Datasheet TSA5055T-C2, TSA5055T-C3 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of November 1991
File under Integrated Circuits, IC02

1999 Aug 11

INTEGRATED CIRCUITS

TSA5055T

2.65 GHz bidirectional I

2

C-bus

controlled synthesizer

1999 Aug 11 2

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

FEATURES

• Complete 2.65 GHz single-chip system

• Low power 5 V, 60 mA

• I2C-bus programming

• In-lock flag

• Varicap drive disable

• Low radiation

• 5-level Analog to Digital Converter (ADC)

• Address selection for Picture-In-Picture (PIP),

DBS tuner, etc.

• 6 controllable outputs, 4 bidirectional

• Power-down flag

• Available in SOT109-1 (SO16) package

• Symmetrical or asymmetrical drive.

APPLICATIONS

• Satellite TV

• High IF cable tuning systems.

GENERAL DESCRIPTION

TheTSA5055Tisasingle-chipPLL frequencysynthesizer
designed for satellite TV tuning systems. It may be used
with a symmetrical input (pins 13 and 14) or with an
asymmetrical input (pin 13).

ControldataisenteredviatheI2C-bus;fiveserialbytesare
required to address the device, select the oscillator
frequency, program the six output ports and set the
charge-pumpcurrent.Fouroftheseportscanalsobe used
as input ports (three general purpose I/O ports, one ADC).
Digital information concerning these ports can be read out
of the TSA5055T on the SDA line (one status byte) during
a READ operation. A flag is set when the loop is ‘in-lock’
and is read during a READ operation. The device has one
fixed I2C-bus address and three programmable
addresses, programmed by applying a specific voltage to
port 3. The phase comparator operates at 7.8125 kHz
when a 4 MHz crystal is used.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

supply voltage 4.5 5 5.5 V

I

CC

supply current − 60 80 mA

f

RF

RF input frequency range 1 − 2.65 GHz

V

I (rms)

input voltage level (RMS value)

1 to 1.8 GHz 50 − 300 mV

1.8 to 2.65 GHz 70 − 300 mV

f

XTAL

crystal oscillator frequency 3.2 4 4.48 MHz

z

XTAL

crystal oscillator impedance (absolute value) 600 1000 −Ω

I

O

open-collector output current P7, P6, P5 and P4 −−10 mA
output current P3 and P0 − 1 − mA

T

amb

ambient temperature −20 − +85 °C

T

stg

storage temperature −40 − +150 °C

TYPE NUMBER

PACKAGE

NAME DESCRIPTION CODE

TSA5055T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1999 Aug 11 3

Philips Semiconductors Product specification

2.65 GHz bidirectional I

2

C-bus controlled

synthesizer

TSA5055T

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BLOCK DIAGRAM

handbook, full pagewidth

15-BIT

PROGRAMMABLE

DIVIDER

DIGITAL

PHASE

COMPARATOR

CHARGE-

PUMP

LOGIC

LATCH 3

CONTROL DATA

GATE

3

TTL LEVEL

COMPARATORS

3-BIT
ADC

ADDRESS

SELECTION

I

2

C-BUS

TRANSCEIVER

POWER DOWN

DETECTOR

15-BIT LATCH

DIVIDER RATIO

DIVIDER

N = 512

OSCILLATOR

4 MHz

TO CP

T1

SDA

SCL

Q1

Q2

RF

IN1

RF

IN2

7.8125 kHz

7-BIT LATCH

PORT INFORMATION

IN-LOCK

DETECTOR

P0 P3 P4 P5 P6 P7

f

REF

f

DIV

PRESCALER

16

PD

UD

TSA5055T

MBC307

OS

13
14

2

3

5

4

12

15

1

16

10

11 9

8

7

6

GND

V

CC

Fig.1 Block diagram.

1999 Aug 11 4

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

PINNING

SYMBOL PIN DESCRIPTION

PD 1 charge-pump output
Q1 2 crystal oscillator input 1
Q2 3 crystal oscillator input 2
SDA 4 serial data input/output
SCL 5 serial clock input
P7 6 port output/input (general

purpose)
P6 7 port output/input (ADC)
P5 8 port output/input (general

purpose)
P4 9 port output/input (general

purpose)
P3 10 port output (also used for address

selection)
P0 11 port output
V

CC

12 voltage supply

RF

IN1

13 RF signal input 1

RF

IN2

14 RF signal input 2 (decoupled)
GND 15 ground
UD 16 drive output

Fig.2 Pin configuration.

handbook, halfpage

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

TSA5055T

PD

Q1
Q2

SDA

SCL

P7
P6
P5

UD
GND
RF

IN2

RF

IN1

V

CC

P0
P3

P4

MBC304

FUNCTIONAL DESCRIPTION
General

The TSA5055T is controlled via the 2-wire I2C-bus. For
programming, there is one (7-bit) module address and the
R/W bit for selecting READ or WRITE mode.

