The TSA5055T is a single chip PLL
frequency synthesizer designed for
satellite TV tuning systems. Control
data is entered via the I2C-bus; five
serial bytes are required to address
the device, select the oscillator
frequency, program the six output
ports and set the charge-pump
current. Four of these ports can also
be used as input ports (3 general
purpose I/O ports, one A/D
converter). Digital information
concerning these ports can be read
out of the TSA5055T on the SDA line
(one status byte) during a READ
operation. A flag is set when the loop
is “in-lock” and is read during a READ
operation. The device has one fixed
I2C-bus address and 3 programmable
addresses, programmed by applying
a specific voltage to port 3. The phase
comparator operates at 7.8125 kHz
when a 4 MHz crystal is used.
12voltage supply
13UHF/VHF signal input 1
14UHF/VHF signal input 2 (decoupled)
TSA5055T
Fig.2 Pinning diagram.
FUNCTIONAL DESCRIPTION
The TSA5055T is controlled via the two-wire I2C-bus. For
programming, there is one module address (7 bits) and the
R/W bit for selecting READ or WRITE mode.
WRITE mode:
R/
W = 0 (see Table 1)
After the address transmission (first byte), data bytes can
be sent to the device. Four data bytes are needed to fully
program the TSA5055T. The bus transceiver has an
auto-increment facility that permits the programming of the
TSA5055T within one single transmission
(address + 4 data bytes).
The TSA5055T can also be partly programmed on the
condition that the first data byte following the address is
byte 2 or byte 4. The meaning of the bits in the data bytes
is given in Table 1. The first bit of the first data byte
transmitted indicates whether frequency data (first bit = 0)
or charge pump and port information (first bit = 1) will
follow. Until an I
2
C-bus STOP condition is sent by the
controller, additional data bytes can be entered without the
need to re-address the device. This allows a smooth
frequency sweep for fine tuning. At power-on, the ports are
set to the high impedance state.
The 7.8125 kHz reference frequency is obtained by
dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of the UHF/VHF signal is first divided by
16, the step size is 125 kHz. A 3.2 MHz crystal can offer a
step size of 100 kHz.
MA1, MA0 programmable address bits (see Table 4)
Aacknowledge bit
N14 to N0programmable divider bits
N = N14 × 2
CPcharge-pump current
CP = 050 µA
CP = 1220 µA
P7 - P4 = 1open-collector outputs are active
P7 - P0 = 0outputs are in high impedance state
P3 - P0 = 1current-limited outputs are active
T1, T0, OS = 0 0 0normal operation
T1 = 1, P6 = f
T0 = 13-state charge-pump
OS = 1operational amplifier output is switched off (varicap drive disable)
Xdon’t care.
14
+ N13 × 213+ ... + N1 × 21+N0
, P7 = f
ref
0N14N13N12N11N10N9N8Abyte 2
N7N6N5N4N3N2N1N0Abyte 3
1CPT1T0111OSAbyte 4
P7P6P5P4P3XXP0Abyte 5
DIV
TSA5055T
READ mode:
R/
W + 1 (see Table 2)
Data can be read out of the
TSA5055T by setting the R/W bit to 1.
After the slave address has been
recognized, the TSA5055T generates
an acknowledge pulse and the first
data byte (status word) is transferred
on the SDA line (MSB first). Data is
valid on the SDA line during a high
position of the SCL clock signal.
A second data byte can be read out of
the TSA5055T if the processor
generates an acknowledge on the
November 19916
SDA line. End of transmission will
occur if no acknowledge from the
processor occurs.The TSA5055T will
then release the data line to allow the
processor to generate a STOP
condition. When ports P3 to P7 are
used as inputs, they must be
programmed in their high-impedance
state.
The POR flag (power-on-reset) is set
to 1 when VCC goes below 3 V and at
power-on. It is reset when an end of
data is detected by the TSA5055T
(end of a READ sequence). Control of
the loop is made possible with the
in-lock flag FL, which indicates
(FL = 1) when the loop is
phase-locked.
The I2, I1 and I0 bits represent the
status of the I/O ports P7, P5 and P4
respectively. A logic '0' indicates a low
level and a logic '1' a high level (TTL
levels). A built-in 5-level A/D
converter is available at I/O port P6.
This converter can be used to feed
AFC information to the controller from
the IF section of the television, as
shown in Fig.3. The relationship
between bits A2, A1, A0 and the input
voltage at port P6 is given in Table 3.
Address11000MA1MA01Abyte 1
Status bytePORFLI1I1I0A2A1A0−byte 2
PORpower-on-reset flag. (POR = 1 on power-on)
FLin-lock flag (FL = 1 when the loop is phase-locked).
I2, I1, I0digital information for I/O ports P7, P5 and P4 respectively.
1
A2, A1, A0digital outputs of the 5-level A/D converter. Accuracy is
⁄2LSB (see Table 3).
MSB is transmitted first.
Address selection (see Table 4)
The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several
synthesizers (up to 3) in one system. The relationship between MA1 and MA0 and the input voltage at port P3 is given
in Table 4.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
TSA5055T
PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
November 199115
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