 13.5 V −−10 µA
LOW level output voltage IOL = 5 mA; note 2 −−0.7 V

Input port P3

I
I

OH
OL

HIGH level input current VOH = 13.5 V −−10 µA
LOW level input current VOL = 0 V −10 −−µA

Input ports P4, P5 and P7

V

IL

V

IH

I

IH

I

IL

LOW level input voltage −−0.8 V
HIGH level input voltage 2.7 −−V
HIGH level input current VIH = 13.5 V −−10 µA
LOW level input current VIL = 0 V −10 −−µA

Input port P6

I

IH

I

IL

HIGH level input current VIH = 13.5 V −−10 µA
LOW level input current VIL = 0 V −10 −−µA

SCL and SDA inputs

V

IH

V

IL

HIGH level input voltage 3.0 − 5.5 V
LOW level input voltage −−1.5 V

October 1992 10

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SCL and SDA inputs

I

IH

I

IL

HIGH level input current VIH = 5 V; VCC = 0 V −−10 µA

V

= 5 V; VCC = 5 V −−10 µA

IH

LOW level input current VIL = 0V;VCC = 0 V −10 −−µA

V

= 0V;VCC = 5 V −10 −−µA

IL

Output SDA (pin 4; open collector)

I

LO

V

O

output leakage current VO = 5.5 V −−10 µA
output voltage IO = 3 mA −−0.4 V

Charge-pump output PD (pin 1)

I

OH

HIGH level output current

CP = 1 90 220 300 µA

(absolute value)

I

OL

LOW level output current

CP = 0 22 50 75 µA

(absolute value)

V

1

I

1leak

output voltage in-lock 1.5 − 2.5 V
off-state leakage current T0 = 1 −5 − 5nA

Operational amplifier output UD (test mode T0 = 1)

V

18

V

18

output voltage VIL = 0 V −−100 mV
output voltage when

OS = 1; VIL = 2 V −−200 mV

switched-off

G operational amplifier

current gain;
I

18

/(I1 - I

1leak

)

OS = 0; VIL = 2 V;

I18 = 10 µA

2000 −−

Notes to the characteristics

1. When a port is active, the collector voltage must not exceed 6 V.

2. Measured with all open-collector ports active.

October 1992 11

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled
synthesizer

TSA5512

October 1992 12

Fig.5 Typical application (DIL18).

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

Fig.6 Prescaler typical input sensitivity curve; VCC= 4.5 to 5.5 V; T

= −10 to +80 °C.

amb

Fig.7 Prescaler Smith chart of typical input impedance; VCC= 5 V; reference value = 50 Ω.

October 1992 13

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

TSA5512

FLOCK FLAG DEFINITION (FL)

When the FL flag is 1, the maximum frequency deviation (∆f) from stable frequency can be expressed as follows:

∆fK

⁄()± ICPC1 C2+()C1 C2×()⁄××=

VCOKO

Where:

K
I
K

VCO

CP

O

= oscillator slope (Hz/V)
= charge-pump current (A)
=4×10E6

C1 and C2 = loop filter capacitors (see Fig.8)

Fig.8 Loop filter.

FLOCK FLAG APPLICATION

• K

= 16 MHz/V (UHF band)

VCO

• ICP = 220 mA

• C1 = 180 nF

• C2 = 39 nF

•∆f = ± 27.5 kHz.

Table 5 Flock flag settings

MIN. MAX. UNIT

Time span between actual phase lock and FL-flag setting 1024 1152 µs
Time span between the loop losing lock and FL-flag resetting 0 128 µs

October 1992 14

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

D

seating plane

L

Z

18

e

b

b

10

A

A

1

w M

1

b

2

TSA5512

SOT102-1

M

E

2

A

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT102-1

12

min.

max.

IEC JEDEC EIAJ

b

1.40

1.14

0.055

0.044

b

1

0.53

0.38

0.021

0.015

b

2

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

(1) (1)

cD E e M

21.8

21.4

0.86

0.84

9

6.48

6.20

0.26

0.24

E

(1)

Z

L

e

1

M

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

E

0.37

0.33

H

9.5

8.3

w

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14
95-01-23

October 1992 15

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

9

TSA5512

SOT109-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

9.8

0.39

0.38

8

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

L

p

L

0.25 0.1

0.25

0.01

0.01 0.004

A

3

θ

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE
VERSION

SOT109-1

IEC JEDEC EIAJ

076E07S MS-012AC

REFERENCES

October 1992 16

EUROPEAN

PROJECTION

ISSUE DATE

95-01-23
97-05-22

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

11

TSA5512

SOT163-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

1

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

0.49

0.36

p

cD

0.32

0.23

0.013

0.009

3

0.019

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

10

w M

b

p

scale

(1)E(1) (1)

13.0

12.6

0.51

0.49

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

Q

A

2

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

1.1

1.0

0.043

0.039

(A )

L

p

L

0.25

0.01

A

3

θ

0.25 0.1

0.01

ywv θ

Z

0.9

0.4

8

0.004

0.035

0.016

0

o
o

OUTLINE
VERSION

SOT163-1

IEC JEDEC EIAJ

075E04 MS-013AC

REFERENCES

October 1992 17

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

20

D

c

y

Z

11

E

H

E

TSA5512

SOT266-1

A

X

v M

A

pin 1 index

110

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.5

0.1501.4

1.2

0.25

b

3

p

0.32

0.20

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

6.6

0.13

6.4

0 2.5 5 mm

scale

(1)E(1)

eHELLpQZywv θ

4.5

0.65 1.0 0.2

4.3

6.6

6.2

Q

A

2

A

1

detail X

0.75

0.65

0.45

0.45

(A )

L

p

L

A

3

θ

0.13 0.1

0.48

0.18

(1)

o

10

o

0

OUTLINE
VERSION

SOT266-1

IEC JEDEC EIAJ

REFERENCES

October 1992 18

EUROPEAN

PROJECTION

ISSUE DATE

90-04-05
95-02-25

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled
synthesizer

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

DIP

SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

(order code 9398 652 90011).

). If the

stg max

TSA5512

method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

SO and SSOP

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and

SSOP packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating

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R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Philips Semiconductors Product specification

1.3 GHz Bidirectional I2C-bus controlled synthesizer

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

TSA5512

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

October 1992 20