• Fully integrated auto-restart reduces short circuit current
• Line under-voltage sense eliminates turn-off glitches
• Frequency jittering dramatically reduces EMI (5 to 10 dB)
• TO-220 package option
Lowest Cost, Low Power Switcher Solution
• Lower cost than RCC, discrete PWM and other
integrated/hybrid solutions
• Cost effective replacement for bulky linear adapters
• Lowest component count
• Simple ON/OFF control – no loop compensation components
• No bias winding – simpler, lower cost transformer
• Designed to work with low cost external components
Extremely Energy Efficient
• Consumes only 30/60 mW at 115/230 VAC with no load
• Meets Blue Angel, Energy Star, Energy 2000 and
200mW European cell phone requirements for standby
• Saves $1 to $4 per year in energy costs (at $0.12/kWHr)
compared to bulky linear adapters
• Ideal for cellular phone chargers and adapters
High Performance at Low Cost
• High voltage powered – ideal for charger applications
• High bandwidth provides fast turn on with no overshoot
• Current limit operation rejects line frequency ripple
• Built-in current limit and thermal protection
Features
Description
The TNY256 extends the power range of the TinySwitch family
of energy efficient, low power off-line switchers. TinySwitch
devices use a breakthrough design to provide the lowest cost,
high efficiency, off-line switching solution for low power
applications. They integrate a 700 V power MOSFET, oscillator,
high voltage switched current source, current limit and thermal
shutdown circuitry into a single, monolithic device. The
devices start-up and operate on power derived from the DRAIN
voltage, eliminating the need for a transformer bias winding and
associated circuitry. TinySwitch's low operating current allows
power supply no-load consumption to be kept under 100 mW,
even at 265 VAC input.
+
Optional
UV Resistor
Wide-Range
HV DC Input
TinySwitch Plus
–
Figure 1. Typical Standby Application.
D
EN/UV
BP
S
+
DC Output
–
PI-2363-022699
OUTPUT POWER CAPABILITY*
ORDER
PART
NUMBER
TNY256P
TNY256G
TNY256Y
Table 1. * The low end of the power ranges shown represent enclosed
adapters with minimal heat sinking whereas, the high end of the power
ranges represent open frame power supplies with adequate heat
sinking, both measured at an ambient of 50
Application Considerations section for more details.
The TinySwitch Plus incorporates auto-restart, line under-voltage
sense, and frequency jittering features. The auto-restart circuit
safely limits output power during fault conditions such as output
short or open loop. The auto-restart circuit is fully integrated and
does not require external timing components. The line undervoltage sense threshold can be externally programmed using a line
sense resistor. During start-up, this feature keeps the TNY256 off
until the input line voltage reaches the under-voltage threshold.
When the input line voltage is removed, the line under-voltage
circuit prevents auto-restart attempts after the output goes out of
regulation. This eliminates power down glitches caused by the
slow discharge of input storage capacitors present in applications
such as standby supplies. A single resistor is used to implement
this feature, eliminating what normally takes five to six components.
The line sense resistor is optional. The TNY256 operating frequency
of 130 kHz is jittered (frequency modulated) to reduce both quasipeak and average EMI, minimizing filtering costs.
PACKAGE
DIP-8
SMD-8
TO-220-7B
230 VAC or
115 VAC
w/Doubler
8-19 W
o
C. Please refer to the Key
85-265
VAC
5-10 W8-15 W
5-11 W
July 2001
Page 2
TNY256
BYPASS
(BP)
50 µA
ENABLE/
UNDER-VOLTAGE
(EN/UV)
1.5 V + V
1.5 V
DRAIN
REGULATOR
5.8 V
LINE UNDER-VOLTAGE
AUTORESTART
COUNTER
CLOCK
RESET
JITTER
CLOCK
TH
DC
MAX
OSCILLATOR
5.8 V
5.1 V
SHUTDOWN
+
-
THERMAL
SRQ
BYPASS PIN
UNDER-VOLTAGE
Q
LEADING
EDGE
BLANKING
+
-
V
I
LIMIT
(D)
Figure 2. Functional Block Diagram.
Pin Functional Description
DRAIN (D) Pin:
Power MOSFET drain connection. Provides internal operating
current for both start-up and steady-state operation.
BYPASS (BP) Pin:
Connection point for a 0.1 µF external bypass capacitor for the
internally generated 5.8 V supply.
ENABLE/UNDER-VOLTAGE (EN/UV) Pin:
This pin has dual functions, enable input and line under-voltage
sense. During normal operation, switching of the power
MOSFET is controlled by this pin. MOSFET switching is
terminated when a current greater than 50 µA is drawn out of
this pin. This pin also senses line under-voltage conditions
through an external resistor connected to the DC line voltage.
If there is no external resistor connected to this pin, TNY256
detects this and disables the line under-voltage function.
Tab Internally
Connected to SOURCE Pin
Y Package (TO-220-7B)
BP
S
S
EN/UV
P Package (DIP-8)
G Package (SMD-8)
Figure 3. Pin Configuration.
SOURCE
(S)
PI-2367-122398
7 D
5 NC
4 S
3 BP
1 EN/UV
1
2
3
4
8
S
7
S
6
S
5
D
PI-2500-031501
SOURCE (S) Pin:
Power MOSFET source connection. Primary return.
