Datasheet tps51275 Datasheet (Texas Instruments)

Page 1
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013
Dual Synchronous, Step-Down Controller with 5-V and 3.3-V LDOs
1

FEATURES

2
Input Voltage Range: 5 V to 24 V
Output Voltages: 5 V and 3.3 V (Adjustable Tablet Computers Range ±10%)
Built-in, 100-mA, 5-V and 3.3-V LDOs
Clock Output for Charge-Pump
±1% Reference Accuracy
Adaptive On-Time D-CAP™ Mode Control Architecture with 300-kHz and 355-kHz Frequency Setting
Auto-skip Light Load Operation (TPS51275, and TPS51275C)
OOA Light Load Operation (TPS51275B)
Internal 0.8-ms Voltage Servo Soft-Start
Low-Side R
Built-In Output Discharge Function
Separate Enable Input for Switchers
Dedicated OC Setting Terminals
Power Good Indicator
OVP, UVP and OCP Protection
Non-Latch UVLO and OTP Protection
20-Pin, 3 mm x 3 mm, QFN (RUK)
ORDERABLE ENABLE
DEVICE NUMBER FUNCTION
TPS51275RUKR Tape and Reel 3000 TPS51275RUKT Mini reel 250
TPS51275BRUKR Tape and Reel 3000 TPS51275BRUKT Mini reel 250
TPS51275CRUKR Tape and Reel 3000
TPS51275CRUKT Mini reel 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Current Sensing Scheme
DS(on)
EN1 and EN2 OOA
NEED SOME SPACE
ORDERING INFORMATION
SKIP MODE ALWAYS On-LDO PACKAGE QUANTITY
Auto-skip VREG3
VREG3 and VREG5
Auto-skip

APPLICATIONS

DESCRIPTION

The TPS51275, TPS51275B and TPS51275C are cost-effective, dual-synchronous buck controllers targeted for notebook system-power supply solutions. It provides 5-V and 3.3-V LDOs and requires few external components. The 260-kHz VCLK output can be used to drive an external charge pump, generating gate drive voltage for the load switches without reducing the main converter efficiency. The TPS51275, TPS51275B and TPS51275C supports high efficiency, fast transient response and provides a combined power-good signal. Adaptive on-time, D­CAP™ control provides convenient and efficient operation. The device operates with supply input voltage ranging from 5 V to 24 V and supports output voltages of 5.0 V and 3.3 V. The TPS51275, TPS51275B and TPS51275C are available in a 20­pin, 3 mm x 3 mm, QFN package and is specified from –40°C to 85°C.
(1)
OUTPUT SUPPLY
PLASTIC Quad
Flat Pack
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2D-CAP is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
Page 2
VIN
VBST1
TPS51275B/C
DRVH1
SW1
DRVL1
VO1
VFB1
CS1
EN1EN-5V
VCLK
VREG5
V
IN
V
OUT
5 V
V
OUT
15 V
VBST2
DRVH2
SW2
DRVL2
VFB2
CS2
EN2
PGOOD
VREG3
EN 3.3 V
V
OUT
3.3 V
PGOOD
3.3-V Always ON
UDG-12091
1 mF
5 V Always ON
1 mF
VIN
VBST1
TPS51275
DRVH1
SW1
DRVL1
VO1
VFB1
CS1
EN1EN-5V
VCLK
VREG5
V
IN
V
OUT
5 V
V
OUT
15 V
VBST2
DRVH2
SW2
DRVL2
VFB2
CS2
EN2
PGOOD
VREG3
EN 3.3 V
V
OUT
3.3 V
PGOOD
3.3-V Always ON
UDG-12090
1 mF
5 V
1 mF
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

TYPICAL APPLICATION DIAGRAM (TPS51275)

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TYPICAL APPLICATION DIAGRAM (TPS51275B and TPS51275C)

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Page 3
TPS51275, TPS51275B, TPS51275C
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ABSOLUTE MAXIMUM RATINGS

(1)
SLUSB45B –JUNE 2012–REVISED MARCH 2013
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN MAX
VBST1, VBST2 –0.3 32 VBST1, VBST2
(3)
–0.3 6
SW1, SW2 –6.0 26
Input voltage
(2)
VIN –0.3 26 V EN1, EN2 –0.3 6 VFB1, VFB2 –0.3 3.6 VO1 –0.3 6 DRVH1, DRVH2 –6.0 32
(3) (3)
(pulse width < 20 ns) –2.5 6
–0.3 6
Output voltage
DRVH1, DRVH2 DRVH1, DRVH2
(2)
DRVL1, DRVL2 –0.3 6 V DRVL1, DRVL2 (pulse width < 20 ns) –2.5 6 PGOOD, VCLK, VREG5 –0.3 6 VREG3, CS1, CS2 –0.3 3.6
Electrostatic discharge kV
Junction temperature, T Storage temperature, T
HBM QSS 009-105 (JESD22-A114A) 2 CDM QSS 009-147 (JESD22-C101B.01) 1
J
ST
150 °C –55 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal unless otherwise noted (3) Voltage values are with respect to SW terminals.
UNIT

