Datasheet TMP36GT9Z Specification

V

Low Voltage Temperature Sensors

FEATURES

Low voltage operation (2.7 V to 5.5 V)
Calibrated directly in °C
10 mV/°C scale factor (20 mV/°C on TMP37)
±2°C accuracy over temperature (typ)
±0.5°C linearity (typ)
Stable with large capacitive loads
Specified −40°C to +125°C, operation to +150°C
Less than 50 μA quiescent current
Shutdown current 0.5 μA max
Low self-heating
Qualified for automotive applications

APPLICATIONS

Environmental control systems
Thermal protection
Industrial process control
Fire alarms
Power system monitors
CPU thermal management

GENERAL DESCRIPTION

The TMP35/TMP36/TMP37 are low voltage, precision centi­grade temperature sensors. They provide a voltage output that
is linearly proportional to the Celsius (centigrade) temperature.
The TMP35/ TMP36/TMP37 do not require any external
calibration to provide typical accuracies of ±1°C at +25°C
and ±2°C over the −40°C to +125°C temperature range.

The low output impedance of the TMP35/TMP36/TMP37 and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and ADCs. All three devices are
intended for single-supply operation from 2.7 V to 5.5 V maxi­mum. The supply current runs well below 50 μA, providing
very low self-heating—less than 0.1°C in still air. In addition, a
shutdown function is provided to cut the supply current to less
than 0.5 μA.

The TMP35 is functionally compatible with the LM35/LM45
and provides a 250 mV output at 25°C. The TMP35 reads
temperatures from 10°C to 125°C. The TMP36 is specified from

−40°C to +125°C, provides a 750 mV output at 25°C, and
operates to 125°C from a single 2.7 V supply. The TMP36 is
functionally compatible with the LM50. Both the TMP35 and
TMP36 have an output scale factor of 10 mV/°C.

TMP35/TMP36/TMP37

FUNCTIONAL BLOCK DIAGRAM

+

(2.7V TO 5.5V)

S

SHUTDOWN

PIN CONFIGURATIONS

V

1

OUT

+V

2

S

3

NC

NC = NO CONNECT

1

V

OUT

2

NC

3

NC

4

GND

NC = NO CONNECT

PIN 1, +V

The TMP37 is intended for applications over the range of 5°C
to 100°C and provides an output scale factor of 20 mV/°C. The
TMP37 provides a 500 mV output at 25°C. Operation extends
to 150°C with reduced accuracy for all devices when operating
from a 5 V supply.

The TMP35/TMP36/TMP37 are available in low cost 3-lead
TO-92, 8-lead SOIC_N, and 5-lead SOT-23 surface-mount
packages.

TMP35/
TMP36/
TMP37

Figure 1.

GND

5

TOP VIEW

(Not to Scale)

4

SHUTDOWN

Figure 2. RJ-5 (SOT-23)

8

+V

S

7

TOP VIEW

(Not to Scale)

NC

6

NC

SHUTDOWN

5

Figure 3. R-8 (SOIC_N)

2

1 3

BOTTOM VIEW

(Not to Scale)

; PIN 2, V

S

; PIN 3, GND

OUT

Figure 4. T-3 (TO-92)

V

OUT

00337-004

00337-001

00337-002

00337-003

Rev. F

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TMP35/TMP36/TMP37

TABLE OF CONTENTS

Features.............................................................................................. 1

Applications....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Pin Configurations ........................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

Thermal Resistance ...................................................................... 4

ESD Caution.................................................................................. 4

Typical Performance Characteristics ............................................. 5

Functional Description.................................................................... 8

Applications Information ................................................................ 9

Shutdown Operation.................................................................... 9

Mounting Considerations ........................................................... 9

Thermal Environment Effects .................................................... 9

Basic Temperature Sensor Connections.................................. 10

Fahrenheit Thermometers........................................................ 10

Average and Differential Temperature Measurement ........... 12

Microprocessor Interrupt Generator....................................... 13

Thermocouple Signal Conditioning with Cold-Junction

Compensation............................................................................. 14

Using TMP3x Sensors in Remote Locations .......................... 15

Temperature to 4–20 mA Loop Transmitter .......................... 15

Temperature-to-Frequency Converter.................................... 16

Driving Long Cables or Heavy Capacitive Loads .................. 17

Commentary on Long-Term Stability..................................... 17

Outline Dimensions....................................................................... 18

Ordering Guide .......................................................................... 19

Automotive Products................................................................. 20



REVISION HISTORY

11/10—Rev. E to Rev. F

Changes to Features.......................................................................... 1

Updated Outline Dimensions....................................................... 18

Changes to Ordering Guide.......................................................... 19

Added Automotive Products Section .......................................... 20

8/08—Rev. D to Rev. E

Updated Outline Dimensions....................................................... 18

Changes to Ordering Guide.......................................................... 19

3/05—Rev. C to Rev. D

Updated Format..................................................................Universal

Changes to Specifications................................................................ 3

Additions to Absolute Maximum Ratings..................................... 4

Updated Outline Dimensions....................................................... 18

Changes to Ordering Guide.......................................................... 19

10/02—Rev. B to Rev. C

Changes to Specifications.................................................................3

Deleted Text from Commentary on Long-Term Stability

Section.............................................................................................. 13

Updated Outline Dimensions....................................................... 14

9/01—Rev. A to Rev. B

Edits to Specifications.......................................................................2

Addition of New Figure 1.................................................................2

Deletion of Wafer Test Limits Section ............................................3

6/97—Rev. 0 to Rev. A

3/96—Revision 0: Initial Version

Rev. F | Page 2 of 20

TMP35/TMP36/TMP37

SPECIFICATIONS

VS = 2.7 V to 5.5 V, −40°C ≤ TA ≤ +125°C, unless otherwise noted.

Table 1.