C
2
7/01
NO CONNECT (N) Pin
No connection.
Page 3
TNY256
TinySwitch
Functional Description
TinySwitch combines a high voltage power MOSFET switch
with a power supply controller in one device. Unlike conventional
PWM (Pulse Width Modulator) controllers, TinySwitch uses a
simple ON/OFF control to regulate the output voltage.
The TNY256 controller consists of an Oscillator, Enable (Sense
and Logic) circuit, 5.8 V Regulator, Bypass pin Under-Voltage
circuit, Over Temperature Protection, Current Limit circuit,
Leading Edge Blanking and a 700 V power MOSFET. The
TNY256 incorporates additional circuitry for Line Under-Voltage
Sense, Auto-Restart and Frequency Jitter. Figure 2 shows the
functional block diagram with the most important features.
Oscillator
The typical oscillator frequency is internally set to an average of
130 kHz. Two signals are generated from the oscillator, the
Maximum Duty Cycle signal (DC
) and the Clock signal that
MAX
indicates the beginning of each cycle.
The TNY256 oscillator incorporates circuitry that introduces a
small amount of frequency jitter, typically 5 kHz peak-to-peak,
to minimize EMI emission. The modulation rate of the frequency
jitter (1 kHz) is set to optimize EMI reduction for both average
and quasi-peak emissions. The frequency jitter should be
measured with the oscilloscope triggered at the falling edge of
the DRAIN waveform. The waveform in Figure4 illustrates the
frequency jitter of the TNY256.
Enable Input Circuit
The enable input circuit at the EN/UV pin consists of a low
impedance source follower output set at 1.5 V. The current
through the source follower is limited to 50 µA with 10 µA of
hysteresis. When the current drawn out of the this pin exceeds
600
500
400
300
200
100
0
0
Figure 4. Frequency Jitter.
V
DRAIN
132.5 kHz
127.5 kHz
.51
Time (µs)
50 µA, a low logic level (disable) is generated at the output of
the enable circuit. This output is sampled at the beginning of
each cycle on the rising edge of the clock signal. If high, the
power MOSFET is turned on for that cycle (enabled), otherwise
the power MOSFET remains off (disabled). Since the sampling
is done only at the beginning of each cycle, subsequent
changes in the EN/UV pin voltage or current during the
remainder of the cycle are ignored.
Under most operating conditions (except when close to noload), the low impedance of the source follower, keeps the
voltage on the EN/UV pin from going much below 1.5 V, in the
disabled state. This improves the response time of the
optocoupler that is usually connected to this pin.
5.8 V Regulator
The 5.8 V regulator charges the bypass capacitor connected to
the BYPASS pin to 5.8 V by drawing a current from the voltage
on the DRAIN, whenever the MOSFET is off. The BYPASS
pin is the internal supply voltage node for the TinySwitch.
When the MOSFET is on, the TinySwitch runs off of the energy
stored in the bypass capacitor. Extremely low power
consumption of the internal circuitry allows the TinySwitch to
operate continuously from the current drawn from the DRAIN
pin. A bypass capacitor value of 0.1 µF is sufficient for both
high frequency de-coupling and energy storage.
BYPASS Pin Under-Voltage
The BYPASS pin under-voltage circuitry disables the power
MOSFET when the BYPASS pin voltage drops below 5.1 V.
Once the BYPASS pin voltage drops below 5.1 V, it must rise
back to 5.8 V to enable (turn-on) the power MOSFET.
Over Temperature Protection
The thermal shutdown circuitry senses the die temperature.
The threshold is set at 135 oC with 70 oC hysteresis. When the
die temperature rises above this threshold (135 oC) the power
MOSFET is disabled and remains disabled until the die
temperature falls by 70 oC, at which point it is re-enabled.
PI-2366-021299
Current Limit
The current limit circuit senses the current in the power
MOSFET. When this current exceeds the internal threshold
(I
), the power MOSFET is turned off for the remainder of
LIMIT
that cycle.
The leading edge blanking circuit inhibits the current limit
comparator for a short time (t
) after the power MOSFET is
LEB
turned on. This leading edge blanking time has been set so that
current spikes caused by primary-side capacitance and
secondary-side rectifier reverse recovery time will not cause
premature termination of the switching pulse.
Auto-Restart
In the event of a fault condition such as output overload, output
7/01
C
3
Page 4
TNY256
short, or an open loop condition, TNY256 enters into autorestart operation. An internal counter clocked by the oscillator
gets reset every time the EN/UV pin is pulled low. If the EN/
UV pin is not pulled low for 32 ms, the power MOSFET
switching is disabled for 128 ms (except in the case of line
under-voltage condition). The auto-restart alternately enables
and disables the switching of the power MOSFET until the fault
condition is removed. Figure 5 illustrates auto-restart circuit
operation in the presence of a temporary output short.
300
200
100
0
20
DRAIN
VOLTAGE
PI-2342-121198
In the event of line under-voltage condition, the switching of the
power MOSFET is disabled beyond its normal 128 ms time
until the line under-voltage condition goes away.
