Datasheet TMMBAT41 Datasheet (SGS Thomson Microelectronics)

Page 1
®
SMALL SIGNAL SC HO TTKY DIODE
DESCRIPTION
General purpose metal to silicon diode featuring very low turn-on voltage and fast switching.
This device has integrated protection against ex­cessive voltage such as electrostatic discharges.
TMMBAT 41
MINIMELF
(Glass)
ABSOLUTE RATINGS
(limiting values)
Symbol Parameter Value Unit
V
I
FRM
I
FSM
P T
RRM
I
F
tot
stg
T
T
L
Repetitive Peak Reverse Voltage 100 V Forward Continuous Current
= 25 °C
T
i
Repetitive Peak Forward Current tp ≤ 1s
0.5
δ ≤
100 mA 350 mA
Surge non Repetitive Forward Current tp = 10ms 750 mA Power Dissipation
= 95 °C
T
i
100 mW
Storage and Junction Temperature Range - 65 to + 150
j
- 65 to + 125
Maximum Temperature for Soldering during 15s 260
THERMAL RESIS TANCE
Symbol Test Conditions Value Unit
R
th(j-l)
Junction-leads 300
ELECTRICAL CHARACT E RISTI CS
STATIC CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit
V
BR
*
V
F
I
*
R
Tj = 25°CI
= 25°CI
T
j
T
= 25°C IF = 200mA
j
= 25°C
T
j
T
= 100°C
j
= 100µA
R
= 1mA
F
V
= 50V 0.1
R
100 V
0.4 0.45 V 1
20
° °
°
C/W
°
µ
C C
C
A
DYNAMIC CHARACTERI STICS
Symbol Test Conditions Min. Typ. Max. Unit
C
* Pulse test: t
T
j
300µs δ < 2%
p
= 25°CV
.
= 1V f = 1MHz
R
2pF
1/4
Page 2
TMMBAT 41
Figure 1. Forward current versus forward voltage at different temperatures (typical values).
Figure 2. Forward current versus forward voltage (typical values).
Figure 3. Reverse current versus junction temperature.
Figure 4. Rever se current versus continuous reverse voltage (typical values).
2/4
Page 3
Figure 5. Capacitance C versus reverse applied volta ge V
(typical values).
R
TMMBAT 41
3/4
Page 4
TMMBAT 41
PACKAGE MECHANICAL DATA
MINIMELF Glass
A
O
C
C
FOOT PRINT DIMENSIONS (Millimeter)
2
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 3.30 3.40 3.6 0.130 0.134 0.142
B
/
B 1.59 1.60 1.62 0.063 0.063 0.064 C 0.40 0.45 0.50 0.016 0.018 0.020 D 1.50 0.059
2.5
5
Marking: ring at cathode end. Weight: 0.05g
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infri ngem ent of patents or other rights of third parties which may result from its use. No license i s grant ed by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronic s.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
STMicroelectronics GROUP OF COMPANIES
http://www.st.com
4/4
Loading...