Datasheet TNY266GN, TNY264GN Specification

This product is not recommended for new designs.

PI-2684-061815

Wide-Range

High-Voltage

DC Input

D

S

EN/UV

BP

+

-

+

-

DC

Output

TinySwitch-II

Optional

UV Resistor

TNY263-268
TinySwitch-II Family

Enhanced, Energy Efcient, Low Power
Off-line Switcher

Product Highlights

TinySwitch-II Features Reduce System Cost

• Fully integrated auto-restart for short circuit and open loop fault

protection – saves external component costs

• Built-in circuitry practically eliminates audible noise with ordinary

dip-varnished transformer

• Programmable line undervoltage detect feature prevents power

on/off glitches – saves external components

• Frequency jittering dramatically reduces EMI (~10 dB)

– minimizes EMI filter component costs

• 132 kHz operation reduces transformer size – allows use of

EF12.6 or EE13 cores for low cost and small size

• Very tight tolerances and negligible temperature variation on key

parameters eases design and lowers cost

• Lowest component count switcher solution

• Expanded scalable device family for low system cost

Better Cost/Performance over RCC & Linears

• Lower system cost than RCC, discrete PWM and other

integrated/hybrid solutions

• Cost effective replacement for bulky regulated linears

• Simple ON/OFF control – no loop compensation needed

• No bias winding – simpler, lower cost transformer

• Simple design practically eliminates rework in manufacturing

EcoSmart™– Extremely Energy Efficient

• No load consumption <50 mW with bias winding and

<250 mW without bias winding at 265 VAC input

• Meets California Energy Commission (CEC), Energy Star, and

EU requirements

• Ideal for cell-phone charger and PC standby applications

High Per formance at Low Cost

• High voltage powered – ideal for charger applications

• High bandwidth provides fast turn on with no overshoot

• Current limit operation rejects line frequency ripple

• Built-in current limit and thermal protection improves safety

Figure 1. Typical Standby Application.

Output Power Table

Product

TNY263 P/G 5 W 7.5 W 3.7 W 4.7 W

TNY264 P/G 5.5 W 9 W 4 W 6 W

TNY265 P/G 8.5 W 11 W 5.5 W 7.5 W

TNY266 P/G 10 W 15 W 6 W 9.5 W

TNY267 P/G 13 W 19 W 8 W 12 W

TNY268 P/G 16 W 23 W 10 W 15 W

Table 1. Output Power Table.

Notes:

1. Minimum continuous power in a typical non-ventilated enclosed adapter
measured at 50 °C ambient.

2. Minimum practical continuous power in an open frame design with adequate
heat sinking, measured at 50 °C ambient (See Key Applications
Considerations).

3. Packages: P: DIP-8B, G: SMD-8B. Please see Part Ordering Information.

3

230 VAC ± 15% 85-265 VAC

Open

Adapter

1

Frame

2

Adapter

Open

1

Frame

2

Description

TinySwitch™-II integrates a 700 V power MOSFET, oscillator,
high voltage switched current source, current limit and thermal
shutdown circuitry onto a monolithic device. The start-up and
operating power are derived directly from the voltage on the
DRAIN pin, eliminating the need for a bias winding and associated
circuitry. In addition, the TinySwitch-II devices incorporate
auto-restart, line undervoltage sense, and frequency jittering. An
innovative design minimizes audio frequency components in the
simple ON/OFF control scheme to practically eliminate audible
noise with standard taped/varnished transformer construction.

www.power.com August 2016

This Product is Covered by Patents and/or Pending Patent Applications.

The fully integrated auto-restart circuit safely limits output power
during fault conditions such as output short circuit or open loop,
reducing component count and secondary feedback circuitry
cost. An optional line sense resistor externally programs a line
undervoltage threshold, which eliminates power down glitches
caused by the slow discharge of input storage capacitors present
in applications such as standby supplies. The operating
frequency of 132 kHz is jittered to significantly reduce both the
quasi-peak and average EMI, minimizing filtering cost.

TNY263-268

PI-2643-031715

CLOCK

OSCILLATOR

5.8 V

4.8 V

SOURCE

(S)

SRQ

DC

MAX

BYPASS

(BP)

+

-

V

I

LIMIT

FAULT

PRESENT

CURRENT LIMIT
COMPARATOR

ENABLE

LEADING

EDGE

BLANKING

THERMAL

SHUTDOWN

+

-

DRAIN

(D)

REGULATOR

5.8 V

BYPASS PIN
UNDERVOLTAGE

1.0 V + V

T

ENABLE/

UNDER-

VOLTAGE

(EN/UV)

Q

240 µA 50 µA

LINE UNDERVOLTAGE

RESET

AUTO-

RESTART

COUNTER

JITTER

1.0 V

6.3 V

CURRENT

LIMIT STATE

MACHINE

PI-2685-031715

EN/UV

D

S

S

S (HV RTN)

S (HV RTN)

BP

P Package (DIP-8B)

G Package (SMD-8B)

8

5

7

1

4

2

3

Figure 2. Functional Block Diagram.

Pin Functional Description

DRAIN (D) Pin:

Power MOSFET drain connection. Provides internal operating
current for both start-up and steady-state operation.

BYPASS (BP) Pin:

Connection point for a 0.1 µF external bypass capacitor for the
internally generated 5.8 V supply.

ENABLE/UNDERVOLTAGE (EN/UV) Pin:

This pin has dual functions: enable input and line undervoltage
sense. During normal operation, switching of the power
MOSFET is controlled by this pin. MOSFET switching is
terminated when a current greater than 240 µA is drawn from
this pin. This pin also senses line undervoltage conditions
through an external resistor connected to the DC line voltage.
If there is no external resistor connected to this pin,
TinySwitch-II detects its absence and disables the line
undervoltage function.

SOURCE (S) Pin:

Control circuit common, internally connected to output
MOSFET source.

2

Rev. J 08/16

Figure 3. Pin Configuration.

SOURCE (HV RTN) Pin:

Output MOSFET source connection for high voltage return.

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TNY263-268

600

Time (µs)

PI-2741-041901

TinySwitch-II Functional Description

TinySwitch-II combines a high voltage power MOSFET switch
with a power supply controller in one device. Unlike conventional
PWM (pulse width modulator) controllers, TinySwitch-II uses a
simple ON/OFF control to regulate the output voltage.

The TinySwitch-II controller consists of an oscillator, enable
circuit (sense and logic), current limit state machine,

5.8 V regulator, BYPASS pin undervoltage circuit, over-
temperature protection, current limit circuit, leading edge
blanking and a 700 V power MOSFET. TinySwitch-II
incorporates additional circuitry for line undervoltage sense,
auto-restart and frequency jitter. Figure 2 shows the functional
block diagram with the most important features.