THERMAL INFORMATION

TPS51275
(1)
θ
θ
θ
ψ
ψ
θ
JA JCtop JB
JT JB
JCbot
THERMAL METRIC
Junction-to-ambient thermal resistance 94.1 Junction-to-case (top) thermal resistance 58.1 Junction-to-board thermal resistance 64.3 Junction-to-top characterization parameter 31.8 Junction-to-board characterization parameter 58.0 Junction-to-case (bottom) thermal resistance 5.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
TPS51275B TPS51275C
20-PIN RUK
UNITS
°C/W
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TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Supply voltage VIN 5 24
VBST1, VBST2 –0.1 30 VBST1, VBST2 SW1, SW2 –5.5 24 V
Input voltage
(1)
EN1, EN2 –0.1 5.5 VFB1, VFB2 –0.1 3.5 VO1 –0.1 5.5 DRVH1, DRVH2 –5.5 30 DRVH1, DRVH2
Output voltage
(1)
DRVL1, DRVL2 –0.1 5.5 V PGOOD, VCLK, VREG5 –0.1 5.5 VREG3, CS1, CS2 –0.1 3.5
Operating free-air temperature, T
(1) All voltage values are with respect to the network ground terminal unless otherwise noted. (2) Voltage values are with respect to the SW terminal.
(2)
(2)
A
–0.1 5.5
–0.1 5.5
–40 85 °C
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Page 5
TPS51275, TPS51275B, TPS51275C
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ELECTRICAL CHARACTERISTICS

over operating free-air temperature range, V noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
SUPPLY CURRENT
I
VIN1
I
VIN2
I
VO1
I
VIN(STBY)
I
VIN(STBY)
INTERNAL REFERENCE
V
FBx
VREG5 OUTPUT
V
VREG5
I
VREG5
R
V5SW
VREG3 OUTPUT
V
VREG3
I
VREG3
DUTY CYCLE and FREQUENCY CONTROL
f
sw1
f
SW2
t
OFF(MIN)
MOSFET DRIVERS
R
DRVH
R
DRVL
t
D
INTERNAL BOOT STRAP SWITCH
R
VBST (ON)
I
VBSTLK
CLOCK OUTPUT
R
VCLK (PU)
R
VCLK (PD)
f
CLK
(1) Ensured by design. Not production tested.
VIN supply current-1 TA= 25°C, No load, V VIN supply current-2 TA= 25°C, No load 30 μA VO1 supply current TA= 25°C, No load, V VIN stand-by current TPS51275 TA= 25°C, No load, V
VIN stand-by current 180 μA
VFB regulation voltage
VREG5 output voltage V
VREG5 current limit V 5-V switch resistance TA= 25°C, V
VREG3 output voltage V
VREG3 current limit V
CH1 frequency CH2 frequency
(1) (1)
Minimum off-time TA= 25°C 200 300 500 ns
DRVH resistance Ω
DRVL resistance Ω
Dead time ns
Boost switch on-resistance TA= 25°C, I VBST leakage current TA= 25°C 1 µA
VCLK on-resistance (pull-up) TA= 25°C 10 VCLK on-resistance (pull-down) TA= 25°C 10 Clock frequency TA= 25°C 260 kHz
SLUSB45B –JUNE 2012–REVISED MARCH 2013
= 12 V, V
VIN
TA= 25°C, No load, V TPS51275B/C)
= 5 V, V
VO1
= V
VFB1
=0 V 860 μA
VO1
= V
VFB1
= 0 V, V
VO1
=0 V, V
VO1
= 2 V, V
VFB2
=2.05 V 900 μA
VFB2
= V
EN1
EN2
=0V (
EN1=VEN2
= V
EN1
= 3.3 V (unless otherwise
EN2
= 0 V 95 μA
TA= 25°C 1.99 2.00 2.01 V
1.98 2.00 2.02 V
TA= 25°C, No load, V V
> 7 V , V
VIN
V
VIN
V
VIN VO1
No load, V V
VIN
5.5 V < V
VO1
> 5.5 V , V > 5 V, V
VO1
= 0 V, V
VREG5 VO1
= 0 V, TA= 25°C 3.267 3.300 3.333
VO1
> 7 V , V
VO1
, V
VIN
0°C TA≤ 85°C, V I
< 35 mA
VREG3
0°C TA≤ 85°C, V I
< 35 mA
VREG3
V
> 5 V, V
VIN VO1
TA= 25°C, V TA= 25°C, V
Source, (V Sink, (V Source, (V Sink, V
VO1
= 0 V, V
VREG3
VIN VIN
VBST
– VSW) = 0.25 V, (V
DRVH
VREG5
= 0.25 V, V
DRVL
= 0 V 4.9 5.0 5.1
VO1
= 0 V, I
= 0 V, I
VO1
= 0 V, I
= 4.5 V, V
= 5 V, I
= 0 V, I
= 0 V, I
VO1
VIN
VIN
= 0 V, I
= 3.0 V, V
< 100 mA 4.85 5.00 5.10
VREG5
< 35 mA 4.85 5.00 5.10
VREG5
< 20 mA 4.50 4.75 5.10
VREG5
= 7 V 100 150 mA
VIN
= 50 mA 1.8 Ω
VREG5
< 100 mA 3.217 3.300 3.383
VREG3
< 35 mA 3.234 3.300 3.366
VREG3
> 5.5 V, V
> 5.5 V, V
VREG3
= 0 V,
VO1
VO1
= 5 V,
3.267 3.300 3.333
3.267 3.300 3.333
< 35 mA 3.217 3.300 3.366
= 7 V 100 150 mA
VIN
= 20 V 240 300 360 kHz = 20 V 280 355 430 kHz
– V
– V
DRVH
DRVL
) = 0.25 V, (V
) = 0.25 V, V
= 5 V 0.9
VREG5
– VSW) = 5 V 3.0
VBST
– VSW) = 5 V 1.9
VBST
= 5 V 3.0
VREG5
DRVH-off to DRVL-on 12 DRVL-off to DRVH-on 20
= 10 mA 13 Ω
VBST
Ω
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TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013