Parameter1 Symbol Test Conditions/Comments Min Typ Max Unit

ACCURACY

TMP35/TMP36/TMP37 (F Grade) TA = 25°C ±1 ±2 °C
TMP35/TMP36/TMP37 (G Grade) TA = 25°C ±1 ±3 °C
TMP35/TMP36/TMP37 (F Grade) Over rated temperature ±2 ±3 °C
TMP35/TMP36/TMP37 (G Grade) Over rated temperature ±2 ±4 °C
Scale Factor, TMP35 10°C ≤ TA ≤ 125°C 10 mV/°C
Scale Factor, TMP36 −40°C ≤ TA ≤ +125°C 10 mV/°C
Scale Factor, TMP37 5°C ≤ TA ≤ 85°C 20 mV/°C
5°C ≤ TA ≤ 100°C 20 mV/°C

3.0 V ≤ VS ≤ 5.5 V
Load Regulation 0 μA ≤ IL ≤ 50 μA

−40°C ≤ TA ≤ +105°C 6 20 m°C/μA

−105°C ≤ TA ≤ +125°C 25 60 m°C/μA
Power Supply Rejection Ratio PSRR TA = 25°C 30 100 m°C/V

3.0 V ≤ VS ≤ 5.5 V 50 m°C/V
Linearity 0.5 °C
Long-Term Stability TA = 150°C for 1 kHz 0.4 °C

SHUTDOWN

Logic High Input Voltage VIH VS = 2.7 V 1.8 V
Logic Low Input Voltage VIL VS = 5.5 V 400 mV

OUTPUT

TMP35 Output Voltage TA = 25°C 250 mV
TMP36 Output Voltage TA = 25°C 750 mV
TMP37 Output Voltage TA = 25°C 500 mV
Output Voltage Range 100 2000 mV
Output Load Current IL 0 50 μA
Short-Circuit Current ISC Note 2 250 μA
Capacitive Load Driving CL
Device Turn-On Time

POWER SUPPLY

Supply Range VS 2.7 5.5 V
Supply Current ISY (ON) Unloaded 50 μA
Supply Current (Shutdown) ISY (OFF) Unloaded 0.01 0.5 μA

1

Does not consider errors caused by self-heating.

2

Guaranteed but not tested.

No oscillations
Output within ±1°C, 100 kΩ||100 pF load

2

1000 10000 pF

2

0.5 1 ms

Rev. F | Page 3 of 20

TMP35/TMP36/TMP37

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

1, 2

Rating

Supply Voltage 7 V
Shutdown Pin

Output Pin GND ≤ V

GND ≤ SHUTDOWN

≤ +VS

OUT

Operating Temperature Range −55°C to +150°C
Die Junction Temperature 175°C
Storage Temperature Range −65°C to +160°C
IR Reflow Soldering

Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature Range 10 sec to 20 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 6 min

IR Reflow Soldering—Pb-Free Package

Peak Temperature 260°C (0°C)
Time at Peak Temperature Range 20 sec to 40 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 8 min

1

Digital inputs are protected; however, permanent damage can occur on

unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.

2

Remove power before inserting or removing units from their sockets.

≤ +VS

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device in
socket.

Table 3. Thermal Resistance

Package Type θJA θ

Unit

JC

TO-92 (T-3) 162 120 °C/W
SOIC_N (R-8) 158 43 °C/W
SOT-23 (RJ-5) 300 180 °C/W

ESD CAUTION

Rev. F | Page 4 of 20

TMP35/TMP36/TMP37

TYPICAL PERFORMANCE CHARACTERISTICS

50

40

30

20

0.4

+VS = 3V TO 5.5V, NO LOAD

0.3

0.2

LOAD REGULAT ION (m°C/ µA)

10

0

–50

0 50 100 150

TEMPERATURE ( °C)

Figure 5. Load Regulation vs. Temperature (m°C/μA)

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

OUTPUT VOL TAGE (V)

0.4

0.2

a. TMP35
b. TMP36
c. TMP37
+V

= 3V

S

0
–50 –25 0 25 50 75 100 125

TEMPERATURE ( °C)

Figure 6. Output Voltage vs. Temperature

0.1

POWER SUPPLY REJECTI ON (°C/V)

00337-005

0

–50 125–25 0 25 50 75 100

TEMPERATURE ( °C)

00337-009

Figure 8. Power Supply Rejection vs. Temperature

100.000

c

b

a

00337-007

31.600

10.000

3.160

1.000

0.320

0.100

POWER SUPPLY REJECTION (°C/V)

0.032

0.010
20 100k100 1k 10k

FREQUENCY (Hz)

00337-010

Figure 9. Power Supply Rejection vs. Frequency

5

4

3

a

2

1

0

–1

–2

ACCURACY ERROR (°C)

–3

–4

–5

0 20 40 60 80 100 120 140

a. MAXIMUM LIMIT (G GRADE)
b. TYPICAL ACCURACY ERROR
c. MINIMUM LIMIT (G GRADE)

b

c

TEMPERATURE (°C)

Figure 7. Accuracy Error vs. Temperature

00337-008

Rev. F | Page 5 of 20

5

MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
DATA SHEET SPECIFICATION

4

NO LOAD

3

2

1

MINIMUM SUPPLY VOLTAGE (V)

a. TMP35/TMP36
b. TMP37

0

–50 125–25 0 25 50 75 100

TEMPERATURE (°C)

Figure 10. Minimum Supply Voltage vs. Temperature

b

a

00337-011

TMP35/TMP36/TMP37

60

a. +VS = 5V
b. +V

= 3V

50

40

30

SUPPLY CURRENT (µA)

20

S

NO LOAD

a

b

400

300

200

RESPONSE TIME (µs)

100

= +VS AND SHUTDOWN PINS
HIGH TO LOW (3V TO 0V)

AND SHUTDOWN PI NS

= +V

S

LOW TO HIGH (0V TO 3V)

SETTLES WITHIN ±1°C

V

OUT

10

–50 125–250 255075100

TEMPERATURE ( °C)

Figure 11. Supply Current vs. Temperature

50

TA = 25°C, NO LOAD

40

A)

μ

30

20

SUPPLY CURRENT (

10

0

07123 456

SUPPLY VOLTAGE (V)

Figure 12. Supply Current vs. Supply Voltage

50

a. +VS= 5V
b. +V

= 3V

S

NO LOA D

25 50 75

0

TEMPERATURE ( °C)

a

SUPPLY CURRENT (nA)

40

30

20

10

0

–50 125–25

Figure 13. Supply Current vs. Temperature (Shutdown = 0 V)

100

00337-012

0

–50 125–250255075

Figure 14. V

Response Time for +VS Power-Up/Power-Down vs.