Line Under-Voltage (UVLO) Sense Circuit
The DC line voltage can be monitored by connecting an
external resistor from the DC line to the EN/UV pin. During
power-up or when the switching of the power MOSFET is
disabled in auto-restart, the current into the EN/UV pin must
exceed 50 µA to initiate switching of the power MOSFET.
During power-up, this is implemented by holding the BYPASS
pin to 5.1 V while the line under-voltage condition exists. The
BYPASS pin then rises from 5.1 V to 5.8V when the line undervoltage condition goes away. When the switching of the power
MOSFET is disabled in auto-restart mode and the line undervoltage condition exists, the counter is stopped. This stretches
the disable time beyond its normal 128ms until the line undervoltage condition goes away.
The line under-voltage circuit also detects when there is no
external resistor connected to the EN/UV pin. In this case the
line under-voltage function is disabled.
10
0
0
Time (ms)
Figure 5. TNY256 Auto-Restart Operation.
TinySwitch
Operation
OUTPUT
VOLTAGE
250500
TinySwitch devices operate in the current limit mode. When
enabled, the oscillator turns the power MOSFET on at the
beginning of each cycle. The MOSFET is turned off when the
current ramps up to the current limit. The maximum on-time of
the MOSFET is limited to DC
by the oscillator. Since the
MAX
current limit and frequency of the TNY256 is constant, the
power delivered is proportional to the primary inductance of the
transformer and is relatively independent of the input voltage.
Therefore, the design of the power supply involves calculating
the primary inductance of the transformer for the maximum
power required. If the TNY256 is appropriately chosen for the
V
EN
CLOCK
D
MAX
I
DRAIN
V
DRAIN
Figure 6. TNY256 Operation at Heavy Load.
C
4
7/01
PI-2373-120998
V
EN
CLOCK
D
MAX
I
DRAIN
V
DRAIN
Figure 7. TNY256 Operation at Light Load.
PI-2377-120998
Page 5
PI-2381-122398
0
12
Time (ms)
0
200
400
5
0
10
0
100
200
V
DC-BUS
V
BYPASS
V
DRAIN
200
TNY256
10
V
DC-BUS
0
V
5
0
0
BYPASS
V
DRAIN
0
Connected to EN/UV Pin.
12
Time (ms)
100
400
200
Figure 8. TNY256 Power-up With External Resistor (2 MΩ)
power level at the lowest input voltage, the calculated inductance
will ramp up the current to the current limit before the DC
limit is reached.
Enable Function
TNY256 senses the EN/UV pin to determine whether or not to
proceed with the next switch cycle as described earlier. Once
a cycle is started, it always completes the cycle (even when the
EN/UV pin changes state half way through the cycle). This
operation results in a power supply whose output voltage ripple
is determined by the output capacitor, amount of energy per
switch cycle and the delay of the feedback.
The EN/UV pin signal is generated on the secondary by
comparing the power supply output voltage with a reference
voltage. The EN/UV pin signal is high when the power supply
output voltage is less than the reference voltage.
In a typical implementation, the EN/UV pin is driven by an
optocoupler. The collector of the optocoupler transistor is
connected to the EN/UV pin and the emitter is connected to the
SOURCE pin. The optocoupler LED is connected in series with
a Zener across the DC output voltage to be regulated. When the
output voltage exceeds the target regulation voltage level
(optocoupler diode voltage drop plus Zener voltage), the
optocoupler diode will start to conduct, pulling the EN/UV pin
low. The Zener can be replaced by a TL431 device for
improved accuracy.
The EN/UV pin pull-down current threshold is nominally
50 µA, but is set to 40 µA the instant the threshold is exceeded.
This is reset back to 50 µA when the EN/UV pull-down current
drops below the current threshold of 40 µA.
PI-2383-122398
MAX
Figure 9. TNY256 Power-up Without External Resistor Connected
to EN/UV Pin.
ON/OFF Control
The internal clock of the TNY256 runs all the time. At the
beginning of each clock cycle, it samples the EN/UV pin to
decide whether or not to implement a switch cycle. If the
EN/UV pin is high (< 40 µA), then a switching cycle takes
place. If the EN/UV pin is low (greater than 50 µA) then no
switching cycle occurs, and the EN/UV pin status is sampled
again at the start of the subsequent clock cycle.
At full load, TNY256 will conduct during the majority of its
clock cycles (Figure6). At loads less than full load, it will
“skip” more cycles in order to maintain voltage regulation at the
secondary output. At light load or no load, almost all cycles will
be skipped (Figure7). A small percentage of cycles will
conduct to support the power consumption of the power supply.
The response time of the TNY256 ON/OFF control scheme is
very fast compared to normal PWM control. This provides tight
regulation and excellent transient response.
Power Up/Down
The TNY256 requires only a 0.1 µF capacitor on the BYPASS
pin. Because of the small size of this capacitor, the power-up
delay is kept to an absolute minimum, typically 0.3 ms. Due to
the fast nature of the ON/OFF feedback, there is no overshoot
at the power supply output. When an external resistor (2 MΩ)
is connected to the EN/UV pin, the power MOSFET switching
will be delayed during power-up until the DC line voltage
exceeds the threshold (100 V). Figures 8 and 9 illustrate the
power-up timing waveform of TNY256 in applications with
and without an external resistor (2 MΩ) connected to the
EN/UV pin.