ELECTRICAL CHARACTERISTICS

over operating free-air temperature range, V noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
OUTPUT DISCHARGE
R
DIS1
R
DIS2
R
DIS2
SOFT START OPERATION
t
SS
t
SSRAMP
POWER GOOD
V
PGTH
I
PGMAX
I
PGLK
t
PGDEL
CURRENT SENSING
I
CS
TC
CS
V
CS
V
ZC
LOGIC THRESHOLD
V
ENX(ON)
V
ENX(OFF)
I
EN
OUTPUT OVERVOLTAGE PROTECTION
V
OVP
t
OVPDLY
OUTPUT UNDERVOLTAGE PROTECTION
V
UVP
t
UVPDLY
t
UVPENDLY
UVLO
V
UVL0VIN
V
UVLO5
V
UVLO3
OVER TEMPERATURE PROTECTION
T
OTP
CH1 discharge resistance 35 Ω CH2 discharge resistance TPS51275 TA= 25°C, V CH2 discharge resistance 70 Ω
Soft-start time From ENx="Hi" and V Soft-start time (ramp-up) V
PG threshold
PG sink current V PG leak current V PG delay From PG lower threshold (95%=typ) to PG flag high 0.7 ms
CS source current TA= 25°C, VCS= 0.4 V 9 10 11 μA CS current temperature coefficient
(1)
CS Current limit setting range 0.2 2 V Zero cross detection offset TA= 25°C –1 1 3 mV
EN threshold high-level SMPS on level 1.6 V EN threshold low-level SMPS off level 0.3 V EN input current V
OVP trip threshold 112.5% 115.0% 117.5% OVP propagation delay TA= 25°C 0.5 µs
UVP trip Threshold 55% 60% 65% UVP prop delay 250 µs UVP enable delay From ENx ="Hi", V
VIN UVLO Threshold
VREG5 UVLO Threshold
VREG3 UVLO Threshold
OTP threshold
(1)
= 12 V, V
VIN
TA= 25°C, V V
EN1
TA= 25°C, V (TPS51275B/C)
OUT
= 5 V, V
VO1
= V
EN2
= 0% to V
VO1
= 0 V
SW2 SW2
OUT
VFB1
= 0.5 V
= 0.5 V, V = 0.5 V, V
VREG5
= 95%, V
= V
= 2 V, V
VFB2
= V
EN1 EN1
> V
= 0 V 75 Ω
EN2
= V
= 0 V
EN2
to V
UVLO5
VREG5
OUT
= 5 V 0.78 ms
= V
EN1
= 3.3 V (unless otherwise
EN2
= 95% 0.91 ms
Lower (rising edge of PG-in) 92.5% 95.0% 97.5% Hysteresis 5% Upper (rising edge of PG-out) 107.5% 110.0% 112.5% Hysteresis 5%
= 0.5 V 6.5 mA
PGOOD
= 5.5 V 1 µA
PGOOD
On the basis of 25°C 4500 ppm/°C
= 3.3 V –1 1 µA
ENx
= 5 V 1.35 ms
VREG5
Wake up 4.58 V Hysteresis 0.5 V Wake up 4.38 4.50 V Hysteresis 0.4 V Wake up 3.15 V Hysteresis 0.15 V
Shutdown temperature 155 Hysteresis 10
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°C
(1) Ensured by design. Not production tested.
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Page 7
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
17
1819
20
TPS51275
TPS51275B
Thermal Pad
TPS51275C
CS1
VFB1
VREG3
VFB2
CS2
EN2
SW2
VBST2
DRVH2
DRVL2
VIN
VREG5
VO1
DRVL1
DRVH1
VBST1
SW1
VCLK
EN1
TPS51275, TPS51275B, TPS51275C
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SLUSB45B –JUNE 2012–REVISED MARCH 2013

DEVICE INFORMATION

RUK PACKAGE
20 PINS
(TOP VIEW)
PIN FUNCTIONS
PIN NO.
TPS51275 TPS51275B TPS51275C
Supply input for high-side MOSFET (bootstrap terminal). Connect capacitor from this pin to SW terminal.
Voltage feedback Input
Power conversion voltage input. Apply the same voltage as drain voltage of high-side MOSFETs of channel 1 and channel 2.
NAME I/O DESCRIPTION
CS1 1 O Sets the channel 1 OCL trip level. CS2 5 O Sets the channel 2OCL trip level. DRVH1 16 O High-side driver output DRVH2 10 O High-side driver output DRVL1 15 O Low-side driver output DRVL2 11 O Low-side driver output EN1 20 I Channel 1 enable. EN2 6 I Channel 2 enable. PGOOD 7 O Power good output flag. Open drain output. Pull up to external rail via a resistor SW1 18 O Switch-node connection. SW2 8 O Switch-node connection. VBST1 17 I VBST2 9 I VCLK 19 O Clock output for charge pump. VFB1 2 I VFB2 4 I
VIN 12 I VO1 14 I Output voltage input, 5-V input for switch-over.
VREG3 3 O 3.3-V LDO output. VREG5 13 O 5-V LDO output. Thermal pad GND terminal, solder to the ground plane
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Page 8
VIN
VBST1
TPS51275 TPS51275 B TPS51275 C
DRVH1
SW1
DRVL1
VO1
VFB1
CS1
EN1
VCLK
VREG5
VBST2
DRVH2
SW2
DRVL2
VFB2
CS2
EN2
PGOOD
VREG3
UDG-12092
+ +
+
+
+
155°C/145°C
+
4.5 V/4.0 V
VO_OK
EN
FAULT
REF
PGOOD
DCHG
VIN VDDVDRV
GNDPGND
Switcher
Controller
(CH1)
EN
FAULT
REF
PGOOD
DCHG
VINVDD VDRV
GND PGND
Switcher
Controller
(CH2)
+
2 V
Osc
GND
(Thermal Pad)
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013

FUNCTIONAL BLOCK DIAGRAM (TPS51275/B/C)