Oscillator

The typical oscillator frequency is internally set to an average
of 132 kHz. Two signals are generated from the oscillator: the
maximum duty cycle signal (DC
indicates the beginning of each cycle.

The TinySwitch-II oscillator incorporates circuitry that
introduces a small amount of frequency jitter, typically 8 kHz
peak-to-peak, to minimize EMI emission. The modulation rate
of the frequency jitter is set to 1 kHz to optimize EMI reduction
for both average and quasi-peak emissions. The frequency
jitter should be measured with the oscilloscope triggered at
the falling edge of the DRAIN waveform. The waveform in
Figure 4 illustrates the frequency jitter of the TinySwitch-II.

Enable Input and Current Limit State Machine

The enable input circuit at the EN/UV pin consists of a low
impedance source follower output set at 1.0 V. The current
through the source follower is limited to 240 µA. When the
current out of this pin exceeds 240 µA, a low logic level
(disable) is generated at the output of the enable circuit. This
enable circuit output is sampled at the beginning of each cycle
on the rising edge of the clock signal. If high, the power
MOSFET is turned on for that cycle (enabled). If low, the power

500

400

300

200

100

0

) and the clock signal that

MAX

V

DRAIN

136 kHz

128 kHz

MOSFET remains off (disabled). Since the sampling is done
only at the beginning of each cycle, subsequent changes in
the EN/UV pin voltage or current during the remainder of the
cycle are ignored.

The current limit state machine reduces the current limit by
discrete amounts at light loads when TinySwitch-II is likely to
switch in the audible frequency range. The lower current limit
raises the effective switching frequency above the audio range
and reduces the transformer flux density, including the
associated audible noise. The state machine monitors the
sequence of EN/UV pin voltage levels to determine the load
condition and adjusts the current limit level accordingly in
discrete amounts.

Under most operating conditions (except when close to no­load), the low impedance of the source follower keeps the
voltage on the EN/UV pin from going much below 1.0 V in the
disabled state. This improves the response time of the
optocoupler that is usually connected to this pin.

5.8 V Regulator and 6.3 V Shunt Voltage Clamp

The 5.8 V regulator charges the bypass capacitor connected
to the BYPASS pin to 5.8 V by drawing a current from the
voltage on the DRAIN pin whenever the MOSFET is off. The
BYPASS pin is the internal supply voltage node for the
TinySwitch-II. When the MOSFET is on, the TinySwitch-II
operates from the energy stored in the bypass capacitor.
Extremely low power consumption of the internal circuitry
allows TinySwitch-II to operate continuously from current it
takes from the DRAIN pin. A bypass capacitor value of 0.1 µF
is sufficient for both high frequency decoupling and energy
storage.

In addition, there is a 6.3 V shunt regulator clamping the
BYPASS pin at 6.3 V when current is provided to the BYPASS
pin through an external resistor. This facilitates powering of
TinySwitch-II externally through a bias winding to decrease the
no-load consumption to about 50 mW.

BYPASS Pin Undervoltage

The BYPASS pin undervoltage circuitry disables the power
MOSFET when the BYPASS pin voltage drops below 4.8 V.
Once the BYPASS pin voltage drops below 4.8 V, it must rise
back to 5.8 V to enable (turn-on) the power MOSFET.

Over Temperature Protection

The thermal shutdown circuitry senses the die temperature.
The threshold is typically set at 135 °C with 70 °C hysteresis.
When the die temperature rises above this threshold the
power MOSFET is disabled and remains disabled until the die
temperature falls by 70 °C, at which point it is re-enabled. A
large hysteresis of 70 °C (typical) is provided to prevent
overheating of the PC board due to a continuous fault
condition.

0510

Figure 4. Frequency Jitter.

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Current Limit

The current limit circuit senses the current in the power
MOSFET. When this current exceeds the internal threshold
(I

), the power MOSFET is turned off for the remainder of

LIMIT

Rev. J 08/16

3

TNY263-268

PI-2699-030701

0

1000 2000

Time (ms)

0

5

0

10

100

200

300

V

DRAIN

V

DC-OUTPUT

that cycle. The current limit state machine reduces the current
limit threshold by discrete amounts under medium and light
loads.

The leading edge blanking circuit inhibits the current limit
comparator for a short time (t

) after the power MOSFET is

LEB

turned on. This leading edge blanking time has been set so
that current spikes caused by capacitance and secondary­side rectifier reverse recovery time will not cause premature
termination of the switching pulse.

Auto-Restart

In the event of a fault condition such as output overload,
output short circuit, or an open loop condition, TinySwitch-II
enters into auto-restart operation. An internal counter clocked
by the oscillator gets reset every time the EN/UV pin is pulled
low. If the EN/UV pin is not pulled low for 50 ms, the power
MOSFET switching is normally disabled for 850 ms (except in
the case of line undervoltage condition, in which case it is
disabled until the condition is removed). The auto-restart
alternately enables and disables the switching of the power
MOSFET until the fault condition is removed. Figure 5
illustrates auto-restart circuit operation in the presence of an
output short circuit.

In the event of a line undervoltage condition, the switching of
the power MOSFET is disabled beyond its normal 850 ms time
until the line undervoltage condition ends.

Line Undervoltage Sense Circuit

The DC line voltage can be monitored by connecting an
external resistor from the DC line to the EN/UV pin. During
power-up or when the switching of the power MOSFET is
disabled in auto-restart, the current into the EN/UV pin must
exceed 49 µA to initiate switching of the power MOSFET.
During power-up, this is accomplished by holding the BYPASS
pin to 4.8 V while the line undervoltage condition exists. The

BYPASS pin then rises from 4.8 V to 5.8 V when the line
undervoltage condition goes away. When the switching of the
power MOSFET is disabled in auto-restart mode and a line
undervoltage condition exists, the auto-restart counter is
stopped. This stretches the disable time beyond its normal
850 ms until the line undervoltage condition ends.

The line undervoltage circuit also detects when there is no
external resistor connected to the EN/UV pin (less than
~2 µA into the pin). In this case the line undervoltage function
is disabled.

TinySwitch-II Operation

TinySwitch-II devices operate in the current limit mode. When
enabled, the oscillator turns the power MOSFET on at the
beginning of each cycle. The MOSFET is turned off when the
current ramps up to the current limit or when the DC
reached. Since the highest current limit level and frequency of
a TinySwitch-II design are constant, the power delivered to the
load is proportional to the primary inductance of the transformer
and peak primary current squared. Hence, designing the supply
involves calculating the primary inductance of the transformer
for the maximum output power required. If the TinySwitch-II is
appropriately chosen for the power level, the current in the
calculated inductance will ramp up to current limit before the
DC

limit is reached.