OUT

TEMPERATURE (° C)

100

00337-015

Temperature

400

= SHUTDOWN PIN
HIGH TO LOW (3V TO 0V)

300

200

RESPONSE T IME (µs)

100

8

00337-013

0

–50 125–25 0 25 50 75

Figure 15. V

1.0

0.8

0.6

0.4

0.2

1.0

0.8

OUTPUT VOLTAGE (V)

0.6

0.4

b

00337-014

0.2

Response Time for

OUT

TA = 25°C
+V
SHUTDOWN =
SIGNAL

0

TA = 25°C
+V

AND SHUTDOWN =

S

0

–50 2500 10050 150 200 300 350 400 450

Figure 16. V

Response Time to

OUT

= SHUTDOWN PI N
LOW TO HIGH (0V TO 3V)

SETTLES WITHIN ±1°C

V

OUT

TEMPERATURE (°C)

SHUTDOWN

= 3V

S

SIGNAL

TIME (µs)

SHUTDOWN

100

00337-016

Pin vs. Temperature

00337-017

Pin and +VS Pin vs. Time

Rev. F | Page 6 of 20

TMP35/TMP36/TMP37

110

100

90

80

70

60

50

CHANGE (%)

40

30

20

10

0

0

a

b

a. TMP35 SO IC SOL DERED TO 0. 5" × 0.3" Cu P CB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 T O-92 IN SO CKET SOLDERED TO
1" × 0.4" Cu PCB

100

c

200 300 400 500 600

TIME (s)

+VS = 3V, 5V

Figure 17. Thermal Response Time in Still Air

10mV

100

90

VOLT/DIVISION

10

0%

00337-034

TIME/DIVISION

1ms

00337-019

Figure 20. Temperature Sensor Wideband Output Noise Voltage;

Gain = 100, BW = 157 kHz

140

a. TMP35 SOIC SOL DERED TO 0.5" × 0.3" Cu P CB

120

100

80

60

TIME CONST ANT (s)

40

20

0

0 100 200 300 400 500 600

b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB

+VS = 3V, 5V

b

c

a

AIR VELOCI TY (FPM)

Figure 18. Thermal Response Time Constant in Forced Air

00337-018

700

2400

2200

2000

1800

1600

1400

1200

1000

800

600

400

VOLTAGE NOISE DENSITY (nV/ Hz)

a. TMP35/TMP36
b. TMP37

200

0

10 10k100 1k

FREQUENCY (Hz)

Figure 21. Voltage Noise Spectral Density vs. Frequency

b

a

00337-020

110

100

90

80

70

60

50

CHANGE (%)

40

30

20

10

0

a

c

b

a. TMP35 SO IC SOL DERED TO 0.5" × 0.3" Cu P CB
b. TMP36 SOIC SO LDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 T O-92 IN SO CKET SOL DERED TO
1" × 0.4" Cu PCB

0

10

+VS = 3V, 5V

20 30 40 50 60

TIME (s)

Figure 19. Thermal Response Time in Stirred Oil Bath

00337-035

Rev. F | Page 7 of 20

TMP35/TMP36/TMP37

FUNCTIONAL DESCRIPTION

An equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 22. The core
of the temperature sensor is a band gap core that comprises
transistors Q1 and Q2, biased by Q3 to approximately 8 μA. The
band gap core operates both Q1 and Q2 at the same collector
current level; however, because the emitter area of Q1 is 10
times that of Q2, the V
by the following relationship:

×=Δ

VV ln

BE

T

Resistors R1 and R2 are used to scale this result to produce
the output voltage transfer characteristic of each temperature
sensor and, simultaneously, R2 and R3 are used to scale the V
Q1 as an offset term in V
in the output characteristics of the three temperature sensors.

The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive. The current gain of Q4, working with the
available base current drive from the previous stage, sets the
short-circuit current limit of these devices to 250 μA.

of Q1 and the VBE of Q2 are not equal

BE

⎞

⎛

A

E,Q1

⎟

⎜
⎜

⎝

⎟

A

E,Q2

⎠

. Tab l e 4 summarizes the differences

OUT

of

BE

+V

S

SHUTDOWN

Q2

10X

1X

Q1

7.5µA

Q3

Q4

V

OUT

6X

GND

Figure 22. Temperature Sensor Simplified Equivalent Circuit

25µA

3X

2X

R1

R3

R2

Table 4. TMP3x Output Characteristics

Sensor

Offset
Voltage (V)

Output Voltage
Scaling (mV/°C)

Output Voltage
@ 25°C (mV)

TMP35 0 10 250
TMP36 0.5 10 750
TMP37 0 20 500

2X

00337-006

Rev. F | Page 8 of 20

TMP35/TMP36/TMP37

APPLICATIONS INFORMATION

SHUTDOWN OPERATION

All TMP3x devices include a shutdown capability, which
reduces the power supply drain to less than 0.5 μA maximum.
This feature, available only in the SOIC_N and the SOT-23
packages, is TTL/CMOS level-compatible, provided that the
temperature sensor supply voltage is equal in magnitude to the
logic supply voltage. Internal to the TMP3x at the
pin, a pull-up current source to +V

SHUTDOWN

the

pin to be driven from an open-collector/drain

is connected. This allows

S

driver. A logic low, or zero-volt condition, on the

SHUTDOWN

SHUTDOWN
pin is required to turn off the output stage. During shutdown,
the output of the temperature sensors becomes high impedance
where the potential of the output pin is then determined by
external circuitry. If the shutdown feature is not used, it is
recommended that the

SHUTDOWN

pin be connected to +VS

(Pin 8 on the SOIC_N; Pin 2 on the SOT-23).

The shutdown response time of these temperature sensors is
shown in Figure 14, Figure 15, and Figure 16.