7/01
C
5
Page 6
TNY256
200
100
0
400
300
200
100
0
0
Time (s)
Figure 10. Normal Power-down Timing.
V
DC-BUS
V
DRAIN
.51
During power-down, when an external resistor is used, the
power MOSFET will switch for 32 ms after the output loses
regulation. The power MOSFET will then remain off without
any glitches since the under-voltage function prohibits restarts
when the line voltage is low.
Figure 10 illustrates a typical power-down timing waveform of
TNY256. Figure 11 illustrates a very slow power-down timing
waveform of TNY256 as in standby applications. The external
resistor (2 MΩ) is connected to the EN/UV pin in this case to
prevent restarts.
The TNY256 does not require a bias winding to provide power
to the chip, because it draws the power directly from the DRAIN
pin (see Functional Description above). This has two main
benefits. First, for a nominal application, this eliminates the
cost of an extra bias winding and associated components.
Secondly, for charger applications, the current-voltage
characteristic often allows the output voltage to fall to low
values while still delivering power. This type of application
normally requires a forward-bias winding which has many
more associated components, none of which are necessary with
the TNY256.
Current Limit Operation
Each switching cycle is terminated when the DRAIN current
reaches the current limit of the TNY256. For a given primary
inductance and input voltage, the duty cycle is constant.
However, the duty cycle does change inversely with the input
voltage providing “voltage feed-forward” advantages: good
line ripple rejection and relatively constant power delivery
independent of the input voltage.
BYPASS Pin Capacitor
The BYPASS pin uses a small 0.1 µF ceramic capacitor for
decoupling the internal power supply of the TNY256.
200
PI-2348-010599
100
0
400
300
200
100
0
0
Time (s)
Figure 11. Slow Power-down Timing with External (2 MΩ)
Resistor Connected to EN/UV Pin.
V
DC-BUS
V
DRAIN
2.55
Application Example
The TNY256 is ideal for low cost, high efficiency power
supplies in a wide range of applications such as PC standby,
cellular phone chargers, AC adapters, motor control, appliance
control and ISDN network termination. The 130kHz operation
allows the use of a low cost EE16 core transformer while still
providing good efficiency. The frequency jitter in TNY256
makes it possible to use a single inductor (or two small resistors
if lower efficiency is acceptable) in conjunction with two input
capacitors for input EMI filtering up to the 10W level. The
auto-restart function allows the design to be optimized for
maximum efficiency without consideration for short-circuit
current on the secondary. For applications requiring undervoltage lockout (UVLO), the TNY256 eliminates several
components and saves cost.
As an example, Figure12 shows a 9V, 0.6A, AC adapter
operating from a universal input range (85-265VAC). The AC
input is rectified and filtered by D1-D4, C1 and C2 to create a
high voltage DC bus which is connected to T1. Inductor L1
forms a pi-filter in conjunction with C1 and C2. The resistor R1
damps resonance in inductor L1. The frequency jitter in
TNY256 allows it to meet worldwide conducted EMI standards
using a simple pi-filter in combination with a small value
Y1-capacitor C5 and a shield winding between primary and
secondary windings inside transformer T1. Diode D5, capacitor
C3 and resistor R3 form an RCD clamp circuit that limits the
turn-off voltage spike to a safe value on the TNY256 DRAIN
pin.
The secondary winding is rectified and filtered by D6, C6 and
C7 to provide the 9V output. Additional filtering is provided
by L3 and C8. The output voltage is determined by the resistor
network R7 and R8. Resistor R9 maintains a bias current
PI-2395-010599
C
6
7/01
Page 7
85-265
VAC
D1
1N4005
RF1
10 Ω
Fusible
D2
1N4005
C1
10 µF
400 V
L1
470 µH
R1
4.7 kΩ
C2
10 µF
400 V
R3
330 kΩ
1/4 W
C3
10 nF
D5
1N4937
U1
TNY256P
T1
NC
2
MBR360
10
1
330 µF
16 V
8
4
TinySwitch Plus
D
EN/UV
BP
S
U2
SFH615-2
C6
D6
C7
330 µF
16 V
R5
100 Ω
L3
18 µH
R9
470 Ω
C11
0.1 µF
220 µF
10 V
R7
26.1 kΩ
TNY256
C8
0.6 A
+ 9 V
RTN
D3
1N4005
D4
1N4005
Figure 12. 5.5 W AC Adapter with Universal Input (85-265 VAC).
through the TL431 voltage reference for proper regulation.
Capacitor C11 bypasses the TL431 response for improved
ripple performance. Resistor R5 determines the AC gain of the
circuit.
Key Application Considerations
For the most up to date information visit our Web site
at: www.powerint.com
Design
Output Power
Table 1 shows the practical maximum continuous output power
levels obtainable under following conditions:
1. The minimum DC input voltage is 90 V or higher for 85 VAC
input or 240 V or higher for 230VAC input or 115 VAC
input with a voltage doubler. This corresponds to a filter
capacitor of 3 µF/W for universal input and 1 µF/W for 230
or 115 VAC w/doubler input.
2. A secondary output of 5 V with a Schottky rectifier diode.
3. The P and G packaged parts are board mounted with source
pins soldered to sufficient area of copper and the Y packaged
parts are heat sinked sufficiently to keep the die temperature
at or below 100 °C.