MAX

Enable Function

TinySwitch-II senses the EN/UV pin to determine whether or
not to proceed with the next switching cycle as described
earlier. The sequence of cycles is used to determine the
current limit. Once a cycle is started, it always completes the
cycle (even when the EN/UV pin changes state half way
through the cycle). This operation results in a power supply in
which the output voltage ripple is determined by the output
capacitor, amount of energy per switch cycle and the delay of
the feedback.

MAX

limit is

The EN/UV pin signal is generated on the secondary by
comparing the power supply output voltage with a reference
voltage. The EN/UV pin signal is high when the power supply
output voltage is less than the reference voltage.

In a typical implementation, the EN/UV pin is driven by an
optocoupler. The collector of the optocoupler transistor is
connected to the EN/UV pin and the emitter is connected to
the SOURCE pin. The optocoupler LED is connected in series
with a Zener diode across the DC output voltage to be
regulated. When the output voltage exceeds the target
regulation voltage level (optocoupler LED voltage drop plus
Zener voltage), the optocoupler LED will start to conduct,
pulling the EN/UV pin low. The Zener diode can be replaced
by a TL431 reference circuit for improved accuracy.

ON/OFF Operation with Current Limit State Machine

The internal clock of the TinySwitch-II runs all the time. At the

Figure 5. TinySwitch-II Auto-Restart Operation.

beginning of each clock cycle, it samples the EN/UV pin to
decide whether or not to implement a switch cycle, and based
on the sequence of samples over multiple cycles, it determines

4

Rev. J 08/16

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TNY263-268

V

DRAIN

V

EN

CLOCK

D

DRAIN

I

MAX

V

DRAIN

V

EN

CLOCK

D

DRAIN

I

MAX

V

DRAIN

V

EN

CLOCK

D

DRAIN

I

MAX

the appropriate current limit. At high loads, when the EN/UV
pin is high (less than 240 µA out of the pin), a switching cycle
with the full current limit occurs. At lighter loads, when EN/UV
is high, a switching cycle with a reduced current limit occurs.

At near maximum load, TinySwitch-II will conduct during
nearly all of its clock cycles (Figure 6). At slightly lower load, it
will “skip” additional cycles in order to maintain voltage
regulation at the power supply output (Figure 7). At medium
loads, cycles will be skipped and the current limit will be
reduced (Figure 8). At very light loads, the current limit will be

reduced even further (Figure 9). Only a small percentage of
cycles will occur to satisfy the power consumption of the
power supply.

The response time of the TinySwitch-II ON/OFF control
scheme is very fast compared to normal PWM control. This
provides tight regulation and excellent transient response.

Power Up/Down

The TinySwitch-II requires only a 0.1 µF capacitor on the
BYPASS pin. Because of its small size, the time to charge this
capacitor is kept to an absolute minimum, typically 0.6 ms.
Due to the fast nature of the ON/OFF feedback, there is no
overshoot at the power supply output. When an external
resistor (2 MΩ) is connected from the positive DC input to the
EN/UV pin, the power MOSFET switching will be delayed
during power-up until the DC line voltage exceeds the
threshold (100 V). Figures 10 and 11 show the power-up timing
waveform of TinySwitch-II in applications with and without an
external resistor (2 M

Ω) connected to the EN/UV pin.

During power-down, when an external resistor is used, the
power MOSFET will switch for 50 ms after the output loses
regulation. The power MOSFET will then remain off without
any glitches since the undervoltage function prohibits restart
when the line voltage is low.

Figure 6. TinySwitch-II Operation at Near Maximum Loading.

Figure 12 illustrates a typical power-down timing waveform of
TinySwitch-II. Figure 13 illustrates a very slow power-down
timing waveform of TinySwitch-II as in standby applications.
The external resistor (2 M

Ω) is connected to the EN/UV pin in

this case to prevent unwanted restarts.

The TinySwitch-II does not require a bias winding to provide
power to the chip, because it draws the power directly from
the DRAIN pin (see Functional Description above). This has

Figure 7. TinySwitch-II Operation at Moderately Heavy Loading.

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Figure 8. TinySwitch-II Operation at Medium Loading.

5

Rev. J 08/16

TNY263-268

V

DRAIN

V

EN

CLOCK

D

DRAIN

I

MAX

Time (s)

PI-2383-021015

Time (ms)

200

100

V

DC-INPUT

Figure 9. TinySwitch-II Operation at Very Light Load.

two main benefits. First, for a nominal application, this
eliminates the cost of a bias winding and associated
components. Secondly, for battery charger applications, the
current-voltage characteristic often allows the output voltage
to fall close to zero volts while still delivering power. This type
of application normally requires a forward-bias winding which
has many more associated components. With TinySwitch-II,
neither are necessary. For applications that require a very low
no-load power consumption (50 mW), a resistor from a bias
winding to the BYPASS pin can provide the power to the chip.
The minimum recommended current supplied is 750 µA. The
BYPASS pin in this case will be clamped at 6.3 V. This method
will eliminate the power draw from the DRAIN pin, thereby

200

0

10

V

5

BYPASS

0

400

200

V

DRAIN

0

0

Figure 11. TinySwitch-II Power-up without Optional External UV

Resistor Connected to EN/UV Pin.

1 2

200

100

V

DC-INPUT

0

400

300

V

200

DRAIN

100

0

0

.5 1

Time (s)

Figure 12. Normal Power-down Timing (without UV).

PI-2381-021015

PI-2348-021015

100

V

DC-INPUT

0

10

V

5

BYPASS

0

400

200

V

DRAIN

0

0

1 2

Time (ms)

Figure 10. TinySwitch-II Power-up with Optional External UV

Resistor (2 MΩ) Connected to EN/UV Pin.

6

Rev. J 08/16

200

100

V

DC-INPUT

0

400

300

200

V

DRAIN

100

0

0

Figure 13. Slow Power-down Timing with Optional External

(2 MΩ) UV Resistor Connected to EN/UV Pin.

