Page 1
INTEGRATED CIRCUITS
DATA SH EET
TSA5511
1.3 GHz Bidirectional I
controlled synthesizer
Product specification
File under Integrated Circuits, IC02
2
C-bus
October 1992
Page 2
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
FEATURES
• Complete 1.3 GHz single chip system
• Low power 5 V, 35 mA
• I2C-bus programming
• In-lock flag
• Varicap drive disable
• Low radiation
• Address selection for Picture-In-Picture (PIP), DBS
tuner (3 addresses)
• Analog-to-digital converter
• 8 bus controlled ports (5 for TSA5511T), 4 current
limited outputs (1 for TSA5511T), 4 open collector
outputs (bi-directional)
• Power-down flag
APPLICATIONS
• TV tuners
• VCR Tuners
GENERAL DESCRIPTION
The TSA5511 is a single chip PLL frequency synthesizer
designed for TV tuning systems. Control data is entered
via the I2C-bus; five serial bytes are required to address
the device, select the oscillator frequency, programme the
eight output ports and set the charge-pump current. Four
of these ports can also be used as input ports (three
general purpose I/O ports, one ADC). Digital information
concerning those ports can be read out of the TSA5511 on
the SDA line (one status byte) during a READ operation.
A flag is set when the loop is “in-lock” and is read during a
READ operation. The device has one fixed I2C-bus
address and 3 programmable addresses, programmed by
applying a specific voltage on Port 3. The phase
comparator operates at 7.8125 kHz when a 4 MHz crystal
is used.
TSA5511
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
TSA5511 18 DIL plastic SOT102
TSA5511T 16 SO plastic SOT109A
TSA5511AT 20 SO plastic SOT163A
Note
1. SOT102-1; 1996 December 5.
2. SOT109-1; 1996 December 5.
3. SOT163-1; 1996 December 5.
PINS PIN POSITION MATERIAL CODE
PACKAGE
(1)
(2)
(3)
October 1992 2
Page 3
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5511
QUICK REFERENCE DATA
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
CC
I
CC
positive supply voltage − 5 − V
supply current − 35 − mA
∆f frequency range 64 − 1300 MHz
V
I
input voltage level
80 MHz to 150 MHz 12 − 300 mV
150 MHz to 1 GHz 9 − 300 mV
1 GHz to 1.3 GHz 40 − 300 mV
f
XTAL
I
O
I
O
T
amb
T
stg
crystal oscillator frequency 3.2 4.0 4.48 MHz
open-collector output current 10 −−mA
current−limited output current − 1 − mA
operating ambient temperature range −10 − +80 °C
IC storage temperature range −40 − +150 °C
October 1992 3
Page 4
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
TSA5511
October 1992 4
Fig.1 Block diagram.
Page 5
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5511
Fig.2 Pin configuration for SOT102. Fig.3 Pin configuration for SOT109.
Fig.4 Pin configuration for SOT163.
October 1992 5
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
PINNING
SYMBOL
PD 1 1 1 charge-pump output
Q1 2 2 2 crystal oscillator input 1
Q2 3 3 3 crystal oscillator reference voltage
n.c. −−4 not connected
SDA 4 4 5 serial data input/output
SCL 5 5 6 serial clock input
P7 6 6 7 port output/input (general purpose)
n.c. −−8 not connected
P6 7 7 9 port output/input for general purpose ADC
P5 8 8 10 port output/input (general purpose)
P4 9 9 11 port output/input (general purpose)
P3 10 10 12 port output/input for address selection
P2 11 − 13 port output
n.c. − 11 − not connected
P1 12 − 14 port output
P0 13 − 15 port output
V
CC
RF
IN1
RF
IN2
V
EE
UD 18 16 20 drive output
SOT102 SOT109 SOT163
14 12 16 voltage supply
15 13 17 UHF/VHF signal input 1
16 14 18 UHF/VHF signal input 2 (decoupled)
17 15 19 ground
PIN
DESCRIPTION
TSA5511
FUNCTIONAL DESCRIPTION
The TSA5511 is controlled via the two-wire I2C-bus. For programming, there is one module address (7 bits) and the R/W
bit for selecting READ or WRITE mode.
