Datasheet TPA0223DGQR, TPA0223DGQ Datasheet (Texas Instruments)

Page 1
TPA0223
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS277A – JANUARY 2000 – REVISED MARCH 2000
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
D
2 W Into 4- From 5-V Supply
D
0.6 W Into 4- From 3-V Supply
D
Stereo Head Phone Drive
D
Separate Inputs for the Mono (BTL) Signal and Stereo (SE) Left/Right Signals
D
Wide Power Supply Compatibility 3 V to 5 V
D
Meets PC99 Desktop Specs (Target)
D
Low Supply Current – 11 mA Typical at 5 V – 10 mA Typical at 3 V
D
Shutdown Control ...1 µA Typical
D
Shutdown Pin is TTL Compatible
D
–40°C to 85°C Operating Temperature Range
D
Space-Saving, Thermally-Enhanced MSOP Packaging
description
The TPA0223 is a 2-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 4- impedance. The amplifier can be reconfigured on-the-fly to drive two stereo single-ended (SE) signals into head phones. This makes the device ideal for use in small notebook computers, PDAs, Digital Personal Audio players, anyplace a mono speaker and stereo head phones are required. From a 5-V supply , the TP A0223 can delivery 2-W of power into a 4- speaker.
The gain of the input stage is set by the user-selected input resistor and a 50-k internal feedback resistor (AV = – RF/ RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL mode. Thus, the overall gain of the amplifier is 62.5 k/ R
I
in SE mode and 125 k/ RI in BTL mode. The
input terminals are high-impedance CMOS inputs, and can be used as summing nodes. The TPA0223 is available in the 10-pin thermally-enhanced MSOP package (DGQ) and operates over an
ambient temperature range of –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
1 2 3 4 5
10
9 8 7 6
MONO–IN
SHUTDOWN
V
DD
BYPASS
RIN
LO/MO LIN GND SR/MN RO/MO
DGQ PACKAGE
(TOP VIEW)
PowerPAD is a trademark of Texas Instruments Incorporated.
Page 2
TPA0223 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE
SLOS277A – JANUARY 2000 – REVISED MARCH 2000
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
4
MONO-IN
+
1.25*R
R
+
50 k
M U X
1
RIN
5
R
I
C
I
Mono Audio Input
R
I
C
I
Right Audio Input
RO/MO+
6
+
1.25*R
R
+
50 k
M U X
LIN
9
R
I
C
I
10
50 k
Left Audio Input
Stereo/Mono
Control
Shutdown
and Depop
Circuitry
SHUTDOWN
2
From System Control
ST/MN
7
LO/MO–
C
C
C
C
100 k
100 k
V
DD
1 k
C
B
BYPASS
8
BYPASS
BYPASS
BYPASS
BYPASS
BYPASS
V
DD
3
V
DD
GND
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
MSOP
(DGQ)
MSOP
SYMBOLIZATION
–40°C to 85°C TPA0223DGQ AEI
The DGQ package are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TP A0223DGQR).
Page 3
TPA0223
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS277A – JANUARY 2000 – REVISED MARCH 2000
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
MONO-IN 1 I Mono input terminal
SHUTDOWN 2 I SHUTDOWN places the entire device in shutdown mode when held low. TTL compatible input.
V
DD
3 I VDD is the supply voltage terminal.
BYPASS 4 I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected
to a 0.1-µF to 1-µF capacitor.
RIN 5 I Right-channel input terminal RO/MO 6 O Right-output in SE mode and mono positive output in BTL mode SR/MN 7 I Selects between stereo and mono mode. When held high, the amplifier is in SE stereo mode, while held
low, the amplifier is in BTL mono mode.
GND 8 Ground terminal
LIN 9 I Left-channel input terminal LO/MO 10 O Left-output in SE mode and mono negative output in BTL mode.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
§
Supply voltage, VDD 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI –0.3 V to VDD +0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation internally limited (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
(see Table 3) –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating junction temperature range, TJ –40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA 25°C DERA TING FACTOR TA = 70°C TA = 85°C
DGQ 2.14 W
17.1 mW/°C 1.37 W 1.11 W
Please see the Texas Instruments document,
PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled
T exas Instruments Recommended
Board for PowerPAD
on page 33 of the before mentioned document.
recommended operating conditions
MIN MAX UNIT
Supply voltage, V
DD
2.5
5.5
V
VDD = 3 V 2.7
High-level input voltage, V
IH
ST/MN
VDD = 5 V 4.5
V
SHUTDOWN 2
VDD = 3 V 1.65
Low-level input voltage, V
IL
ST/MN
VDD = 5 V 2.75
V
SHUTDOWN 0.8
Operating free-air temperature, T
A
–40
85
°C
Page 4
TPA0223 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE
SLOS277A – JANUARY 2000 – REVISED MARCH 2000
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VDD = 3 V , TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
|VOO|
Output offset voltage (measured differentially)
30
mV
I
DD
Supply current
10
13
mA
I
DD(SD)
Supply current, shutdown mode
1
10
µA
operating characteristics, VDD = 3 V, T
A
= 25°C, RL = 4
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
p
p
THD = 1%,
BTL mode
660
POOutput power, see Note 1
THD = 0.1%,
SE mode,
RL = 32
33
mW
THD + N
Total harmonic distortion plus noise
PO = 500 mW,
f = 20 Hz to 20 kHz
0.3%
B
OM
Maximum output power bandwidth
Gain = 2,
THD = 2%
20
kHz
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
electrical characteristics at specified free-air temperature, VDD = 5 V , TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
|VOO|
Output offset voltage (measured differentially)
30
mV
I
DD
Supply current
11
15
mA
I
DD(SD)
Supply current, shutdown mode
1
10
µA
operating characteristics, VDD = 5 V, T
A
= 25°C, RL = 4
PARAMETER TEST CONDITIONS
MIN TYP MAX UNIT
p
p
THD = 1%,
BTL mode
2
ÁÁÁ
W
POOutput power, see Note 1
THD = 0.1%,
SE mode,
RL = 32
95
ÁÁÁ
mW
THD + N
Total harmonic distortion plus noise
PO = 1 W,
f = 20 Hz to 20 kHz
0.2%
ÁÁÁ
B
OM
Maximum output power bandwidth
Gain = 2.5,
THD = 2%
20
ÁÁÁ
kHz
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
Page 5
TPA0223
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS277A – JANUARY 2000 – REVISED MARCH 2000
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
DGQ (S-PDSO-G10) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
0,69
0,41
0,25
Thermal Pad (See Note D)
0,15 NOM
Gage Plane
4073273/A 04/98
4,98
0,17
6
3,05
4,78
2,95
10
5
3,05 2,95
1
0,27
0,15
0,05
1,07 MAX
Seating Plane
0,10
0,50
M
0,25
0°–6°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
PowerPAD is a trademark of Texas Instruments Incorporated.
Page 6
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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