2.5 5

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PI-2395-101014

TNY263-268

PI-2706-061815

+ 5 V

500 mA

RTN

D1

1N4005

C1

3.3 µF
400 V

Fusible

RF1

8.2 Ω

C3

0.1 µF
C7

10 µF

10 V

85-265

VAC

L1

2.2 mH

D2

1N4005

D3

1N4005

D4

1N4005

R2

200 kΩ

U2

LTV817

D5

1N5819

Shield

L2

3.3 µH

C5

330 µF

16 V

C2

3.3 µF
400 V

C6

100 µF

35 V

R7

100 Ω

R4

1.2 Ω

1/2 W

Q1

2N3904

R8

270 Ω

VR1

BZX79B3V9

3.9 V

U1

TNY264

C3

2.2 nF

D6

1N4937

R6

1 Ω

1/2 W

T1

R1

1.2 kΩ

1 8

4 5

R3

22 Ω

R9

47 Ω

C8 680 pF

Y1 Safety

TinySwitch-II

D

S

BP

EN/UV

Figure 14. 2.5 W Constant Voltage, Constant Current Battery Charger with Universal Input (85-265 VAC).

reducing the no-load power consumption and improving full­load efficiency.

Current Limit Operation

Each switching cycle is terminated when the DRAIN current
reaches the current limit of the TinySwitch-II. Current limit
operation provides good line ripple rejection and relatively
constant power delivery independent of input voltage.

BYPASS Pin Capacitor

The BYPASS pin uses a small 0.1 µF ceramic capacitor for
decoupling the internal power supply of the TinySwitch-II.

Application Examples

The TinySwitch-II is ideal for low cost, high efficiency power
supplies in a wide range of applications such as cellular phone
chargers, PC standby, TV standby, AC adapters, motor
control, appliance control and ISDN or a DSL network
termination. The 132 kHz operation allows the use of a low
cost EE13 or EF12.6 core transformer while still providing good
efficiency. The frequency jitter in TinySwitch-II makes it
possible to use a single inductor (or two small resistors for
under 3 W applications if lower efficiency is acceptable) in
conjunction with two input capacitors for input EMI filtering.
The auto-restart function removes the need to oversize the
output diode for short circuit conditions allowing the design to
be optimized for low cost and maximum efficiency. In charger
applications, it eliminates the need for a second optocoupler
and Zener diode for open loop fault protection. Auto-restart

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also saves the cost of adding a fuse or increasing the power
rating of the current sense resistors to survive reverse battery
conditions. For applications requiring undervoltage lock out
(UVLO), such as PC standby, the TinySwitch-II eliminates
several components and saves cost. TinySwitch-II is well
suited for applications that require constant voltage and
constant current output. As TinySwitch-II is always powered
from the input high voltage, it therefore does not rely on bias
winding voltage. Consequently this greatly simplifies designing
chargers that must work down to zero volts on the output.

2.5 W CV/CC Cell-Phone Charger

As an example, Figure 14 shows a TNY264 based 5 V,

0.5 A, cellular phone charger operating over a universal input
range (85 VAC to 265 VAC). The inductor (L1) forms a π-filter
in conjunction with C1 and C2. The resistor R1 damps
resonances in the inductor L1. Frequency jittering operation of
TinySwitch-II allows the use of a simple π-filter described
above in combination with a single low value Y1-capacitor (C8)
to meet worldwide conducted EMI standards. The addition of
a shield winding in the transformer allows conducted EMI to be
met even with the output capacitively earthed (which is the
worst case condition for EMI). The diode D6, capacitor C3
and resistor R2 comprise the clamp circuit, limiting the leakage
inductance turn-off voltage spike on the TinySwitch-II DRAIN
pin to a safe value. The output voltage is determined by the
sum of the optocoupler U2 LED forward drop (~1 V), and Zener
diode VR1 voltage. Resistor R8 maintains a bias current
through the Zener diode to ensure it is operated close to the
Zener test current.

7

Rev. J 08/16

TNY263-268

A simple constant current circuit is implemented using the V

BE

of transistor Q1 to sense the voltage across the current sense
resistor R4. When the drop across R4 exceeds the V

of

BE

transistor Q1, it turns on and takes over control of the loop by
driving the optocoupler LED. Resistor R6 assures sufficient
voltage to keep the control loop in operation down to zero volts
at the output. With the output shorted, the drop across R4 and
R6 (~1.2 V) is sufficient to keep the Q1 and LED circuit active.
Resistors R7 and R9 limit the forward current that could be
drawn through VR1 by Q1 under output short circuit conditions,
due to the voltage drop across R4 and R6.

10 and 15 W Standby Circuits

Figures 15 and 16 show examples of circuits for standby
applications. They both provide two outputs: an isolated 5 V
and a 12 V primary referenced output. The first, using TNY266P,
provides 10 W, and the second, using TNY267P,
15 W of output power. Both operate from an input range of 140
VDC to 375 VDC, corresponding to a 230 VAC or 100/115 VAC
with doubler input. The designs take advantage of the line
undervoltage detect, auto-restart and higher switching
frequency of TinySwitch-II. Operation at 132 kHz allows the use
of a smaller and lower cost transformer core, EE16 for
10 W and EE22 for 15 W. The removal of pin 6 from the 8 pin
DIP TinySwitch-II packages provides a large creepage distance
which improves reliability in high pollution environments such as
fan cooled power supplies.

Capacitor C1 provides high frequency decoupling of the high
voltage DC supply, only necessary if there is a long trace length
from the DC bulk capacitors of the main supply. The line sense
resistors R2 and R3 sense the DC input voltage for line
undervoltage. When the AC is turned off, the undervoltage
detect feature of the TinySwitch-II prevents auto-restart glitches
at the output caused by the slow discharge of large storage
capacitance in the main converter. This is achieved by
preventing the TinySwitch-II from switching when the input
voltage goes below a level needed to maintain output
regulation, and keeping it off until the input voltage goes above
the undervoltage threshold, when the AC is turned on again.
With R2 and R3, giving a combined value of 2 MΩ, the power

up undervoltage threshold is set at 200 VDC, slightly below the
lowest required operating DC input voltage, for start-up at 170
VAC, with doubler. This feature saves several components
needed to implement the glitch-free turn-off compared with
discrete or TinySwitch-II based designs. During turn-on the
rectified DC input voltage needs to exceed 200 V undervoltage
threshold for the power supply to start operation. But, once the
power supply is on it will continue to operate down to
140 V rectified DC input voltage to provide the required hold up
time for the standby output.

The auxiliary primary side winding is rectified and filtered by D2
and C2 to create a 12 V primary bias output voltage for the
main power supply primary controller. In addition, this voltage is
used to power the TinySwitch-II via R4. Although not necessary
for operation, supplying the TinySwitch-II externally reduces the
device quiescent dissipation by disabling the internal drain
derived current source normally used to keep the BYPASS pin
capacitor (C3) charged. An R4 value of 10 k

Ω provides 600 µA
into the BYPASS pin, which is slightly in excess of the current
consumption of TinySwitch-II. The excess current is safely
clamped by an on-chip active Zener diode to 6.3 V.