WRITE mode : R/
After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully
program the TSA5511. The bus transceiver has an auto-increment facility which permits the programming of the
TSA5511 within one single transmission (address + 4 data bytes).
The TSA5511 can also be partially programmed on the condition that the first data byte following the address is byte 2
or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted
indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an
I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the
device. This allows a smooth frequency sweep for fine tuning or AFC purposes. At power-on the ports are set to the high
impedance state.
The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because
the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes of 50 kHz.
October 1992 6
W = 0 (see Table 1)
Page 7
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 1 Write data format
MSB LSB
Address 11000MA1MA00Abyte 1
Programmable
divider
Programmable
divider
Charge-pump
and test bits
Output ports
control bits
Note to Table 1
* not valid for TSA5511T
MA1, MA0 programmable address bits (see Table 4)
A acknowledge bit
N14 to N0 programmable divider bits
N = N14 × 2
CP charge-pump current
CP = 0 50 µA
CP = 1 220 µA
P3 to P0 = 1 limited-current output is active
P7 to P4 = 1 open-collector output is active
P7 to P0 = 0 outputs are in high impedance state
T1, T0, OS = 0 0 0 normal operation
T1 = 1 P6 = f
T0 = 1 3-state charge-pump
OS =1 operational amplifier output is switched off (varicap drive disable)
14
+ N13 × 213+ ... + N1 × 21+ N0
0 N14 N13 N12 N11 N10 N9 N8 A byte 2
N7 N6 N5 N4 N3 N2 N1 N0 A byte 3
1 CP T1 T0 1 1 1 OS A byte 4
P7 P6 P5 P4 P3 P2* P1* P0* A byte 5
, P7 = f
ref
DIV
TSA5511
October 1992 7
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
READ mode : R/W = 1 (see Table 2)
Data can be read out of the TSA5511 by setting the R/W bit to 1. After the slave address has been recognized, the
TSA5511 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first).
Data is valid on the SDA line during a high position of the SCL clock signal.
A second data byte can be read out of the TSA5511 if the processor generates an acknowledge on the SDA line. End of
transmission will occur if no acknowledge from the processor occurs.
The TSA5511 will then release the data line to allow the processor to generate a STOP condition.
When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state.
The POR flag (power-on reset) is set to 1 when VCC goes below 3 V and at power-on. It is reset when an end of data is
detected by the TSA5511 (end of a READ sequence).
Control of the loop is made possible with the in-lock flag FL which indicates (FL = 1) when the loop is phase-locked. The
bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a
logic 1 a HIGH level (TTL levels).
A built-in 5-level ADC is available on I/O port P6. This converter can be used to feed AFC information to the controller
from the IF section of the television as illustrated in the typical application circuit (Fig.5). The relationship between bits
A2, A1 and A0 and the input voltage on port P6 is given in Table 3.
Table 2 Read data format
MSB LSB
Address 11000MA1MA01Abyte 1
Status byte POR FL I2 I1 I0 A2 A1 A0 − byte 2
TSA5511
Note to Table 2
POR power-on reset flag. (POR = 1 on power-on)
FL in-lock flag (FL = 1 when the loop is phase-locked)
I2, I1, I0 digital information for I/O ports P7, P5 and P4 respectively
A2, A1, A0 digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)
MSB is transmitted first.
Address selection
The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the
possibility of having several synthesizers (up to 3) in one system.
The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4.