WRITE mode: R/W=0; see Table 1
After the address transmission (first byte), data bytes can

be sent to the device. Four data bytes are needed to fully
program the TSA5055T. The bus transceiver has an
auto-incrementfacilitythatpermits the programming of the
TSA5055T within one single transmission (address + four
data bytes).

The TSA5055T can also be partly programmed on the
condition that the first data byte following the address is
byte 2 or byte 4.

The meaning of the bits in the data bytes is given in
Table 1. The first bit of the first data byte transmitted
indicates whether frequency data (first bit = 0) or
charge-pump and port information (first bit = 1) will follow.
Until an I2C-bus STOP condition is sent by the controller,
additional data bytes can be entered without the need to
re-address the device. This allows a smooth frequency
sweep for fine tuning. At power-on, the ports are set to the
high-impedance state.

The 7.8125 kHz reference frequency is obtained by
dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of the RF signal is first divided by 16,
thestepsizeis125 kHz. A 3.2 MHz crystal can offer a step
size of 100 kHz.

1999 Aug 11 5

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Table 1 Write data format; see notes 1 to 13

Notes

1. MA1 and MA0: programmable address bits (see Table 3).

2. A: Acknowledge bit.

3. N14 to N0: programmable divider bits.

4. N = N14 × 2

14

+ N13 × 213+ ... + N1 × 21+ N0.

5. CP: charge-pump current. CP = 0: 50 µA; CP = 1: 220 µA.

6. P7 to P4 = 1: open-collector outputs are active.

7. P7 to P3 and P0 = 0: outputs are in high-impedance state.

8. P3 and P0 = 1: current-limited outputs are active.

9. T1, T0 and OS = 0, 0 and 0: normal operation.

10. T1 = 1: P6 = f

REF

and P7 = f

DIV

.

11. T0 = 1: 3-state charge-pump.

12. OS = 1: Operational amplifier output is switched off (varicap drive disable).

13. X: don’t care.

BYTE MSB DATA BYTE LSB COMMAND

Address 11000MA1MA00Abyte1
Programmable divider 0 N14 N13 N12 N11 N10 N9 N8 A byte 2

N7 N6 N5 N4 N3 N2 N1 N0 A byte 3
Charge-pump and test bits 1 CP T1 T0 1 1 1 OS A byte 4
Output ports, control bits P7 P6 P5 P4 P3 X X P0 A byte 5

READ mode: R/W=1; see Table 2
Data can be read out of the TSA5055T by setting the R/W

bit to 1. After the slave address has been recognized, the
TSA5055T generates an Acknowledge signal (A) and the
first data byte (status byte) is transferred to the SDA line
(MSB first). Data is valid on the SDA line while the SCL
clock signal is HIGH.

A second data byte can be read out of the TSA5055T if the
processor generates an Acknowledge signal on the SDA
line. End of transmission will occur if the processor does
not send an Acknowledge signal.

The TSA5055T will then release the data line to allow the
processor to generate a STOP condition. When ports
P3 to P7 are used as inputs, they must be programmed to
their high-impedance state.

The POR flag (Power-On Reset) is set to 1 at power-on
and when VCC goes below 3 V. The flag is reset when an
end of data is detected by the TSA5055T (end of a READ
sequence). Control of the loop is made possible with the
in-lock flag FL, which indicates when the loop is
phase-locked (FL = 1).

1999 Aug 11 6

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Table 2 Read data format (see notes 1 to 5)

Notes

1. POR: Power-on reset flag (POR = 1 on power-on).

2. FL: in-lock flag (FL = 1 when the loop is phase-locked).

3. I2, I1 and I0: digital information for I/O ports P7, P5 and P4 respectively.

4. A2, A1 and A0: digital outputs of the 5-level ADC. Accuracy is1⁄2LSB (see Table 4).

5. MSB is transmitted first.

Bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4, respectively. A logic ‘0’ indicates a LOW level and
a logic ‘1’ a HIGH level (TTL levels). A built-in 5-level ADC is available at I/O port P6. This ADC can be used to feed AFC
information to the controller from the IF section of the receiver, as shown in Fig.4. The relationship between bits A2, A1,
A0 and the input voltage at port P6 is given in Table 4.

Table 3 Address selection

Address selection; see Table 3

The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several
synthesizers (up to three) in one system. The relationship between MA1 and MA0 and the input voltage at port P3 is
given in Table 3.