The secondary winding is rectified and filtered by D3 and C6.
For a 15 W design an additional output capacitor, C7, is
required due to the larger secondary ripple currents compared
to the 10 W standby design. The auto-restart function limits
output current during short circuit conditions, removing the
need to over rate D3. Switching noise filtering is provided by L1
and C8. The 5 V output is sensed by U2 and VR1. R5 is used to
ensure that the Zener diode is biased at its test current and R6
centers the output voltage at 5 V.

In many cases the Zener regulation method provides sufficient
accuracy (typically ± 6% over a 0 °C to 50 °C temperature
range). This is possible because TinySwitch-II limits the dynamic
range of the optocoupler LED current, allowing the Zener diode
to operate at near constant bias current. However, if higher
accuracy is required, a TL431 precision reference IC may be
used to replace VR1.

8

Rev. J 08/16

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TNY263-268

C1

0.01 µF
1 kV

140 - 375

VDC INPUT

L1

10 µH

2 A

R5

680 Ω

R6

59 Ω

1%

D3

1N5822

U1

TNY266P

C5

2.2 nF
1 kV

D1

1N4005GP

U2

TLP181Y

VR1

BZX79B3V9

5

4

2

1

10

8

TinySwitch-II

D

S

BP

+5 V, 2 A

RTN

C2

82 µF

35 V

C8

470 µF

10 V

PI-2713-061815

C4

1 nF Y1

D2

1N4148

EN

+12 VDC, 20 mA

0 V

C3

0.1 µF
50 V

R4

10 kΩ

C6

1000 µF

10 V

R2

1 MΩ

R3

1 MΩ

R1

200 kΩ

T1

PERFORMANCE SUMMARY

Continuous Output Power: 10.24 W
Efciency: ≥ 75%

C1

0.01 µF
1 kV

140 - 375

VDC INPUT

L1

10 µH

3 A

R5

680 Ω

D3

SB540

U1

TNY267P

C5

2.2 nF
1 kV

D1

1N4005GP

U2

TLP181Y

PERFORMANCE SUMMARY

Continuous Output Power: 15.24 W
Efciency: ≥ 78%

5

4

2

1

10

8

TinySwitch-II

D

S

BP

+5 V, 3 A

RTN

C2

82 µF

35 V

C8

470 µF

10 V

PI-2712-061815

C4

1 nF Y1

D2

1N4148

EN

+12 VDC, 20 mA

0 V

C3

0.1 µF
50 V

R4

10 kΩ

C7

1000 µF

10 V

C6

1000 µF

10 V

R2

1 MΩ

R3

1 MΩ

R1

100 kΩ

T1

R6

59 Ω

1%

VR1
BZX79B3V9

Figure 15. 10 W Standby Supply.

Figure 16. 15 W Standby Supply.

www.power.com

9

Rev. J 08/16

TNY263-268

Key Application Considerations

TinySwitch-II vs. TinySwitch

Table 2 compares the features and performance differences
between the TNY254 device of the TinySwitch-II family with
the TinySwitch-II family of devices. Many of the new features
eliminate the need for or reduce the cost of circuit components.
Other features simplify the design and enhance performance.

Design

Output Power

Table 1 (front page) shows the practical continuous output
power levels that can be obtained under the following
conditions:

TinySwitch-II vs. TinySwitch

Function

Switching Frequency and
Tolerance
Temperature Variation
(0-100 °C)**

44 kHz ±10% (at 25 °C)

+8%

TinySwitch

TNY254

132 kHz ±6% (at 25 °C)

+2%

1. The minimum DC input voltage is 90 V or higher for
85 VAC input, or 240 V or higher for 230 VAC input or
115 VAC input with a voltage doubler. This corresponds to
a filter capacitor of 3 µF/W for universal input and 1 µF/W
for 230 VAC or 115 VAC with doubler input.

2. A secondary output of 5 V with a Schottky rectifier diode.

3. Assumed efficiency of 77% (TNY267 & TNY268), 75%
(TNY265 & TNY266) and 73% (TNY263 & TNY264).

4. The parts are board mounted with SOURCE pins soldered
to sufficient area of copper to keep the die temperature at
or below 100 °C.

In addition to the thermal environment (sealed enclosure,
ventilated, open frame, etc.), the maximum power capability of
TinySwitch-II in a given application depends on transformer

TinySwitch-II

TNY263-268

• Smaller transformer for low cost

• Ease of design

• Manufacturability

• Optimum design for lower cost

TinySwitch-II

Advantages

Active Frequency Jitter N/A* ±4 kHz

Transformer Audible Noise
Reduction

Line UV Detect N/A* Single resistor

Current Limit Tolerance
Temperature Variation
(0-100 °C)**

Auto-Restart N/A* 6% effective on-time

BYPASS Pin Zener Clamp N/A* Internally clamped to 6.3 V • Allows TinySwitch-II to be powered from a low

DRAIN Creepage at Package 0.037 in. / 0.94 mm 0.137 in. / 3.48 mm • Greater immunity to arcing as a result of dust,

N/A* Yes–built into controller • Practically eliminates audible noise with ordinary dip

programmable

±11% (at 25 °C)

-8%

±7% (at 25 °C)
0%

• Lower EMI minimizing filter

component costs

varnished transformer – no special
construction or gluing required

• Prevents power on/off glitches

• Increases power capability and

simplifies design for high volume
manufacturing

• Limits output short-circuit current to less than full

load current

• No output diode size penalty

• Protects load in open loop fault conditions

• No additional components required

voltage bias winding to improve efficiency and to
reduce on-chip power dissipation

debris or other contaminants build-up

*Not available. ** See typical performance curves.

Table 2. Comparison Between TinySwitch and TinySwitch-II.

10

Rev. J 08/16

www.power.com

TNY263-268

core size and design (continuous or discontinuous), efficiency,
minimum specified input voltage, input storage capacitance,
output voltage, output diode forward drop, etc., and can be
different from the values shown in Table 1.

Audible Noise

The TinySwitch-II practically eliminates any transformer audio
noise using simple ordinary varnished transformer construction.
No gluing of the cores is needed. The audio noise reduction is
accomplished by the TinySwitch-II controller reducing the
current limit in discrete steps as the load is reduced. This
minimizes the flux density in the transformer when switching at
audio frequencies.

Worst Case EMI & Efficiency Measurement

Since identical TinySwitch-II supplies may operate at several
different frequencies under the same load and line conditions,
care must be taken to ensure that measurements are made
under worst case conditions. When measuring efficiency or
EMI verify that the TinySwitch-II is operating at maximum
frequency and that measurements are made at both low and
high line input voltages to ensure the worst case result is
obtained.

Layout

Single Point Grounding

Use a single point ground connection at the SOURCE pin for
the BYPASS pin capacitor and the Input Filter Capacitor
(see Figure 17).

