Datasheet TQ1089MC700, TQ1089MC500 Datasheet (TriQuint Semiconductor)

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T R I Q U I N T S E M I C O N D U C T O R , I N C .
1
SYSTEM TIMING
PRODUCTS
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TQ1089
11-Output Configurable Clock Buffer
Figure 1. Block Diagram
Output Buffers
VCO
Phase
Detector
VDD
Q10
Q9
GND
Q8
Q7
VDD
TEST
VDD
Q0
GND
Q1
Q2
VDD
FBIN GND REFCLK GND GND GND GND
GND Q3 Q4 VDD Q5 Q6 GND
1
2
14
13
12
11 10
9
8765
4
3
22212019
18
17
16
15
27
28
252423
26
MUX
Divide Logic
÷ 2
Group A
Group B
TriQuint’s TQ1089 is a configurable clock buffer which generates 11 outputs, operating over a wide range of frequencies from 65 MHz to 90 MHz and from 130 MHz to 180 MHz. The outputs are available at either 1x and 2x or at 1x and
1
/2 x the reference clock frequency, f
REF
. When one of the Group A outputs (Q0–Q8) is used as feedback to the PLL, all Group A outputs will be at f
REF
, and all Group B outputs (Q9, Q10) will be at 2x f
REF
. When one of the Group B outputs is used as feedback to the PLL, all Group A outputs will be at
1
/2 x f
REF
and all Group B outputs will be at f
REF
.
A very stable internal Phase-Locked Loop (PLL) provides low-jitter operation. This completely self-contained PLL requires no external capacitors or resistors. The PLL’s Voltage-Controlled Oscillator (VCO) has a frequency range from 260 MHz to 360 MHz. By feeding back one of the output clocks to FBIN, the PLL continuously maintains frequency and phase synchronization between the reference clock (REFCLK) and each of the outputs.
TriQuint’s patented output buffer design delivers a very low output-to­output skew of 150 ps (max). The TQ1089’s symmetrical TTL outputs are capable of sourcing and sinking 30 mA.
Features
• Wide frequency range: 65 MHz to 90 MHz and 130 MHz to 180 MHz
• Output configurations: eight outputs at f
REF
two outputs at 2x f
REF
or
nine outputs at
1
/2 x f
REF
one output at f
REF
• Low output-to-output skew: 150 ps (max) within a group
• Near-zero propagation delay –350 ps
+ 500 ps (max) or
–350 ps
+700 ps (max)
• TTL–compatible with 30 mA output drive
• 28–pin J–lead surface–mount package
• Ideal for PowerPC
–based
designs
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TQ1089
2
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In the test mode, the PLL is bypassed and REFCLK is connected directly to the Divide Logic block via the MUX, as shown in Figure 1. This mode is useful for debug and test purposes. The test mode is outlined in Table 2.
The maximum rise and fall time at the output pins is 1.4 ns. All outputs of the TQ1089 are TTL-compatible with 30 mA symmetric drive and a minimum V
OH
of 2.4 V.
Power Up/Reset Synchronization
After power up or reset, the PLL requires time before it achieves synchronization lock. The maximum time required for synchronization (TSYNC) is 500 ms.
Table 1. Frequency Mode Selection
Functional Description
The core of the TQ1089 is a Phase-Locked Loop (PLL) that continuously compares the reference clock (REFCLK) to the feedback clock (FBIN), maintaining a zero frequency difference between the two. Since one of the outputs is always connected to FBIN, the PLL keeps the propagation delay between the outputs and the reference clock within –350 ps
+500 ps for the
TQ1089–MC500, and within –350 ps
+700 ps for the
TQ1089–MC700.
The internal Voltage-Controlled Oscillator (VCO), has an operating range of 260 MHz to 360 MHz, as shown in Table 1. The combination of the VCO and the Divide Logic enables the TQ1089 to operate between 65 MHz and 90 MHz and from 130 MHz to 180 MHz.
Table 2. Test Mode Selection
Group A Group B
Test Mode Ref. Clock Outputs Q0–Q8 Outputs Q9, Q10
1 ÷ 2f
REF
f
REF
÷ 4f
REF
÷ 2␣
Output Reference Clock Output Frequency Range
Test Feedback Mode Frequency Range Group A: Q0–Q8 Group B: Q9,Q10
0 Group B ÷ 2 130 MHz – 180 MHz 65 MHz – 90 MHz 130 MHz – 180 MHz 0 Group A ÷ 4 65 MHz – 90 MHz 65 MHz – 90 MHz 130 MHz – 180 MHz
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TQ1089
3
SYSTEM TIMING
PRODUCTS
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Layout Guidelines
Multiple ground and power pins on the TQ1089 reduce ground bounce. Good layout techniques, however, are necessary to guarantee proper operation and to meet the specifications across the full operating range. TriQuint recommends bypassing each of the V
DD
supply pins to the nearest ground pin, as close to the chip as possible.