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Page 9
DCHG
SW
TPS51275 TPS51275 B
NOC
ZC
XCON
VO_OK
DRVL
PWM
Control Logic
UDG-12093
+
+
V
REF
+15%
+
+
SKIP
UV
OV
V
REF
–40%
+
VIN
GND
REF
One-Shot
Discharge
10 µA
VBST
DRVH
FAULT
PGOOD
CS
+
VFB
OC
+
+
SS Ramp Comp
V
REF
+5%/10 %
V
REF
–5%/10%
+
+
EN
VDD
HS
LS
VDRV
PGND
PGOOD
TPS51275 C
TPS51275, TPS51275B, TPS51275C
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SWITCHER CONTROLLER BLOCK DIAGRAM

SLUSB45B –JUNE 2012–REVISED MARCH 2013
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Page 10
( )
( )
- ´
= ´
´ ´
IN OUT OUT
OUT LL
SW IN
V V V
1
I
2 L f V
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
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DETAILED DESCRIPTION

PWM Operations

The main control loop of the switch mode power supply (SMPS) is designed as an adaptive on-time pulse width modulation (PWM) controller. It supports a proprietary D-CAP™ mode. D-CAP™ mode does not require external conpensation circuit and is suitable for low external component count configuration when used with appropriate amount of ESR at the output capacitor(s).
At the beginning of each cycle, the synchronous high-side MOSFET is turned on, or enters the ON state. This MOSFET is turned off, or enters the ‘OFF state, after the internal, one-shot timer expires. The MOSFET is turned on again when the feedback point voltage, V
, decreased to match the internal 2-V reference. The inductor
VFB
current information is also monitored and should be below the overcurrent threshold to initiate this new cycle. By repeating the operation in this manner, the controller regulates the output voltage. The synchronous low-side (rectifying) MOSFET is turned on at the beginning of each OFF state to maintain a minimum of conduction loss. The low-side MOSFET is turned off before the high-side MOSFET turns on at next switching cycle or when inductor current information detects zero level. This enables seamless transition to the reduced frequency operation during light-load conditions so that high efficiency is maintained over a broad range of load current.

Adaptive On-Time/ PWM Frequency Control

Because the TPS51275/B/C does not have a dedicated oscillator for control loop on board, switching cycle is controlled by the adaptive on-time circuit. The on-time is controlled to meet the target switching frequency by feed-forwarding the input and output voltage into the on-time one-shot timer. The target switching frequency is varied according to the input voltage to achieve higher duty operation for lower input voltage application. The switching frequency of CH1 (5-V output) is 300 kHz during continuous conduction mode (CCM) operation when VIN= 20 V. The CH2 (3.3-V output) is 355 kHz during CCM when VIN= 20 V. (See Figure 27 and Figure 28).
To improve load transient performance and load regulation in lower input voltage conditions, TPS51275/B/C can extend the on-time. The maximum on-time extension of CH1 is 4 times for CH2 is 3 times. To maintain a reasonable inductor ripple current during on-time extension, the inductor ripple current should be set to less than half of the OCL (valley) threshold. (See Step 2. Choose the Inductor). The on-time extension function provides high duty cycle operation and shows better DC (static) performance. AC performance is determined mostly by the output LC filter and resistive factor in the loop.

Light Load Condition in Auto-Skip Operation (TPS51275/C)

The TPS51275/C automatically reduces switching frequency during light-load conditions to maintain high efficiency. This reduction of frequency is achieved smoothly and without an increase in output voltage ripple. A more detailed description of this operation is as follows. As the output current decreases from heavy-load condition, the inductor current is also reduced and eventually approaches valley zero current, which is the boundary between continuous conduction mode and discontinuous conduction mode. The rectifying MOSFET is turned off when this zero inductor current is detected. As the load current further decreases, the converter runs in discontinuous conduction mode and it takes longer and longer to discharge the output capacitor to the level that requires the next ON cycle. The ON time is maintained the same as that in the heavy-load condition. In reverse, when the output current increase from light load to heavy load, the switching frequency increases to the preset value as the inductor current reaches to the continuous conduction. The transition load point to the light load operation I
OUT(LL)
as shown in Equation 1.
where
fSWis the PWM switching frequency (1)
Switching frequency versus output current during light-load conditions is a function of inductance (L), input voltage (VIN) and output voltage (V I
.
OUT(LL)
(i.e. the threshold between continuous and discontinuous conduction mode) can be calculated
), but it decreases almost proportional to the output current from the
OUT
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= £
p ´ ´
SW
0
OUT
f
1
f
2 ESR C 4
R1
R2
Voltage
Divider
+
VFB
+
VREF
PWM
Control
Logic
and
Divider
L
ESR
C
OUT
V
C
R
LOAD
I
IND
I
OUT
UDG-1211 1
I
C
Switching Modulator
Output
Capacitor
V
OUT
TPS51275 TPS51275B TPS51275C
V
IN
DRVH
DRVL
TPS51275, TPS51275B, TPS51275C
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SLUSB45B –JUNE 2012–REVISED MARCH 2013

Light-Load Condition in Out-of-Audio™ Operation (TPS51275B)

Out-of-Audio™ (OOA) light-load mode is a unique control feature that keeps the switching frequency above acoustic audible frequencies toward a virtual no-load condition. During Out-of-Audio™ operation, the OOA control circuit monitors the states of both high-side and low-side MOSFETs and forces them switching if both MOSFETs are off for more than 40 µs. When both high-side and low-side MOSFETs are off for 40 µs during a light-load condition, the operation mode is changed to FCCM. This mode change initiates one cycle of the low­side MOSFET and the high-side MOSFET turning on. Then, both MOSFETs stay turned off waiting for another 40 µs.
Table 1. SKIP Mode Operation (TPS51275/B/C)
SKIP MODE OPERATION
TPS51275 Auto-skip TPS51275B OOA TPS51275C Auto-skip