MOUNTING CONSIDERATIONS

If the TMP3x temperature sensors are thermally attached and
protected, they can be used in any temperature measurement
application where the maximum temperature range of the
medium is between −40°C and +125°C. Properly cemented or
glued to the surface of the medium, these sensors are within

0.01°C of the surface temperature. Caution should be exercised,
especially with T-3 packages, because the leads and any wiring
to the device can act as heat pipes, introducing errors if the
surrounding air-surface interface is not isothermal. Avoiding this
condition is easily achieved by dabbing the leads of the temper­ature sensor and the hookup wires with a bead of thermally
conductive epoxy. This ensures that the TMP3x die temperature
is not affected by the surrounding air temperature. Because
plastic IC packaging technology is used, excessive mechanical
stress should be avoided when fastening the device with a clamp
or a screw-on heat tab. Thermally conductive epoxy or glue,
which must be electrically nonconductive, is recommended
under typical mounting conditions.

These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically non­conductive epoxy paints or dip or any one of the many printed
circuit board coatings and varnishes.

THERMAL ENVIRONMENT EFFECTS

The thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Figure 23 illustrates a thermal model
of the TMP3x temperature sensors, which is useful in under­standing these characteristics.

T

C

P

D

CH

Figure 23. Thermal Circuit Model

In the T-3 package, the thermal resistance junction-to-case, θJC,
is 120°C/W. The thermal resistance case-to-ambient, C
difference between θ

JA

acteristics of the thermal connection. The power dissipation of
the temperature sensor, P
across the device and its total supply current, including any
current delivered to the load. The rise in die temperature above
the ambient temperature of the medium is given by

T

= PD × (θJC + θCA) + TA

J

Thus, the die temperature rise of a TMP35 SOT-23 package
mounted into a socket in still air at 25°C and driven from a 5 V
supply is less than 0.04°C.

The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, C
thermal capacity of C

C

because it includes anything in direct contact with the package.
In all practical cases, the thermal capacity of C
factor in the thermal response time of the sensor and can be
represented by a single-pole RC time constant response. Figure
17 and Figure 19 show the thermal response time of the TMP3x
sensors under various conditions. The thermal time constant
of a temperature sensor is defined as the time required for the
sensor to reach 63.2% of the final value for a step change in the
temperature. For example, the thermal time constant of a
TMP35 SOIC package sensor mounted onto a 0.5" × 0.3" PCB is
less than 50 sec in air, whereas in a stirred oil bath, the time
constant is less than 3 sec.

θ

J

JC

T

C

C

θ

C

CA

, is the

A

and θJC, and is determined by the char-

, is the product of the total voltage

D

, and the case, CC. The

CH

varies with the measurement medium

is the limiting

C

T

A

00337-021

Rev. F | Page 9 of 20

TMP35/TMP36/TMP37

V

V

S

V

BASIC TEMPERATURE SENSOR CONNECTIONS

Figure 24 illustrates the basic circuit configuration for the
TMP3x family of temperature sensors. The table in Figure 24
shows the pin assignments of the temperature sensors for the
three package types. For the SOT-23, Pin 3 is labeled NC, as are
Pin 2, Pin 3, Pin 6, and Pin 7 on the SOIC_N package. It is
recommended that no electrical connections be made to these
pins. If the shutdown feature is not needed on the SOT-23 or
on the SOIC_N package, the

HUTDOWN

.

S

connected to +V

SHUTDOWN

2.7V < +

S

+V

S

TMP3x

GND

< 5.5

pin should be

0.1µF

V

OUT

FAHRENHEIT THERMOMETERS

Although the TMP3x temperature sensors are centigrade
temperature sensors, a few components can be used to convert
the output voltage and transfer characteristics to directly read
Fahrenheit temperatures. Figure 25 shows an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. Using the TMP35, this circuit can be used to sense
temperatures from 41°F to 257°F with an output transfer
characteristic of 1 mV/°F; using the TMP37, this circuit can be
used to sense temperatures from 41°F to 212°F with an output
transfer characteristic of 2 mV/°F. This particular approach
does not lend itself to the TMP36 because of its inherent 0.5 V
output offset. The circuit is constructed with an AD589, a 1.23 V
voltage reference, and four resistors whose values for each sensor
are shown in the table in Figure 25. The scaling of the output
resistance levels ensures minimum output loading on the temp­erature sensors. A generalized expression for the transfer
equation of the circuit is given by

PIN ASSIGNMENTS

GND

V

OUT

SHUTDOWN

00337-022

PACKAGE

SOIC_N 8 4 1 5

SOT-23 2 5 1 4
TO-92 1 3 2 NA

Figure 24. Basic Temperature Sensor Circuit Configuration

+V

S

Note the 0.1 μF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface-mount
is preferable), and be located as close as possible in physical
proximity to the temperature sensor supply pin. Because these
temperature sensors operate on very little supply current and
may be exposed to very hostile electrical environments, it is
important to minimize the effects of radio frequency interference
(RFI) on these devices. The effect of RFI on these temperature
sensors specifically and on analog ICs in general is manifested as
abnormal dc shifts in the output voltage due to the rectification
of the high frequency ambient noise by the IC. When the
devices are operated in the presence of high frequency radiated
or conducted noise, a large value tantalum capacitor (±2.2 μF)
placed across the 0.1 μF ceramic capacitor may offer additional
noise immunity.

V

OUT

⎛
⎜

=

⎜
⎝

⎞

R1

⎟

()

TMP35

⎟

+

R2R1

⎠

⎛
⎜

+

⎜
⎝

⎞

R3

⎟

()

AD589

⎟

+

R4R3

⎠

where:
TMP35 is the output voltage of the TMP35 or the TMP37 at the
measurement temperature, T

.

M

AD589 is the output voltage of the reference, that is, 1.23 V.

The output voltage of this circuit is not referenced to the
circuit’s common ground. If this output voltage were applied
directly to the input of an ADC, the ADC common ground
should be adjusted accordingly.

