Datasheet TPCA8023-H Datasheet

Page 1
TPCA8023-H
A
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSⅤ-H)
TPCA8023-H
High-Efficiency DC/DC Converter Applications
Notebook PC Applications
• Small footprint due to a small and thin package
• High-speed switching
• Small gate charge: Q
• Low drain-source ON-resistance: R
• High forward transfer admittance: |Y
• Low leakage current: I
• Enhancement mode: Vth = 1.5 to 2.5 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings
Characteristic Symbol Rating Unit
Drain-source voltage
Drain-gate voltage (RGS = 20 kΩ)
Gate-source voltage
Drain current
Drain power dissipation (Tc=25℃) PD 30 W
Drain power dissipation (t = 10 s)
(Note 2a)
Drain power dissipation (t = 10 s)
(Note 2b)
Single-pulse avalanche energy
Avalanche current IAR 21 A
Repetitive avalanche energy
(Tc=25℃) (Note 4)
Channel temperature
Storage temperature range
= 5.0 nC (typ.)
SW
DS (ON)
= 10 μA (max) (VDS = 30 V)
DSS
(Ta = 25°C)
DC (Note 1) ID 21
Pulsed (Note 1) I
(Note 3)
= 9.8 mΩ (typ.)
| = 47 S (typ.)
fs
V
30 V
DSS
V
30 V
DGR
V
±20 V
GSS
63
DP
P
2.8 W
D
P
1.6 W
D
57 mJ
E
AS
E
2.9 mJ
AR
T
150 °C
ch
T
−55 to 150 °C
stg
A
Unit: mm
0.5±0.1 8
6.0±0.3
5.0±0.2
1
0.95±0.05
S
1,2,3:SOURCE 4:GATE 5,6,7,8:DRAIN
5.0±0.2
0.05 S
1
0.6±0.1
4.25±0.2
0.05 M
5
0.15±0.05
4
0.595
A
0.166±0.05
1.1±0.2
4
3.5±0.2
58
0.8±0.1
0.4±0.1
1.27
JEDEC ―
JEITA ―
TOSHIBA 2-5Q1A
Weight: 0.069 g (typ.)

Circuit Configuration

8 6
1 2 3
7 5
4
Note: For Notes 1 to 4, refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.
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Page 2