D-CAP™ Mode

From small-signal loop analysis, a buck converter using D-CAP™ mode can be simplified as shown in Figure 1.
The output voltage is compared with internal reference voltage after divider resistors, R1 and R2. The PWM comparator determines the timing to turn on the high-side MOSFET. The gain and speed of the comparator is high enough to keep the voltage at the beginning of each ON cycle substantially constant. For the loop stability, the 0dB frequency, ƒ0, defined in Equation 2 must be lower than 1/4 of the switching frequency.
As ƒ0is determined solely by the output capacitor characteristics, the loop stability during D-CAP™ mode is determined by the capacitor chemistry. For example, specialty polymer capacitors have output capacitance in the order of several hundred micro-Farads and ESR in range of 10 milli-ohms. These yield an f0value on the order of 100 kHz or less and the loop is stable. However, ceramic capacitors have ƒ0at more than 700 kHz, which is not suitable for this operational mode.
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Figure 1. Simplifying the Modulator
(2)
Page 12
VIN-UVLO_threshold
EN_threshold
95% of V
OUT
95% of Vout
EN_threshold
VIN
VREG3
EN1
VREG5
5-V V
OUT
PGOOD
EN2
Soft-Start Time (tSS)
Soft-Start Time
(t
SS(ramp)
)
Soft-Start Time (tSS)
Soft-Start Time
(t
SS(ramp)
)
PGOOD
Delay t
PGDEL
3.3-V V
OUT
UDG-12013
VREG5-UVLO_threshold
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
www.ti.com

Enable and Powergood

VREG3 is an always-on regulator (TPS51275), VREG3/VREG5 are always-on regulators (TPS51275B/C), when the input voltage is beyond the UVLO threshold it turns ON. VREG5 is turned ON when either EN1 or EN2 enters the ON state (TPS51275). The VCLK signal initiates when EN1 enters the ON state (TPS51275/B/C). Enable states are shown in Table 2 through Table 3.
Table 2. Enabling/PGOOD State (TPS51275)
EN1 EN2 VREG5 VREG3 CH1 (5Vout) CH2 (3.3Vout) VCLK PGOOD
OFF OFF OFF ON OFF OFF OFF Low
ON OFF ON ON ON OFF ON Low
OFF ON ON ON OFF ON OFF Low
ON ON ON ON ON ON ON High
Table 3. Enabling/PGOOD State (TPS51275B/C)
EN1 EN2 VREG5 VREG3 CH1 (5Vout) CH2 (3.3Vout) VCLK PGOOD
OFF OFF ON ON OFF OFF OFF Low
ON OFF ON ON ON OFF ON Low
OFF ON ON ON OFF ON OFF Low
ON ON ON ON ON ON ON High
12 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Figure 2. TPS51275 Timing
Page 13
VIN-UVLO_threshold
95% of V
OUT
95% of Vout
EN_threshold
VIN
VREG3
VREG5
5-V V
OUT
PGOOD
EN2
Soft-Start Time (tSS)
Soft-Start Time
(t
SS(ramp)
)
Soft-Start Time (tSS)
Soft-Start Time
(t
SS(ramp)
)
PGOOD
Delay t
PGDEL
3.3-V V
OUT
UDG-12015
EN_threshold
EN1
2.4 V
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013
Figure 3. TPS51275B/C Timing
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Page 14
( )
( )
( )
( )IND ripple
IN OUT OUT
TRIP TRIP
OCP
SW IN
DS on DS on
I
V V V
V V
1
I
R 2 R 2 L f V
- ´
= + = + ´
´ ´
CS CS
TRIP
R I
V 1 mV
8
´
= +
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
www.ti.com

Soft-Start and Discharge

The TPS51275/B/C operates an internal, 0.8-ms, voltage servo soft-start for each channel. When the ENx pin becomes higher than the enable threshold voltage, an internal DAC begins ramping up the reference voltage to the PWM comparator. Smooth control of the output voltage is maintained during start-up. When ENx becomes lower than the lower level of threshold voltage, TPS51275/B/C discharges outputs using internal MOSFETs through VO1 (CH1) and SW2 (CH2).

VREG5/VREG3 Linear Regulators

There are two sets of 100-mA standby linear regulators which output 5 V and 3.3 V, respectively. The VREG5 pin provides the current for the gate drivers. The VREG3 pin functions as the main power supply for the analog circuitry of the device. VREG3 is an Always ON LDO and TPS51275B/C has Always ON VREG5. (See Table 2 and Table 3)
Add ceramic capacitors with a value of 1 µF or larger (X5R grade or better) placed close to the VREG5 and VREG3 pins to stabilize LDOs.
The VREG5 pin switchover function is asserted when three conditions are present:
CH1 internal PGOOD is high
CH1 is not in OCL condition
VO1 voltage is higher than VREG5-1V In this switchover condition three things occur:
the internal 5-V LDO regulator is shut off
the VREG5 output is connected to VO1 by internal switchover MOSFET
VREG3 input pass is changed from VIN to VO1

VCLK for Charge Pump

The 260-kHz VCLK signal can be used in the charge pump circuit. The VCLK signal becomes available when EN1 is on state. The VCLK driver is driven by VO1 voltage. In a design that does not require VCLK output, leave the VCLK pin open.