Figure 2 shows the recommended power layout for the TQ1089. The bypass capacitors should be located on the same side of the board as the TQ1089. The V
DD
traces connect to an inner-layer VDD plane. All of the ground pins (GND) are connected to a small ground plane on the surface beneath the chip. Multiple through holes connect this small surface plane to an inner-layer ground plane. The capacitors (C1–C5) are 0.1 mF. TriQuint’s test board uses X7R temperature-stable capacitors in 1206 SMD cases.
C4
C5
C1
C2
C3
Pin 1
Pin 15
Ground
Plane
V
DD
V
DD
V
DD
V
DD
V
DD
Figure 2. Top Layer Layout of Power Pins
(Approx. 3.3x)
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TQ1089
4
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Limits
4
Symbol Description Test Conditions Min Typ Max Unit
V
OHT
Output HIGH voltage VDD= Min IOH= –30 mA 2.4 3.4 V
VIN= VIH or V
IL
V
OHC
Output HIGH voltage VDD= Min IOH= –1 mA 3.2 4.1 V
VIN= VIH or V
IL
V
OL
Output LOW voltage VDD= Min IOL = 30 mA 0.27 0.5 V
VIN= VIH or V
IL
V
IH
5
Input HIGH level Guaranteed input logical HIGH 2.0 V
Voltage for all Inputs
V
IL
5
Input LOW level Guaranteed input logical LOW 0.8 V
Voltage for all inputs
I
IL
Input LOW current VDD= Max VIN = 0.40 V –156 –400 µA
I
IH
Input HIGH current VDD= Max VIN = 2.7 V 0 25 µA
I
I
Input HIGH current VDD= Max VIN = 5.5 V 2 1000 µA
I
DDS
6
Power supply current VDD= Max 119 170 mA
V
I
Input clamp voltage VDD= Min IIN = –18 mA –0.70 –1.2 V
Notes: 1. Exceeding these parameters may damage the device.
2. Maximum ambient temperature with device not switching and unloaded.
3. These values apply to both TQ1089-MC500 and TQ1089-MC700.
4. Typical limits are at V
DD
= 5.0 V and TA = 25 °C.
5. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
6. This parameter is measured with device not switching and unloaded.
7. These parameters are not 100% tested, but are periodically sampled.
Symbol Description Test Conditions Min Typ Max Unit
C
IN
3,7
Input capacitance VIN = 2.0 V at f = 1 MHz 6 pF
(VDD = +5 V + 5%, TA = 0 °C to +70 °C)
3
Absolute Maximum Ratings
1
DC Characteristics
Capacitance
Storage temperature –65 °C to +150 °C Ambient temperature with power applied
2
–55 °C to +100 °C
Supply voltage to ground potential –0.5 V to +7.0 V DC input voltage –0.5 V to +(VDD + 0.5)V DC input current –30 mA to +5 mA Package thermal resistance (MQuad) θJA = 45 °C/W Die junction temperature TJ = 150 ° C␣ ␣
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TQ1089
5
SYSTEM TIMING
PRODUCTS
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Symbol Input Clock (REFCLK) Test Conditions (Figure 3)
1
Min Typ Max Unit
t
CPWH
CLK pulse width HIGH Figure 4 3 --- ns
t
CPWL
CLK pulse width LOW Figure 4 3 --- ns
t
IR
Input rise time (0.8 V - 2.0V) 2.0 ns
AC Characteristics
Notes: 1. All measurements are tested with a REFCLK having a rise time of 0.5 ns (0.8 V to 2.0 V).
2. The PLL maintains alignment of CLK and FBIN at all times. This specification applies to the rising edge only because the input duty cycle can vary while the output duty cycle is typically 50/50. The delay t
PD
is measured at the 1.5 V level between CLK and FBIN.
3. Skew
specifies the width of the window in which outputs switch, and is measured at 1.5 V.
4. This specification represents the deviation from 50/50 on the outputs.
5. Jitter specifications refer to peak-to-peak value. t
JR
is the jitter on the output with respect to the reference clock.
t
JP
is the jitter on the output with respect to the output’s previous rising edge.
6. t
SYNC
is the time required for the PLL to synchronize; this assumes the presence of a CLK signal and
a connection from one of the outputs to FBIN.