The voltage rating of a resistor should be considered for the
undervoltage detect (Figure 15: R2, R3) resistors. For 1/4 W
resistors, the voltage rating is typically 200 V continuous,
whereas for 1/2 W resistors the rating is typically 400 V
continuous.

Y-Capacitor

The placement of the Y-capacitor should be directly from the
primary bulk capacitor positive rail to the common/return
terminal on the secondary side. Such placement will maximize
the EMI benefit of the Y-capacitor and avoid problems in
common-mode surge testing.

Optocoupler

It is important to maintain the minimum circuit path from the
optocoupler transistor to the TinySwitch-II EN/UV and
SOURCE pins to minimize noise coupling.

The EN/UV pin connection to the optocoupler should be kept
to an absolute minimum (less than 12.7 mm or 0.5 in.), and
this connection should be kept away from the DRAIN pin
(minimum of 5.1 mm or 0.2 in.).

Output Diode

For best performance, the area of the loop connecting the
secondary winding, the output diode and the output filter
capacitor, should be minimized. See Figure 17 for optimized
layout. In addition, sufficient copper area should be provided
at the anode and cathode terminals of the diode for adequate
heatsinking.

Primary Loop Area

The area of the primary loop that connects the input filter
capacitor, transformer primary and TinySwitch-II together
should be kept as small as possible.

Primary Clamp Circuit

A clamp is used to limit peak voltage on the DRAIN pin at turn­off. This can be achieved by using an RCD clamp (as shown
in Figure 14). A Zener and diode clamp (200 V) across the
primary or a single 550 V Zener clamp from DRAIN to
SOURCE can also be used. In all cases care should be taken
to minimize the circuit path from the clamp components to the
transformer and TinySwitch-II.

Thermal Considerations

Copper underneath the TinySwitch-II acts not only as a single
point ground, but also as a heatsink. The hatched areas
shown in Figure 17 should be maximized for good heat sinking
of TinySwitch-II and the same applies to the output diode.

EN/UV pin

If a line undervoltage detect resistor is used then the resistor
should be mounted as close as possible to the EN/UV pin to
minimize noise pick up.

Input and Output Filter Capacitors

There are constrictions in the traces connected to the input
and output filter capacitors. These constrictions are present
for two reasons. The first is to force all the high frequency
currents to flow through the capacitor (if the trace were wide
then it could flow around the capacitor). Secondly, the
Constrictions minimize the heat transferred from the TinySwitch-II
to the input filter capacitor and from the secondary diode to
the output filter capacitor. The common/return (the negative
output terminal in Figure 17) terminal of the output filter
capacitor should be connected with a short, low impedance
path to the secondary winding. In addition, the common/
return output connection should be taken directly from the
secondary winding pin and not from the Y-capacitor
connection point.

PC Board Cleaning

Power Integrations does not recommend the use of “no clean”
flux.

For the most up-to-date information visit the PI website
at: www.power.com.

www.power.com

11

Rev. J 08/16

TNY263-268

TOP VIEW

PI-2707-061815

Y1-

Capacitor

Opto-

coupler

D

EN/UV

BP

+

–

HV

+–

DC

OUT

Input Filter Capacitor

Output Filter Capacitor

Safety Spacing

Maximize hatched copper
areas ( ) for optimum
heat sinking

S

S

SEC

C

BP

TinySwitch-II

PRI

T

r
a
n
s

f
o

r

m

e

r

Figure 17. Recommended Circuit Board Layout for TinySwitch-II with Undervoltage Lock Out Resistor.

12

Rev. J 08/16

www.power.com

TNY263-268

Absolute Maximum Ratings

(1,4)

DRAIN Voltage .................................. ................ -0.3 V to 700 V

DRAIN Peak Current:

TNY263......................................400 mA

TNY264.....................................400 mA

.................................... TNY265......................................440 mA

TNY266.....................................560 mA

.................................... TNY267.....................................720 mA

TNY268.....................................880 mA

EN/UV Voltage
EN/UV Current

BYPASS Voltage ..................................................

Storage Temperature

....................................................... -0.3 V to 9 V

............................................................... 100 mA

.. -0.3 V to 9 V

....................................... -65 °C to 150 °C

Thermal Resistance

Thermal Resistance: P or G Package:

(qJA) ........................... 70 °C/W

(1)

(qJC)

............................................... 11 °C/W

(2)

; 60 °C/W

(3)

Conditions

Parameter Symbol

SOURCE = 0 V; T

See Figure 18

J

(Unless Otherwise Specified)

Control Functions

(2)

Operating Junction Temperature
Lead Temperature

(3)

....................................................... ..260 °C

.................... -40 °C to 150 °C

Notes:

1. All voltages referenced to SOURCE, TA = 25 °C.

2. Normally limited by internal circuitry.

3. 1/16 in. from case for 5 seconds.

4. Maximum ratings specified may be applied one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.

Notes:

1. Measured on the SOURCE pin close to plastic interface.

2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.

3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

= -40 to 125 °C

Min Ty p Max Units

Output Frequency f

Maximum Duty Cycle DC

EN/UV Pin Turnoff
Threshold Current

EN/UV Pin Voltage V

DRAIN Supply Current

BYPASS Pin Charge
Current

I

I

I

OSC

DIS

EN

I

S1

I

S2

CH1

CH2

MAX

TJ = 25 °C

See Figure 4

TJ = -40 °C to 125 °C -300 -240 -170 µA

EN/UV Open

(MOSFET

Switching)

See Note A, B

VBP = 0 V,

T

= 25 °C

J

See Note C, D

VBP = 4 V,

T

= 25 °C

J

See Note C, D

Average 124 132 140

Peak-Peak Jitter 8

S1 Open 62 65 68 %

I

= -125 µA 0.4 1.0 1.5

EN/UV

I

= 25 µA 1.3 2.3 2.7

EN/UV

V

= 0 V 430 500 µA

EN/UV

TNY263 200 250

TNY264 225 270

TNY265 245 295

TNY266 265 320

TNY267 315 380

TNY268 380 460

TNY263-264 -5.5 -3.3 -1.8

TNY265-268 -7.5 -4.6 -2.5

TNY263-264 -3.8 -2.0 -1.0

TNY265-268 -4.5 -3.0 -1.5

kHz

V

µA

mA

www.power.com

13

Rev. J 08/16

TNY263-268

Parameter Symbol

Control Functions (cont.)