October 1992 8
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 3 ADC levels
VOLTAGE APPLIED ON THE PORT P6 A2 A1 A0
0.6 V
0.45 V
0.3 V
0.15 V
0 to 0.15 V
Table 4 Address selection
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version
to 13.5 V 1 0 0
CC
to 0.6 V
CC
to 0.45 V
CC
to 0.3 V
CC
CC
CC
CC
CC
011
010
001
000
MA1 MA0 VOLTAGE APPLIED ON PORT P3
0 0 0 to 0.1 V
CC
0 1 always valid
1 0 0.4 to 0.6 V
CC
1 1 0.9 VCCto 13.5 V
TSA5511
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
V
1
V
2
V
4
V
5
V
6-13
V
15
V
18
I
6-9
I
4
T
stg
T
j
THERMAL RESISTANCE
SYMBOL PARAMETER THERMAL RESISTANCE
R
th j-a
supply voltage −0.3 6 V
charge-pump output voltage −0.3 V
crystal (Q1) input voltage −0.3 V
CC
CC
V
V
serial data input/output voltage −0.3 6 V
serial clock input voltage −0.3 6 V
P7 to P0 input/output voltage −0.3 +16 V
prescaler input voltage −0.3 V
drive output voltage −0.3 V
CC
CC
V
V
P7 to P4 output current (open collector) −115mA
SDA output current (open collector) −15 mA
IC storage temperature range −40 +150 °C
maximum junction temperature − 150 °C
from junction to ambient in free air
DIL18 80 K/W
SO16 110 K/W
SO20 80 K/W
October 1992 9
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5511
CHARACTERISTICS
V
CC
= 5 V; T
= 25 °C, unless otherwise specified
amb
All pin numbers refer to DIL18 version
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Functional range
V
CC
T
amb
supply voltage range 4.5 − 5.5 V
operating ambient
−10 − +80 °C
temperature range
f input frequency 64 − 1300 MHz
N divider 256 − 32767
I
CC
f
XTAL
Z
I
supply current 25 35 50 mA
crystal oscillator frequency
range
crystal series resonance
resistance ≤ 150 Ω
3.2 4.0 4.48 MHz
input impedance (pin 2) −480 −400 −320 Ω
input level V
= 4.5 V to 5.5 V;
CC
T
= −10 to +80 °C;
amb
see typical sensitivity
curve Fig.6
f = 80 to 150 MHz 12/−25 − 300/2.6 mV/dBm
f = 150 to 1000 MHz 9/−28 − 300/2.6 mV/dBm
f = 1000 to 1300 MHz 40/−15 − 300/2.6 mV/dBm
R
I
prescaler input resistance
− 50 −Ω
(see Fig.7)
C
I
input capacitance − 2 − pF
Output ports (current-limited) P0 to P3
I
I
LO
sink
output leakage current VO = 13.5 V −−10 µA
output sink current VO = 12 V 0.7 1.0 1.5 mA
Output ports (open collector) P4 to P7 (see note 1)
I
LO
V
OL
output leakage current VO = 13.5 V −−10 µA
LOW level output voltage IOL = 10 mA; note 2 −−0.7 V
Input port P3
I
I
OH
OL
HIGH level input current VOH = 13.5 V −−10 µA
LOW level input current VOL = 0 V −10 −−µA
Input ports P4, P5 and P7
V
IL
V
IH
I
IH
I
IL
LOW level input voltage −−0.8 V
HIGH level input voltage 2.7 −−V
HIGH level input current VIH = 13.5 V −−10 µA
LOW level input current VIL = 0 V −10 −−µA
Input port P6
I
IH
I
IL
HIGH level input current VIH = 13.5 V −−10 µA
LOW level input current VIL = 0 V −10 −−µA
October 1992 10
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled
TSA5511
synthesizer
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SCL and SDA inputs
V
IH
V
IL
I
IH
I
IL
Output SDA (pin 4; open collector)
I
LO
V
O
Charge-pump output PD (pin 1)
I
OH
I
OL
V
1
I
1leak
Operational amplifier output UD (test mode T0 = 1)
V
18
V
18
G operational amplifier current
Notes to the characteristics
1. When a port is active, the collector voltage must not exceed 6 V.
2. Measured with a single open-collector port active.
HIGH level input voltage 3.0 − 5.5 V
LOW level input voltage −−1.5 V
HIGH level input current VIH = 5 V; VCC = 0 V −−10 µA
V
= 5 V; VCC = 5 V −−10 µA
IH
LOW level input current VIL = 0 V; VCC = 0 V −10 −−µA
V
= 0 V; VCC = 5 V −10 −−µA
IL
output leakage current VO = 5.5 V −−10 µA
output voltage IO = 3 mA −−0.4 V
HIGH level output current
CP = 1 90 220 300 µA
(absolute value)
LOW level output current
CP = 0 22 50 75 µA
(absolute value)
output voltage in-lock 1.5 − 2.5 V
off-state leakage current T0 = 1 −5 − 5nA
output voltage VIL = 0 V −−100 mV
output voltage when
OS = 1; VIL = 2 V −−200 mV
switched-off
gain;
I
/(I1 - I
18
1leak
OS = 0; VIL = 2 V;
I18 = 10 µA
)
2000 −−
October 1992 11
Page 12
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
TSA5511
October 1992 12
Fig.5 Typical application (DIL18).