Figure 3. AC Test Circuit
Notes:
Q0 Q1 Q2
Q10
FBIN
CLK
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
R1
R2
+5 V
Y
X
50
Z
Z
R1 = 160 R2 = 71 Y + Z = X
Symbol Output Clocks (Q0–Q10) Test Conditions (Figure 3)
1
Min Typ Max Unit
t
OR,t OF
Rise/fall time (0.8 V – 2.0V) Figure 4 350 1400 ps
t
PD1
2
CLK to FBIN (TQ1089-MC500) Figure 4 –850 –350 +150 ps
t
PD2
2
CLK to FBIN (TQ1089-MC700) Figure 4 –1050 –350 +350 ps
t
SKEW1
3
Rise–rise, fall–fall (within group) Figure 5 60 150 ps
t
SKEW2
3
Rise–rise, fall–fall (group-to-group, aligned) Figure 6 (skew 2 takes into account skew 1) 75 350 ps
t
SKEW3
3
Rise-rise, fall-fall (group-to-group, non-aligned) Figure 7 (skew 3 takes into account skews 1, 2) — 650 ps
t
SKEW4
3
Rise–fall, fall–rise Figure 8 (skew 4 takes into account skew 3) 1200 ps
t
CYC
4
Duty-cycle Variation Figure 4 –1000 0 +1000 ps
t JP
5
Period-to-Period Jitter Figure 4 80 200 ps
t JR
5
Random Jitter Figure 4 190 400 ps
t
SYNC
6
Synchronization Time 10 500 µs
(VDD = +5 V + 5%, TA = 0 °C to +70 °C)
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TQ1089
6
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Figure 5. t
SKEW1
Switching Waveforms
t
PD1,2
t
JR
t
CPW
(INDIVIDUALLY)
REFCLK
FBIN
Q0 – Q10
t
CPW
t
PERIOD
t
JP
Figure 4. General Timing
t
SKEW4 =
Period
2
– t
=
Period
4
– t
=
Period
4
– t
t
3
t
4
Group A
Group B
Period =
1
f
REFCLK
t
2
f = f
f = 2x f
REF
REF
2
3
4
Figure 8. t
SKEW4
Figure 7. t
SKEW3
t
1
Group B
Period =
1
f
REFCLK
t
SKEW3 =
Period
2
– t
f = 2x f
REF
1
Figure 6. t
SKEW2
t
SKEW1
t
SKEW1
Group A
Group A
Group B
Group B
t
SKEW1 tSKEW1
t
SKEW2
Group A
Group B
(For Group A Feedback)
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TQ1089
7
SYSTEM TIMING
PRODUCTS
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28-Pin MQuad Pin Description
Pin # Pin Name Description I/O
1 GND Ground — 2 Q9 Output Clock 9 (B1) O 3 Q10 Output Clock 10 (B2) O 4 VDD +5 V — 5 GND Ground — 6 GND Ground — 7 GND Ground — 8 GND Ground
9 REFCLK Reference Clock I 10 GND Ground — 11 FBIN Feedback In I 12 TEST Test I 13 VDD +5 V — 14 Q0 Output Clock 0 (A1) O
Pin # Pin Name Description I/O
15 GND Ground — 16 Q1 Output Clock 1 (A2) O 17 Q2 Output Clock 2 (A3) O 18 VDD +5 V — 19 GND Ground — 20 Q3 Output Clock 3 (A4) O 21 Q4 Output Clock 4 (A5) O 22 VDD +5 V — 23 Q5 Output Clock 5 (A6) O 24 Q6 Output Clock 6 (A7) O 25 GND Ground — 26 VDD +5 V — 27 Q7 Output Clock 7 (A8) O 28 Q8 Output Clock 8 (A9) O
28-Pin MQuad J-Leaded Package Mechanical Specification
PIN 1
.050 TYP.
NON-ACCUM.
.445 ±.005
.490 ±.005
.445
±.005
.490
±.005
.045
X 45°°
.132 ±.005
.050 TYP.
.410
±.015
.018
.104
±.005
.172 ±.005
8
15
22
.445
±.005
.040 MIN
.015
X 45°°
0.125
VENT PLUG
.028
.060
(All dimensions are in inches)
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TQ1089
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Figure 10. IOL vs.V
OL
0.0 1.0 2.0 3.0 4.0 5.0
Volts
160
140
120
100
80
60
40
20
0
I (mA)
OL
V max
OL
V min
OL
LOW
V
OL
IOL min (mA) IOL max (mA)
–2.5 –145 –435 –2.0 –135 –410 –1.5 –115 –350 –1.0 –90 –265 –0.5 –40 –120
0.0 0 0
0.5 37 97
1.0 49 140
1.5 53 155
2.0 54 157
2.5 54 159
3.0 54 160
3.5 54 160
4.0 54 160
4.5 54 160
5.0 54 160
10.0 54 160
Table 5. IOL vs.V
OL
These output characteristics are provided for modelling purposes only. TriQuint does not guarantee the information in these tables and figures.