+

AD589

1.23V

S

+V

TMP35/
TMP37

GND

S

V

OUT

R1

+

R2

V

OUT

R3

R4

–

0.1µF

TCV

R1 (kΩ)

SENSOR

TMP35

TMP37 2mV/°F 45.3 10 10 182

Figure 25. TMP35/TMP37 Fahrenheit Thermometers

Rev. F | Page 10 of 20

OUT

1mV/°F 45.3 10 10 374

R2 (kΩ)R3 (kΩ)R4 (kΩ)

00337-023

TMP35/TMP36/TMP37

V

V

The same circuit principles can be applied to the TMP36, but
because of the inherent offset of the TMP36, the circuit uses only
two resistors, as shown in Figure 26. In this circuit, the output
voltage transfer characteristic is 1 mV/°F but is referenced to
the common ground of the circuit; however, there is a 58 mV
(58°F) offset in the output voltage. For example, the output
voltage of the circuit reads 18 mV if the TMP36 is placed in a

−40°F ambient environment and 315 mV at +257°F.

+

S

+V

S

V

GND

OUT

R1

45.3kΩ

R2
10kΩ

V

@ –40°F = 18mV

OUT

@ +257°F = 315mV

V

OUT

V

@ 1mV/° F – 58°F

OUT

+3

00337-024

0.1µF

TMP36

Figure 26. TMP36 Fahrenheit Thermometer Version 1

At the expense of additional circuitry, the offset produced by
the circuit in Figure 26 can be avoided by using the circuit in
Figure 27. In this circuit, the output of the TMP36 is conditioned
by a single-supply, micropower op amp, the OP193. Although
the entire circuit operates from a single 3 V supply, the output
voltage of the circuit reads the temperature directly, with a
transfer characteristic of 1 mV/°F, without offset. This is accom­plished through an ADM660, which is a supply voltage inverter.
The 3 V supply is inverted and applied to the V− terminal of the
OP193. Thus, for a temperature range between −40°F and +257°F,
the output of the circuit reads −40 mV to +257 mV. A general
expression for the transfer equation of the circuit is given by

⎛
⎜

=

V

OUT

⎜
⎝

R6

⎛

⎞

⎜

⎟

⎜

⎟

+

R6R5

⎝

⎠

⎞

R4

⎟

+

1

()

TMP36

⎟

R3

⎠

−

V

R4

⎛
⎜

R3

⎝

⎞

⎛

⎞

S

⎟

⎜

⎟

2

⎠

⎠

⎝

10µF/0. 1µF

R1

50kΩ

+

R2

50kΩ

+V

S

GND

ELEMENT

V

OUT

VALUE

R3

R4

R5

R6

258.6kΩ

10kΩ

47.7kΩ

10kΩ

+

TMP36

C1

10µF

10µF

NC

+

R3

2

–

R5

R6

8

1

2

ADM660

4

3

3

+

5

6

7

7

OP193

4

+

–3V

10µF

NC

R4

0.1µF

V

@ 1mV/°F

OUT

6

–40°F ≤ T

≤ +257°F

A

00337-025

Figure 27. TMP36 Fahrenheit Thermometer Version 2

Rev. F | Page 11 of 20

TMP35/TMP36/TMP37

0

V

V

0

F

AVERAGE AND DIFFERENTIAL TEMPERATURE MEASUREMENT

In many commercial and industrial environments, temperature
sensors often measure the average temperature in a building, or
the difference in temperature between two locations on a factory
floor or in an industrial process. The circuits in Figure 28 and
Figure 29 demonstrate an inexpensive approach to average and
differential temperature measurement.

In Figure 28, an OP193 sums the outputs of three temperature
sensors to produce an output voltage scaled by 10 mV/°C that
represents the average temperature at three locations. The circuit
can be extended to include as many temperature sensors as
required as long as the transfer equation of the circuit is
maintained. In this application, it is recommended that one
temperature sensor type be used throughout the circuit;
otherwise, the output voltage of the circuit cannot produce an
accurate reading of the various ambient conditions.

The circuit in Figure 29 illustrates how a pair of TMP3x sensors
used with an OP193 configured as a difference amplifier can
read the difference in temperature between two locations. In
these applications, it is always possible that one temperature
sensor is reading a temperature below that of the other sensor.
To accommodate this condition, the output of the OP193 is
offset to a voltage at one-half the supply via R5 and R6. Thus,
the output voltage of the circuit is measured relative to this
point, as shown in Figure 29. Using the TMP36, the output
voltage of the circuit is scaled by 10 mV/°C. To minimize the
error in the difference between the two measured temperatures,
a common, readily available thin-film resistor network is used
for R1 to R4.

TMP3x

TMP3x

TMP3x

.1µ

.1µF

2.7V < +V

< 5.5V

S

0.1µF

V

TEMP(AVG)

@ 10mV/°C FO R TMP35/T MP36
@ 20mV/°C FOR TMP37

6

= 1 (TMP3x1 + TMP3x2 + TMP3x3)

3

R1

300kΩ

R2

300kΩ

R3

300kΩ

7.5kΩ

7

2

–

OP193

3

+

4

FOR R1 = R2 = R3 = R;

V

TEMP(AVG)

R1

R5 =

R4

3

R4 = R6

Figure 28. Configuring Multiple Sensors for

Average Temperature Measurements

2.7V < +

S

TMP36

@ T1

TMP36

@ T2

< 5.5

1

R1

R8
25kΩ

1

R3

R9
25kΩ

CENTERED AT

1

R4

1µF

2

3

7

–

OP193

+

R5
100kΩ

R6

7.5kΩ

4

R2

0.1µF

00337-026

1

V

R7
100kΩ

OUT

6

0°C ≤ TA ≤ 125°C

NOTE:

1

R5

100kΩ

R1–R4, CADDOCK T914–100k–100, OR EQUIV ALENT.