Table 4 ADC levels

BYTE MSB DATA BYTE LSB COMMAND

Address 11000MA1MA01Abyte1
Status byte POR FL I2 I1 I0 A2 A1 A0 − byte 2

MA1 MA0 VOLTAGE APPLIED ON PORT P3

0 0 0 to 0.1V

CC

0 1 always valid
1 0 0.4V

CC

to 0.6V

CC

1 1 0.9VCCto 13.5 V

A2 A1 A0 VOLTAGE APPLIED ON PORT P6

1 0 0 0.6V

CC

to V

CC

0 1 1 0.45VCCto 0.6V

CC

0 1 0 0.3VCCto 0.45V

CC

0 0 1 0.15VCCto 0.3V

CC

0 0 0 0 to 0.15V

CC

1999 Aug 11 7

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Fig.3 Symmetrical application diagram.

handbook, full pagewidth

FCE048

TSA5055T

P5

P6

P7

P4

P3

SCL

I2C-bus

4 MHz

18 pF

180 nF

IF signal

IF SECTION

AFC

OUTPUT

MICRO-

CONTROLLER

P0

39 nF

22 kΩ

SATELLITE

MIXER

OSCILLATOR

PART

oscillator

outputs

varicap

input

22 kΩ

1 nF

1 nF

BC847B

0.1 µF

V

T

+33 V

+5 V

+12 V

16

12

15

14

13

11

10

9

1

5

2

3

4

6

7

8

SDA

1999 Aug 11 8

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Fig.4 Asymmetrical application diagram.

handbook, full pagewidth

FCE049

TSA5055T

P5

P6

P7

P4

P3

SCL

I2C-bus

4 MHz

18 pF

180 nF

IF signal

IF SECTION

AFC

OUTPUT

MICRO-

CONTROLLER

P0

39 nF

22 kΩ

SATELLITE

MIXER

OSCILLATOR

PART

oscillator

output

varicap

input

22 kΩ

1 nF

10 nF

BC847B

0.1 µF

V

T

+33 V

+5 V

+12 V

16

12

15

14

13

11

10

9

1

5

2

3

4

6

7

8

SDA

1999 Aug 11 9

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

All pins withstand the ESD test in accordance with

“MIL-STD-883C”

, category A (1000 V).

THERMAL CHARACTERISTICS

CHARACTERISTICS

V

CC

= 5 V; T

amb

=25°C; unless otherwise specified.

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

supply voltage −0.3 +6 V

V

O(PD)

charge-pump (PD) output voltage −0.3 V

CC

V

V

I(Q1)

crystal (Q1) input voltage −0.3 V

CC

V

V

I/O(SDA)

serial data (SDA) input/output voltage −0.3 +6 V

V

I(SCL)

serial clock (SCL) input voltage −0.3 +6 V

V

I/O(P7-P0)

input/output ports (P7 to P3 and P0) voltage −0.3 +16 V

V

I(RFIN)

prescaler inputs (RF

IN1

and RF

IN2

) voltage −0.3 +2.5 V

V

O(UD)

drive output (UD) voltage −0.3 V

CC

V

I

O(P4-P7)

output ports (P7 to P4) current (open-collector) −1 +15 mA

I

O(SDA)

serial data (SDA) output current (open-collector) −1+5mA

T

stg

storage temperature −40 +150 °C

T

j

maximum junction temperature − 150 °C

SYMBOL PARAMETER CONDITIONS VALUE

UNIT

R

th(j-a)

from junction to ambient in free air 110 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

supply voltage range 4.5 5 5.5 V

T

amb

ambient temperature −20 − +85 °C

f

RF

RF input frequency range 1 − 2.65 GHz
N divider ratio 256 − 32767
I

CC

supply current − 60 80 mA
f

XTAL

crystal oscillator frequency 3.2 4 4.48 MHz
Z

XTAL

crystal oscillator impedance (pin 2) absolute value 600 1000 −Ω
V

XTAL(p-p)

drive level on pin 2 (quartz Philips

4322 143 04093) (peak-to-peak

value)

− 110 − mV

V

I(rms)

input voltage level (RMS value) VCC= 4.5 to 5.5 V;

T

amb

= −20 to +85 °C; see
typical sensitivity curve in
Fig.5

f = 1 to 1.8 GHz 50/−13 − 300/2.6 mV/dBm
f = 1.8 to 2.65 GHz 70/−10 − 300/2.6 mV/dBm

R

I

prescaler input impedance see Smith chart in Fig.6 − 50 −Ω

C

I

input capacitance − 2 − pF

1999 Aug 11 10

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Notes

1. When a port is active, the collector voltage must not exceed 6 V.

2. Measured with a single open-collector active.

Output ports P3 and P0 (current limited)

I

LO

leakage current Vo= 13.5 V −−10 µA

I

OS

output sink current Vo= 13.5 V 0.7 1 1.5 mA
Output ports P7 to P4 (open collector); see note 1
I