C4
0.1 µF
C5
2200 pF
Y1 Safety
U3
TL431CLP
R8
10 kΩ
PI-2502-040901
The maximum power capability of TinySwitch in a given
application depends on the thermal environment (sealed
enclosure, ventilated, open frame, etc.,), transformer core size
and design (continuous or discontinuous), efficiency required,
minimum specified input voltage, input storage capacitance,
output voltage, output diode forward drop, etc., and can be
different from the values shown in Table 1.
Audible Noise
At loads other than maximum load, the cycle skipping mode
operation used in TinySwitch can generate audio frequency
components in the transformer. This can cause the transformer
to produce audio noise. Transformer audible noise can be
reduced by using appropriate transformer construction
techniques and decreasing the peak flux density. For more
information on audio suppression techniques, please check the
Application Notes section on our Web site at www.powerint.com.
Ceramic capacitors that use dielectrics such as Z5U, when used
in clamp and snubber circuits, can also generate audio noise due
to electrostriction and piezo-electric effects. If this is the case,
replacing them with a capacitor having a different type of
dielectric is the simplest solution. Polyester film capacitors and
ceramic capacitors with dielectrics such as NPO or X7R are
good alternatives.
7/01
C
7
Page 8
TNY256
Layout
Single Point Grounding
Use a single point ground connection at the SOURCE pin for the
BYPASS pin capacitor and the Input Filter Capacitor (see
Figure 13).
Primary Loop Area
The area of the primary loop that connects the input filter
capacitor, transformer primary and TinySwitch together, should
be kept as small as possible.
Primary Clamp Circuit
A clamp or snubber circuit is used to minimize peak voltage and
ringing on the DRAIN pin at turn-off. This can be achieved by
using an RC snubber for less than 3 W or an RCD clamp as
shown in Figure 13 for higher power. A Zener and diode clamp
across the primary or a single 550 V Zener clamp from DRAIN
to SOURCE can also be used. In all cases care should be taken
to minimize the circuit path from the snubber/clamp components
to the transformer and TinySwitch.
Thermal Considerations
Copper underneath the TinySwitch acts not only as a single point
ground, but also as a heatsink. The hatched area shown in
Figure13 should be maximized for good heat-sinking of
TinySwitch and output diode.
EN/UV pin layout optimization
The EN/UV pin connection to the opto-coupler should be kept
to an absolute minimum (less than 0.5 in.), and this connection
should be kept away from the DRAIN pin (minimum of 0.2 in.).
These distance limitations are critical only in applications
where an external under-voltage resistor (2 MΩ) is not used.
Y-Capacitor
The placement of the Y-capacitor should be directly from the
primary single point ground to the common/return terminal on
the secondary side. Such placement will maximize the EMI
benefit of the Y-capacitor.
Optocoupler
It is important to maintain the minimum circuit path from the
optocoupler transistor to the TinySwitch EN/UV and SOURCE
pins to minimize noise coupling.
Output Diode
For best performance, the area of the loop connecting the
secondary winding, the Output Diode and the Output Filter
Capacitor, should be minimized. See Figure13 for optimized
layout. In addition, sufficient copper area should be provided
at the anode and cathode terminals of the diode to adequately
heatsink the diode under output short circuit conditions.
Input and Output Filter Capacitors
There are constrictions in the traces connected to the input and
output filter capacitors. These constrictions are present for two
reasons. The first is to force all the high frequency currents to
flow through the capacitor (if the trace were wide then it could
flow around the capacitor). Secondly, the constrictions minimize
the heat transferred from the TinySwitch to the input filter
capacitor and from the secondary diode to the output filter
capacitor. The common/return (the negative output terminal in
Figure13) terminal of the output filter capacitor should be
connected with a short, low resistance path to the secondary
winding. In addition, the common/return output connection
should be taken directly from the secondary winding pin and not
from the Y-capacitor connection point.
Safety Spacing
Input Filter Capacitor
+
HV
–
TOP VIEW
TinySwitch
C
BP
BP
Figure 13. Recommended PC Layout for TinySwitch without Under-Voltage Lock Out Resistor.
C
8
7/01
S
S
Transformer
PRI
D
EN/UV
Y1-
Capacitor
Opto-
coupler
SEC
Output Filter Capacitor
DC
+–
Out
Maximize hatched copper
areas ( ) for optimum
heat sinking
PI-2360-012199
Page 9
TNY256
ABSOLUTE MAXIMUM RATINGS
DRAIN Voltage ....................................... - 0.3 V to 700 V
Peak DRAIN Current .............................................800 mA
EN/UV Voltage............................................ - 0.3 V to 9 V
EN/UV Current ......................................................100 mA
1. All voltages referenced to SOURCE, TA = 25 °C.
2. Normally limited by internal circuitry.
THERMAL IMPEDANCE
Thermal Impedance: Y Package (θJA)
(θJC)
P/G Package:
(θJA) ........ 45 °C/W
(θJC)
(1)
............... 70 °C/W
(2)
................. 2 °C/W
(3)
(2)
.......................... 11 °C/W
; 35 °C/W
Conditions
Parameter
Symbol
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 14
(Unless Otherwise Specified)
CONTROL FUNCTIONS
(1)
BYPASS Voltage.......................................... -0.3 V to 9 V
Storage Temperature ..................................... -65 to 150 °C
Operating Junction Temperature
Lead Temperature
(3)
................................................ 260 °C
(2)
................-40 to 150 °C
3. 1/16" from case for 5 seconds.