R6

100kΩ

V

= T2 – T1 @ 10mV/ °C

OUT

CENTERED AT

V

S

2

00337-027

Figure 29. Configuring Multiple Sensors for

Differential Temperature Measurements

Rev. F | Page 12 of 20

TMP35/TMP36/TMP37

(

0

F

V

MICROPROCESSOR INTERRUPT GENERATOR

These inexpensive temperature sensors can be used with a
voltage reference and an analog comparator to configure an
interrupt generator for microprocessor applications. With the
popularity of fast microprocessors, the need to indicate a
microprocessor overtemperature condition has grown
tremendously. The circuit in Figure 30 demonstrates one way to
generate an interrupt using a TMP35, a CMP402 analog
comparator, and a REF191, a 2 V precision voltage reference.

The circuit is designed to produce a logic high interrupt signal
if the microprocessor temperature exceeds 80°C. This 80°C trip
point was arbitrarily chosen (final value set by the microprocessor
thermal reference design) and is set using an R3 to R4 voltage
divider of the REF191 output voltage. Because the output of the
TMP35 is scaled by 10 mV/°C, the voltage at the inverting
terminal of the CMP402 is set to 0.8 V.

3.3

Because temperature is a slowly moving quantity, the possibility
for comparator chatter exists. To avoid this condition, hysteresis
is used around the comparator. In this application, a hysteresis
of 5°C about the trip point was arbitrarily chosen; the ultimate
value for hysteresis should be determined by the end application.
The output logic voltage swing of the comparator with R1 and
R2 determines the amount of comparator hysteresis. Using a

3.3 V supply, the output logic voltage swing of the CMP402 is

2.6 V; therefore, for a hysteresis of 5°C (50 mV @ 10 mV/°C),
R1 is set to 20 kΩ, and R2 is set to 1 MΩ. An expression for the
hysteresis of this circuit is given by

R1

⎞

⎛

V

V

=

⎟

⎜

R2

⎠

⎝

)

CMP402SWINGLOGICHYS

,

Because this circuit is probably used in close proximity to high
speed digital circuits, R1 is split into equal values and a 1000 pF
capacitor is used to form a low-pass filter on the output of the
TMP35. Furthermore, to prevent high frequency noise from
contaminating the comparator trip point, a 0.1 μF capacitor is
used across R4.

R2

1MΩ

.1µ

+V

TMP35

GND

S

V

OUT

R5
100kΩ

REF191

3

R1A

10kΩ

0.1µF

2

6

+

4

1µF

1

C1 = CMP402

4

C

L

1000pF

R3

16kΩ

R1B

10kΩ

R4
10kΩ

6

–

CMP402

5

+

13

V

REF

0.1µF

0.1µF

3

4

2

14

<80°C

INTERRUPT

>80°C

0337-028

Figure 30. Microprocessor Overtemperature Interrupt Generator

Rev. F | Page 13 of 20

TMP35/TMP36/TMP37

V

V

V

THERMOCOUPLE SIGNAL CONDITIONING WITH COLD-JUNCTION COMPENSATION

The circuit in Figure 31 conditions the output of a Type K
thermocouple, while providing cold-junction compensation for
temperatures between 0°C and 250°C. The circuit operates from
a single 3.3 V to 5.5 V supply and is designed to produce an
output voltage transfer characteristic of 10 mV/°C.

A Type K thermocouple exhibits a Seebeck coefficient of
approximately 41 μV/°C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of 10 mV/°C, is used
with R1 and R2 to introduce an opposing cold-junction temp­erature coefficient of −41 μV/°C. This prevents the isothermal,
cold-junction connection between the PCB tracks of the circuit

+V

S

V

OUT

GND

CU

CU

TYPE K
THERMO­COUPLE

0°C ≤ T

0.1µF

CHROMEL

+

ALUMEL

–

≤ 250°C

A

TMP35

COLD

JUNCTION

ISOTHERMAL

BLOCK

Figure 31. Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation

R1

24.9kΩ

R2
102Ω

and the wires of the thermocouple from introducing an error in
the measured temperature. This compensation works extremely
well for circuit ambient temperatures in the range of 20°C to 50°C.
Over a 250°C measurement temperature range, the thermocouple
produces an output voltage change of 10.151 mV. Because the
required output full-scale voltage of the circuit is 2.5 V, the gain
of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ sets
R5 equal to 1.22 MΩ. Because the closest 1% value for R5 is

1.21 MΩ, a 50 kΩ potentiometer is used with R5 for fine trim of
the full-scale output voltage. Although the OP193 is a superior
single-supply, micropower operational amplifier, its output stage
is not rail-to-rail; therefore, the 0°C output voltage level is 0.1 V.
If this circuit is digitized by a single-supply ADC, the ADC
common should be adjusted to 0.1 V accordingly.

3.3V < +

1

1

< 5.5

S

R3

R4

10MΩ

4.99kΩ

5%

0.1µF

7

2

–

OP193

3

+

4

NOTE:

1

ALL RESISTORS 1% UNLESS OTHERWISE NOTED.

1

R5

1.21MΩ

6

50kΩ

R6
100kΩ
5%

P1

V
0V TO 2.5

OUT

00337-029

Rev. F | Page 14 of 20

TMP35/TMP36/TMP37

USING TMP3x SENSORS IN REMOTE LOCATIONS

In many industrial environments, sensors are required to
operate in the presence of high ambient noise. These noise
sources take many forms, for example, SCR transients, relays,
radio transmitters, arc welders, and ac motors. They can also
be used at considerable distances from the signal conditioning
circuitry. These high noise environments are typically in the
form of electric fields, so the voltage output of the temperature
sensor can be susceptible to contamination from these noise
sources.

Figure 32 illustrates a way to convert the output voltage of a
TMP3x sensor into a current to be transmitted down a long
twisted pair shielded cable to a ground referenced receiver. The
temperature sensors are not capable of high output current
operation; thus, a standard PNP transistor is used to boost the
output current drive of the circuit. As shown in the table in
Figure 32, the values of R2 and R3 were chosen to produce an
arbitrary full-scale output current of 2 mA. Lower values for the
full-scale current are not recommended. The minimum-scale
output current produced by the circuit could be contaminated
by ambient magnetic fields operating in the near vicinity of the
circuit/cable pair. Because the circuit uses an external transistor,
the minimum recommended operating voltage for this circuit is
5 V. To minimize the effects of EMI (or RFI), both the circuit
and the temperature sensor supply pins are bypassed with good
quality ceramic capacitors.