BYPASS Pin
Voltage

BYPASS Pin
Voltage Hysteresis

EN/UV Pin Line Under­Voltage Threshold

Circuit Protection

Conditions

SOURCE = 0 V; T

See Figure 18

= -40 to 125 °C

J

Min Ty p Max Units

(Unless Otherwise Specified)

V

BP

V

BPH

I

LUV

TNY263

T

= 25 °C

J

See Note C 5.6 5.85 6.15 V

0.80 0.95 1.20 V

TJ = 25 °C 44 49 54 µA

di/dt = 42 mA/

See Note E

µs

195 210 225

Current Limit I

Initial Current Limit I

Leading Edge
Blanking Time

Current Limit
Delay

Thermal Shutdown
Temperature

Thermal Shutdown
Hysteresis

Output

LIMIT

INIT

t

LEB

t

ILD

TNY264

T

= 25 °C

J

TNY265

T

= 25 °C

J

TNY266

T

= 25 °C

J

TNY267

T

= 25 °C

J

TNY268

T

= 25 °C

J

TNY263

I

= 21 mA

D

di/dt = 50 mA/

di/dt = 55 mA/

di/dt = 70 mA/

di/dt = 90 mA/

di/dt = 110 mA/

See Figure 21

T

= 25 °C

J

TJ = 25 °C

See Note F

TJ = 25 °C

See Note F, G

µs

See Note E

µs

See Note E

µs

See Note E

µs

See Note E

µs

See Note E

233 250 267

255 275 295

325 350 375

419 450 481

512 550 588

0.65 x

I

LIMIT(MIN)

170 215 ns

150 ns

125 135 150 °C

70 °C

= 25 °C 33 38

T

J

TJ = 100 °C 50 57

mA

mA

ON-State
Resistance

14

Rev. J 08/16

R

DS(ON)

TNY264

I

= 25 mA

D

TNY265

I

= 28 mA

D

= 25 °C 28 32

T

J

TJ = 100 °C 42 48

= 25 °C 19 22

T

J

TJ = 100 °C 29 33

Ω

www.power.com

Parameter Symbol

Output (cont.)

ON-State
Resistance

R

DS(ON)

Conditions

SOURCE = 0 V; T

See Figure 18

= -40 to 125 °C

J

(Unless Otherwise Specified)

TNY266

I

= 35 mA

D

TNY267

I

= 45 mA

D

TNY268

I

= 55 mA

D

T

TJ = 100 °C 21 24

T

TJ = 100 °C 11.7 13.5

T

TJ = 100 °C 7.8 9.0

TNY263-268

Min Ty p Max Units

= 25 °C 14 16

J

= 25 °C 7.8 9.0

J

= 25 °C 5.2 6.0

J

Ω

OFF-State Drain
Leakage Current

Breakdown
Voltage

BV

Rise Time t

Fall Time t

Drain Supply
Voltage

Output EN/UV Delay t

Output Disable
Setup Time

Auto-Restart
ON-Time

Auto-Restart
Duty Cycle

DC

I

DSS

DSS

R

F

EN/UV

t

DST

t

AR

VBP = 6.2 V,
V

= 0 V,

EN/UV

V

= 560 V,

DS

T

= 125 °C

J

VBP = 6.2 V, V

See Note H, T

Measured in a Typical Flyback

Converter Application

See Figure 20 10 µs

TJ = 25 °C
See Note I

AR

TNY263-266 50

TNY267-268 100

= 0 V,

EN/UV

= 25 °C

J

700 V

50 ns

50 ns

50 V

0.5 µs

50 ms

5.6 %

NOTES:
A. Total current consumption is the sum of IS1 and I

I

and I

S2

when EN/UV pin is open (MOSFET switching).

DSS

when EN/UV pin is shorted to ground (MOSFET not switching) and the sum of

DSS

B. Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN.

An alternative is to measure the BYPASS pin current at 6.1 V.

C. BYPASS pin is not intended for sourcing supply current to external circuitry.

D. See Typical Performance Characteristics section for BYPASS pin start-up charging waveform.

E. For current limit at other di/dt values, refer to Figure 25.

F. This parameter is derived from characterization.

G. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the I

H. Breakdown voltage may be checked against minimum BV

exceeding minimum BV

DSS

.

specification by ramping the DRAIN pin voltage up to but not

DSS

specification.

LIMIT

I. Auto-restart on-time has the same temperature characteristics as the oscillator (inversely proportional to frequency).

µA

www.power.com

15

Rev. J 08/16

TNY263-268

PI-2686-031715

0.1 µF

10 V

50 V

470 Ω

5 W

S2

470 Ω

NOTE: This test circuit is not applicable for current limit or output characteristic measurements.

D EN/UV

BPS

S S

S

150 V

S1

2 MΩ

0.8

Figure 18. TinySwitch-II General Test Circuit.

DC

MAX

(internal signal)

t

P

Figure 19. TinySwitch-II Duty Cycle Measurement.

EN/UV

t

V

DRAIN

1

tP =

f

OSC

Figure 20. TinySwitch-II Output Enable Timing.

EN/UV

PI-2364-012699

Figure 21. Current Limit Envelope.

16

Rev. J 08/16

www.power.com

Typical Performance Characteristics

1.1

1.0

0.9

-50 -25 0255075 100 125 150

Junction Temperature (°C)

Breakdown Voltage

(Normalized to 25 °C)

PI-2213-012301

1.2

1.0

0.8

0.6

0.4

0.2

0

-50 -25 0255075 100 125

Junction Temperature (°C)

PI-2680-012301

Output Frequency

(Normalized to 25 °C)

6

5

4

3

2

1

0

0 0.2 0.4 0.6 0.8 1.0

Time (ms)

PI-2240-012301

BYPASS Pin Voltage (V)

7

Drain Voltage (V)

Drain Current (mA)

300

250

200

100

50

150

0

0 2 4 6 8 10

T

CASE

= 25 °C

T

CASE

= 100 °C

PI-2221-031715

TNY263 0.85
TNY264 1.0
TNY265 1.5
TNY266 2.0
TNY267 3.5
TNY268 5.5

Scaling Factors:

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

1234

Normalized di/dt

PI-2697-033104

Normalized Current Limit

TNY263 42 mA/ s 210 mA
TNY264 50 mA/

s 250 mA

TNY265 55 mA/

s 275 mA

TNY266 70 mA/

s 350 mA

TNY267 90 mA/

s 450 mA

TNY268 110 mA/

s 550 mA

Normalized

di/dt = 1

Normalized

Current

Limit = 1

1

0.8

0.6

0.4

0.2

0.0

-50

0 50 100 150

Temperature (°C)

PI-2714-031715

1.2

Current Limit

(Normalized to 25 °C)

TNY263/268
TNY264-266
TNY267

TNY263-268

Figure 22. Breakdown vs. Temperature.

Figure 24. Current Limit vs. Temperature.