1. Free standing with no heatsink.
2. Measured at tab closest to plastic interface or source pin.
2
3. Soldered to 0.36 sq. inch (232mm
(4)
clad.
), 2oz (610 gm/m2) copper
4. Soldered to 1 sq. inch (645mm2), 2oz. (610 gm/m2) copper clad
MinTypMax
Units
Output
Frequency
Maximum
Duty Cycle
EN/UV Pin Turnoff
Threshold Current
EN/UV Pin
Hysteresis Current
EN/UV Pin
Voltage
EN/UV ShortCircuit Current
DRAIN
Supply Current
f
DC
I
V
I
OSC
MAX
I
DIS
HYS
EN
ENSC
I
S1
I
S2
TJ = 25 °C
See Figure 4
Peak-Peak Jitter
S1 Open
T
= -40 °C to 125 °C
J
T
= 125 °C
J
See Note A
I
= -25 µA
EN/UV
I
= 25 µA
EN/UV
V
EN/UV
= 0 V, T
V
EN/UV
= -40 °C to 125 °C
J
= 0 V, T
V
EN/UV
J
= 0 V
(MOSFET Not Switching)
See Note B
EN/UV Open
(MOSFET Switching)
See Note B, C
Average
= 125 °C
115140
3.86.2
63
130
5.0
66
69
-68 -50-28
-68-41
-52
-15-10-5
1.10 1.451.80
1.853.25
-58-25
-58-35
2.70
-40
-45
170
255
215
300
kHz
%
µA
µA
V
µA
µA
µA
BYPASS Pin
Charge Current
I
I
CH1
CH2
VBP = 0 V, TJ = 25 °C
See Note D, E
VBP = 4 V, TJ = 25 °C
See Note D, E
-5.50
-6.00-2.25
-4.10
-3.75-7.50
7/01
mA
mA
C
9
Page 10
TNY256
Conditions
Parameter SymbolSOURCE = 0 V; T
See Figure 14
(Unless Otherwise Specified)
CONTROL FUNCTIONS (cont.)
= -40 to 125 °C
J
Min
TypMax
Units
BYPASS Pin
Voltage
BYPASS
Hysteresis
V
EN/UV Pin Line
Under-voltage
Threshold
CIRCUIT PROTECTION
Current Limit
Initial Current
Limit
Leading Edge
Blanking Time
Current Limit
Delay
Thermal Shutdown
Temperature
V
I
I
LIMIT
I
t
BPH
LUV
INIT
LEB
t
ILD
BP
di/dt = 120 mA/µs, TJ = 25 °C
See Note D
= 25 °C
T
J
See Note F
See Figure 17
T
= 25 °C
J
TJ = 25 °C
See Note H
TJ = 25 °C
See Note H, I
5.60
0.60V
44
5.85
0.72
50
6.10
0.85
55
450500550
0.65 x
l
LIMIT(MIN)
170215
100150
125135 145
V
µA
mA
mA
ns
ns
°C
Thermal Shutdown
Hysteresis
OUTPUT
ON-State
Resistance
OFF-State
Leakage
Breakdown
Voltage
Rise Time
Fall Time
C
10
7/01
R
BV
DS(ON)
I
DSS
DSS
t
R
t
F
ID = 50 mA
V
I
VBP = 6.2 V, V
= 560 V, TJ = 125 °C
DS
VBP = 6.2 V, V
= 100 µA, TJ = 25 °C
DS
EN/UV
EN/UV
Measured in a Typical Flyback
Converter Application.
T
= 25 °C
J
TJ = 100 °C
= 0 V,
= 0 V,
700
70
15.6 18.0
25.7 30.0
50
50
50
°C
Ω
µA
V
ns
ns
Page 11
Parameter Symbol
OUTPUT (cont.)
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 14
(Unless Otherwise Specified)
MinTyp
TNY256
Max
Units
DRAIN Supply
50
V
Voltage
Output EN/UV
Delay
Output Disable
Setup Time
Auto-Restart
ON-Time
Auto-Restart
Duty Cycle
NOTES:
A. For a threshold with a negative value, negative hysteresis is a decrease in magnitude of the corresponding threshold.
B. Total current consumption is the sum of IS1 and I
and the sum of IS2 and I
C. Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the
DRAIN. An alternative is to measure the BYPASS pin current at 6.2 V.
t
EN/UV
t
DST
t
AR
DC
AR
when EN/UV pin is open (MOSFET switching).
DSS
See Note H
Tj = 25 °C
See Note I
when EN/UV pin is shorted to ground (MOSFET not switching)
DSS
10
0.5
28.935.2
32.0
20
2416
µs
µs
ms
%
D. BYPASS pin is not intended for sourcing supply current to external circuitry.
E. See typical performance characteristics section for BYPASS pin start-up charging waveform.
F. For current limit at other di/dt values, refer to current limit vs. di/dt curve under typical performance
characteristics.