R1

4.7kΩ

2N2907

0.1µF

0.01µF

SENSOR R2 R3

TMP35 634 634

TMP36 887 887

TMP37 1k 1k

Figure 32. Remote, 2-Wire Boosted Output Current Temperature Sensor

+V

TMP3x

GND

S

V

OUT

R2

TWISTED PAIR
BELDEN TYPE 9502
OR EQUIVALENT

5V

V

OUT

R3

00337-030

TEMPERATURE TO 4–20 mA LOOP TRANSMITTER

In many process control applications, 2-wire transmitters are
used to convey analog signals through noisy ambient environ­ments. These current transmitters use a zero-scale signal current
of 4 mA, which can be used to power the signal conditioning
circuitry of the transmitter. The full-scale output signal in these
transmitters is 20 mA.

Figure 33 illustrates a circuit that transmits temperature inform­ation in this fashion. Using a TMP3x as the temperature sensor,
the output current is linearly proportional to the temperature of
the medium. The entire circuit operates from the 3 V output of
the REF193. The REF193 requires no external trimming because
of its tight initial output voltage tolerance and the low supply
current of the TMP3x, the OP193, and the REF193. The entire
circuit consumes less than 3 mA from a total budget of 4 mA.
The OP193 regulates the output current to satisfy the current
summation at the noninverting node of the OP193. A generalized
expression for the KCL equation at Pin 3 of the OP193 is given by

×

I

OUT

⎛

1

⎞

⎛

⎜

×

=

⎟

⎜

⎜

R7

⎠

⎝

⎝

R3TMP3x

R1

For each temperature sensor, Ta ble 5 provides the values for the
components P1, P2, and R1 to R4.

Table 5. Circuit Element Values for Loop Transmitter

Sensor R1 P1 R2 P2 R3 R4

TMP35 97.6 kΩ 5 kΩ 1.58 MΩ 100 kΩ 140 kΩ 56.2 kΩ
TMP36 97.6 kΩ 5 kΩ 931 kΩ 50 kΩ 97.6 kΩ 47 kΩ
TMP37 97.6 kΩ 5 kΩ 10.5 kΩ 500 Ω 84.5 kΩ 8.45 kΩ

The 4 mA offset trim is provided by P2, and P1 provides the
full-scale gain trim of the circuit at 20 mA. These two trims do
not interact because the noninverting input of the OP193 is
held at a virtual ground. The zero-scale and full-scale output
currents of the circuit are adjusted according to the operating
temperature range of each temperature sensor. The Schottky
diode, D1, is required in this circuit to prevent loop supply
power-on transients from pulling the noninverting input of the
OP193 more than 300 mV below its inverting input. Without
this diode, such transients can cause phase reversal of the
operational amplifier and possible latch-up of the transmitter.
The loop supply voltage compliance of the circuit is limited by
the maximum applied input voltage to the REF193; it is from
9 V to 18 V.

×

R3V

R2

⎞
⎟

⎟
⎠

REF

+

Rev. F | Page 15 of 20

TMP35/TMP36/TMP37

V

3V

6

REF193

2

1

R2

1

P2

P1

20mA

R3

4mA
ADJUST

2

1

1

3

D1

R4

D1: HP5082-2810

+V

S

GND

R1

V

OUT

TMP3x

NOTE:

1

SEE TEXT FOR VALUES.

1

ADJUST

Figure 33. Temperature to 4–20 mA Loop Transmitter

TEMPERATURE-TO-FREQUENCY CONVERTER

Another common method of transmitting analog information
from a remote location is to convert a voltage to an equivalent
value in the frequency domain. This is readily done with any of
the low cost, monolithic voltage-to-frequency converters (VFCs)
available. These VFCs feature a robust, open-collector output
transistor for easy interfacing to digital circuitry. The digital
signal produced by the VFC is less susceptible to contamination
from external noise sources and line voltage drops because the
only important information is the frequency of the digital sig­nal. When the conversions between temperature and frequency
are done accurately, the temperature data from the sensors can
be reliably transmitted.

The circuit in Figure 34 illustrates a method by which the
outputs of these temperature sensors can be converted to a
frequency using the AD654. The output signal of the AD654 is
a square wave that is proportional to the dc input voltage across
Pin 4 and Pin 3. The transfer equation of the circuit is given by

f

OUT

⎛

−

⎜

=

⎜
⎝

VV

⎞

OFFSETTPM

⎟
⎟

××

)(10

CR

TT

⎠

–

OP193

+

1

+

7

4

1µF

0.1µF

6

10µF/0.1µ F

4

R5
100kΩ

R6

100kΩ

100Ω

R7

Q1
2N1711

I

L

TMP3x

P2

100kΩ

5

+V

S

V

GND

1

R

T

5V

R

OFF1

470Ω

SENSOR R

TMP35

TMP36

TMP37

V

LOOP

9V TO 18V

V

OUT

R

L

250Ω

0.1µF

4

OUT

3

R1

P1

f

OUT

OFFSET

R

OFF2

10Ω

(R1 + P1) C

T

11.8kΩ + 500Ω

16.2kΩ + 500Ω

18.2kΩ + 1kΩ

00337-032

1

C

T

6

8

7

AD654

2

5

NB: ATTA (MIN),

NOTE:

1

RT AND CT – SEE TABLE

T

1.7nF

1.8nF

2.1nF

R

PU

5kΩ

1

f

OUT

f

= 0Hz

OUT

0337-031

Figure 34. Temperature-to-Frequency Converter

Rev. F | Page 16 of 20

TMP35/TMP36/TMP37

F

V

An offset trim network (f
circuit to set f

to 0 Hz when the minimum output voltage of

OUT

the temperature sensor is reached. Potentiometer P1 is required
to calibrate the absolute accuracy of the AD654. The table in
Figure 34 illustrates the circuit element values for each of the
three sensors. The nominal offset voltage required for 0 Hz
output from the TMP35 is 50 mV; for the TMP36 and TMP37,
the offset voltage required is 100 mV. For the circuit values
shown, the output frequency transfer characteristic of the
circuit was set at 50 Hz/°C in all cases. At the receiving end, a
frequency-to-voltage converter (FVC) can be used to convert
the frequency back to a dc voltage for further processing. One
such FVC is the AD650.