Output Characteristics
The IV characteristics, transition times, package characteristics, device and bond wire characteristics for the TQ1089 are describedin Tables 4 through 9 and Figures 9 through 11.
Figure 9. IOH vs.V
OH
0.0 1.0 2.0 3.0 4.0 5.0
Volts
0
-20
-40
-60
-80
-100
-120
-140
-160
I (mA)
OH
V max
OH
V min
OH
HIGH
Table 4. IOH vs.V
OH
V
OH
IOH min (mA) IOH max (mA)
0.0 –70 –160
0.5 –70 –157
1.0 –68 –152
1.5 –65 –142
2.0 –59 –130
2.5 –48 –106
3.0 –29 –79
3.5 0 –42
4.0 0 0
4.5 0 0
5.0 0 0
5.5 40 120
6.0 90 265
6.5 115 350
7.0 135 410
7.5 145 435
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TQ1089
9
SYSTEM TIMING
PRODUCTS
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Diode to GND␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣ Diode Stack to VDD
V I (mA) V I (mA)
0.0 0 5.0 0 –0.4 0 5.4 0 –0.5 0 5.5 0 –0.6 –5 5.6 5 –0.7 –15 5.7 15 –0.8 –35 5.8 35 –0.9 –55 5.9 55 –1.0 –75 6.0 75 –2.0 –300 7.0 300 –2.5 –350 7.5 350 –3.0 –360 8.0 360
Note: TriQuint does not guarantee diode operation for purposes
other than ESD protection.
Table 6. Above-VDD and Below-GroundCharacteristics Table 9. Rise and Fall Times
(Into 0 pF, 50 Ohms to 1.5 V)
Figure 11. Output Model
C2
DIE
C1
L2L1
OUTPUT
Time (ns) TR min (V) TR max (V) TF min (V) TF max (V)
0.0 0.15 0.32 3.20 3.04
0.1 0.15 0.32 3.20 3.04
0.2 0.16 0.32 3.06 2.95
0.3 0.18 0.32 2.86 2.90
0.4 0.23 0.32 2.62 2.68
0.5 0.26 0.32 2.38 2.50
0.6 0.34 0.32 2.17 2.36
0.7 0.46 0.34 2.00 2.22
0.8 0.67 0.39 1.85 2.09
0.9 0.89 0.49 1.69 1.95
1.0 1.12 0.63 1.52 1.86
1.1 1.32 0.86 1.38 1.68
1.2 1.50 1.09 1.26 1.59
1.3 1.73 1.27 1.12 1.49
1.4 1.93 1.45 0.96 1.36
1.5 2.15 1.64 0.83 1.23
1.6 2.75 2.23 0.52 0.95
1.7 2.58 2.00 0.61 1.00
1.8 2.75 2.23 0.52 0.95
1.9 2.90 2.41 0.45 0.91
2.0 3.02 2.50 0.39 0.86
2.1 3.12 2.64 0.33 0.77
2.2 3.17 2.77 0.29 0.73
2.3 3.19 2.86 0.24 0.68
2.4 3.20 2.95 0.21 0.64
2.5 3.20 2.99 0.19 0.59
2.6 3.20 3.02 0.17 0.55
2.7 3.20 3.02 0.16 0.53
2.8 3.20 3.04 0.16 0.50
2.9 3.20 3.04 0.15 0.45
3.0 3.20 3.04 0.15 0.41
3.1 3.20 3.04 0.15 0.40
3.2 3.20 3.04 0.15 0.37
3.3 3.20 3.04 0.15 0.36
3.4 3.20 3.04 0.15 0.32
3.5 3.20 3.04 0.15 0.32
L1 C1
2 nH 10 pF
Table 7. Device and Bond-Wire Characteristics
(Estimated)
L2 C2
1.85 nH 0.40 pF
Table 8. 28-Pin MQuad Package Characteristics
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TQ1089
10
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Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint:
Web: www.triquint.com Tel: (503) 615-9000 Email: sales@tqs.com Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: applications@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1997 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.1.A November 1997
Ordering Information
To order, please specify as shown below:
TQ1089-MC nnn
11-Output Configurable Clock Buffer
Propagation delay skew:
500
–350 ps ± 500 ps
700
–350 ps ± 700 ps
Temperature range: 0 °C to 70 °C (Commercial)
Package: MQuad
Note: All parts are marked as MC500. MC700 parts have a “2” added to the marking.
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