G. This parameter is derived from characterization.
H. This parameter is derived from the change in current limit measured at 5X and 10X of the di/dt shown in the I
specification.
I.Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to
frequency).
C
7/01
LIMIT
11
Page 12
TNY256
EN/UV
D
S
S
S
S
BPS
NOTE: This test circuit is not applicable for current limit or output characteristic measurements.
Figure 14. TinySwitch General Test Circuit.
t
2
t
1
HV
90%
DRAIN
VOLTAGE
10%
0 V
Figure 15. TinySwitch Duty Cycle Measurement.
D =
0.1 µF
90%
t
1
t
2
PI-2048-033001
2 MΩ
470 Ω
5 W
S2
470 Ω
S1
50 V
10 V
150 V
DC
MAX
(internal signal)
t
P
EN/UV
t
V
DRAIN
1
tP =
f
OSC
Figure 16. TinySwitch Output Enable Timing.
EN/UV
PI-2352-011899
PI-2364-012699
12
C
7/01
t
(Blanking Time)
1.3
LEB
1.2
1.1
1.0
0.9
0.8
0.8
0.7
0.6
0.5
0.4
I
INIT(MIN)
I
LIMIT(MAX)
I
LIMIT(MIN)
@ 25 °C
@ 25 °C
0.3
0.2
DRAIN Current (normalized)
0.1
0
012683
457
Time ( s)
Figure 17. Current Limit Envelope.
PI-2362-012699
Page 13
Typical Performance Characteristics
1.2
1.0
0.8
0.6
0.4
0.2
0
-50 -250255075 100 125
Junction Temperature (°C)
FREQUENCY vs. TEMPERATURE
PI-2356-011899
Output Frequency
BREAKDOWN vs. TEMPERATURE
1.1
PI-2213-033001
1.0
(Normalized to 25 °C)
Breakdown Voltage (V)
0.9
-50 -25025 50 75 100 125 150
Junction Temperature (°C)
TNY256
CURRENT LIMIT vs. TEMPERATURE
1.4
1.2
1.0
0.8
0.6
0.4
Current Limit (A)
(Normalized to 25 °C)
0.2
0.0
-50 -250255075 100 125
Temperature (°C)
BYPASS PIN START-UP WAVEFORM
7
6
5
4
3
2
1
BYPASS Pin Voltage (V)
0
00.20.40.60.81.0
Time (ms)
PI-2354-033001
PI-2240-082898
CURRENT LIMIT vs. di/dt
1.4
1.2
1.0
0.8
0.6
Current Limit
0.4
0.2
(Normalized to 120 mA/µs)
0.0
0
2404807209601200
di/dt in mA/ s
OUTPUT CHARACTERISTIC
600
T
=25 °C
500
400
300
200
Drain Current (mA)
100
0
0246810
CASE
=100 °C
T
CASE
DRAIN Voltage (V)
PI-2234-082798
PI-2385-040901
C
7/01
13
Page 14
TNY256
Typical Performance Characteristics (cont.)
C
100
10
vs. DRAIN VOLTAGE
OSS
DRAIN Capacitance (pF)
1
0600
200400
DRAIN Voltage (V)
DRAIN CAPACITANCE POWER
100
PI-2387-121798
80
60
40
Power (mW)
20
0
0200400600
UNDERVOLTAGE THRESHOLD
80
PI-2389-121798
DRAIN Voltage (V)
PI-2358-033001
40
Input Voltage (VAC)
0
-40 -20020 40 60 80
Power-up*
Power-down at 8 W**
* 2 MΩ resistor connected to EN/UV pin.
** Load dependant and determined by the
level of the device upon entering auto restart.
Temperature (°C)
100
110
14
C
7/01
Page 15
DIP-8
TNY256
DIM
J1
J2
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB for standard dual in-line
(DIP) package .300 inch row spacing
(PLASTIC) 8 leads (issue B, 7/85).
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold flash
or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on any
side.
4. D, E and F are reference datums on the molded
body.
A
B
0.245-0.255
C
G
H
0.060 (NOM)
K
L
M
N
P
Q
inches
0.370-0.385
0.125-0.135
0.015-0.040
0.120-0.135
0.014-0.022
0.010-0.012
0.090-0.110
0.030 (MIN)
0.300-0.320
0.300-0.390
0.300 BSC
mm
9.40-9.78
6.22-6.48
3.18-3.43
0.38-1.02
3.05-3.43
1.52 (NOM)
0.36-0.56
0.25-0.30
2.29-2.79
0.76 (MIN)
7.62-8.13
7.62-9.91
7.62 BSC
D S .004 (.10)
85
-E-
B
1
A
M
4
-D-
J1
C
N
-F-
G
L
H
J2
K
Q
P
P08A
PI-2076-040501
-E-
B
J3
G08A
D S .004 (.10)
85
E S .010 (.25)
P
1
L
A
M
4
-D-
J1
C
-F-
J4
.010 (.25) M A S
J2
SMD-8
Heat Sink is 2 oz. Copper
As Big As Possible
.046
.060
Pin 1
.086
.186
Solder Pad Dimensions
.004 (.10)
α
G
.286
.060
DIM
G
.420
J1
.046
J2
J3
.080
J4
M
Notes:
1. Package dimensions conform to JEDEC
K
H
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
A
0.370-0.385
B
0.245-0.255
C
0.125-0.135
0.004-0.012
H
0.036-0.044
0.060 (NOM)
0.048-0.053
0.032-0.037
0.007-0.011
K
0.010-0.012
L
0.030 (MIN)
P
0.372-0.388
α
inches
0.100 BSC
0-8°
mm
9.40-9.78
6.22-6.48
3.18-3.43
0.10-0.30
0.91-1.12
1.52 (NOM)
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
PI-2077-042601
7/01
C
15
Page 16
TNY256
.146 (3.71)
.156 (3.96)
.400 (10.16)
.415 (10.54)
+
.108 (2.74) REF
TO-220-7B
.165 (4.19)
.185 (4.70)
.236 (5.99)
.260 (6.60)
.045 (1.14)
.055 (1.40)
Y07B
.860 (21.84)
.880 (22.35)
PIN 1
.050 (1.27)
.050 (1.27)
.200 (5.08)
PIN 1
.150 (3.81)
.467 (11.86)
.487 (12.37)
.028 (.71)
.032 (.81)
.050 (1.27) BSC
.150 (3.81) BSC
.050 (1.27)
MOUNTING HOLE PATTERN
.050 (1.27)
.180 (4.58)
.150 (3.81)
.010 (.25) M
PIN 7
.570 (14.48)
REF.