Page 13
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5511
Fig.6 Prescaler typical input sensitivity curve; VCC = 4.5 to 5.5 V; T
= −10 to +80 °C.
amb
Fig.7 Prescaler Smith chart of typical input impedance; VCC= 5 V; reference value = 50 Ω.
October 1992 13
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Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5511
FLOCK FLAG DEFINITION (FL)
When the FL flag is 1, the maximum frequency deviation (∆f) from stable frequency can be expressed as follows:
∆f= K
⁄()ICPC1 C2+()×× C1 C2×()⁄±
VCOKO
Where:
K
I
K
VCO
CP
O
= oscillator slope (Hz/V)
= charge-pump current (A)
=4×10E6
C1 and C2 = loop filter capacitors (see Fig.8)
Fig.8 Loop filter.
FLOCK FLAG APPLICATION
• K
= 16 MHz/V (UHF band)
VCO
• ICP = 220 µA
• C1 = 180 nF
• C2 = 39 nF
•∆f = ± 27.5 kHz.
Table 5 Flock flag settings
MIN. MAX. UNIT
Time span between actual phase lock and FL-flag setting 1024 1152 µs
Time span between the loop losing lock and FL-flag resetting 0 128 µs
October 1992 14
Page 15
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
PACKAGE OUTLINES
DIP18: plastic dual in-line package; 18 leads (300 mil)
D
seating plane
L
Z
18
e
b
b
10
A
A
1
w M
1
b
2
TSA5511
SOT102-1
M
E
2
A
c
(e )
1
M
H
pin 1 index
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT102-1
12
min.
max.
IEC JEDEC EIAJ
b
1.40
1.14
0.055
0.044
b
1
0.53
0.38
0.021
0.015
b
2
0.32
1.40
0.23
1.14
0.013
0.055
0.009
0.044
REFERENCES
(1) (1)
cD E e M
21.8
21.4
0.86
0.84
9
6.48
6.20
0.26
0.24
E
(1)
Z
L
e
1
M
3.9
8.25
3.4
7.80
0.15
0.32
0.13
0.31
EUROPEAN
PROJECTION
E
0.37
0.33
H
9.5
8.3
w
max.
0.2542.54 7.62
0.854.7 0.51 3.7
0.010.10 0.30
0.0330.19 0.020 0.15
ISSUE DATE
93-10-14
95-01-23
October 1992 15
Page 16
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
9
TSA5511
SOT109-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0 2.5 5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.0100
0.019
0.0075
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
10.0
9.8
0.39
0.38
8
b
p
scale
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
w M
6.2
5.8
0.244
0.228
A
2
1.05
0.041
Q
A
1
detail X
1.0
0.7
0.4
0.6
0.028
0.039
0.020
0.016
(A )
L
p
L
0.25 0.1
0.25
0.01
0.01 0.004
A
3
θ
0.7
0.3
0.028
0.012
o
8
o
0
OUTLINE
VERSION
SOT109-1
IEC JEDEC EIAJ
076E07S MS-012AC
REFERENCES
October 1992 16
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
Page 17
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TSA5511
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A
2
2.45
2.25
0.096
0.089
A3b
0.25
0.01
p
0.49
0.36
0.019
0.014
cD
0.32
0.23
0.013
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1) (1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
0.055
A
1.4
1
detail X
1.1
1.1
1.0
0.4
0.043
0.043
0.039
0.016
(A )
L
p
L
0.25
0.01
A
3
θ
0.25 0.1
0.01
ywv θ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
October 1992 17
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 18
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the
stg max
TSA5511
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
October 1992 18
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Page 19
Philips Semiconductors Product specification
1.3 GHz Bidirectional I2C-bus controlled
TSA5511
synthesizer
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
October 1992 19
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