LO

leakage current Vo= 13.5 V −−10 µA
V

OL

output voltage LOW Io= 10 mA; note 2 −−0.7 V

Input ports P6 and P3

I

IH

input current HIGH VIH= 13.5 V −−10 µA
I

IL

input current LOW VIL=0V −10 −− µA

Input ports P7, P5 and P4

V

IH

input voltage HIGH 2.7 −− V
V

IL

input voltage LOW −−0.8 V
I

IH

input current HIGH VIH= 13.5 V −−10 µA
I

IL

input current LOW VIL=0V −10 −− µA

Bus inputs SCL and SDA

V

IH

input voltage HIGH 3 − 5.5 V
V

IL

input voltage LOW −−1.5 V
I

IH

input current HIGH VIH=5V; VCC=0V −−10 µA

V

IH

=5V; VCC=5V −−10 µA

I

IL

input current LOW VIL=0V; VCC=0V −10 −− µA

V

IL

=0V; VCC=5V −10 −− µA

Output SDA (open-collector)

I

OH

leakage current VOH= 5.5 V −−10 µA
V

OL

output voltage IOL=3mA −−0.4 V

Charge-pump output PD

I

OH

output current HIGH (absolute value) CP = 1 90 220 300 µA
I

OL

output current LOW (absolute value) CP = 0 22 50 75 µA
V

O

output voltage in-lock 1.5 − 2.5 V
I

O(leak)

off-state leakage current T0 = 1 −5 − +5 nA

Operational amplifier output UD (test mode: T0 = 1)

V

O

output voltage V

O(PD)

=0V −−100 mV

output voltage when switched off T0 = 1; OS = 1; V

O(PD)

=2V −−250 mV

h

FE

operational amplifier current gain T0 = 1, OS = 0; V

O(PD)

=2V

I

O(UD)

=10µA

2000 −−

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

OUD()

I

OPD()IO PD leak()

–

---------------------------------------------- -

1999 Aug 11 11

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Fig.5 Typical input sensitivity curve.

VCC= 5 V; T

amb

=25°C.

handbook, halfpage

0 800 1600 3200

9

−3

−27

−39

−15

FCE060

2400

−10 dBm

2650

f (MHz)

V

i

(dBm)

guaranteed

operating

area

Fig.6 Smith chart of typical input impedance.

VCC= 5 V; reference value = 50 Ω.

handbook, full pagewidth

0.2

0.5

1

2

5

10

∞

0.2

0.5

1

2

5

10

0

+ j

− j

FCE061

1 GHz

2 GHz

2.65 GHz

0.5 10.2 1052

1999 Aug 11 12

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

FLOCK FLAG DEFINITION (FL)

When the FL flag is 1, the maximum frequency deviation
(∆f) from stable frequency can be expressed as follows:

where:

K

VCO

= oscillator slope (Hz/V)
ICP= charge-pump current (A)
KO=4 ×10

6

C1 and C2 = loop filter capacitors.

∆f

K

VCO

K

O

--------------

ICP×

C1 C2+
C1 C2×

----------------------

×





±=

Fig.7 Loop filter.

handbook, halfpage

C1

C2

R

MGA032

Flock flag settings

Flock flag application

• K

VCO

= 50 MHz/V

• ICP= 220 µA

• C1 = 180 nF

• C2 = 39 nF

•∆f=±85.8 kHz.

PARAMETER

MIN. MAX. UNIT

Time span between actual phase lock and FL-flag setting 1024 1152 µs
Time span between the loop losing lock and FL-flag resetting 0 128 µs

1999 Aug 11 13

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

EQUIVALENT INPUT CIRCUITS

Fig.8 RF input amplifier.

13

14

RF

IN1

V

ref

RF

IN2

FCE051

600 Ω600 Ω

Fig.9 Current amplifier.

1

16PDUD

OS

FCE052

V

CC

V

ref

200 Ω

170 Ω

Fig.10 Input/output ports, pins 6 to 11.

(1) This resistor is implemented only for P0 and P3.
(2) These components are not implemented for P0.

FCE053

V

CC

6-11

(1)

(2)

(2)

(2)

4SDA

1 kΩ

FCE054

V

CC

Fig.11 I2C SDA.

1999 Aug 11 14

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Fig.12 I2C SCL.

5SCL

1 kΩ

FCE055

V

CC

Fig.13 Reference oscillator.

3Q2

FCE056

V

CC

2Q1

1999 Aug 11 15

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

PACKAGE OUTLINE

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

95-01-23
97-05-22

076E07S MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

1999 Aug 11 16

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

SOLDERING
Introduction to soldering surface mount packages

Thistextgives a very brief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) or printed-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Aug 11 17

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

1999 Aug 11 18

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1999 Aug 11 19

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled
synthesizer

TSA5055T

NOTES

© Philips Electronics N.V.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

67

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
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Middle East: see Italy

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Printed in The Netherlands 545004/25/03/pp20 Date of release: 1999 Aug 11 Document order number: 9397 750 05009