Overcurrent Protection

TPS51275/B/C has cycle-by-cycle over current limiting control. The inductor current is monitored during the OFF state and the controller maintains the OFF state during the inductor current is larger than the overcurrent trip level. In order to provide both good accuracy and cost effective solution, TPS51275/B/C supports temperature compensated MOSFET R setting resistor, RCS. The CSx pin sources CS current (ICS) which is 10 µA typically at room temperature, and the CSx terminal voltage (VCS= RCS× ICS) should be in the range of 0.2 V to 2 V over all operation temperatures.  The trip level is set to the OCL trip voltage (V
The inductor current is monitored by the voltage between GND pin and SWx pin so that SWx pin should be connected to the drain terminal of the low-side MOSFET properly.The CS pin current has a 4500 ppm/°C temperature slope to compensate the temperature dependency of the R current sensing node so that GND should be connected to the source terminal of the low-side MOSFET.
As the comparison is done during the OFF state, V current at the overcurrent threshold, I
In an overcurrent condition, the current to the load exceeds the current to the output capacitor thus the output voltage tends to fall down. Eventually, it ends up with crossing the undervoltage protection threshold and shutdown both channels.
sensing. The CSx pin should be connected to GND through the CS voltage
DS(on)
) as shown in Equation 3.
TRIP
. GND is used as the positive
DS(on)
sets the valley level of the inductor current. Thus, the load
, can be calculated as shown in Equation 4.
OCP
TRIP
(3)
(4)
14 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Page 15
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013

Output Overvoltage/Undervoltage Protection

TPS51275/B/C asserts the overvoltage protection (OVP) when VFBx voltage reaches OVP trip threshold level. When an OVP event is detected, the controller changes the output target voltage to 0 V. This usually turns off DRVH and forces DRVL to be on. When the inductor current begins to flow through the low-side MOSFET and reaches the negative OCL, DRVL is turned off and DRVH is turned on. After the on-time expires, DRVH is turned off and DRVL is turned on again. This action minimizes the output node undershoot due to LC resonance. When the VFBx reaches 0V, the driver output is latched as DRVH off, DRVL on. The undervoltage protection (UVP) latch is set when the VFBx voltage remains lower than UVP trip threshold voltage for 250 µs or longer. In this fault condition, the controller latches DRVH low and DRVL low and discharges the outputs. UVP detection function is enabled after 1.35 ms of SMPS operation to ensure startup.

Undervoltage Lockout (UVLO) Protection

TPS51275/B/C has undervoltage lock out protection at VIN, VREG5 and VREG3. When each voltage is lower than their UVLO threshold voltage, both SMPS are shut-off. They are non-latch protections.

Over-Temperature Protection

TPS51275/B/C features an internal temperature monitor. If the temperature exceeds the threshold value (typically 155°C), TPS51275/B/C is shut off including LDOs. This is non-latch protection.
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Page 16
V
VOUT
V
REF
(2)
t
ON
t
OFF
Slope (2)
Jitter
20 mV
Slope (1)
Jitter
UDG-12012
V
REF
+Noise
(1)
( )
OUT SW
IND ripple
V 20 mV (1 D) 20mV L f
ESR
2 V I 2 V
´ ´ - ´ ´
= =
´
( )
( )
( )
(
)
( )
IN OUT OUT
max
TRIP
IND peak
SW IN
DS on max
V V V
V
1
I
R L f V
- ´
= + ´
´
( )
( )
(
)
( ) ( )
( )
(
)
- ´ - ´
= ´ = ´
´ ´
IN OUT OUT IN OUT OUT
max max
SW IN OUT SW IN(max)
IND ripple max max
V V V V V V
1 3
L
I f V I f V
( )
OUT RIPPLE
V 0.5 V 2.0
R1 R2
2.0
- ´ -
= ´
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
www.ti.com

External Components Selection

The external components selection is relatively simple for a design using D-CAP™ mode.

Step 1. Determine the Value of R1 and R2

The recommended R2 value is between 10 kΩ and 20 kΩ. Determine R1 using Equation 5.
(5)

Step 2. Choose the Inductor

The inductance value should be determined to give the ripple current of approximately 1/3 of maximum output current and less than half of OCL (valley) threshold. Larger ripple current increases output ripple voltage, improves signal/noise ratio, and helps ensure stable operation.
(6)
The inductor also needs to have low DCR to achieve good efficiency, as well as enough room above peak inductor current before saturation. The peak inductor current can be estimated as shown in Equation 7.
(7)

Step 3. Choose Output Capacitor(s)

Organic semiconductor capacitor(s) or specialty polymer capacitor(s) are recommended. Determine ESR to meet required ripple voltage. A quick approximation is as shown in Equation 8.
where
D as the duty-cycle factor
the required output ripple voltage slope is approximately 20 mV per tSW(switching period) in terms of VFB terminal (8)
Figure 4. Ripple Voltage Slope and Jitter Performance
16 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Page 17
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013

Layout Considerations

Good layout is essential for stable power supply operation. Follow these guidelines for an efficient PCB layout.

Placement

Place voltage setting resistors close to the device pins.
Place bypass capacitors for VREG5 and VREG3 close to the device pins.

Routing (Sensitive analog portion)

Use small copper space for VFBx. There are short and narrow traces to avoid noise coupling.
Connect VFB resistor trace to the positive node of the output capacitor. Routing inner layer away from power traces is recommended.
Use short and wide trace from VFB resistor to vias to GND (internal GND plane).