7° TYP.
.095 (2.41)
.115 (2.92)
PIN 1 & 7
.015 (.38)
.020 (.51)
.190 (4.83)
.210 (5.33)
Notes:
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
2. Pin locations start with Pin 1, and continue
from left to right when viewed from the front.
Pins 2 and 6 are omitted.
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
shall not exceed .006 (.15mm) on any side.
4. Minimum metal to metal spacing at the pack age body for omitted pin locations is .068
inch (1.73 mm).
5. Position of the formed leads to be measured
at the mounting plane, .670 inch (17.02 mm)
below the hole center.
6. All terminals are solder plated.
PIN 4
.040 (1.02)
.060 (1.52)
.670 (17.02)
REF.
.040 (1.06)
.060 (1.52)
PI-2560-101599
16
C
7/01
Page 17
Notes
TNY256
7/01
C
17
Page 18
TNY256
Notes
18
C
7/01
Page 19
Notes
TNY256
7/01
C
19
Page 20
TNY256
Revision
A
B
C
Notes
-
1) TO-220-7B package information added.
2) I
minimum increased to 44 µΑ to reflect production improvements.
LUV
1) Updated package references.
2) Corrected spelling.
3) Added Omega symbol (2 MΩ on pg. 8).
4) Corrected storage temperature and θJC and updated nomenclature in parameter table.
5) Corrected spacing and font sizes in figures.
Date
3/99
8/99
7/01
For the latest updates, visit our Web site:www.powerint.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.
Power Integrations does not assume any liability arising from the use of any device or circuit described herein, nor does it
convey any license under its patent rights or the rights of others.
The PI Logo,
TOPSwitch, TinySwitch
and
EcoSmart
are registered trademarks of Power Integrations, Inc.
Power Integrations, Inc.
5245 Hellyer Avenue
San Jose, CA 95138 USA
Main:+1 408-414-9200
Customer Service:
Phone:+1 408-414-9665
Fax:+1 408-414-9765
e-mail: usasales@powerint.com
KOREA
Power Integrations
International Holdings, Inc.
Rm# 402, Handuk Building
649-4 Yeoksam-Dong,
Kangnam-Gu,
Seoul, Korea
Phone:+82-2-568-7520
Fax:+82-2-568-7474
e-mail: koreasales@powerint.com
EUROPE & AFRICA
Power Integrations (Europe) Ltd.
Centennial Court
Easthampstead Road
Bracknell
Berkshire, RG12 1YQ
United Kingdom
Phone:+44-1344-462-300
Fax:+44-1344-311-732
e-mail: eurosales@powerint.com
JAPAN
Power Integrations, K.K.
Keihin-Tatemono 1st Bldg.
12-20 Shin-Yokohama 2-Chome
Kohoku-ku, Yokohama-shi
Kanagawa 222-0033, Japan
Phone:+81-45-471-1021
Fax:+81-45-471-3717
e-mail: japansales@powerint.com
TAIWAN
Power Integrations
International Holdings, Inc.
17F-3, No. 510
Chung Hsiao E. Rd.,
Sec. 5,
Taipei, Taiwan 110, R.O.C.
Phone:+886-2-2727-1221
Fax:+886-2-2727-1223
e-mail: taiwansales@powerint.com
INDIA (Technical Support)
Innovatech
#1, 8th Main Road
Vasanthnagar
Bangalore, India 560052
Phone:+91-80-226-6023
Fax:+91-80-228-9727
e-mail: indiasales@powerint.com
CHINA
Power Integrations
International Holdings, Inc.
Rm# 1705, Bao Hua Bldg.
1016 Hua Qiang Bei Lu
Shenzhen, Guangdong 518031
China
Phone:+86-755-367-5143
Fax:+86-755-377-9610
e-mail: chinasales@powerint.com
APPLICATIONS HOTLINE
World Wide +1-408-414-9660
APPLICATIONS FAX
World Wide +1-408-414-9760
20
C
7/01
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