Figure 23. Frequency vs. Temperature.

Figure 25. Current Limit vs. di/dt.

www.power.com

Figure 26. BYPASS Pin Start-up Waveform.

Figure 27. Output Characteristic.

17

Rev. J 08/16

TNY263-268

Drain Voltage (V)

Drain Capacitance (pF)

PI-2683-033104

0 100 200 300 400 500 600

1

10

100

1000

TNY263 1.0
TNY264 1.0
TNY265 1.5
TNY266 2.0
TNY267 3.5
TNY268 5.5

Scaling Factors:

35

20

25

30

5

10

15

0

0 200 400 600

Power (mW)

PI-2225-031715

TNY263 1.0
TNY264 1.0
TNY265 1.5
TNY266 2.0
TNY267 3.5
TNY268 5.5

Scaling Factors:

Junction Temperature (°C)

PI-2698-012301

Under-Voltage Threshold

(Normalized to 25 °C)

Typical Performance Characteristics (cont.)

Figure 28. C

vs. Drain Voltage.

OSS

Figure 30. Under-voltage Threshold vs. Temperature.

Figure 29. Drain Capacitance Power.

18

Rev. J 08/16

www.power.com

TNY263-268

Notes:

1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.

3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock­ wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.

.008 (.20)
.015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)
.390 (9.91)

.356 (9.05)
.387 (9.83)

.240 (6.10)
.260 (6.60)

.125 (3.18)
.145 (3.68)

.057 (1.45)
.068 (1.73)

.118 (3.00)
.140 (3.56)

.015 (.38)
MINIMUM

.048 (1.22)
.053 (1.35)

.100 (2.54) BSC

.014 (.36)
.022 (.56)

-E-

Pin 1

SEATING
PLANE

-D-

-T-

P08B

PDIP-8B (P Package)

PI-2551-081716

D S

.004 (.10)

⊕

T E D S

.010 (.25) M

⊕

(NOTE 6)

.137 (3.48)
MINIMUM

www.power.com

19

Rev. J 08/16

TNY263-268

SMD-8B (G Package)

PI-2546-081716

.004 (.10)
.012 (.30)

.036 (0.91)
.044 (1.12)

.004 (.10)

0 -

°

8

°

.356 (9.05)
.387 (9.83)

.048 (1.22)

.009 (.23)

.053 (1.35)

.032 (.81)
.037 (.94)

.125 (3.18)
.145 (3.68)

-D-

Notes:

1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.

2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.

3. Pin locations start with Pin 1,
and continue counter-clock­ wise to Pin 8 when viewed
from the top. Pin 6 is omitted.

4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).

5. Lead width measured at
package body.

6. D and E are referenced
datums on the package body.

.057 (1.45)
.068 (1.73)

(NOTE 5)

E S

.100 (2.54) (BSC)

.372 (9.45)

.240 (6.10)

.388 (9.86)

.137 (3.48)
MINIMUM

.260 (6.60)

.010 (.25)

-E-

Pin 1

D S

.004 (.10)

⊕

⊕

G08B

.420

.046

.060

.060

.046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions

Part Ordering Information

TNY 264 G N - TL

20

Rev. J 08/16

• TinySwitch Product Family

• Series Number

• Package Identifier

G Plastic Surface Mount SMD-8B

P Plastic DIP-8B

• Lead Finish

Blank Standard (Sn Pb)

N Pure Matte Tin (RoHS Compliant)

G RoHS Compliant and Halogen Free (P package only)

• Tape & Reel and Other Options

Blank Standard Configurations

TL Tape & Reel, 1 k pcs minimum, G Package only.

www.power.com

TNY263-268

Revision Notes Date

A – 03/01

Corrected first page spacing and sentence in description describing innovative design.
Corrected Frequency Jitter in Figure 4 and Frequency Jitter in Parameter Table.
Added last sentence to Over Temperature Protection section.
Clarified detecting when there is no external resistor connected to the EN/UV pin.

B

Corrected Figure 6 and its description in the text.
Corrected formatting, grammar and style errors in text and figures.
Corrected and moved Worst Case EMI & Efficiency Measurement section.
Added PC Board Cleaning section.
Replaced Figure 21 and SMD-8B Package Drawing.

Corrected q

C

Updated Figures 15 and 16 and text description for Zener performance.

for P/G package.

JA

Corrected DIP-8B and SMD-8B Package Drawings.

Corrected EN/UV under-voltage threshold in text.

D

Corrected 2 MW connected between positive DC input to EN/UV pin in text and Figures 15 and 16.

E Added TNY263 and TNY265. 04/04

F Added lead-free ordering information. 12/04

1) Typographical correction in OFF-STATE Drain Leakage Current parameter condition.

G

2) Removed I

3) Added Note 4 to Absolute Maximum Ratings specifications.

condition from BV

DS

parameter and added new Note H.

DSS

H Reformatted document, updated Figures 23 and 24 and Part Ordering Information. 02/09

I Updated with new Brand Style. 06/15

J

Updated PDIP-8B (P Package) and SMD-8B (G Package) per PCN-16232.

07/01

04/03

03/04

04/05

08/16

www.power.com

21

Rev. J 08/16

For the latest updates, visit our website: www.power.com

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power
Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS
MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD
PARTY RIGHTS.

Patent Information

The products and applications illustrated herein (including transformer construction and circuits external to the products) may be
covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power
Integrations. A complete list of Power Integrations patents may be found at www.power.com. Power Integrations grants its customers
a license under certain patent rights as set forth at http://www.power.com/ip.htm.

Life Support Policy

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii)
whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in
significant injury or death to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its safety or effectiveness.

The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE-iDriver, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch, InnoSwitch,
HiperTFS, HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and
PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2016, Power
Integrations, Inc.

Power Integrations Worldwide Sales Support Locations

World Headquarters

5245 Hellyer Avenue
San Jose, CA 95138, USA.
Main: [phone]
Customer Service:
Phone: [phone]
Fax: [phone]
e-mail: [e-mail]

China (Shanghai)

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17/F, Hivac Building, No. 2, Keji
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Germany

Lindwurmstrasse 114
80337 Munich
Germany
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e-mail: [e-mail]

Germany

HellwegForum 1
59469 Ense
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e-mail: igbt-driver.sales@
power.com

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Japan

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222-0033 Japan
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Korea

RM 602, 6FL
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Seoul, 135-728, Korea
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e-mail: [e-mail]

Singapore

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Taiwan

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UK

Cambridge Semiconductor,
a Power Integrations company
Westbrook Centre, Block 5,
2nd Floor
Milton Road
Cambridge CB4 1YG
Phone: [phone]
e-mail: [e-mail]