For complete information about the AD650 and the AD654,
consult the individual data sheets for those devices.

DRIVING LONG CABLES OR HEAVY CAPACITIVE LOADS

Although the TMP3x family of temperature sensors can drive
capacitive loads up to 10,000 pF without oscillation, output
voltage transient response times can be improved by using a
small resistor in series with the output of the temperature
sensor, as shown in Figure 35. As an added benefit, this resistor
forms a low-pass filter with the cable capacitance, which helps
to reduce bandwidth noise. Because the temperature sensor is
likely to be used in environments where the ambient noise level
can be very high, this resistor helps to prevent rectification by
the devices of the high frequency noise. The combination of this
resistor and the supply bypass capacitor offers the best protection.

+

OFFSET ) is included with this

OUT

S

COMMENTARY ON LONG-TERM STABILITY

The concept of long-term stability has been used for many years
to describe the amount of parameter shift that occurs during
the lifetime of an IC. This is a concept that has been typically
applied to both voltage references and monolithic temperature
sensors. Unfortunately, integrated circuits cannot be evaluated
at room temperature (25°C) for 10 years or more to determine
this shift. As a result, manufacturers very typically perform
accelerated lifetime testing of integrated circuits by operating
ICs at elevated temperatures (between 125°C and 150°C) over a
shorter period of time (typically, between 500 and 1000 hours).

As a result of this operation, the lifetime of an integrated circuit
is significantly accelerated due to the increase in rates of reaction
within the semiconductor material.

V

750Ω

0.1µ

Figure 35. Driving Long Cables or Heavy Capacitive Loads

TMP3x

GND

OUT

LONG CABLE O R
HEAVY CAPACITIV E
LOADS

00337-033

Rev. F | Page 17 of 20

TMP35/TMP36/TMP37

0

0

OUTLINE DIMENSIONS

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

0.25 (0.0098)

0.10 (0.0040)

COPLANARITY

0.10

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

85

1

1.27 (0.0500)

SEATING

PLANE

COMPLIANT TO JEDEC STANDARDS MS-012-AA

BSC

6.20 (0.2441)

5.80 (0.2284)

4

1.75 (0.0688)

1.35 (0.0532)

0.51 (0.0201)

0.31 (0.0122)

8°
0°

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0196)

0.25 (0.0099)

1.27 (0.0500)

0.40 (0.0157)

45°

012407-A

.15 MAX
.05 MIN

1.30

1.15

0.90

1.70

1.60

1.50

3.00

2.90

2.80

5

123

1.90
BSC

4

0.95 BSC

0.50 MAX

0.35 MIN

3.00

2.80

2.60

1.45 MAX

0.95 MIN

SEATING
PLANE

0.20 MAX

0.08 MIN

10°

0.55

0.60

5°

BSC

0°

0.45

0.35

Figure 36. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

COMPLIANT TO JEDEC STANDARDS MO-178-AA

Figure 37. 5-Lead Small Outline Transistor Package [SOT-23]

(RJ-5)

Dimensions shown in millimeters

11-01-2010-A

Dimensions shown in millimeters and (inches)

0.165 (4.19)

0.210 (5.33)

0.190 (4.83)

0.170 (4.32)

0.205 (5.21)

0.190 (4.83)

0.175 (4.45)

0.0220 (0.56)

0.0185 (0.47)

0.0150 (0.38)

FRONT VIEW

CONTROLL ING DIMENS IONS ARE IN I
(IN PARENTHESE S) ARE ROUNDED-OF F EQUIVALENTS FO R
REFERENCE ONLY AND ARE NOT APPRO PRIATE FO R USE IN DESIGN.

0.500 (12.70) MIN

SEATING
PLANE

COMPLIANT TO JEDEC ST

0.055 (1.40)

0.050 (1.27)

0.045 (1.15)

0.105 (2.68)

0.100 (2.54)

0.095 (2.42)

ANDARDS TO-226-AA

NCHES; MILLIMETER DI MENSIONS

Figure 38. 3-Pin Plastic Header-Style Package [TO-92]

(T-3)

Dimensions shown in inches and (millimeters)

0.145 (3.68)

0.125 (3.18)

3

2

1

0.020 (0.51)

0.017 (0.43)

BOTTOM VIEW

0.014 (0.36)

0.1150 (2.92)

0.0975 (2.48)

0.0800 (2.03)

A

042208-

Rev. F | Page 18 of 20

TMP35/TMP36/TMP37

ORDERING GUIDE

Accuracy at
25°C (°C max)

Model

1, 2

TMP35FSZ-REEL ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GRT-REEL7 ±3.0 10°C to 125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T5G
TMP35GRTZ-REEL7 ±3.0 10°C to 125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T11
TMP35GS ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GT9 ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP35GT9Z ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
ADW75001Z-0REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T6G
TMP36FS ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FS-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FSZ ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FSZ-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GRT-REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T6G
TMP36GRTZ-REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T6G
TMP36GS ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GS-REEL ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GS-REEL7 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ-REEL ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ-REEL7 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GT9 ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP36GT9Z ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37FT9 ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37FT9-REEL ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37FT9Z ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GRT-REEL7 ±3.0 5°C to 100°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T7G
TMP37GRTZ-REEL7 ±3.0 5°C to 100°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 #T12
TMP37GSZ ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GSZ-REEL ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GT9 ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GT9-REEL ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GT9Z ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

Linear Operating
Temperature Range Package Description

Package
Option Branding

Rev. F | Page 19 of 20

TMP35/TMP36/TMP37

AUTOMOTIVE PRODUCTS

The ADW75001Z-0REEL7 model is available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only automotive grade products shown are available for use
in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.

©1996–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00337-0-11/10(F)

Rev. F | Page 20 of 20