Routing (Power portion)

Use wider/shorter traces of DRVL for low-side gate drivers to reduce stray inductance.
Use the parallel traces of SW and DRVH for high-side MOSFET gate drive in a same layer or on adjoin layers, and keep them away from DRVL.
Use wider/ shorter traces between the source terminal of the high-side MOSFET and the drain terminal of the low-side MOSFET
Thermal pad is the GND terminal of this device. Five or more vias with 0.33-mm (13-mils) diameter connected from the thermal pad to the internal GND plane should be used to have strong GND connection and help heat dissipation.
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 17
Page 18
0
2
4
6
8
10
12
14
16
18
20
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
CS Source Current (µA)
G005
210
220
230
240
250
260
270
280
290
300
310
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
VCLK Frequency (kHz)
G006
0
25
50
75
100
125
150
175
200
225
250
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
VIN Stand−By Current (µA)
TPS51275 TPS51275B/C
G004
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
VO1 Supply Current 1 (mA)
G003
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
VIN Supply Current 1 (mA)
G001
0
10
20
30
40
50
60
−40 −25 −10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C)
VIN Supply Current 2 (µA)
G002
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013

TYPICAL CHARACTERISTICS

Figure 5. VIN Supply Current 1 vs. Junction Temperature Figure 6. VIN Supply Current 2 vs. Junction Temperature
www.ti.com
Figure 7. VO1 Supply Current 1 vs. Junction Temperature Figure 8. VIN Stand-By Current vs. Junction Temperature
18 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Figure 9. CS Source Current vs. Junction Temperature Figure 10. Clock Frequency vs. Junction Temperature
Page 19
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
Efficiency (%)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 14.8 V
V = 20 V
C002
IN
IN
IN
IN
Out-of-Audio V
VOUT2
= 3.3 V
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10 Output Current (A)
Efficiency (%)
V
VIN
= 7.4 V
V
VIN
= 11.1 V
V
VIN
= 14.8 V
V
VIN
= 20 V
V
VOUT2
= 3.3 V
G000
Auto-Skip
4.85
4.90
4.95
5.00
5.05
5.10
5.15
0.001 0.01 0.1 1 10
Output Voltage (V)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 14.8 V
V = 20 V
C003
IN
IN
IN
IN
Out-of-Audio V
VOUT1
= 5 V
4.85
4.90
4.95
5.00
5.05
5.10
5.15
0.001 0.01 0.1 1 10 Output Current (A)
Output Volage (V)
V
VIN
= 7.4 V
V
VIN
= 11.1 V
V
VIN
= 14.8 V
V
VIN
= 20 V
V
VOUT1
= 5 V
G014
Auto-Skip
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
Efficiency (%)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 14.8 V
V = 20 V
Out-of-Audio V
VOUT1
= 5 V
C001
IN
IN
IN
IN
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10 Output Current (A)
Efficiency (%)
V
VIN
= 7.4 V
V
VIN
= 11.1 V
V
VIN
= 14.8 V
V
VIN
= 20 V
V
VOUT1
= 5 V
G000
Auto-Skip
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013
TYPICAL CHARACTERISTICS (continued)
Figure 11. Efficiency vs. Output Current Figure 12. Efficiency vs. Output Current
Figure 13. Load Regulation Figure 14. Load Regulation
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 19
Figure 15. Efficiency vs. Output Current Figure 16. Efficiency vs. Output Current
Page 20
0
50
100
150
200
250
300
350
400
450
500
0.001 0.01 0.1 1 10
Switching Frequency (kHz)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 20 V
C006
Out-of-Audio V
OUT2
= 3.3 V
IN
IN
IN
0
50
100
150
200
250
300
350
400
450
0.001 0.01 0.1 1 10 Output Current (A)
Switching Frequency (kHz)
V
VIN
= 7.4 V
V
VIN
= 12.6 V
V
VIN
= 20 V
V
VOUT2
= 3.3 V
G000
Auto-Skip
0
50
100
150
200
250
300
350
400
450
500
0.001 0.01 0.1 1 10
Switching Frequency (kHz)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 20 V
C005
Out-of-Audio V
OUT1
= 5 V
IN
IN
IN
0
50
100
150
200
250
300
350
0.001 0.01 0.1 1 10 Output Current (A)
Switching Frequency (kHz)
V
VIN
= 7.4 V
V
VIN
= 12.6 V
V
VIN
= 20 V
V
VOUT1
= 5 V
G000
Auto-Skip
3.20
3.25
3.30
3.35
3.40
0.001 0.01 0.1 1 10
Output Voltage (V)
Output Current (A)
V = 7.4 V
V = 11.1 V
V = 14.8 V
V = 20 V
C004
IN
IN
IN
IN
Out-of-Audio V
VOUT2
= 3.3 V
3.20
3.25
3.30
3.35
3.40
0.001 0.01 0.1 1 10 Output Current (A)
Output Volage (V)
V
VIN
= 7.4 V
V
VIN
= 11.1 V
V
VIN
= 14.8 V
V
VIN
= 20 V
V
VOUT2
= 3.3 V
G014
Auto-Skip
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013
TYPICAL CHARACTERISTICS (continued)
Figure 17. Load Regulation Figure 18. Load Regulation
www.ti.com
Figure 19. Switching Frequency vs. Output Current Figure 20. Switching Frequency vs. Output Current
Figure 21. Switching Frequency vs. Output Current Figure 22. Switching Frequency vs. Output Current
20 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Page 21
0
50
100
150
200
250
300
350
400
450
500
5 10 15 20 25
Input Voltage (V)
Switching Frequency (kHz)
V
OUT1
= 5 V
I
OUT1
= 6 A
G000
0
50
100
150
200
250
300
350
400
450
500
5 10 15 20 25
Input Voltage (V)
Switching Frequency (kHz)
V
OUT2
= 3.3 V
I
OUT2
= 6 A
G000
V
OUT1
(100 mV/div)
SW1 (10 V/div )
V
OUT2
( 100 mV/div )
Time (100 µs /div)
I
IND1
(5 A/div)
I
OUT1:
0 A ßà 3 A
I
OUT2
= 0 A
V
VIN
= 7 .4 V
Time (100 µs /div)
V
OUT1
(100 mV/div)
SW 2 (10 V /div)
V
OUT2
(100 mV/div)
I
IND2
(5 A/div)
I
OUT1
= 0 A
I
OUT2
: 0 A ßà 3 A
V
VIN
= 7 .4 V
V
OUT1
(2 V/div)
PGOOD (5 V/div)
V
OUT2
(2 V/div)
Time (400 µs/div)
EN1 = EN2 (5 V/div)
V
OUT1
(2 V/div)
EN1 = EN2 (5 V/div)
V
OUT2
(2 V/div)
PGOOD (5 V/div)
Time (10 ms/div)
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013
TYPICAL CHARACTERISTICS (continued)
Figure 23. Start-Up Figure 24. Output Discharge
Figure 25. 5-V Load Transient Figure 26. 3.3-V Load Transient
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 21
Figure 27. Switching Frequency vs. Input Voltage Figure 28. Switching Frequency vs. Input Voltage
Page 22
VIN
VBST1
U1
TPS51275
TPS51275 B
TPS51275 C
DRVH1
SW1
12
17
16
18
0.1 µF
L1
C1
15 kW
DRVL115
VO114
VFB12
CS11
EN1
20
30.9 k W
10 kW
EN 5V
0.1 µF
0.1 µF
VCLK19
VREG513
10 µF x 2
V
IN
V
OUT
5 V to 6 A
Charge-pump Output
VBST2
DRVH2
SW2
9
10
8
DRVL2
11
VFB2
4
CS2 5
EN2
6
PGOOD
7
VREG3
3
10 µF x 2
0.1 µF
L2
C2
13 kW
33.2 kW
20 kW
EN 3.3 V
1 µF
V
OUT
3.3 V to 7A
PGOOD
VREG (3.3-V LDO)
UDG-12094
Q2
Q1
0.1 µF
GND
0.1 µF
VREG5 (5-V LDO)
1 µF
D1
6.8 W 8.2 W
TPS51275, TPS51275B, TPS51275C
SLUSB45B –JUNE 2012–REVISED MARCH 2013