Thermal Characteristics

Characteristic Symbol Max Unit
TPCA8023-H
Thermal resistance, channel to case
(Tc=25℃)
Thermal resistance, channel to ambient
(t = 10 s) (Note 2a)
Thermal resistance, channel to ambient
(t = 10 s) (Note 2b)
R
R
R
4.17 °C/W
th (ch-c)
44.6 °C/W
th (ch-a)
78.1 °C/W
th (ch-a)
Marking
(Note 5)
8023-H
※
Type TPCA
Lot No.
Note 1: The channel temperature should not exceed 150°C during use
Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(a)
Note 3: V
= 24 V, Tch = 25°C (initial), L = 100 μH, RG = 25 Ω, IAR = 21 A
DD
Note 4: Repetitive rating: pulse width limited by max. channel temperature
Note 5:
* Weekly code: (Three digits)
Week of manufacture (01 for first week of year, continuing up to 52 or 53)
Year of manufacture (The last digit of the calendar year)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(b)
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Page 3
TPCA8023-H
<
∼
∼
∼
∼
Electrical Characteristics
Characteristic Symbol Test Condition Min Typ. Max Unit
Gate leakage current I
Drain cutoff current I
Drain-source breakdown voltage
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 1.5 ⎯ 2.5 V
Drain-source ON-resistance R
Forward transfer admittance |Yfs| VDS = 10 V, ID = 11 A 23.5 47 ⎯ S
Input capacitance C
Reverse transfer capacitance C
Output capacitance C
Gate resistance Rg VDS = 10 V, VGS = 0 V, f = 5 MHz ⎯ 1.0 1.5 Ω
Rise time tr ⎯ 2.8 ⎯
Turn-on time ton ⎯ 9.3 ⎯
Switching time
Fall time tf ⎯ 3.4 ⎯
Turn-off time t
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1 Q
Gate-drain (“Miller”) charge Qgd ⎯ 3.0 ⎯
Gate switch charge QSW
(Ta = 25°C)
VGS = ±20 V, VDS = 0 V ⎯ ⎯ ±100 nA
GSS
VDS = 30 V, VGS = 0 V ⎯ ⎯ 10 μA
DSS
V
(BR) DSSID
V
(BR) DSXID
DS (ON)
⎯ 1433 2150
iss
⎯ 83 125
rss
oss
off
Q
g
gs1
= 10 mA, VGS = 0 V 30 ⎯ ⎯
= 10 mA, VGS = −20 V 15 ⎯ ⎯
VGS = 4.5 V, ID = 11 A ⎯ 12.1 15.7
= 10 V, ID = 11 A ⎯ 9.8 12.9
V
GS
V
= 10 V, VGS = 0 V, f = 1 MHz
DS
4.7 Ω
ID = 11 A
V
DD
V
= 1.36Ω
L
R
15 V
OUT
10 V
V
GS
0 V
1%, tw = 10 μs
Duty
V
24 V, VGS = 10 V, ID = 21 A ⎯ 21 ⎯
DD
24 V, VGS = 5 V, ID = 21 A ⎯ 11 ⎯
V
DD
⎯ 4.7 ⎯
V
24 V, VGS = 10 V, ID = 21 A
DD
⎯ 303 ⎯
⎯ 21 ⎯
⎯ 5.0 ⎯
Source-Drain Ratings and Characteristics
(Ta = 25°C)
V
mΩ
pF
ns
nC
Characteristic Symbol Test Condition Min Typ. Max Unit
Drain reverse current Pulse (Note 1) I
Forward voltage (diode) V
⎯ ⎯ ⎯ 63 A
DRP
IDR = 21 A, VGS = 0 V ⎯ ⎯ −1.2 V
DSF
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TPCA8023-H
=
(A)
D
Drain current I
(A)
D
Drain current I
6 5
8
10
8
6
4
2
0
4
10
4.5
0 0.2 0.4 0.6 0.8
Drain-source voltage VDS (V)
I
– VDS
D
3.2
Common source Ta = 25°C Pulse test
VGS = 2.7V
I
– VGS
40
Common source VDS = 10 V Pulse test
32
24
16
8
0
0 1 2 3
D
100
Ta = −55°C
25
4 5
Gate-source voltage VGS (V)
3.1
2.9
3.0
6
5
8
20
10
4
16
(A)
D
12
4.5
8
Drain current I
4
0
1
0 0.8 1.6
I
– VDS
D
Common source
3.4
Ta = 25°C Pulse test
3.3
3.2
3.1
VGS = 2.9V
1.2 0.4
2
Drain-source voltage VDS (V)
V
– V
DS
0.4
(V)
0.3
DS
0.2
0.1
Drain-source voltage V
0
0 2 4 6 8
GS
Common source Ta = 25℃ Pulse test
ID = 21 A
11
5
10
Gate-source voltage VGS (V)
1000
Common source V
= 10 V
| (S)
fs
Forward transfer admittance |Y
DS
Pulse test
100
10
1
0.1
0.1 1
⎪Y
⎪ – ID
fs
Ta = −55°C
25
100
10
Drain current ID (A)
100
100
(mΩ)
10
DS (ON)
R
V
Drain-source ON-resistance
1
0.1 1 10
Drain current ID (A)
R
DS (ON)
4.5
GS
10 V
– ID
Common source Ta = 25 ℃ Pulse test
100
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TPCA8023-H
25
Common source Pulse test
20
(mΩ)
15
DS (ON)
R
10
Drain-source ON-resistance
5
10000
1000
100
Common source
Capacitance C (pF)
VGS = 0 V f = 1 MHz Ta = 25°C
10
0.1
R
VGS = 4.5 V
VGS = 10 V
DS (ON)
– Ta
ID = 5A,11A,21A
ID = 5A,11A,21A
Ambient temperature Ta (°C)
Capacitance – V
1 10
DS
Drain-source voltage VDS (V)
I
– VDS
100
DR
(A)
DR
10
Drain reverse current I
160 −40 0 40 80 120 −80
10
Common source Ta = 25°C Pulse test
0 1−0.2
4.5
3
1
VGS = 0 V
−0.6 −0.8 −0.4 −1.2
−1
Drain-source voltage VDS (V)
2.5
2
C
iss
C
oss
C
rss
100
(V)
th
1.5
1
Common source
0.5 VDS = 10 V
ID = 1 mA
Gate threshold voltage V
Pulse test
0
−80 −40 0 40 80 120 160
V
– Ta
th
Ambient temperature Ta (°C)
(V)
Drain-source voltage V
40
DS
50
Common source
ID = 21 A Ta = 25°C
Pulse test
30
VDS
20
10
0
0
Dynamic input/output
characteristics
VDD = 6 V
12 V
24 V
5
10
15
20
Total gate charge Qg (nC)
25
30
20
16
12
8
4
0
(V)
GS
Gate-source voltage V
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TPCA8023-H
r
– tw
th
1000
Transient thermal impedance r
th
(1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (3) Tc=25℃
100
10
(°C/W)
1
0.1
0.01
0.0001
0.001
0.01 0.1 1 10 100 1000
(2)
(1)
(3)
Single - pulse
Pulse width tw (s)
P
– Ta
3
(1)
2.5
(W)
D
2
(2)
1.5
1
0.5
Drain power dissipation P
0
0 40 80 120
Ambient temperature Ta (°C)
D
(1)Device mounted on a glass-epox y
board(a) (Note 2a)
(2)Device mounted on a glass-epox y
board(b) (Note 2b)
t=10s
160
50
40
(W)
D
30
20
10
Drain power dissipation P
0
0 40 80 120 160
Case temperature TC (°C)
P
D
– Tc
1000
Safe operating area
(A)
D
Drain current I
100
ID max (Pulse) *
10
1
* Single – pulse Ta = 25℃
Curves must be derated linearly with increase in temperature.
0.1
0.1
Drain-source voltage VDS (V)
10ms *
1
t =1ms *
V
DSS
10
max
100
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TPCA8023-H
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• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
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TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
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BSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
• A FO
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