APPLICATION DIAGRAM (TPS51275/TPS51275B/TPS51275C)

www.ti.com
Table 4. Key External Components (APPLICATION DIAGRAM (TPS51275/TPS51275B/TPS51275C))
REFERENCE
DESIGNATOR
L1 Output Inductor (5-V L2 Output Inductor (3.3-V C1 Output Capacitor (5-V
C2 Output Capacitor (3.3-V Q1 MOSFET (5-V Q2 MOSFET (3.3-V
22 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
FUNCTION MANUFACTURER PART NUMBER
) Alps GLMC3R303A
OUT
) Alps GLMC2R203A
OUT
) SANYO 6TPE220MAZB x 2
OUT
) SANYO 6TPE220MAZB x 2
OUT
) TI CSD87330Q3D
OUT
) TI CSD87330Q3D
OUT
Page 23
TPS51275, TPS51275B, TPS51275C
www.ti.com
SLUSB45B –JUNE 2012–REVISED MARCH 2013

REVISION HISTORY

Changes from Original (JUNE 2011) to Revision A Page
Changed typographical error in V
Added V
specification in ELECTRICAL CHARACTERISTICS table ............................................................................ 5
VREG3
Changed updated inductor values in APPLICATION DIAGRAM (TPS51275/TPS51275B/TPS51275C) and Table 4 ...... 22
Changes from Revision A (September 2012) to Revision B Page
Changed revision date From A Septemer 2012 to B March 2013. Also added device TPS51275B to Part number .......... 1
Added (TPS151275/B/C) to Auto-skip ListItem in the FEATURES ...................................................................................... 1
Added new OOA ListItem to FEATURES ............................................................................................................................. 1
Changed TPS51275/C TO TPS51275/B/C globally ............................................................................................................. 1
Changed the ORDERING INFORMATION table. ................................................................................................................. 1
Changed the device number from TPS51275C TO TPS51275B/C in the elec chara table 2 places .................................. 5
Added TPS51275B to the PIN NO. column .......................................................................................................................... 7
Added OOA section after the Auto-Skip section ................................................................................................................. 11
Changed the APPLICATION DIAGRAM. ............................................................................................................................ 22
condition in ELECTRICAL CHARACTERISTICS table .......................................... 5
VREG3
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 23
Page 24
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device Status
HPA02239RUKR ACTIVE WQFN RUK 20 3000 Green (RoHS
TPS51275BRUKR ACTIVE WQFN RUK 20 3000 Green (RoHS
TPS51275BRUKT ACTIVE WQFN RUK 20 250 Green (RoHS
TPS51275CRUKR ACTIVE WQFN RUK 20 3000 Green (RoHS
TPS51275CRUKT ACTIVE WQFN RUK 20 250 Green (RoHS
TPS51275RUKR ACTIVE WQFN RUK 20 3000 Green (RoHS
TPS51275RUKT ACTIVE WQFN RUK 20 250 Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 51275
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 1275B
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 1275B
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 1275C
CU NIPDAU Level-2-260C-1 YEAR -40 to 125 1275C
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 51275
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 51275
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Samples
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
www.ti.com
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
15-Apr-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
TPS51275BRUKR WQFN RUK 20 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
TPS51275BRUKT WQFN RUK 20 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS51275CRUKR WQFN RUK 20 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS51275CRUKT WQFN RUK 20 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
TPS51275RUKR WQFN RUK 20 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
TPS51275RUKT WQFN RUK 20 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
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PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2015
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS51275BRUKR WQFN RUK 20 3000 367.0 367.0 35.0 TPS51275BRUKT WQFN RUK 20 250 210.0 185.0 35.0 TPS51275CRUKR WQFN RUK 20 3000 367.0 367.0 35.0 TPS51275CRUKT WQFN RUK 20 250 210.0 185.0 35.0
TPS51275RUKR WQFN RUK 20 3000 367.0 367.0 35.0
TPS51275RUKT WQFN RUK 20 250 210.0 185.0 35.0
Pack Materials-Page 2
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